CN1127980A - Fixing end structure of electronic unit - Google Patents
Fixing end structure of electronic unit Download PDFInfo
- Publication number
- CN1127980A CN1127980A CN95117595A CN95117595A CN1127980A CN 1127980 A CN1127980 A CN 1127980A CN 95117595 A CN95117595 A CN 95117595A CN 95117595 A CN95117595 A CN 95117595A CN 1127980 A CN1127980 A CN 1127980A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit template
- fixed terminal
- electronic unit
- scolding tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention relates to a structure of a fixed terminal of an electric element, and is provided with an electric element for installing the surface of the fixed terminal welded by circumfluence, wherein the electric element is embarked on a printed circuit template of a printing base plate; the lateral margin part of the embarked part on the printed circuit template is chamfered and oblique, opposite to an undersurface, and is provided with an inclined plane for adhering solder and is opposite to the printed circuit template. The shape of the fixed terminal welded by circumfluence on the printed circuit template of the printing base plate is improved into a shape of a wide solder adhering surface and a narrow undersurface, thus improving the solder adhering intensity and the reliability when the electric element with the fixed terminal is installed on the surface of the printed base plate.
Description
The present invention relates to a kind of electronic unit of adorning in fact by the reflow soldering fixed terminal in the printed base plate upper surface, particularly relate to a kind of fixing end structure of electronic unit.
As electronic unit, for example, resemble Fig. 3, as shown in Figure 4, its outward appearance is well-known.In the drawings, symbol 1 is blanket electronic unit.Side at body 2, the fixed terminal 3 of the sheet metal system of stretching out, the state that this fixed terminal 3 stretches out is a bending in situation shown in Figure 3, in situation shown in Figure 4 is tabular, no matter which kind of situation all as shown in Figure 5, on the printed circuit template 5 that sets on the printed base plate 4, be equipped with the leading section of fixed terminal 3, and carry out reflow soldering, by the scolding tin 6 that solidifies again after dissolving this fixed terminal 3 and this printed circuit template 5 mechanically are connected to electric parcel, the position that on printed base plate 4, sets, surperficial real electronic parts 1.The operation procedure of relevant reflow soldering at first is coated with scolding tin on the printed circuit template 5 that sets, after carrying the fixed terminal 3 of corresponding electronic unit 1 on this printed circuit template 5, heating dissolves scolding tin in reflow ovens.
In above-mentioned prior art, as shown in Figure 5, its section configuration of carried part on printed circuit template 5 of fixed terminal 3 is for slightly being rectangle, only on upright side end face 3a and printed circuit template 5, be attached with scolding tin 6, form easy scolding tin attachment surface, and can not obtain very firm soldering intensity, the electronic unit 1 after adorning in fact might be peeled off from printed base plate 4.
The fixed terminal 3 of this kind electronic unit 1 causes some distortion that distortion is such easily when conveyance and bait dress etc., the situation of existing product, the situation of torsional deformation as shown in Figure 6 can take place, a side of the wide cut direction of fixed terminal 3 produces on printed circuit template 5 big floating, lost due function as solder side, so in this case, extreme low of the scolding tin adhesive strength of fixed terminal 3 makes electronic unit 1 be easy to cause and peels off.
The objective of the invention is to, overcome the defective of prior art, and a kind of fixing end structure of electronic unit is provided, make it, the phenomenon of peeling off from printed base plate can not take place by the scolding tin adhesive strength height of the fixed terminal of reflow soldering.
The objective of the invention is to realize by following technical scheme.The surperficial real equipment used electronic unit that on the printed circuit template of printed base plate, has the fixed terminal that is carried reflow soldering, on the above-mentioned printed circuit template of said fixing terminal, the relative bottom surface of the side edge part of its carried part tilts, and is provided with the scolding tin relative with the printed circuit template and adheres to the inclined plane of usefulness.This scolding tin adheres to the inclined plane of usefulness, on the above-mentioned printed circuit template of said fixing terminal the side edge part of carried part be formed with chamfering structure for example or to the structure of the inboard warpage of Width for well.
Be provided with the inclined plane that above-mentioned scolding tin is used on the fixed terminal of electronic unit, when reflow soldering, this inclined plane forms and resembles that bigger scolding tin accumulates the solder attachment face on the printed circuit template, can obtain high soldering intensity.Again, fixed terminal bottom surface fabric width of carried part on the printed circuit template is narrower, so in the occasion that produces torsional deformation, this scolding tin attachment surface does not have big floating on the printed circuit template, the extremely low misgivings of the soldering intensity of worry needn't be arranged also.
