JPH0743737A - Film carrier - Google Patents

Abstract

PURPOSE:To facilitate the connection of input terminals of a film carrier and the circuit patterns, etc., of a printed circuit board. CONSTITUTION:The circuit patterns 12' are formed on an insulating base material 10. Solder 15 is stuck by printing on the input terminals 12'a of the circuit patterns 12' formed across a hole 1d for outer leads of the insulating base material 10. The input terminals 12'a are electrically connected to, for example, the circuit patterns of the printed circuit board by using the solder 15 stuck by printing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier on which a driving IC for a liquid crystal panel or the like is mounted.

[0002]

2. Description of the Related Art Conventionally, in this type of film carrier,
A circuit pattern having a uniform thickness was formed on the insulating base material. The plurality of input terminals of the circuit pattern are electrically connected to the circuit pattern of the printed wiring board, for example, by soldering, and the plurality of output terminals are electrically connected to the ITO thin film pattern of the liquid crystal panel and the anisotropic conductive adhesive, respectively. Was connected to.

However, when the input terminal is connected to the printed wiring board, if the solder on the printed wiring board is used, the amount of solder is small and the workability is poor. For this reason,
Conventionally, a method has been adopted in which solder is thickly applied on the input terminal of the film carrier by electroplating and then the thickened solder is used to connect to the printed wiring board.

[0004]

However, the thickening of the solder on the input terminal has the following problems.

Until now, many film carriers have provided input terminals along the perforation on one edge. However, recently, due to a demand for miniaturization, an increasing number of film carriers have input terminals in a direction orthogonal to the perforation. In such a recent film carrier, since it is transported in the direction orthogonal to the arrangement direction of the input terminals during the manufacturing process, when soldering by electroplating, almost the whole is immersed in the plating solution and transported. There must be. For this reason, not only the input terminal portion but also all the circuit patterns are soldered, which is uneconomical and makes it difficult to increase the density of the circuit patterns.

In order to solve this problem, it is possible to apply a mask to a portion other than the input terminal. However, when the mask is applied, for example, the IC-bonded inner leads having a cantilever structure may be deformed to cause defective bonding.

Adjacent input terminals must be sufficiently spaced so that the solder attached to the input terminals does not come into contact with each other, and the film carrier becomes large against the recent demand.

Therefore, an object of the present invention is to facilitate the connection between the input terminal of the film carrier and the circuit pattern of the printed wiring board without causing such a problem.

[0009]

Therefore, the present invention provides
For example, as shown in the illustrated embodiments below, insulating substrate 10
In the film carrier having the circuit pattern 12 'formed thereon, solder 15 is attached by printing on the input terminal 12'a of the circuit pattern 12' provided across the hole 10d of the insulating base material 10. Characterize.

[0010]

Then, the solder 15 attached by printing is used,
The input terminal 12'a is electrically connected to the circuit pattern of the printed wiring board 24, for example.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a film carrier which is an embodiment of the present invention. FIG. 2 shows the manufacturing process of the film carrier.

Reference numeral 10 in the drawing is an insulating base material made of polyimide or polyester and having a thickness of 20 to 200 μm.
The adhesive 11 having a thickness of about 20 μm is provided on the surface of the insulating base material 10. Then, as shown in FIG. 2 (A), holes are punched in the insulating base material 10 and the adhesive 11 to form slit holes 10a, 11a and 10b, 11b, and the inner leads shown in FIG. 3 are formed. Holes (device holes) 10c and 11c and holes 10d and 11d for outer leads are also formed.

Next, as shown in FIG. 2B, the conductor 12 is attached to the insulating base material 10 using the adhesive 11. As the conductor 12, copper, copper alloy, aluminum, aluminum alloy, iron, iron alloy or the like is used. Its thickness is 18
Approximately 36 μ.

Then, as shown in FIG. 2C, a liquid insulating thin film synthetic resin 13 such as a polyimide resin is applied and cured in the slit holes 10a, 11a and 10b, 11b. Then, as shown in FIG. 4, the thin film synthetic resin 13 is applied to the inner surface portion of the conductor 12 in a thickness of 5 to 50 μm. The thin film synthetic resin 13 must be easily bendable, have mechanical strength, and have heat resistance and chemical resistance.

