CN112793204A - 一种电子设备陶瓷壳体的制备方法 - Google Patents

一种电子设备陶瓷壳体的制备方法 Download PDF

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CN112793204A
CN112793204A CN202011549535.6A CN202011549535A CN112793204A CN 112793204 A CN112793204 A CN 112793204A CN 202011549535 A CN202011549535 A CN 202011549535A CN 112793204 A CN112793204 A CN 112793204A
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metal frame
ceramic
shell
electronic device
injection molding
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李荣辉
李凤园
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Huizhou Weibo Precision Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D99/00Subject matter not provided for in other groups of this subclass
    • B29D99/006Producing casings, e.g. accumulator cases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055Shaping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467Joining articles or parts of a single article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055Shaping
    • B29C2045/0058Shaping removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C2045/14237Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
    • B29C2045/14245Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity using deforming or preforming means outside the mould cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486Details, accessories and auxiliary operations
    • B29C2045/14868Pretreatment of the insert, e.g. etching, cleaning

Abstract

本发明属于材料工程技术领域。一种电子设备陶瓷壳体的制备方法,包括以下步骤:将铝挤型材进行CNC粗加工,得到金属边框;将金属边框与陶瓷背板安装于注塑模具内注塑成型,使得金属边框和陶瓷背板通过注塑塑胶件连接为一体结构的壳体构件;将所述壳体构件进行CNC精加工;对精加工后的壳体构件进行抛光、喷砂以及金属边框外表面喷涂,即得陶瓷壳体。本发明制备方法易操作,低成本,制备而成的陶瓷壳体强度高,密封性好,屏蔽信号弱,壳体外观效果好,光泽度高。

Description

一种电子设备陶瓷壳体的制备方法
技术领域
本发明属于材料工程技术领域,具体涉及一种电子设备陶瓷壳体的制备方法。
背景技术
由于陶瓷壳体既具有金属的质感,又有玻璃镜面的光泽,相比于金属塑胶壳体,金属陶瓷壳体具有耐磨亲肤、气密性好以及电磁屏蔽弱的特点。现有的陶瓷金属壳体制备时,陶瓷背板需通过胶粘的方式与塑胶件连接在固定于金属边框上,存在着密封性差、粘接强度低、影响美观等问题。
采用板材加工金属边框,材料表面稳定,但材料成本高,加工时间长。采用型材加工,生产成本低,但壳体外观差。金属材料在挤压成型的过程中,铸锭的宏观或微观组织不均匀、铸锭的均匀化处理不充分或挤压前铸锭加热不均匀,会导致型材中金属晶粒大小不均一,而型材中金属晶粒的大小又与挤压温度、挤压速度、挤压变形程度和结晶程度有关,空心型材在挤压过程中容易引起局部过热,会在型材较宽表面部位产生条纹。采用型材加工制备壳体如通过阳极工艺加工外观,则会在型材表面产生条纹,影响壳体美观。
发明内容
本发明所要解决的技术问题是提供一种电子设备陶瓷壳体的制备方法,易操作,低成本,制备而成的陶瓷壳体强度高,密封性好,屏蔽信号弱,壳体外观效果好,光泽度高。
本发明的技术方案如下:
一种电子设备陶瓷壳体的制备方法,包括以下步骤:
S1.将铝挤型材进行CNC粗加工,得到金属边框;
S2.将金属边框与陶瓷背板安装于注塑模具内注塑成型,使得金属边框和陶瓷背板通过注塑塑胶件连接为一体结构的壳体构件;
S3.将所述壳体构件进行CNC精加工;
S4.对精加工后的壳体构件进行抛光、喷砂以及金属边框外表面喷涂,即得陶瓷壳体。
进一步的,所述金属边框包括至少一个拉胶槽,至少一个减胶槽以及设于所述金属边框内周壁上的凸边。注塑过程中塑胶材料可进入拉胶槽中,并包覆住金属框内周壁上的凸边,从而形成稳固的拉胶结构,提高金属边框和陶瓷背板固定的稳定性,注塑成型后的壳体构件强度高,抗冲击性能好。
进一步的,所述拉胶槽包括贯穿所述金属边框本体上下表面的通孔,以及设于所述通孔和所述金属边框内壁之间连通所述通孔和所述金属边框内部空间的缺口部。注塑过程中塑胶材料可进入拉胶槽的通孔和缺口部中,形成卡扣结构,可提高拉胶结构的强度和稳定性,从而提高壳体构件的整体强度。
进一步的,所述减胶槽为台状,其横截面积大的一端开设于所述金属边框外壁上。注塑前塑胶可经减胶槽流动至产品的最大边外,可减少发生注塑时因困气导致产品不良的现象。减胶槽的设置可避免因注塑后塑胶量过多导致缩水,有效解决了注塑胶裂的问题。
进一步的,所述凸边上设有至少一个贯穿所述凸边上下表面的拉胶孔。注塑过程中塑胶材料可进入拉胶孔中,并包覆住金属框内周壁上的凸边,凸边上拉胶孔可增加塑胶材料与凸边的接触面积,提高塑胶体3与金属边框的结合强度,从而提高了壳体构件的整体性能,所得壳体强度高,抗摔性能好。
进一步的,所述陶瓷背板为平板状,陶瓷背板为不带弧度的平板状,避免了陶瓷背板在膜内注塑时被模具压碎,提高了注塑效率和成品率。
进一步的,步骤S2中,所述金属边框注塑前经E处理在材料表面形成纳米孔,可增强注塑时塑胶材料与金属边框的粘接强度,从而提高壳体构件的强度。
进一步的,步骤S4中,所述壳体构件喷涂前经蚀刻和T处理,在金属材料表面形成纳米微孔。金属边框经酸洗后,在表面蚀刻出尺寸较大的微孔,再经T处理药水处理,可在尺寸较大的纳米孔内形成尺寸较小的蜂窝状微孔,最终在金属材料表面形成呈珊瑚礁形态的纳米微孔,双层结构的纳米微孔可提高表面喷涂的均匀程度,提高涂料在金属材料表面的附着力,提高涂层强度和抗刮耐磨性能。
本发明具有如下有益效果:
本发明陶瓷壳体中的金属边框采用铝基型材加工而成,减少了CNC粗加工的加工步骤,生产效率高,生产成本低。金属边框和陶瓷背板通过注塑塑胶件连接为一体结构,壳体强度高,无缝隙,密封性好,防水性能好。壳体构件中的金属边框外表面采用喷涂工艺,有效遮蔽了金属边框因采用型材加工在而产生于表面的纹路,壳体外观效果好,相比于阳极外观工艺,外观使用喷涂工艺,可大大提高壳体色彩的丰富度、饱和度和光泽度。
附图说明
图1为本发明电子设备陶瓷壳体的制备方法中金属边框的结构示意图;
图2为本发明电子设备陶瓷壳体的制备方法中壳体构件的结构示意图;
图3为本发明电子设备陶瓷壳体的制备方法步骤中精加工后的壳体构件的结构示意图;
图4为本发明电子设备陶瓷壳体的制备方法制备而成的陶瓷壳体的结构示意图;
图5为本发明电子设备陶瓷壳体的爆炸图;
1.金属边框,2.陶瓷背板,3.塑胶体,4.拉胶槽,5.减胶槽,6.凸边,7.拉胶孔。
具体实施方式
下面结合附图和实施例对本发明进行详细的说明,实施例仅是本发明的优选实施方式,不是对本发明的限定。
如图1-5所示,一种电子设备陶瓷壳体的制备方法,包括以下步骤:
S1.将铝挤型材进行CNC粗加工,得到金属边框1;
S2.将金属边框1与陶瓷背板2安装于注塑模具内注塑成型,使得金属边框1和陶瓷背板2通过注塑塑胶件连接为一体结构的壳体构件;
S3.将所述壳体构件进行CNC精加工;
S4.对精加工后的壳体构件进行抛光、喷砂以及金属边框1外表面喷涂,即得陶瓷壳体。
其中,步骤S1中,CNC粗加工包括CNC0、CNC1和CNC2;CNC0为在铝挤型材上建立凸边6、基准边和定位孔,在铝挤型材四角处开设预钻孔和定位孔,四边处开设Z方向压点位置,保证后序CNC加工和注塑加工的精准定位;CNC1为在铝挤型材上开设拉胶槽4、拉胶孔预钻孔和减胶槽5;CNC2为将拉胶孔预钻孔加工为拉胶孔7。选用铝挤型材加工金属边框1减少了CNC粗加工的步骤,生产效率高,生产成本低。
其中,步骤S1中,所述金属边框1包括至少一个拉胶槽4,至少一个减胶槽5以及设于所述金属边框1内周壁上的凸边6;所述拉胶槽4包括贯穿所述金属边框1本体上下表面的通孔,以及设于所述通孔和所述金属边框1内壁之间连通所述通孔和所述金属边框1内部空间的缺口部;所述减胶槽5为台状,其横截面积大的一端开设于所述金属边框1外壁上;所述凸边6上设有至少一个贯穿所述凸边6上下表面的拉胶孔7。注塑过程中塑胶材料可进入拉胶槽4和拉胶孔7中,并包覆住金属框内周壁上的凸边6,从而形成稳固的拉胶结构,提高金属边框1和陶瓷背板2固定的稳定性,注塑成型后的壳体构件强度高。减胶结构的设置可避免注注塑胶裂的问题,提高壳体成品率。
其中,所述陶瓷背板2为平板状,陶瓷背板2为不带弧度的平板状,避免了陶瓷背板2在膜内注塑时被模具压碎,提高了注塑效率和成品率。
其中,步骤S2中,所述金属边框1注塑前经E处理在材料表面形成纳米孔,可增强注塑时塑胶材料与金属边框1的粘接强度,从而提高壳体构件的强度。注塑时采用多个进胶点,可使塑胶体3更易成型,提高塑胶成型效率和塑胶材料与金属的结合力;陶瓷壳体上未填充塑胶的部分,可用于作为模具的z方向加紧。
其中,步骤S3中,所述CNC精加工包括CNC3、CNC4和CNC5;CNC3为在注塑后的壳体构件上加工电池盖装配位置、音源孔位置和定位基准,定位基准设于塑胶体3内腔,两个定位基准间的距离增加,可减少产品中心的定位偏差;CNC4为加工壳体构件外观,加工为壳体形状;CNC5在陶瓷背板2上加工摄像头特征,使用25000转以上的CNC设备,CNC设备选用气动主轴,采用少切削快进给切削方式,用合金磨头刀具加工。
其中,步骤S4中,所述壳体构件喷涂前经蚀刻和T处理,在金属材料表面形成纳米微孔,可提高表面喷涂的均匀程度,提高涂料在金属材料表面的附着力,提高涂层强度和抗刮耐磨性能。具体步骤为:去除金属基材表面油脂后水洗;酸洗金属基材,刻蚀出尺寸较大的纳米孔后水洗;使用T处理药水处理基材,刻蚀出尺寸较小的蜂窝状纳米孔,最终基材表面形成纳米级别的珊瑚礁结构微孔;水洗基材后烘干。
本发明制备方法易操作,低成本,制备而成的陶瓷壳体强度高,密封性好,屏蔽信号弱,壳体外观效果好,光泽度高。

Claims (8)

1.一种电子设备陶瓷壳体的制备方法,其特征在于,包括以下步骤:
S1.将铝挤型材进行CNC粗加工,得到金属边框;
S2.将金属边框与陶瓷背板安装于注塑模具内注塑成型,使得金属边框和陶瓷背板通过注塑塑胶件连接为一体结构的壳体构件;
S3.将所述壳体构件进行CNC精加工;
S4.对精加工后的壳体构件进行抛光、喷砂以及金属边框外表面喷涂,即得陶瓷壳体。
2.根据权利要求1所述的电子设备陶瓷壳体的制备方法,其特征在于,步骤S1中,所述金属边框包括至少一个拉胶槽,至少一个减胶槽以及设于所述金属边框内周壁上的凸边。
3.根据权利要求2所述的电子设备陶瓷壳体的制备方法,其特征在于,所述拉胶槽包括贯穿所述金属边框本体上下表面的通孔,以及设于所述通孔和所述金属边框内壁之间连通所述通孔和所述金属边框内部空间的缺口部。
4.根据权利要求2所述的电子设备陶瓷壳体的制备方法,其特征在于,所述减胶槽为台状,其横截面积大的一端开设于所述金属边框外壁上。
5.根据权利要求2所述的电子设备陶瓷壳体的制备方法,其特征在于,所述凸边上设有至少一个贯穿所述凸边上下表面的拉胶孔。
6.根据权利要求1所述的电子设备陶瓷壳体的制备方法,其特征在于,所述陶瓷背板为平板状。
7.根据权利要求1所述的电子设备陶瓷壳体的制备方法,其特征在于,步骤S2中,所述金属边框注塑前经E处理在金属材料表面形成纳米孔。
8.根据权利要求1所述的电子设备陶瓷壳体的制备方法,其特征在于,步骤S4中,所述壳体构件喷涂前经蚀刻和T处理,在金属材料表面形成纳米微孔。
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