Concrete structure of the present invention is provided in detail by following examples and accompanying drawing thereof.
Fig. 1 is the profile of the critical piece of one embodiment of the invention.
Fig. 2 is the critical piece profile of another embodiment of the present invention.
Fig. 3 is the embodiment end view that fixed terminal stretches out shape in the electronic unit.
Fig. 4 is another embodiment end view that fixed terminal stretches out shape in the electronic unit.
Fig. 5 is the fixed terminal profile that scolding tin adheres on the existing printed circuit template.
Fig. 6 is the explanation schematic diagram of problem points in the prior art.
Fig. 1 is the profile of the critical piece of one embodiment of the invention.At first illustrate, all use identical symbol with the corresponding parts of Fig. 1 among Fig. 3 to Fig. 5.
See also shown in Figure 1, symbol 3 is fixed terminals that the body of not shown electronic unit stretches out to the side, the 4th, the printed base plate of surface this electronic unit of real dress, the 5th, the printed circuit template that on printed base plate 4, forms, the 6th, dissolved the scolding tin that solidify the back in the unshowned in the drawings reflow ovens.In present embodiment shown in Figure 1, the shape of fixed terminal 3 carried part on the printed circuit template 5 of printed base plate 4 and the shape of existing product are different.Promptly, the side edge part chamfering of carried part on these fixed terminal 3 printed circuit templates 5, relative bottom surface 3b tilts at side edge part, and be provided with the scolding tin relative and adhere to the inclined plane 3C of usefulness with printed circuit template 5, when carrying out reflow soldering, this inclined plane 3C can form on printed circuit template 5 and resemble that bigger scolding tin accumulates the scolding tin attachment surface, can access high soldering tin adhesive strength.The bottom surface 3b of this fixed terminal 3 carried part on printed circuit template 5 is only narrow in the stenosis of chamfered part width, so when conveyance and assembly etc., the distortion that can not be distorted of this fixed terminal 3, the inclined plane 3C that scolding tin adheres to usefulness also can not produce big floating on printed circuit template 5, promptly, the situation that this inclined plane 3C is lost as scolding tin attachment surface function etc. can not take place, and the worry situation that the scolding tin adhesive strength is extremely low can not take place yet.Therefore have the electronic unit of this fixed terminal 3, its fixed terminal 3 always has reliable scolding tin adhesive strength with respect to printed circuit template 5, can carry out reflow soldering, can not peel off from printed base plate 4, and can trust the real dress in the high surface of reliability.
Shown in Figure 2 is the critical piece profile of other embodiment of the present invention, the same with Fig. 1, expresses the section configuration of fixed terminal 3 inside carried part on the printed circuit template 5 of printed base plate 4 of electronic unit.
Promptly, fixed terminal 3 shown in Figure 2, the side edge part of its carried part on printed circuit template 5 is to the interior lateral buckling of Width, slightly be in the shape of the letter V by that face opposite with bottom surface 3b, tilt at the relative bottom surface 3b of side edge part, and be provided with the scolding tin relative and adhere to the inclined plane 3C of usefulness with printed circuit template 5.By above-mentioned structure, make the fixed terminal 3 in the present embodiment be formed with the inclined plane 3C that the wide scolding tin of area adheres to usefulness than the fixed terminal in the foregoing description 3, its result, when carrying out reflow soldering, this inclined plane 3C forms that big scolding tin accumulates the scolding tin attachment surface than bigger the resembling of the foregoing description, so can access the high scolding tin adhesive strength of higher level.
In sum, the fixing end structure of electronic unit of the present invention, on the printed circuit template of printed base plate by the printed circuit template of reflow soldering fixed terminal on, the side edge part of carried part, be provided with the inclination of relative bottom surface and adhere to the inclined plane of usefulness for printed circuit template scolding tin, so when carrying out reflow soldering, this inclined plane can be formed with and resemble that bigger scolding tin accumulates the scolding tin attachment surface, so can obtain high scolding tin adhesive strength, simultaneously when conveyance and assembling etc., this fixed terminal can not be distorted, big floating also can not take place in the scolding tin attachment surface on this printed circuit template, can not produce the extremely low misgivings of scolding tin adhesive strength, make fixed terminal always have reliable soldering intensity, can reflow soldering, can provide for printed base plate and to trust the high good electronic unit of surface real dress effect of reliability.
Claims (3)
1. the fixing end structure of an electronic unit, it is characterized in that: on the printed circuit template of printed base plate, carry and have by the surperficial real equipment used electronic unit of the fixed terminal of reflow soldering, the side edge part of carried part on the above-mentioned printed circuit template of said fixing terminal, relatively the bottom surface tilts, and is provided with the scolding tin relative with the printed circuit template and adheres to the inclined plane of usefulness.