After that, as shown in FIG. 2D, the circuit pattern 12 'is formed by etching by a conventional method. Then, plating 14 such as tin or gold is applied to the surface of the circuit pattern 12 ′ so that it can be easily bonded, and is formed as shown in FIG. 3 as a whole.

By the way, in the present invention, as shown in FIG. 1, an input terminal 12'a of a circuit pattern 12 'is provided across the outer lead holes 10d and 11d, and on the input terminal 12'a, Solder 5 ~ 11μ by printing
Be attached. Reference numeral 12'b in FIG. 1 denotes an output terminal, which is formed along with the input terminal 12'a in the width direction of the film carrier.

Now, as a method of attaching the solder 15 by printing, for example, as shown in FIG. 5, the solder 15 formed as shown in FIG. 3 is set on the stage 16 of the printing machine so that it can be conveyed in the longitudinal direction. The printing plate 17 is placed on it. As shown in FIG. 6, the printing plate 17 has a metal frame 18 on which a mesh material 19 uniformly coated with an emulsion is applied.
Then, a part of the emulsion is removed by a photographic method to form a hole 19a corresponding to the input terminal 12'a.

Then, as shown in FIG. 5, the metal frame 18
The paste-like solder 15 is put therein and the silicon rubber stage 20 is moved. Then, the solder 15 is attached to the input terminal 12'a through the hole 19a. Stage 20
Sets the attachment movement angle according to the printing material and the viscosity of the ink paste.

As another method of attaching the solder 15 by printing, for example, as shown in FIG. 7, the solder 15 formed on the stage 16 of the printing machine can be similarly conveyed in the length direction as shown in FIG. set. Then, the paste-like solder 15 is applied to the input terminal 12'a with the rubber jig 21.
To adhere. The jig 21 can move up and down,
It can be moved to another location. In another place, glass 2
The paste-like solder 15 is placed on the surface 2. And
The jig 21 is moved down at another place, the paste-like solder 15 is attached to the tip, and after moving up, it moves to the input terminal 12'a and moves down to solder on the input terminal 12'a. 15 is attached.

After the solder 16 is attached on the input terminal 12'a, it is heat-treated using infrared rays or the like to melt the solder 15,
While activating it, it is made to fit into the circuit pattern 12 '.

The film carrier according to the present invention formed as described above is housed in the inner leads holes 10c and 11c by attaching the IC 23 to the inner leads 12'c of the circuit pattern 12 ', as shown in FIG. . Then, the input terminals 12'a formed by cutting the outer lead holes 10d and 11d are connected to the circuit pattern of the printed wiring board 24, while the output terminals 12'b are connected.
Is connected to the liquid crystal panel 25. As a result, the slit holes 10a and 11a and 10b and 11b are bent at the positions A and B, respectively, and assembled in a small space in an electronic device, for example.

The reference numeral 26 in FIG. 1 indicates a plurality of perforations formed along both side edges of the film carrier.

[0023]

Therefore, according to the present invention, since the input terminal is electrically connected to the circuit pattern of the printed wiring board, for example, by using the solder thickened by printing, the input terminal of the film carrier and the printed wiring board are connected. Connection with a circuit pattern or the like can be facilitated.

[Brief description of drawings]

FIG. 1 is a perspective view of a film carrier which is an embodiment of the present invention.

FIG. 2 is a process drawing showing a manufacturing process of the film carrier.

FIG. 3 is a vertical cross-sectional view of the film carrier before solder is thickly applied to the input terminals.

FIG. 4 is a partially enlarged view of the bent portion.

FIG. 5 is an explanatory diagram showing an example of a method for thickly soldering the input terminals of the film carrier.

FIG. 6 is a perspective view of a printing plate used in the method.

FIG. 7 is an explanatory diagram showing another example of a method of thickening solder on an input terminal.

FIG. 8 is an explanatory view of a usage state of the film carrier.

[Explanation of symbols]

 10 Insulating Base Material 10d Outer Lead Hole 12 'Circuit Pattern 12'a Input Terminal 15 Solder 24 Printed Wiring Board

Claims (1)

[Claims] 1. A film carrier having a circuit pattern formed on an insulating base material, wherein solder is attached by printing onto input terminals of the circuit pattern provided across the holes of the insulating base material. Yes, a film carrier.