2. the fixing end structure of electronic unit according to claim 1 is characterized in that the side edge part chamfering of its carried part on the above-mentioned printed circuit template of said fixing terminal, forms the inclined plane that above-mentioned scolding tin adheres to usefulness.
3. the fixing end structure of electronic unit according to claim 1 is characterized in that the inboard warpage of the side edge part of carried part on the above-mentioned printed circuit template of said fixing terminal to Width, forms the inclined plane that above-mentioned scolding tin adheres to usefulness.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6298537A JPH08162745A (en) | 1994-12-01 | 1994-12-01 | Fixing terminal structure of electronic device |
| JP298537/1994 | 1994-12-01 | ||
| JP298537/94 | 1994-12-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1127980A true CN1127980A (en) | 1996-07-31 |
| CN1051904C CN1051904C (en) | 2000-04-26 |
Family
ID=17861017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95117595A Expired - Fee Related CN1051904C (en) | 1994-12-01 | 1995-12-01 | Fixing end structure of electronic unit |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH08162745A (en) |
| KR (1) | KR100188450B1 (en) |
| CN (1) | CN1051904C (en) |
| TW (1) | TW297177B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1098536C (en) * | 1995-08-25 | 2003-01-08 | 松下电器产业株式会社 | Terminal for electronic elements and making method |
| CN101563813B (en) * | 2006-12-22 | 2014-10-22 | 泰科电子公司 | Low profile surface mount poke-in connector |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8680932B2 (en) * | 2011-02-07 | 2014-03-25 | Nihon Dempa Kogyo Co., Ltd | Oscillator |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1075050A (en) * | 1992-01-29 | 1993-08-04 | 菲奥娜·梅莉·道格拉斯 | Integrated circuit is fixed on the circuit board |
| JP2783093B2 (en) * | 1992-10-21 | 1998-08-06 | 日本電気株式会社 | Printed wiring board |
-
1994
- 1994-12-01 JP JP6298537A patent/JPH08162745A/en active Pending
-
1995
- 1995-10-17 TW TW084110913A patent/TW297177B/zh active
- 1995-11-30 KR KR1019950045216A patent/KR100188450B1/en not_active IP Right Cessation
- 1995-12-01 CN CN95117595A patent/CN1051904C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1098536C (en) * | 1995-08-25 | 2003-01-08 | 松下电器产业株式会社 | Terminal for electronic elements and making method |
| CN101563813B (en) * | 2006-12-22 | 2014-10-22 | 泰科电子公司 | Low profile surface mount poke-in connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08162745A (en) | 1996-06-21 |
| TW297177B (en) | 1997-02-01 |
| KR960028733A (en) | 1996-07-22 |
| CN1051904C (en) | 2000-04-26 |
| KR100188450B1 (en) | 1999-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1035759A3 (en) | Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board | |
| CN1127980A (en) | Fixing end structure of electronic unit | |
| US6880243B2 (en) | Stiffener for stiffening a circuit board | |
| JPH08195548A (en) | Electronic component mounting method | |
| JPH07131139A (en) | Wiring board for electronic part | |
| EP0245713B1 (en) | Solder pads for use on printed circuit boards | |
| JPH10145032A (en) | Printed circuit board for mounting electronic part | |
| JPH1041667A (en) | Shielding structure of circuit board | |
| JP2000059018A (en) | Prevention of warpage of printed wiring board | |
| CN217591209U (en) | A bear circuit board and electrical components for fixing paster device | |
| JPH01176681A (en) | Connector mounting method | |
| JP3413746B2 (en) | Component mounting structure and mounting components | |
| JPH0730014A (en) | Solder bump forming method | |
| JP3188077B2 (en) | Soldering structure for sheet metal members | |
| KR200224156Y1 (en) | Surface mount structure of printed circuit board | |
| JP2604572Y2 (en) | Solder mask with solder adhesion prevention function | |
| JP2991055B2 (en) | Surface mount electronic components | |
| JPH0520269U (en) | IC card connector | |
| JPH0743737A (en) | Film carrier | |
| JPS595390B2 (en) | solder tank | |
| KR960007302Y1 (en) | Print circuit board | |
| JP2004186508A (en) | Electric circuit board | |
| JPH08204055A (en) | Structure of hybrid integrated circuit device | |
| JPH03116889A (en) | Split board and use thereof | |
| JPH03234083A (en) | Connecting structure for printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |