CN112793013A - Dividing device and dividing method - Google Patents

Dividing device and dividing method Download PDF

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Publication number
CN112793013A
CN112793013A CN202011130648.2A CN202011130648A CN112793013A CN 112793013 A CN112793013 A CN 112793013A CN 202011130648 A CN202011130648 A CN 202011130648A CN 112793013 A CN112793013 A CN 112793013A
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China
Prior art keywords
substrate
chamber
dividing
lid
pressure
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Pending
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CN202011130648.2A
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Chinese (zh)
Inventor
西尾仁孝
留井直子
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority claimed from JP2019206478A external-priority patent/JP2021082634A/en
Priority claimed from JP2019206480A external-priority patent/JP2021082635A/en
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN112793013A publication Critical patent/CN112793013A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)

Abstract

The invention provides a dividing device and a dividing method capable of easily and well dividing a substrate. A dividing device (1) divides a substrate (100) having a first surface (101) on which predetermined scribe lines (L1, L2) are formed and a second surface (102) which is bonded to a film (110), along the scribe lines, and comprises: a cavity (20) having a lid (300) and a body (200), and holding the substrate (100) by the lid (300) and the body (200) so that a first chamber (21) on the first surface (101) side and a second chamber (22) on the second surface (102) side are formed with the diaphragm (110) therebetween; a pressure adjustment unit (400) that individually adjusts the pressure in the first chamber (21) and the pressure in the second chamber (22), and maintains the substrate (100) in a predetermined posture; and a dividing mechanism (30) that divides the substrate (100) along the scribe lines (L1, L2), wherein the dividing mechanism (30) is disposed in the second chamber (22) and pushes the substrate (100) upward toward the first chamber (21) while moving along the second surface (102) of the substrate (100).

Description

Dividing device and dividing method
Technical Field
The present invention relates to a dividing apparatus and a dividing method for dividing a substrate.
Background
In general, in the manufacture of a semiconductor wafer, first, the outer peripheral surface of a single crystal ingot is ground so as to make the diameter of the single crystal ingot uniform, and the single crystal ingot is cut into a disk shape having a thickness of about 1 mm. This is called a wafer. Both surfaces of the wafer are ground and processed to a predetermined thickness (grinding step). Then, both surfaces of the wafer are polished, and mirror finishing with high flatness is performed (polishing step). Then, the polished wafer is cleaned (cleaning process), and the wafer is completed. Thereafter, a circuit pattern is formed on the surface of the wafer, and the wafer is divided into a plurality of dividing elements (chips) along a predetermined line.
Patent document 1 below describes a device for manufacturing a divided body in which lattice-shaped dividing grooves are formed in one surface of a plate-shaped material serving as an insulating substrate for a power module, and the plate-shaped material is divided along the dividing grooves.
In the device for manufacturing a divided body of patent document 1, a pair of plate-like portions having a plurality of ridges each having a pectinate shape on one surface and having an area capable of covering the entire surface of a plate-like raw material are used. The raised strips of the plate-shaped portion are formed so as to rise vertically with a constant width in the plate-shaped portion. Thus, when the ridges are arranged on the surface of the plate-like raw material, the ridges abut against the division grooves formed in the plate-like raw material in the longitudinal direction.
In the dividing step, the pair of plate-like portions having the ridge portion is arranged to face each other with the plate-like material interposed therebetween. At this time, the convex strip of one plate-like portion is brought into contact with the dividing groove of the plate-like raw material. Thereby, the plate-like raw material is sandwiched between the pair of convex strips. In this state, the pair of plate-like portions are continuously bent, and when the bent shape exceeds a predetermined curvature, all the dividing grooves of the plate-like material sandwiched between the pair of plate-like portions are divided together at substantially the same time.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2009-143197.
Problems to be solved by the invention
In the structure of patent document 1, if the ridge portions penetrate into the dividing grooves too deeply during dividing, chipping or burr may occur on the end faces of the divided chips. Thereby, the product quality of the chip is reduced.
In the device of patent document 1, it is necessary to strictly design the intervals between the ridges of the plate-like portion according to the dividing grooves of the plate-like raw material. Therefore, the plate-like portion needs to be formed every time according to the size of the chip to be divided, and the division of the plate-like raw material takes time.
Disclosure of Invention
In view of the above problem, an object of the present invention is to provide a dividing apparatus and a dividing method capable of easily and satisfactorily dividing a substrate.
Means for solving the problems
A first aspect of the present invention relates to a dividing apparatus (dividing apparatus of a first embodiment) that divides a substrate. A dividing apparatus according to the present embodiment divides a substrate, on which a predetermined scribe line is formed on a first surface and a film (sheet) is attached to a second surface opposite to the first surface, along the scribe line, and includes: a cavity having a lid and a body, and holding the substrate by the lid and the body so that a first chamber on the first surface side and a second chamber on the second surface side are formed with the diaphragm interposed therebetween; a pressure adjusting unit that individually adjusts pressures of the first chamber and the second chamber, and maintains the substrate in a predetermined posture in the chamber; and a dividing mechanism configured to divide the substrate along the scribe line, the dividing mechanism being disposed in the second chamber and pushing up the substrate toward the first chamber while moving along the second surface of the substrate.
According to the dividing apparatus of the present embodiment, the substrate is maintained in a predetermined posture by applying the pressure to the first chamber and the second chamber. The predetermined attitude means, for example, an attitude in which the substrate is fixed to the film. Therefore, the substrate can be prevented from shaking on the film sheet while the dividing mechanism moves along the second surface of the substrate.
The dividing mechanism pushes up the substrate toward the first chamber side while moving along the second surface of the substrate. At this time, when the dividing mechanism pushes up on the scribing line, a force to open to the outside of the substrate is applied at the pushed-up scribing line. Thus, the crack generated along the scribe line penetrates from the first surface to the second surface and extends along the scribe line. Thus, the substrate is divided. In this way, the substrate can be easily divided when the roller is moved along the second surface of the substrate.
Further, as described above, since the cracks penetrate from the first surface to the second surface, chipping and burr generated on the end surface of the substrate after the division can be suppressed, and a favorable divided element can be obtained.
Further, in the dividing device of the present configuration, a member or the like that contacts the first surface of the substrate is not provided. Therefore, even in such a case where the semiconductor component is mounted on the first surface of the substrate, the substrate can be divided by using the dividing apparatus of the present configuration. That is, the first surface of the substrate is kept in a non-contact state. Therefore, the substrate can be divided without affecting the quality after division.
The dividing apparatus according to the present embodiment includes a control unit that controls the pressure adjusting unit, and the control unit adjusts the pressures of the first chamber and the second chamber to maintain the substrate in a predetermined posture in the chamber.
According to the partitioning device of the present embodiment, the pressure of the first chamber and the pressure of the second chamber are controlled by the control unit. In this way, since the pressure capable of maintaining the substrate in the predetermined posture is automatically applied to the first chamber and the second chamber, for example, in the case of manually operating the dividing mechanism, the user can operate the dividing mechanism without troublesome pressure adjustment. Therefore, the usability of the dividing device is improved.
In the dividing device according to the present aspect, the dividing mechanism includes: a pressing unit that pushes up the substrate toward the first chamber side; a moving unit for moving the pressing unit, the pressing unit including: a pressing member extending along a forming direction of the scribing line, the moving unit including: a support portion that detachably supports the pressing unit; and a shaft portion coupled to the support portion for moving the support portion in an arrangement direction of the scribe lines.
According to the dividing device of the present aspect, the pressing member is gradually positioned at a position directly below the scribe line and along the scribe line by moving the support portion through the shaft portion. At this time, when the pressing unit is in a state of being pushed up toward the first chamber side, the pressing member pushes up the second surface of the substrate along the scribe line, and a force of opening to the outside of the substrate is applied to the scribe line. This allows the crack generated along the scribe line to more favorably penetrate from the first surface to the second surface, and to smoothly extend along the scribe line. As a result, the substrate is divided satisfactorily.
Further, the pressing unit can be detached from the support portion. Thus, the substrate can be divided by the pressing unit having an appropriate pressing member according to the size of the substrate.
In the splitting apparatus according to the present aspect, the moving means may include: an engaging portion that engages the support portion with one end portion of the shaft portion; a collar that restricts movement of the shaft portion in an arrangement direction of the scribe lines.
According to the partitioning device of the present embodiment, the movement of the shaft portion is restricted by the collar. Thus, for example, when the shaft portion is manually moved, the operator can prevent the pressing means from being excessively moved and from hitting the inner side surface of the body portion.
In the splitting apparatus according to this aspect, the support portion may be configured to include an eccentric cam that moves the pressing unit in the vertical direction in accordance with rotation of the shaft portion.
According to the partitioning device of the present aspect, the pressing unit and the pressing member can be easily lifted and lowered by rotating the shaft portion. Further, the amount of lifting of the pressing unit is determined by the eccentric cam, and the pressing unit can be prevented from being excessively lifted. Therefore, even when the operator manually rotates the shaft portion, for example, the pressing unit can be stably and appropriately raised at the time of dividing the substrate, and the substrate can be divided satisfactorily. Further, the shaft portion for moving the pressing unit is also used for adjusting the height of the pressing unit, so the structures of the moving unit and the pressing unit can be simplified.
In the dividing device according to the present aspect, the pressing unit includes a receiving portion that receives the pressing member, and the receiving portion is configured to detachably support the pressing member.
According to the dividing device of the present embodiment, the pressing member can be removed from the receiving portion. Therefore, for example, in the case where the pressing member deteriorates, the pressing member can be replaced with a new one.
In this case, the pressing member may be a member having magnetism, and may be configured such that a magnet is provided in the receiving portion.
According to the partitioning device of the present invention, the pressing member is provided on the receiving portion by the magnetic force of the magnet. Therefore, the pressing member can be easily and smoothly removed from the receiving portion.
In the dividing device according to this aspect, the pressing member may be configured to have a curved shape having a uniform curvature over the entire length.
According to the dividing device of the present aspect, when the curved portion of the pressing member is located on the scribe line, a force that opens to the outside of the substrate is uniformly applied to the scribe line. Thus, the crack generated along the scribe line penetrates substantially vertically from the first surface to the second surface. When a crack such as this propagates along the scribe line, the substrate is divided in a substantially vertical direction along the scribe line. As a result, chipping and burr generated on the end face of the substrate after the division can be further reduced, and a more preferable substrate can be obtained.
In this case, the pressing member may be configured as a roller extending in the direction in which the scribing line is formed.
According to the dividing device of the present invention, the pressing member can be pressed against the second surface of the substrate and smoothly moves along the second surface.
In the dividing device according to this aspect, the scribe lines may be formed in a lattice shape on the substrate, and the dividing mechanism may include a first dividing mechanism that moves in a first arrangement direction of the scribe lines and a second dividing mechanism that moves in a second arrangement direction orthogonal to the first arrangement direction of the scribe lines.
According to the dividing apparatus of the present embodiment, when the lattice-shaped scribe lines are formed on the substrate, the first dividing means divides the substrate in the first arrangement direction of the scribe lines, and then the second dividing means divides the substrate in the second arrangement direction of the scribe lines. Therefore, the substrate can be efficiently divided into individual pieces along the lattice-shaped scribe lines.
A second aspect of the present invention relates to a dividing apparatus (dividing apparatus of the second embodiment) that divides a substrate. The dividing device according to the present embodiment divides a substrate, on which a predetermined scribe line is formed on a first surface and a second surface opposite to the first surface is bonded to a film, along the scribe line. The dividing device has: a chamber that holds the substrate so as to form a first chamber on the first surface side and a second chamber on the second surface side with the diaphragm interposed therebetween; and a pressure adjusting unit that individually adjusts pressures of the first chamber and the second chamber.
According to the partitioning device of the present aspect, the pressures of the first chamber and the second chamber can be adjusted to different pressures by the pressure adjusting unit. For example, when a higher pressure is applied to the second chamber than to the first chamber, the diaphragm bulges toward the first chamber. The substrate bends with the bulging of the membrane. Thereby, a force that opens to the outside of the substrate is applied to the scribe line formed on the substrate. Therefore, a crack (crack) generated along the scribe line penetrates from the first surface to the second surface of the substrate and extends along the scribe line. As a result, the substrate is divided. In this manner, the substrate can be easily divided by adjusting the pressures of the first chamber and the second chamber, respectively.
Further, as described above, the substrate is bent by the pressure difference. That is, the substrate can be bent without contacting the substrate. Therefore, after the division, chipping and burr generated on the end face of the substrate to be singulated can be suppressed. Therefore, the substrate can be divided satisfactorily.
The dividing apparatus according to the present aspect may include a control unit that controls the pressure adjusting unit, wherein the control unit may be configured to adjust pressures of the first chamber and the second chamber, and bend the diaphragm and the substrate along the scribe line until the substrate is divided by a pressure difference between the first chamber and the second chamber.
According to the dividing apparatus of the present embodiment, the pressure of the first chamber and the pressure of the second chamber are controlled by the control unit, whereby the substrate is automatically divided. Therefore, the substrate can be easily divided.
In the partitioning device according to the present aspect, the cavity may be composed of a lid portion forming the first chamber and a body portion forming the second chamber, and an inner wall surface of the lid portion may be configured to have a shape curved in a concave shape.
According to the dividing device of the present aspect, since the inner wall surface of the substrate is curved in the concave shape, when the diaphragm continues to bulge toward the first chamber due to the pressure difference between the first chamber and the second chamber, the diaphragm and the substrate are in contact with the inner wall of the lid portion. In this case, the diaphragm and the substrate are deformed into a concave shape which is the same shape as the inner wall surface of the lid. Therefore, a force to open to the outside of the substrate can be appropriately applied. Thus, the crack generated along the scribe line appropriately penetrates and extends, and the substrate can be smoothly and satisfactorily divided along the scribe line.
In this case, the dividing device may include a control unit that controls the pressure adjusting unit, and the control unit may be configured to adjust the pressure of the first chamber and the pressure of the second chamber during the division of the substrate so that the first surface of the substrate is in contact with the inner wall surface of the lid.
According to the dividing device of the present aspect, when a higher pressure is applied to the second chamber than to the first chamber, the first surface of the substrate comes into contact with the inner wall surface of the lid. That is, the membrane stops bulging at the time when the first surface of the substrate comes into contact with the inner wall surface of the lid. This reduces the force that excessively acts on the substrate outside the scribe line, and prevents the substrate from being cracked at an undesired portion of the substrate.
The inner wall surface of the lid may be formed in a spherical shape.
According to the dividing device of the present embodiment, the shape of the diaphragm and the substrate along the inner wall surface becomes spherical by applying a higher pressure to the second chamber than to the first chamber. That is, the diaphragm and the substrate are curved with a certain curvature. Thereby, a force to open the scribe line on the substrate to the outside of the substrate is uniformly applied. This facilitates uniform penetration of the crack along the scribe line, and the penetrated crack smoothly extends. This enables the substrate to be divided more smoothly and satisfactorily along the scribe line.
The dividing device according to the first and second aspects may further include a position adjusting portion for placing the membrane at a predetermined position of the main body portion.
According to the dividing device of the present aspect, since the diaphragm can be placed at a predetermined position on the main body, positional displacement in the cavity can be prevented. Thus, when the second chamber is pressurized higher than the first chamber and the diaphragm bulges, the substrate is bent well, and the substrate can be divided along the scribe line.
In this case, the configuration may be: the peripheral edge portion of the diaphragm is fixed to a frame, the frame has a groove portion recessed toward the inside of the diaphragm, and the position adjusting portion has a pin that is provided in the main body portion and that fits into the groove portion of the frame.
According to the dividing apparatus of the present embodiment, first, the film sheet to which the substrate is attached is fixed to the frame. When the frame is installed in the cavity, the frame is placed on the body, which is the cavity, such that the pins are fitted into the grooves of the frame. In this way, the substrate can be positioned at an appropriate position in the cavity with a simple configuration.
The frame may have two groove portions in a V-shape, and two pins engaged with the groove portions, one of the pins may contact both sides of one of the groove portions, and the other pin may contact both sides of the other groove portion.
According to the dividing device of the present aspect, one pin is in contact with one groove portion at two points. Therefore, the frame does not move in the direction of the contact point connecting the one pin and the one groove portion. However, with this structure alone, the frame can rotate about one pin. In the present structure, the rotation is restricted by the other pin engaging with the other groove. Therefore, the frame can be appropriately placed on the main body portion, and the substrate can be appropriately positioned.
In the dividing device according to this aspect, the lid portion may be guided to the upper surface of the main body portion by a guide plate attached to a side surface of the main body portion such that an upper portion thereof protrudes from the side surface of the main body portion, and an inclined surface that descends toward the main body portion may be formed on a surface of the upper portion on the side of the main body portion.
According to the dividing device of the present aspect, the side surface of the lid portion can be stacked on the main body portion from above along the inclined surface formed on the upper portion of the guide plate. This makes it possible to appropriately stack the lid portion on the body portion without causing the lid portion to deviate from the body portion.
In the dividing device according to the present aspect, the main body portion and the lid portion may be fixed at two sets of diagonal positions by toggle clamps (toggle clamps).
According to the partitioning device of the present embodiment, the body section and the lid section can be fixed to each other without a gap being generated between the body section and the lid section. Thereby, the first chamber and the second chamber are brought into a sealed state, and a predetermined pressure is applied to the first chamber and the second chamber. Further, the first chamber and the second chamber can be brought into a sealed state when different pressures are applied to the first chamber and the second chamber. Therefore, the first chamber and the second chamber are adjusted to a predetermined pressure. In addition, when the first chamber is opened to atmospheric pressure and a positive pressure is applied to the second chamber, only the second chamber can be brought into a sealed state.
In the dividing device according to the present aspect, the cover may be configured to have a transparent portion that can visually observe the substrate held in the cavity.
According to the partitioning device of the present aspect, the cavity can be observed through the lid portion. Therefore, it is possible to confirm whether or not the substrate is held in the chamber in an appropriate posture, and therefore, the user can appropriately correct the posture of the substrate, and the substrate can be more stably divided. Further, when the user operates the pressure adjusting portion, the pressure can be adjusted while checking the bulging state of the diaphragm.
A third aspect of the present invention relates to a method for dividing a substrate (a dividing method by the dividing apparatus of the first embodiment). A dividing method according to an aspect of the present invention divides a substrate, in which a predetermined scribe line is formed on a first surface, a second surface opposite to the first surface is bonded to a film sheet, along the scribe line, holds the substrate in a cavity so as to form a first chamber on the first surface side and a second chamber on the second surface side with the film sheet interposed therebetween, adjusts pressures of the first chamber and the second chamber, maintains the substrate in a predetermined posture in the cavity, and pushes up the substrate toward the first chamber side while moving a pressing member in an arrangement direction of the scribe line in the second chamber.
According to the splitting method of the present invention, the same effects as those of the first embodiment are obtained.
A fourth aspect of the present invention relates to a method for dividing a substrate (a dividing method based on the dividing apparatus of the second embodiment). In the dividing method of the present embodiment, a substrate having a first surface on which a predetermined scribe line is formed and a second surface opposite to the first surface, which is bonded to a diaphragm, is divided into individual elements along the scribe line, the substrate is held in a cavity so that a first chamber on the first surface side and a second chamber on the second surface side are formed with the diaphragm interposed therebetween, and the pressure in the first chamber and the pressure in the second chamber are adjusted so that the pressure in the second chamber becomes higher than that in the first chamber.
According to the segmentation method according to the present invention, the same effects as those of the second embodiment are obtained.
In the dividing method according to the present aspect, the substrate may be bonded to the film sheet after the film sheet is previously given a tension.
According to the dividing method of the present invention, the tension is uniformly applied to the entire area of the membrane. When the substrate is bonded to such a diaphragm and pressure is applied to the first chamber and the second chamber so that the pressure in the second chamber is higher than that in the first chamber, the diaphragm is more likely to bulge toward the cover portion side. This also facilitates the substrate to be bent, and the substrate can be more easily and satisfactorily divided along the scribe lines.
In this case, when the film tension is applied in the same direction as the forming direction of the scribe line on the substrate, it becomes easier to more appropriately apply a force to the scribe line to open to the outside of the substrate when the substrate is bent. This makes it possible to more easily and satisfactorily divide the substrate.
Drawings
Fig. 1 is a perspective view showing the overall configuration of a dividing device according to a first embodiment.
Fig. 2 is a schematic view showing an air flow path in the partitioning devices according to the first and second embodiments.
Fig. 3 (a) is a perspective view showing the structure of the substrate of the dividing device according to the first embodiment. Fig. 3 (b) is a perspective view showing the configuration of the main body portion of the splitting apparatus and the splitting apparatus according to the first embodiment.
Fig. 4 is a perspective view showing the structure of a dividing mechanism of the dividing device according to the first embodiment.
Fig. 5 is a partially exploded perspective view of the pressing unit of the splitting apparatus according to the first embodiment.
Fig. 6 is a partially exploded perspective view of the moving unit of the splitting apparatus according to the first embodiment.
Fig. 7 (a) to 7 (c) are perspective views each showing the structure of the lid portion of the splitting apparatus according to the first embodiment. Fig. 7 (a) is a perspective view showing the structure of the outer lid. Fig. 7 (b) is a perspective view showing the structure of the outer lid viewed from a direction different from that of fig. 7 (a). Fig. 7 (c) is a perspective view of the member housed in the outer cover.
Fig. 8 is a sectional view of the cavity of the partitioning device according to the first and second embodiments.
Fig. 9 (a) and 9 (b) are views for explaining the air flow paths of the partitioning device 1 according to the first and second embodiments, respectively, and are partially enlarged views on the X-axis positive side of fig. 8.
Fig. 10 (a) to 10 (d) are views for explaining alignment of the substrates in the dividing devices according to the first and second embodiments, respectively. Fig. 10 (a) is a diagram showing a state in which a pin is inserted into a groove portion of a frame. Fig. 10 (b) is a partially enlarged view of fig. 10 (a). Fig. 10 (c) is a view schematically showing a rotation operation of the frame. Fig. 10 (d) is a partially enlarged view of fig. 10 (a).
Fig. 11 is a flowchart showing a substrate dividing step using the dividing apparatus according to the first embodiment.
Fig. 12 (a) to 12 (c) are schematic views each showing a substrate dividing operation of the dividing device according to the first embodiment.
Fig. 13 (a) and 13 (b) are schematic views each showing a substrate dividing operation of the dividing apparatus according to the first embodiment.
Fig. 14(a) is a diagram schematically showing the configuration of the dividing device according to the first embodiment. Fig. 14(b) is a diagram schematically showing the configuration of the moving unit of the dividing device according to the first embodiment (2).
Fig. 15 is a block diagram showing the configuration of the dividing device according to the first embodiment (2).
Fig. 16 is a flowchart showing a substrate dividing step using the dividing apparatus according to modification 1 of the first embodiment.
Fig. 17 (a) to 17 (d) are schematic diagrams showing a substrate dividing operation of the dividing apparatus according to modification 1 of the first embodiment.
Fig. 18 is a perspective view showing the entire configuration of the dividing device according to the second embodiment.
Fig. 19 (a) is a perspective view showing the structure of the substrate of the dividing device according to the second embodiment. Fig. 19 (b) is a perspective view showing the structure of the main body of the splitting apparatus according to the second embodiment.
Fig. 20 is a flowchart showing a substrate dividing step by the dividing apparatus of the second embodiment.
Fig. 21 (a) to 21 (d) are schematic views each showing a substrate dividing operation by the dividing device according to the second embodiment.
Fig. 22 is a diagram schematically showing the configuration of the dividing apparatus according to the second embodiment.
Fig. 23 is a block diagram showing the configuration of the dividing device according to the second embodiment.
Fig. 24 (a) to 24 (d) are schematic views each showing a substrate dividing operation of the dividing device according to the modification example of the second embodiment.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, the X, Y, and Z axes orthogonal to each other are shown in the drawings. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is vertical. The positive side of the Z axis is the upper side, and the negative side of the Z axis is the lower side.
[ Structure of dividing device ]
The dividing apparatus 1 of the present embodiment is used to divide a ceramic substrate, which is a material of a semiconductor device widely used in electronic devices and the like, into a plurality of pieces. Hereinafter, in the present embodiment, the ceramic substrate 100 is simply denoted as "substrate 100".
Fig. 1 is a perspective view showing the overall configuration of a partitioning device 1 according to a first embodiment. Fig. 18 is a perspective view showing the overall configuration of the splitting apparatus 1 according to the second embodiment.
As shown in fig. 18, the partitioning device 1 of the second embodiment has a chamber 20 and a pressure adjusting portion 400, and as shown in fig. 1, the partitioning device 1 of the first embodiment further has a partitioning mechanism 30.
The cavity 20 holds the substrate 100 (see fig. 3a and 19 a). The cavity 20 is composed of a main body 200 and a lid 300. When the substrate 100 is placed at a predetermined position of the body 200 and the lid 300 is placed on the body 200, a space is formed on the body 200 side and the lid 300 side, respectively, with the diaphragm 110 to which the substrate 100 is attached interposed therebetween. In the present embodiment, the space formed on the lid 300 side in the cavity 20 will be referred to as a "first chamber 21", and the space formed on the body 200 side will be referred to as a "second chamber 22".
Since the substrate 100 is held in the cavity 20, the substrate 100 is not shown in fig. 1 and 18. Note that the diaphragm 110 to which the substrate 100 is attached is not shown in fig. 1 and 18. The configurations of the substrate 100, the main body 200, and the lid 300 will be described in detail with reference to fig. 3 (a), 3 (b), 7 (a) to 11, and 19 (a) to 20.
The dividing mechanism 30 divides the substrate 100 by pushing it up from below. Since a part of the dividing mechanism 30 is disposed inside the main body 200, a part of the dividing mechanism 30 is illustrated in fig. 1. The structure of the dividing mechanism 30 will be described in detail with reference to fig. 3 (b) to 6.
As shown in fig. 1 and 18, the pressure adjustment portion 400 includes: a first regulator 410, a second regulator 420, a first speed controller 430, a second speed controller 440, a valve 450, and a compressed air source 460. In fig. 1 and 18, first speed controller 430 and compressed air source 460 are not shown. First speed controller 430 is shown in fig. 7 (a), and compressed air source 460 is shown in fig. 2.
In fig. 1 and 18, the valve 450 is provided on the first regulator 410 side, and is also connected to the second regulator 420 via a pipe not shown. The air flowing from the compressed air source 460 is distributed to the first regulator 410 side and the second regulator 420 side via the valve 450.
The first regulator 410 and the first speed controller 430 are connected by a pipe not shown. Similarly, the second regulator 420 and the second speed controller 440 are connected by a pipe not shown.
The valve 450 is connected to a compressed air source 460 via a pipe not shown. When the valve 450 is opened by operating the switch 451 of the valve 450, air from the compressed air source 460 flows into the first and second regulators 410 and 420 through the valve 450.
The first and second regulators 410 and 420 regulate the pressure of the inflow air. The first regulator 410 is a regulator with a gauge 411, and the user manually operates a knob 412 to adjust the pressure to a predetermined pressure. The second regulator 420 is also a regulator with a gauge 421, similar to the first regulator 410, and the user manually operates the knob 422 to adjust the pressure to a predetermined pressure.
The first speed controller 430 and the second speed controller 440 adjust the flow rates of the air flowing in from the first regulator 410 and the second regulator 420, respectively. The user operates a knob 431 (see fig. 7 a) coupled to a needle valve (not shown) in the first speed controller 430 to adjust the flow rate of air. Similarly, the user operates a knob 441 (see fig. 3 b) coupled to a needle valve (not shown) in the second speed controller 440 to adjust the flow rate of air in the second speed controller 440.
Fig. 2 is a schematic view showing an air flow path in the partitioning device 1.
As shown in fig. 2, the air flowing from the compressed air source 460 flows into the first regulator 410 continuing to the first chamber 21 side and the second regulator 420 continuing to the second chamber 22 side, respectively, via the valve 450. The air flowing into the first regulator 410 flows into the first chamber 21 through the first speed controller 430. The air flowing into the second regulator 420 flows into the second chamber 22 through the second speed controller 440.
As shown in fig. 2, a switching valve 470 is provided between the first chamber 21 and the first speed controller 430. The switching valve 470 is a valve that switches when the air or atmospheric pressure from the compressed air source 460 is made to flow into the first chamber 21.
Fig. 3 (a) and 19 (a) are perspective views of the substrate 100.
As shown in fig. 3 (a) and 19 (a), lattice-shaped scribe lines are formed on the first surface 101 of the substrate 100. That is, scribe line L1 along the X axis direction and scribe line L2 along the Y axis direction are formed so as to be orthogonal to each other on substrate 100. Further, a film 110 is bonded to a second surface 102 which is a surface opposite to the first surface 101 of the substrate 100. In addition, scribe lines L1 and L2 are not formed on second surface 102.
The material of the diaphragm 110 is not particularly limited as long as it is a material having elasticity. Examples of the material of the diaphragm 110 include polyimide resin, polyester resin, polyethylene resin, cellophane, and the like.
As shown by the broken lines in fig. 3 (a) and fig. 19 (a), the outer peripheral edge of the membrane sheet 110 is bonded to the lower surface side of the frame 120. Thus, the frame 120 holds the diaphragm 110.
As shown in fig. 3 (a) and 19 (a), the frame 120 has a first groove 121 and a second groove 122 aligned in the X-axis direction and located on the Y-axis positive side. The first groove 121 and the second groove 122 are formed in a V shape and are recessed inward of the diaphragm 110. The first groove 121 has an acute angle-shaped recess when viewed from the Z-axis positive side, and the second groove 122 has an obtuse angle-shaped recess when viewed from the Z-axis positive side. The first groove 121 and the second groove 122 are respectively fitted with pins 220 and 221 to be described later.
In the present embodiment, unless otherwise specified, the description "the substrate 100 is placed on the main body 200" or "the frame 120 is placed on the main body 200" means that "the frame 120 holding the diaphragm 110 to which the substrate 100 is attached is placed on the main body 200". As described above, in the present embodiment, the substrate 100, the diaphragm 110, and the frame 120 are integrally formed.
Fig. 3 (b) and 19 (b) are perspective views showing the structure of the main body 200 according to the first and second embodiments.
As shown in fig. 3 (b) and 19 (b), the main body 200 includes: housing 210, pins 220, pins 221, guide plates 230, toggle clamps 240, and legs 250. In the splitting apparatus 1 according to the first embodiment, the splitting mechanism 30 is provided in the main body 200. In addition, the toggle clamps 240 are shown in fig. 1 and 18, and the toggle clamps 240 are omitted in fig. 3 (b) and 19 (b).
The case 210 has a rectangular parallelepiped shape, and the substrate 100 is placed on the upper surface 211. The housing 210 has a cylindrical recess 213 formed from the upper surface 211 to the bottom surface 212. The inner surface and the bottom surface 212 of the recess 213 constitute the side surface and the bottom surface of the second chamber 22, respectively.
In the first embodiment, the dividing mechanism 30 is provided in the recess 213. The dividing mechanism 30 divides the substrate 100 while moving in the space surrounded by the inner surface of the recess 213 and the bottom surface 212. The dividing mechanism 30 is provided in two. One dividing mechanism 30 moves in the X-axis direction to divide the substrate 100 along the scribing line L2. The other dividing mechanism 30 moves in the Y-axis direction to divide the substrate 100 along the scribing line L1. The two dividing mechanisms 30 are identical, but have different moving directions.
The housing 210 has four side surfaces 214a to 214d, and four corners 215 are chamfered in the Z-axis direction. A toggle clamp 240 (see fig. 1) is attached to each corner 215.
Pins 220 and 221 are provided at predetermined positions on upper surface 211 so that substrate 100 is positioned at the center of upper surface 211. In fig. 3 (b) and 19 (b), the pins 220 and 221 are arranged in the X-axis direction on the Y-axis positive side of the upper surface 211 of the housing 210. The pins 220, 221 are the same size.
The main body 200 is provided with four guide plates 230 each having a rectangular lower portion 231 and a table-shaped upper portion 232. The lower portion 231 of each guide plate 230 is attached to the side surfaces 214a to 214d so that the upper portion 232 of the guide plate 230 extends beyond the side surfaces 214a to 214 d.
In the upper part 232 of the guide plate 230, an inclined surface 233 that descends toward the housing 210 is formed on the surface on the housing 210 side. Further, a hole 234 is formed in the upper portion 232 of the guide plate 230. A pin cylinder 235, described later, passes through the aperture 234.
The dividing mechanism 30 is provided on each of the X-axis negative side surface 214a and the Y-axis negative side surface 214 b. In this case, in order to distinguish the guide plates 230 mounted on the side surfaces 214a, 214b from the remaining two guide plates 230, they are labeled as 230a, 230 b.
The guide plates 230a, 230b are respectively formed with holes 236 for passing through the shaft portion 52 of the partition mechanism 30. The side surfaces 214a and 214b are formed with holes 217 for passing through the dividing mechanism 30.
The dividing mechanism 30 provided on the side surface 214a and the guide plate 230a is a first dividing mechanism 31 that moves in the X-axis direction and divides the substrate 100 along the scribe line L2 formed on the substrate 100. The dividing mechanism 30 provided on the side surface 214b and the guide plate 230b is the second dividing mechanism 32, which moves in the Y-axis direction and divides the substrate 100 along the scribing line L1. The moving direction of the dividing mechanisms 30 in the chamber 20 and the divided scribing lines are different, but the structures are the same.
Returning to fig. 1 and 18, toggle clamps 240 are mounted at the four corners 215 of the housing 210, respectively. Toggle clamp 240 is a member that fixes main body 200 and lid 300.
As shown in fig. 3 (b) and 19 (b), a second speed controller 440 is attached to the side surface 214 c. Therefore, a hole 216 is formed in the side surface 214c, and the hole 216 is used to convey the air flowing out from the second speed controller 440 to the second chamber 22, that is, the recess 213.
The legs 250 are provided at four corners of the bottom surface of the case 210, respectively, and support the entire partitioning device 1.
Next, the structure of the dividing mechanism 30 according to the first embodiment will be described with reference to fig. 4 to 6. In the following description, the first dividing mechanism 31 that moves in the X-axis direction in fig. 1 and 3 (b) and divides the scribe line L2 is focused on the two dividing mechanisms 30.
Fig. 4 is a perspective view showing the structure of the first dividing mechanism 31.
As shown in fig. 4, the first dividing mechanism 31 has a pressing unit 40 and a moving unit 50. The pressing unit 40 presses the substrate 100 from the second chamber 22 side through the diaphragm 110 to push the substrate up to the first chamber 21 side. The moving unit 50 is used to move the pressing unit 40.
The moving unit 50 has: a support portion 51 and a shaft portion 52. The pressing unit 40 is disposed above the support portion 51. The pressing unit 40 and the moving unit 50 are connected via a support portion 51.
Fig. 5 is a partially exploded perspective view showing the structure of the pressing unit 40 in the first mechanism 31.
As shown in fig. 5, the pressing unit 40 includes a pressing member 41, a receiving portion 42, and a magnet 43.
The pressing member 41 is a member for pushing up the substrate 100 from the second chamber 22 to the first chamber 21 side via the diaphragm 110. The pressing member 41 is a roller extending along the forming direction of the scribing line L2. In fig. 5, the pressing member 41 extends in the Y-axis direction.
The diameter of the pressing member 41 is set by the distance between the adjacent scribe lines L2 (or scribe line L1), the size and weight of the substrate 100, and the like. The pressing member 41 is made of a magnetic material (magnetic material). The pressing member 41 is formed of metal such as iron.
The receiving portion 42 is a member that receives the pressing member 41 along the entire length of the pressing member 41. A plurality of projections 44 are provided on the upper surface 42a of the receiving portion 42 at predetermined intervals. In the present embodiment, as shown in fig. 5, 6 projections 44 are provided.
Holes 42b penetrating vertically are formed near both ends in the longitudinal direction (Y-axis direction) of the upper surface 42a of the receiving portion 42. As will be described later, the hole 42b is used for inserting the linear bushing 54 from below. Further, a hole 42c is formed near the center of the upper surface 42a in the longitudinal direction.
The protrusion 44 has a recess 44 a. The bottom surface of the recess 44a is a cylindrical surface. The bottom surface of the recess 44a is formed so as to be curved with substantially the same curvature as the pressing member 41. The pressing member 41 is placed on the recess 44a of the projection 44. The receiving portion 42 and the projecting portion 44 may be integrally molded or may be separate.
The receiving portion 42 and the projecting portion 44 are formed of a material having a small friction coefficient. Examples of such a material include polyamide resin, fluororesin, polyethylene resin, and the like.
The magnet 43 is provided in a hole 42c formed in the upper surface 42a of the receiving portion 42. When the pressing member 41 is placed on the recess 44a of the protrusion 44, the pressing member 41 is attracted to the magnet 43 because the pressing member 41 is a member having magnetism. Thus, the pressing member 41 is detachably provided on the receiving portion 42.
As described above, the pressing member 41 is placed on the recess 44a of the projection 44, and therefore does not directly contact the magnet 43. The receiving portion 42 and the projection 44 are formed of a material having a small friction coefficient, and the projection 44 is provided on the upper surface 42a of the receiving portion 42 at a predetermined interval. In this way, the contact area of the pressing member 41 with the receiving portion 42 and the projection 44 is small. Thus, when the pressing unit 40 is moved in the X-axis direction with the pressing member 41 placed on the recess 44a of the projection 44, the pressing member 41 is attracted to the receiving portion 42 side by the magnetic force of the magnet 43 and rotates in the recess 44 a.
Fig. 6 is a partially exploded perspective view showing the structure of the moving unit 50 in the first dividing mechanism 31.
As shown in fig. 6, the moving unit 50 includes, in addition to the support portion 51 and the shaft portion 52, an engaging portion 53, a linear bushing 54, a spherical roller 55, a collar 56, a buffer member 57, a bearing 58, a gripping portion 59, and an eccentric cam 60.
The support portion 51 is a block member. A hole 51a is formed in the center of the upper surface of support portion 51, and holes 51b are formed in both end portions of the upper surface of support portion 51. The eccentric cam 60 is disposed in the hole 51 a. The linear bushing 54 is pressed into the hole 51 b. Two holes, not shown, are formed in the bottom surface of the support portion 51, and the fixed spherical roller 55 is pressed into these holes.
Holes 51c and 51d are formed in the X-axis positive side surface and the negative side surface of support portion 51, respectively. Further, a hole 51e is formed beside the hole 51 c. In a state where the eccentric cam 60 is provided in the hole 51a, the shaft portion 52 is fixed by passing through the hole 51d, the hole 60a of the eccentric cam 60, and the hole 51c in this order. A screw hole 60c penetrating through the hole 60a is formed in the outer periphery of the eccentric cam 60. When a screw, not shown, is screwed in from this screw hole 60c, the screw reaches the flat surface 52d of the shaft portion 52. Thus, the tip end of the screw presses the flat surface 52d of the shaft portion 52, and the shaft portion 52 and the eccentric cam 60 are integrated.
When the shaft portion 52 is fixed by passing through the hole 51d, the hole 60a of the eccentric cam 60, and the hole 51c in this order, the groove portion 52b formed in the end portion 52a of the shaft portion 52 protrudes from the hole 51c of the support portion 51. The groove 52b is formed along the outer periphery of the shaft 52.
The locking portion 53 has a ring shape divided into substantially half and has a claw portion 53a provided inward. When shaft portion 52 is inserted into support portion 51, groove portion 52b protrudes from hole 51c of support portion 51. The claw portion 53a of the locking portion 53 is fitted into the groove portion 52 b. This restricts the movement of the shaft 52 in the longitudinal direction.
The eccentric cam 60 has a semicircular groove 60 formed along the outer periphery of the eccentric cam 60 on the side surface on the X-axis positive side. When the eccentric cam 60 is disposed in the hole 51a of the support portion 51, the pin 61 is inserted into the hole 51e of the support portion 51, and the end of the pin 61 is fitted into the groove portion 60b of the eccentric cam 60. The eccentric cam 60 moves in the vertical direction while rotating with the rotation of the shaft portion 52. At this time, since the pin 61 is fitted into the groove portion 60b, when both end portions of the groove portion 60b come into contact with the pin 61, the eccentric cam 60 cannot be further rotated. In this manner, the pin 61 restricts the rotation and vertical movement of the eccentric cam 60. That is, the rotation of the shaft portion 52 is restricted by the pin 61.
The collar 56 is attached to the end 52a side of the shaft portion 52. The collar 56 restricts movement of the shaft portion 52 in the longitudinal direction. The support portion 51 moves in the longitudinal direction together with the shaft portion 52 by the engagement portion 53 and the collar 56.
The bearing 58 is a guide for moving the shaft portion 52 in the longitudinal direction. The bearing 58 is provided with a projection 58a on the X-axis positive side. When the moving unit 50 is disposed in the cavity 20, the protrusion 58a of the bearing 58 is inserted into the hole 236 of the guide plate 230a, 230 b. Thereby, the bearings 58 are connected to the guide plates 230a, 230 b.
The grip portion 59 is provided at the end portion 52c of the shaft portion 52. When the user manually operates the dividing mechanism 30, the user grips the grip portion 59 and operates the moving unit 50.
The first dividing mechanism 31 constituted by the pressing unit 40 and the moving unit 50 described above is provided in the cavity 20 as follows.
First, as shown in fig. 4 and 5, the pressing unit 40 is assembled. As shown in fig. 4 and 6, the support portion 51 is disposed in the cavity 20, i.e., the recess 213 of the housing 210, with the eccentric cam 60, the pin 61, the linear bushing 54, and the spherical roller 55 appropriately provided in the support portion 51.
As shown in fig. 3 (b), the protrusion 58a of the bearing 58 is fitted into the hole 236 of the guide plate 230 a. In this state, the shaft portion 52 passes through the bearing 58, the hole 236 of the guide plate 230a, and the hole 216 of the side surface 214a from the end portion 52a side. The buffer member 57 and the collar 56 are fitted into the shaft portion 52 that enters the recess 213 of the housing 210. Then, as described above, the end portion 52a of the shaft portion 52 is inserted into the support portion 51, and the groove portion 52b is locked by the locking portion 53. In this manner, shaft 52 is coupled to support portion 51.
Next, as shown in fig. 4, the linear bushing 54 inserted into the hole 51b of the support portion 51 is inserted into the hole 42b of the receiving portion 42. Thus, the pressing unit 40 is mounted on the moving unit 50, and the pressing unit 40 is coupled to the moving unit 50. At this time, the upper portion of the eccentric cam 60 contacts the bottom surface of the receiving portion 42 of the pressing unit 40.
The distance between the rotation center of the eccentric cam 60 and the outer side surface varies in the circumferential direction. Therefore, when the eccentric cam 60 rotates along with the rotation of the shaft portion 52, the height of the upper surface of the eccentric cam 60 changes. Since the eccentric cam 60 is in contact with the lower surface of the receiving portion 42, the receiving portion 42 is lifted by the height change of the eccentric cam 60. At this time, since the linear bushing 54 inserted into both the socket 42 and the support 51 guides the pressing unit 40, the socket 42 moves up and down without shaking.
Grip portion 59 may be provided on shaft portion 52 from the beginning, or may be provided after shaft portion 52 and support portion 51 are coupled.
In this way, the first dividing mechanism 31 is provided in the chamber 20. As described above, the second dividing mechanism 32 has the same structure as the first dividing mechanism 31. As shown in fig. 3 (b), the second dividing mechanism 32 is provided on the side surface 214b side of the cavity 20 to divide the scribe line L1.
Fig. 7 (a) to 7 (c) are perspective views showing the structure of the lid 300. Fig. 7 (a) is a perspective view showing the structure of the outer lid 310 of the lid 300, and fig. 7 (b) is a perspective view showing the structure of the outer lid 310 viewed from a direction different from that of fig. 7 (a), corresponding to fig. 7 (a). Fig. 7 (c) is a perspective view showing the members constituting the lid 300 other than the outer lid 310.
As shown in fig. 7 (a) to 7 (c), the lid 300 includes an outer lid 310, an inner lid 320, a gasket 330, and a baffle 340.
The outer cover 310 includes a base 311, a protrusion 312, and two grip portions 313. The projection 312 and the two gripping portions 313 are provided on the upper surface 311a of the table 311. The stage 311 forms a hole 311b in a central portion. The table 311 has four side surfaces 311c and four corners 311d chamfered in the Z-axis direction, similarly to the case 210 of the main body 200. In the upper surface 311a, recesses 311e are formed at four corners, respectively.
As shown in fig. 7 (b), a first speed controller 430 is mounted on one side 311c of the four sides 311c of the table 311. Therefore, in this side surface 311c, a hole 311f for sending the air flowing out from the first speed controller 430 to the first chamber 21 is formed. Further, in each side surface 311c, a hole 311g for inserting the pin cylinder 235 is formed.
As shown in fig. 7 (b), an annular gasket 314 is provided on the bottom surface 311h of the base 311 in order to improve the sealing performance of the body 200.
As shown in fig. 7 (a), the projection 312 is formed in a cylindrical shape. The outer diameter of the protrusion 312 is substantially the same as the diameter of the hole 311b of the table 311. The land 311 is integrally formed with the protrusion 312.
Examples of the material of the outer cover 310 include resin such as plastic, metal such as aluminum, and alloy such as stainless steel.
As shown in fig. 1, 18 and 7 (c), the inner lid 320 is fitted into the protrusion 312 to form an inner wall of the lid 300. The inner lid 320 has a cylindrical shape in appearance, and an upper surface 321 is formed in a horizontal plane parallel to the X-Y plane. The bottom surface 322 forms a hemispherical recess. The upper surface 321 has a diameter slightly smaller than the outer diameter of the protrusion 312. The shape of the bottom surface 322 of the inner lid 320 is not shown in fig. 7 (c), but is shown in fig. 8, 9 (a), and 9 (b).
The material of the inner lid 320 may be glass or transparent acrylic resin, for example. When the inner lid 320 is formed of the material described above, the inside of the cavity 20 can be visually observed.
The gasket 330 is an annular member, and is interposed between the protrusion 312 of the outer cover 310 and the inner cover 320, whereby the degree of adhesion between the outer cover 310 and the inner cover 320 can be improved. The radial width of the gasket 330 is equal to the radial width of the bottom surface 312a (indicated by oblique lines in fig. 7 (b)) of the protrusion 312. The gasket 330 is fixed to this bottom surface 312 a.
Further, as a material of the gasket 330, for example, rubber is cited.
The baffle 340 is an annular member disposed below the bottom surface 322 of the inner lid 320, reinforcing the inner lid 320. The outer diameter and the inner diameter of the baffle 340 are equal to those of the gasket 330.
Examples of the material of the baffle 340 include resin compounds such as plastics, metals such as aluminum, and alloys such as stainless steel.
Fig. 8 is a cross-sectional view of the cavity 20 when viewed from the Y-axis negative side, and the cavity 20 is viewed in the state shown in fig. 1 and 18, that is, in the state where the lid 300 is placed on the main body 200. In fig. 8, the toggle clamp 240 is omitted.
As shown in fig. 8, in the cavity 20, a first chamber 21 is formed on the lid 300 side and a second chamber 22 is formed on the body 200 side with the diaphragm 110 interposed therebetween.
A slight gap 301 is formed between the outer cap 310 and the inner cap 320. The first speed controller 430 is inserted into the hole 311f of the stage 311 of the outer cover 310, and the air flowing from the first speed controller 430 flows out of the gap 301 through the hole 311f to fill the first chamber 21.
Fig. 9 (a) and 9 (b) are views for explaining the path of air, and are partially enlarged views on the X-axis positive side of fig. 8. In fig. 9 (a) and 9 (b), the upper portion of the diaphragm 110, i.e., the lid 300 side, is shown. Fig. 9 (a) shows a path in a case where air flows into the first chamber 21. Fig. 9 (b) shows a path in the case where air is discharged from the first chamber 21.
As shown by the chain line in fig. 9 (a), the air flowing from the first speed controller 430 passes through the gap 301 formed between the outer cover 310 and the inner cover 320 through the hole 311 f. Then, the fluid flows into the first chamber 21, which is a space between the inner lid 320 and the substrate 100, through the gap 302 between the baffle 340 and the diaphragm 110.
In the case of discharging the air in the first chamber 21, the air passes through a path opposite to fig. 9 (a). That is, as shown in fig. 9 (b), the air in the first chamber 21 passes through the gap 302 and the gap 301 in this order, and flows into the first speed controller 430 through the hole 311 f. Then, the air passes through the first speed controller 430 and the first regulator 410, and is discharged to the outside.
Next, the positional alignment of the substrate 100 held in the cavity 20 will be described with reference to fig. 10 (a) and 10 (b).
Fig. 10 (a) is a plan view of the case 200 with the substrate 100 placed on the upper surface 211 of the case 210. Fig. 10 (b) and 10 (d) are enlarged views of the vicinity of the pin 220 and the pin 221 in fig. 10 (a), respectively. Fig. 10 (c) is a view schematically showing a case where frame 120 rotates when only pin 220 is provided on upper surface 211 of case 210. In fig. 10 (a) and 10 (c), only the frame 120, the pin 220, and the pin 221 are shown.
As shown in fig. 10 (a), when the substrate 100 is placed on the main body 200, the pins 220 and 221 are fitted into the first groove 121 and the second groove 122 of the frame 120, respectively. At this time, as shown in fig. 10 (b), the pin 220 contacts the first groove portion 121 at two points.
If the pin provided in the main body 200 is only the pin 220, the frame 120 does not move at least in the X-axis direction when the first groove 121 of the frame 120 is fitted into the pin 220, as in the case of fig. 10 (a). However, as shown by the dotted line in fig. 10 (c), the frame 120 can rotate in the X-Y plane around the pin 220. Thus, the substrate 100 cannot be positioned at an appropriate position of the body 200, that is, the substrate 100 cannot be positioned at a central portion of the upper surface 211 of the case 210.
Therefore, as shown in fig. 10 (a), a pin 221 is provided on the upper surface 211 of the housing 210 so as to be aligned with the pin 220 in the X-axis direction. As shown in fig. 10 (d), the second groove portion 122 is formed in a shape having an obtuse end with respect to the first groove portion 121. Thus, when the pin 220 is rotated in a state of being fitted into the first groove portion 121, the pin 221 inevitably contacts the second groove portion 122 at a single point. This can restrict the rotation of the frame 120 in the X-Y plane.
The first dividing mechanism 31 is disposed at a position where the substrate 100 is divided along the scribe line L1, and the second dividing mechanism 32 is disposed at a position where the substrate 100 is divided along the scribe line L2. Thus, as described above, the substrate 100 is appropriately positioned in the cavity 20, and when the shaft portion 52 of each dividing mechanism 30 moves in the longitudinal direction, each pressing member 41 is positioned directly below the scribe line L1 or the scribe line L2. Thereby, the substrate 100 is divided along the scribe lines L1 and L2.
Next, the alignment of the lid 300 with respect to the body 200 will be described with reference to fig. 1, 18, 3 (a), 3 (b), 19 (a) to 19 (c), 7 (a), and 7 (b). In the following description, a case where the user places the lid 300 on the body 200 will be described.
When the user places the lid 300 on the body 200, the user grips the grip 313 of the lid 300 shown in fig. 1 and 7 (a), lifts the lid 300, and places the lid 300 on the body 200. At this time, the user adjusts the direction of the lid 300 so that the four corners 215 of the case 210 shown in fig. 2 and the corner 311d of the base 311 of the outer lid 310 shown in fig. 7 (a) are aligned in the Z-axis direction.
Further, when the user places the lid 300 on the main body 200, the user places the lid 300 on the main body 200 while confirming that the inclined surfaces 233 formed on the guide plates 230 (including the guide plates 230a and 230b) shown in fig. 3 (b) and fig. 19 (b) and the holes 311g formed in the side surfaces 311c of the outer lid 310 shown in fig. 7 (a) are aligned in the Z-axis direction. Thus, when the user places the lid 300 on the body 200, as shown in fig. 1 and 18, the hole 234 of the guide plate 230 faces the hole 311g of the outer cover 310, and the pin cylinder 235 can be inserted into the hole 234 and the hole 311 g. Thus, the lid 300 is properly positioned on the body 200.
Assuming that the pin cylinder 235 cannot be inserted into the hole 234 and the hole 311g, the user knows that the lid 300 is not properly positioned in the body 200. Therefore, in this case, the user may place the lid 300 on the main body 200 again.
When the lid 300 is properly positioned on the body 200, as shown in fig. 1 and 18, the four bolts 241 are brought into contact with the recesses 311e of the outer cover 310, respectively, and the body 200 and the lid 300 are fixed by toggle clamps 240.
As described above, the inner lid 320 constituting the inner wall of the lid 300 is formed of a material that allows the inside of the cavity 20 to be visually observed. Therefore, the user can see the lid 300 from above and confirm whether or not the substrate 100 is positioned at an appropriate position. Therefore, even when the position of the frame 120 is displaced while the user mounts the lid 300 on the body 200, the user may reposition the substrate 100 to the body 200 and then mount the lid 300 on the body 200.
The first groove 121, the second groove 122, the pin 220, the pin 221, and the guide plates 230a to 230d of the frame 120 are members used when the positions of the frame 120, which is the substrate 100, and the main body 200 are aligned, and when the positions of the main body 200 and the lid 300 are aligned. These components correspond to the "position adjustment portion" in the claims.
As described with reference to fig. 3 (a) and 19 (a), the outer peripheral edge of the diaphragm 110 is bonded to the frame 120. As shown in fig. 8, when the upper surface 211 of the housing 210 of the main body 200 is placed on the frame 120, the member in contact with the upper surface 211 is not the frame 120 but the diaphragm 110. Thereby, a frictional force is generated between the diaphragm 110 and the upper surface 211 of the housing 210. Therefore, once the frame 120 is positioned at a proper position of the housing 210, the frame 120 is easily stopped on the upper surface 211 of the housing 210.
Therefore, when the user places the lid 300 on the body 200, the frame 120 is less likely to be displaced so far as the lid 300 slightly contacts the frame 120, for example, except when the lid 300 strongly hits the frame 120.
[ splitting action ]
In the present embodiment (third embodiment), the dividing apparatus 1 applies pressure to the first chamber 21 and the second chamber 22 so that the substrate 100 is maintained in the horizontal direction on the X-Y plane. Then, the substrate 100 is divided by the dividing mechanism 30. In the present embodiment, the user operates the separation device 1. In the present embodiment, the term "maintaining the posture of the substrate 100" means "maintaining the posture of the substrate 100 in the horizontal direction on the X-Y plane" as described above.
In the present embodiment (fourth embodiment), the dividing apparatus 1 divides the substrate 100 by using a difference in pressure between the first chamber 21 and the second chamber 22. Specifically, the first chamber 21 is opened to atmospheric pressure, and the second chamber 22 is given a higher pressure than the first chamber 21, that is, a pressure higher than atmospheric pressure. Further, the user performs the operation of the splitting apparatus 1. Therefore, in the path of the air shown in fig. 2, the user switches the switching valve 470 to the atmospheric pressure open side.
Fig. 11 and 20 are flowcharts showing a substrate 100 dividing process using the dividing apparatus 1 according to the first and second embodiments.
< first embodiment (1) >
As shown in fig. 11, the substrate 100 is divided by the dividing apparatus 1 according to the first embodiment by the following steps: a mounting step (S11) for holding the substrate 100 in the cavity 20; a pressure adjustment step (S12) in which the user adjusts the pressure in the first chamber 21 and the second chamber 22 of the chamber 20 to a pressure that maintains the posture of the substrate 100; a dividing step (S13) of dividing the substrate 100 by the dividing mechanism 30; the pressure removal step (S14) is a step in which the user adjusts the pressure in the first chamber 21 and the second chamber 22 of the chamber 20 to remove the pressure in the first chamber 21 and the second chamber 22.
The steps S11 to S14 will be specifically described with reference to fig. 12 (a) to 12 (c), fig. 13 (a), and fig. 13 (b). In fig. 12 (a) to 13 (b), the dividing mechanism 30 is a first dividing mechanism 31 that moves in the X-axis direction to divide the scribe line L2.
Fig. 12 (a) to 13 (b) are cross-sectional views of the cavity 20 schematically showing states of the substrate 100 and the diaphragm 110 in steps S11 to S14 shown in the flowchart of fig. 11. In fig. 12 (a) to 13 (b), hatching is not added to the substrate 100 and the membrane sheet 110. In addition, the packing 330, the baffle 340, the first speed controller 430, and the hole 311f of the table 311 of the outer cover 310 shown in fig. 8 are omitted.
First, as shown in fig. 12 (a), the user properly positions the substrate 100 on the upper surface 211 of the case 210. Then, the lid 300 is placed on the main body 200, and the main body 200 and the lid 300 are fixed by toggle clamps 240. Thus, when the substrate 100 is held in the cavity 20, the main body 200 and the lid 300 are fixed. This corresponds to the mounting step (S11) of fig. 11.
In step S11, the user can observe the inside of the cavity 20 from the lid 300, confirm whether or not the substrate 100 is properly positioned on the upper surface 211 of the case 210, and perform the positional alignment of the substrate 100 again as appropriate.
When a user operates the switch 451 to open the valve 450, air flows from the compressed air source 460 to the first chamber 21 and the second chamber 22. At this time, the user adjusts the pressure to maintain the posture of the substrate 100. Specifically, the knob 412 of the first adjuster 410 is operated to make the degree of the gauge 411 coincide with a prescribed pressure. Further, the knob 431 of the first speed controller 430 is rotated to adjust the flow rate of the air to a predetermined flow rate. Similarly, the knob 422 of the second regulator 420 is operated to adjust the degree of the gauge 421 to a predetermined pressure. Further, the knob 441 of the second speed controller 440 is rotated to adjust the flow rate of the air to a predetermined flow rate.
The pressure applied to the first chamber 21 presses the substrate 100 and the diaphragm 110 downward. On the other hand, the pressure applied to the second chamber 22 presses the substrate 100 and the diaphragm 110 upward. Therefore, when the pressures applied to the first chamber 21 and the second chamber 22 are substantially the same, the forces applied to the substrate 100 and the diaphragm 110 are balanced. In this case, the posture of the substrate 100 is maintained in the horizontal direction of the X-Y plane. Therefore, substantially the same pressure is applied to the first chamber 21 and the second chamber 22. This corresponds to the pressure adjusting process (S12) of fig. 11.
In addition, for example, when the substrate 100 is heavy, the substrate 100 is held in the cavity 20 in a state of being slightly sunk toward the second chamber 22 by its own weight. In this case, when the pressures applied to the first chamber 21 and the second chamber 22 are adjusted to be the same, the posture of the substrate 100 is maintained in a state of sinking toward the second chamber 22 side without being maintained in the horizontal direction of the X-Y plane.
Therefore, in the above case, in the pressure adjustment step (S12), the pressure is adjusted so as to be slightly higher than the pressure in the first chamber 21 in the second chamber 22. In this manner, the optimum pressure is adjusted to be applied to the first chamber 21 and the second chamber 22 based on the weight and material of the substrate 100.
In the pressure adjustment step (S12), when the pressure is appropriately applied to the first chamber 21 and the second chamber 22, the division step (S13) is performed. In a state where the mounting step (S11) and the pressure adjustment step (S12) are completed, the pressing member 41 of the dividing mechanism 30 is not yet in contact with the diaphragm 110 as shown in fig. 12 (a).
The user grips the grip portion 59 of the dividing mechanism 30 to rotate the shaft portion 52, thereby raising the pressing unit 40. As described above, when the shaft portion 52 rotates, the eccentric cam 60 rotates and the upper surface of the eccentric cam 60 rises. As a result, as shown in fig. 12 (b), the receiving portion 42 in contact with the eccentric cam 60 is pushed up, and the pressing member 41 pushes up the diaphragm 110.
In a state where the pressing member 41 pushes up the diaphragm 110, the user moves the shaft portion 52 in the longitudinal direction. This moving direction is the X-axis direction. As shown in fig. 12 (c), when the user starts moving the shaft portion 52 in the longitudinal direction from the state shown in fig. 12 (b), the pressing unit 40 passes below the substrate 100 through the diaphragm 110. At this time, the substrates 100 are sequentially pushed up toward the first chamber 21 side by the pressing member 41. Thus, in the pushed-up scribe line L2, the crack formed along the scribe line L penetrates from the first surface 101 to the second surface 102 of the substrate 100. Further, penetration of such cracks extends along the scribe line L2. As a result, the substrate 100 is divided along the scribing line L2 pushed up by the pressing member 41.
As shown in fig. 13 (a), when the user moves the shaft portion 52 in the longitudinal direction and the pressing member 41 finishes passing along the second surface 102 of the substrate 100, the substrate 100 is divided along all the scribe lines L2 formed in the substrate 100.
As shown in fig. 13 (b), the user rotates the shaft 52 to lower the pressing unit 40. Thereby, the pressing member 41 is separated from the substrate 100. Then, the shaft 52 is moved in the X-axis negative direction to return the pressing member 41 to the initial position, i.e., the state (a) of fig. 12.
After dividing the substrate 100 along the scribe line L2, the user operates the second dividing mechanism 32 to divide the substrate 100 along the scribe line L1. The dividing process by the second dividing mechanism 32 is the same as described above except that the moving direction of the pressing member 41 is the Y-axis direction. In this way, the user divides the substrate 100 along the scribe lines L1 and L2. This corresponds to the dividing step (S13) of fig. 11.
The user can confirm that the substrate 100 is divided by viewing the lid 300 from above. When dividing the substrate 100, the user operates the second regulator 420 and the second speed controller 440 to reduce the pressure of the first chamber 21 and the second chamber 22 to the atmospheric pressure. This corresponds to the decompression process (S14) of fig. 11. In this way, the substrate 100 is divided by the dividing apparatus 1.
After the pressure removing process (S14), the user operates the switch 451 to close the valve 450. Then, the lid 300 is opened together with the frame 120 to take out the substrate 100. The individual pieces 10 are separated from the substrate 100 taken out by a predetermined method.
< Effect of the first embodiment >
According to the first embodiment, the following effects can be obtained.
As shown in fig. 8 and 12 (a) to 13 (b), a first chamber 21, which is a space on the lid 300 side, and a second chamber 22, which is a space on the body 200 side, are formed in the cavity 20 of the partitioning device 1 with the diaphragm 110 interposed therebetween. The pressure of the first chamber 21 and the pressure of the second chamber 22 are adjusted by the pressure adjusting unit 400 so that the substrate 100 is maintained in a predetermined posture. That is, substantially the same pressure is applied to the first chamber 21 and the second chamber 22 so that the posture of the substrate 100 is maintained in the horizontal direction on the X-Y plane.
Thus, since the posture of the substrate 100 is maintained, the substrate 100 can be prevented from being shaken on the diaphragm 110 while the pressing member 41 moves along the second surface 102 of the substrate 100.
Further, the pressing member 41 pushes up the substrate 100 toward the first chamber 21 side while moving along the second surface 102 of the substrate 100. When the pressing member 41 pushes up the scribe lines L1, L2, a force that opens to the outside of the substrate 100 is applied to the pushed-up scribe lines L1, L2. Thus, the cracks generated along scribe lines L1 and L2 penetrate from first surface 101 to second surface 102 of substrate 100 and extend along scribe lines L1 and L2. Thus, the substrate 100 is divided. In this way, when the pressing member 41 is moved along the second surface 102 of the substrate 100, the substrate 100 can be easily divided.
Further, as described above, since cracks penetrate from the first surface 101 to the second surface 102 of the substrate 100, chipping and burring occurring on the end surfaces of the divided substrates 100 can be suppressed, and a good single piece 10 can be obtained.
Further, in the dividing apparatus 1, a member or the like that contacts the first surface 101 of the substrate 100 is not provided. Therefore, even when the semiconductor component is mounted on the first surface 101 of the substrate 100, the substrate 100 can be divided by the dividing apparatus 1. That is, the first surface 101 of the substrate 100 is maintained in a non-contact state. Therefore, the substrate 100 can be divided without affecting the quality after division.
As shown in fig. 4 to 6, the dividing mechanism 30 is composed of a pressing unit 40 and a moving unit 50. The pressing unit 40 includes a pressing member 41 extending along the scribe lines L1, L2, and the moving unit 50 includes a support portion 51 detachably supporting the pressing unit 40. The support portion 51 is connected to the shaft portion 52, and the shaft portion 52 moves in the longitudinal direction.
As support portion 51 moves through shaft portion 52 in this manner, pressing member 41 is positioned in order directly below score lines L1 and L2 and along score lines L1 and L2. At this time, when the pressing unit 40, that is, the pressing member 41 is in a state of being pushed up toward the first chamber 21 side, the pressing member 41 pushes up the second surface 102 of the substrate 100 along the scribing lines L1, L2, and a force of opening to the outside of the substrate 100 is applied to the scribing lines L1, L2. Thus, the cracks generated along the scribe lines L1 and L2 penetrate more favorably from the first surface 101 to the second surface 102, and smoothly extend along the scribe lines L1 and L2. As a result, the substrate 100 is well divided.
Further, the pressing unit 40 can be detached from the support portion 51. Therefore, the substrate 100 can be divided using the pressing unit 40 having the appropriate pressing member 41 according to the size of the substrate 100.
As shown in fig. 6, the moving unit 50 includes a locking portion 53 for locking the support portion 51 and the groove portion 52b of the shaft portion 52, and a collar 56. Therefore, the movement of the shaft portion 52 in the longitudinal direction is restricted. Therefore, the pressing unit 40 can be prevented from being excessively moved to collide with the inner surface of the case 210, that is, the inner surface of the recess 213.
Further, the moving unit 50 includes an eccentric cam 60, and the shaft portion 52 is inserted into the eccentric cam 60. Therefore, when the shaft 52 is rotated, the eccentric cam 60 moves up and down while rotating. Thereby, the receiving portion 42 abutting against the eccentric cam 60 moves up and down. That is, the pressing member 41 can be lifted and lowered by rotating the shaft 52. In this manner, the pressing member 41 can be easily moved up and down by simply rotating the shaft 52.
Further, a groove portion 60b is formed in the eccentric cam 60, and the pin 61 is fitted into the groove portion 60 b. The amount of lifting of the pressing unit 40 is determined by the eccentric cam 60, and the excessive rotation of the eccentric cam 60 is restricted by the pin 61. That is, the pressing unit 40 can be prevented from being excessively lifted. Therefore, even when the user manually rotates the shaft portion 52, for example, the pressing unit 40 can be stably and appropriately raised when the substrate 100 is divided, and the substrate 100 can be divided satisfactorily.
Further, the height of the pressing unit 40 is adjusted using the shaft portion 52 for moving the pressing unit 40. Therefore, the structures of the pressing unit 40 and the moving unit 50 can be simplified.
As shown in fig. 5, the receiving portion 42 that receives the pressing member 41 detachably supports the pressing member 41. This enables the pressing member 41 to be removed from the receiving portion 42. Therefore, for example, in the case where the pressing member 41 deteriorates, the pressing member 41 can be replaced with a new one.
The pressing member 41 is a magnetic member, and a magnet 43 is provided on the receiving portion 42. Thus, the pressing member 41 is provided on the receiving portion 42 by the magnetic force of the magnet 43. Therefore, the pressing member 41 can be easily and smoothly removed from the receiving portion 42.
Further, the pressing member 41 has a curved shape with a uniform curvature over the entire length. Thereby, when the curved shape portions of the pressing member 41 are located at the scribing lines L1, L2, the force of opening to the outside of the substrate 100 is uniformly applied at the scribing lines L1, L2. Thus, the cracks generated along the scribe lines L1 and L2 penetrate substantially vertically from the first surface 101 to the second surface 102. When such a crack extends along scribe lines L1 and L2, substrate 100 is divided in a substantially vertical direction along scribe lines L1 and L2. As a result, chipping and burring occurring on the end surfaces of the divided substrates 100 are reduced, and good single pieces 10 can be obtained.
Further, the pressing member 41 is a roller extending along the forming direction of the scribing lines L1, L2. For example, in the case where the pressing member 41 is not a roller, the pressing member 41 is difficult to move along the second surface 102 of the substrate 100 due to friction with the film 110. In view of this, since the pressing member 41 of the dividing device 1 is a roller, it can smoothly move along the second surface 102 of the substrate 100.
For example, in the case of the film bonding substrate 100 having a small friction coefficient, the pressing member 41 may not be a roller in the case where almost no friction is generated between the pressing member 41 and the film 110 or only a very small frictional force is generated.
As shown in fig. 5, the receiving portion 42 is provided with a projection 44 so that the magnet 43 does not directly contact the pressing member 41. The projections 44 are provided on the receiving portion 42 at predetermined intervals. In this manner, the receiving portion 42 and the projection 44 are formed so that the contact area with the pressing member 41 is reduced. Therefore, the pressing member 41 placed on the projection 44 receives the magnetic force from the magnet 43, is attracted to the receiving portion 42 side, and rotates by the movement of the shaft 52.
As shown in fig. 3 (a) and 3 (b), the scribe lines L1 and L2 are formed in a lattice shape on the substrate 100, and the dividing mechanism 30 includes a portion dividing the scribe line L1 and a portion dividing the scribe line L2.
Therefore, when the lattice-shaped scribe lines L1 and L2 are formed on the substrate 100, after one dividing mechanism 30 (second dividing mechanism 32) divides the substrate 100 along the scribe line L1, the other dividing mechanism 30 (first dividing mechanism 31) subsequently divides the substrate 100 along the scribe line L2. In this manner, the substrate 100 can be efficiently divided into the individual pieces 10 along the lattice-shaped scribe lines L1 and L2.
Note that the scribe line formed on the substrate 100 may be only the scribe line L1 or only the scribe line L2.
As shown in fig. 3 (b) and fig. 10 (a) to 10 (d), a position adjusting unit is provided to position the substrate 100 at an appropriate position in the cavity 20. The position adjustment unit includes a frame 120 holding the diaphragm 110 and pins 220 and 221 provided in the housing 210 of the main body 200.
The pin 220 is fitted in the first groove 121 formed in the frame 120, and the pin 221 is fitted in the second groove 122. In this case, since the pin 220 is in two-point contact with the first groove part 121, the frame 120 is prevented from moving in the X-axis direction. On the other hand, since the pin 221 is in single-point contact with the second groove portion 122, the frame 120 is prevented from rotating. This allows the frame 120 to be positioned at a predetermined position of the main body 200.
As shown in fig. 1 and 3 (a), the partitioning device 1 includes a guide plate 230 for appropriately guiding the lid 300 on the upper surface 211 of the main body 200.
The guide plate 230 is attached so that the upper portion 232 protrudes from the side surfaces 214a to 214d of the housing 210. In the upper portion 232, a slope 233 that descends toward the housing 210 is formed on the surface on the housing 210 side.
With this configuration, when the user places the lid 300 on the body section 200, the lid 300 can be appropriately placed on the body section 200 from above while the side surface 311c of the outer lid 310 is along the inclined surface 233 formed on the upper portion 232.
As shown in fig. 1, the main body 200 and the lid 300 are fixed by toggle clamps 240. This secures the body 200 and the lid 300 without a gap between the body 200 and the lid 300. This makes it possible to seal the first chamber 21 and the second chamber 22. Therefore, the first chamber 21 and the second chamber 22 are adjusted to predetermined pressures. When the first chamber 21 is opened to atmospheric pressure and a positive pressure is applied to the second chamber 22, only the second chamber 22 can be sealed.
Alternatively, the chamber 20 may be formed by a hinged housing.
Further, as described above, the main body 200 and the lid 300 are firmly fixed by the toggle clamps 240, but it is assumed that the toggle clamps 240 are released from the fixing, and the pin cylinder 235 is used. When the internal pressure of the chamber 20 becomes too high and the toggle clamp 240 is released from being fixed, the lid 300 may be detached from the body 200. Therefore, the body 200 and the lid 300 are also fixed by the pin cylinder 235. This further secures the body 200 and the lid 300.
As shown in fig. 1 and fig. 7 (a) to 7 (c), the inner lid 320 constituting the inner wall of the lid 300 is formed as a member capable of visually observing the inside of the cavity 20. Also, the inner lid 320 is fitted into the hole 311b of the outer lid 310. Thereby, the user can observe the inside of the cavity 20 from the lid 300. Therefore, for example, the user can confirm whether or not the substrate 100 is held in the cavity 20 at an appropriate position, and therefore, the user can correct the posture of the substrate 100 as appropriate, and can divide the substrate 100 more stably.
< first embodiment (2) >
In embodiment (1) described above, in step S11 of fig. 11, the user holds the substrate 100 in the cavity 20 and fixes the main body 200 and the lid 300 with the toggle clamp 240. In steps S12 and S14, the user operates the pressure adjustment unit 400 to apply pressure to the first chamber 21 and the second chamber 22. In step S13, the user operates the shaft 52 to divide the substrate 100. After the substrate 100 is divided, the user performs an operation of taking out the substrate 100 from the cavity 20. In embodiment (2), the control unit 500 controls these operations.
Fig. 14(a) is a side view schematically showing the dividing apparatus 1 according to embodiment (2). In fig. 14(a), the pressure adjusting section 400 is omitted.
In embodiment (1) described above, the main body 200 and the lid 300 are fixed by toggle clamps 240. In the case of embodiment (2), as shown in fig. 14(a), for example, an air cylinder 260 is used instead of the toggle clamp 240. In this case, the air cylinder 260 can be provided in the recess 311e of the table 311 of the outer cover 310. That is, four air cylinders 260 are provided in the cover 300.
The lid 300 is placed on the body 200, and when the cylinder 260 is pressurized, the lid 300 is pressed against the body 200. Thereby, the body 200 and the lid 300 are fixed.
Fig. 14(b) is a side view schematically showing a part of the moving unit 50 of the splitting apparatus 1 according to embodiment (2). The grip 59 to be gripped by the user during operation is the gear 59 in embodiment (2).
As shown in fig. 14(b), the moving unit 50 of the dividing mechanism 30 further includes a housing 70, a gear 71, two washers 72, a first motor 73, and a second motor 74.
The shaft portion 52 is inserted into the housing 70 so that the grip portion 59 is housed in the housing 70. The shaft portion 52 is locked to both the inner surface and the outer surface of the frame 70 by a washer 72. Thereby, the shaft 52 is rotatably held by the frame 70.
The gear 59 housed in the housing 70 is fitted to the gear 71. The gear 71 is connected to a first motor 73. Therefore, when the first motor 73 is driven, the gear 71 rotates, and the gear 59 rotates. That is, the shaft portion 52 rotates. This enables the pressing unit 40 to be lifted and lowered.
The driving shaft of the second motor 74 is a screw 74a, and the screw 74a is connected to a gear 70a penetrating the housing 70 in the X-axis direction. Thus, when the second motor 74 is driven, the housing 70 moves in the longitudinal direction of the shaft portion 52. Thereby, the shaft 52 moves in the longitudinal direction, and the pressing member 41 of the pressing unit 40 moves along the second surface 102 of the substrate 100.
Fig. 15 is a block diagram showing the configuration of the dividing apparatus 1. As shown in fig. 15, the separation device 1 includes a control unit 500, an input unit 510, a detection unit 520, a solenoid valve driving unit 530, a first pressure driving unit 540, a second pressure driving unit 550, a robot 560, a cylinder driving unit 570, a first driving unit 580, and a second driving unit 590.
The input unit 510 receives the start of dividing the substrate 100 by the dividing apparatus 1. Further, the start and end of the pressure applied to the cavity 20 are received. The detection unit 520 detects the position of the substrate 100 of the dividing apparatus 1. For example, a sensor or an imaging device can be used as the detection unit 520.
The solenoid valve driving unit 530 opens and closes the valve 450. In embodiment (2), the valve 450 is a solenoid valve. The first pressure driving part 540 drives the first regulator 410. The second pressure driving part 550 drives the second regulator 420. In embodiment (2), the first regulator 410 and the second regulator 420 are electric proportional valves.
When the substrate 100 on which the scribe lines L1 and L2 are formed is conveyed to the dividing apparatus 1, the robot 560 receives the substrate 100 and appropriately places the substrate on the upper surface 211 of the housing 210. The robot arm 560 places the lid unit 300 on the body unit 200. The cylinder driving part 570 drives the cylinder 260.
The first driving section 580 drives the first dividing mechanism 31. The second driving portion 590 drives the second partition mechanism 32. That is, the first and second drivers 580 and 590 drive the first and second motors 73 and 74 corresponding to the first and second dividing mechanisms 31 and 32 as shown in fig. 14(b), thereby driving the first and second dividing mechanisms 31 and 32.
The control unit 500 includes an arithmetic processing circuit such as a CPU, and a memory such as a ROM, a RAM, and a hard disk. The control unit 500 controls each unit in accordance with a program stored in a memory.
Next, the substrate 100 dividing operation of the dividing apparatus 1 according to embodiment (2) will be described. This action is the same as the flowchart of fig. 11. Further, a cross-sectional view of the cavity 20 schematically showing the states of the substrate 100 and the diaphragm 110 is shown in fig. 12 (a) to 13 (b).
In step S11 of fig. 11, when the substrate 100 on which the scribe lines L1 and L2 are formed is conveyed by a conveying mechanism (not shown) and the input unit 510 receives the start of the division by the dividing apparatus 1, the control unit 500 controls the robot 560 to receive the substrate 100. In this case, the substrate 100 is bonded to the diaphragm 110 held by the frame 120.
As shown in fig. 12 (a), the controller 500 places the robot 560 on the upper surface 211 of the housing 210. In this case, the alignment of the frame 120 with respect to the main body 200 is described with reference to fig. 10 (a) to 10 (d) in embodiment (1) above.
Next, the controller 500 causes the hand 560 to place the lid 300 on the body 200. The controller 500 controls the cylinder driving unit 570 to apply positive pressure to the cylinder 260, thereby fixing the body 200 and the lid 300. This corresponds to the mounting step (S11) of fig. 11.
After the mounting step (S11), when the user operates the switch 451 and the input unit 510 receives the start of applying pressure, the control unit 500 opens the valve 450 by the solenoid valve driving unit 530. The control part 500 drives the first pressure driving part 540 to adjust the first regulator 410. Further, the second pressure driving part 550 is driven to adjust the second regulator 420. In this way, the first chamber 21 and the second chamber 22 are adjusted so that the posture of the substrate 100 is maintained at the pressure in the horizontal direction of the X-Y plane. This corresponds to the pressure adjusting process (S12) of fig. 11.
In a state where the mounting step (S11) and the pressure adjustment step (S12) are completed, the pressing member 41 of the dividing mechanism 30 does not contact the diaphragm 110 as shown in fig. 12 (a).
When adjusting the pressures of the first chamber 21 and the second chamber 22, the controller 500 drives the first driving unit 580 to move the moving unit 50 of the first dividing mechanism 31. The first driving unit 580 is the first motor 73 and the second motor 74 shown in fig. 14 (b).
As shown in fig. 12 (b), the controller 500 drives the first motor 73 of the first dividing mechanism 31 to adjust the height of the pressing unit 40. That is, the shaft 52 is rotated to adjust the amount of lift of the pressing member 41.
Next, as shown in fig. 12 (c), the controller 500 drives the second motor 74 of the first dividing mechanism 31 to move the shaft 52 in the X-axis direction. Thereby, the pressing member 41 moves in the X-axis direction while sequentially pushing up the substrates 100 toward the first chamber 21 side. At this time, since the force for opening the substrate 100 outward is uniformly applied to the scribe line L2 pushed up by the pressing member 41, the divided substrate 100 is divided in the vertical direction along the scribe line L2.
As shown in fig. 13 (a), the controller 500 drives the second motor 74 of the first dividing mechanism 31 to move the shaft portion 52 in the positive X-axis direction, and when the passage of the pressing member 41 along the second surface 102 of the substrate 100 is completed, divides the substrate 100 along all the scribe lines L2 formed in the substrate 100.
As shown in fig. 13 (b), when the substrate 100 is divided along the scribing line L2, the first motor 73 of the first dividing mechanism 31 is driven to adjust the height of the pressing unit 40. That is, the pressing member 41 is lowered by rotating the shaft 52. Thereby, the pressing member 41 is separated from the substrate 100. Then, the controller 500 drives the second motor 74 of the first dividing mechanism 31 to move the shaft portion 52 in the X-axis negative direction, and returns the pressing member 41 to the initial position, i.e., the state (a) of fig. 12.
When the detection unit 520 detects that the first dividing mechanism 31 has divided the substrate 100 along all the scribe lines L2, the division of the scribe line L1 by the second dividing mechanism 32 is started.
The control unit 500 drives the second driving unit 590 to move the moving unit 50 of the second dividing mechanism 32. The second driving unit 590 is the first motor 73 and the second motor 74 shown in fig. 14(b) as well as the first driving unit 580.
The division of the scribing line L1 by the second dividing mechanism 32 is controlled in the same manner as the first dividing mechanism 31 described above.
At this time, a camera is used as the detection unit 520, and an image captured by the camera is displayed on a display. The user can confirm that the substrate 100 is divided by viewing the image. This corresponds to the dividing step (S13) of fig. 11.
When the substrate 100 is divided along the scribe lines L1 and L2, the controller 500 drives the first pressure driver 540 to adjust the first regulator 410, thereby depressurizing the first chamber 21. Similarly, the controller 500 drives the second pressure driver 550 to adjust the second regulator 420, thereby depressurizing the second chamber 22. When the user operates the switch 451 and the input unit 510 receives the end of the pressure application, the control unit 500 closes the valve 450 by the solenoid valve driving unit 530. This corresponds to the decompression process (S14) of fig. 11.
Next, the controller 500 applies a negative pressure to the air cylinder 260 by the air cylinder driving unit 570, and releases the fixation of the lid 300 and the body 200. The controller 500 controls the robot 560 to take out the substrate 100 from the main body 200, which is the chamber 20. In this way, the substrate 100 is divided by the dividing apparatus 1 according to embodiment (2).
In the above description, the first and second regulators 410 and 420 are driven by the first and second pressure driving units 540 and 550, respectively, and the first and second regulators 410 and 420 may be operated by the user. In this case, the user adjusts the second regulator 420 and the second speed controller 440 in advance to give a predetermined pressure to the second chamber 22.
In the first and second separating mechanisms 31 and 32, the first and second driving portions 580 and 590 drive the pressing unit 40 to move up and down and the shaft portion 52 to move, and the pressing unit 40 to move up and down and the shaft portion 52 to move may be operated by the user.
< modification example >
In embodiments (1) and (2), the substrate 100 is divided by the dividing mechanism 30, but when the thickness of the substrate 100 is small, the substrate 100 can be divided along the scribe lines L1 and L2 by bending the substrate 100 toward the first chamber 21 side by the pressure difference between the first chamber 21 and the second chamber 22 without driving the dividing mechanism 30. Therefore, in modification 1, the pressure in the first chamber 21 and the pressure in the second chamber 22 are adjusted to generate a pressure difference between the first chamber 21 and the second chamber 22, thereby dividing the substrate 100 without using the dividing mechanism 30. In modification 1, the user adjusts the pressure.
Fig. 16 is a flowchart showing a dividing step of the substrate 100 according to modification 1.
As shown in fig. 16, the substrate 100 is divided by the dividing apparatus 1 by the following steps: a mounting step (S21) for holding the substrate 100 in the cavity 20; a pressure adjustment step (S22) in which the user adjusts the pressure in the first chamber 21 and the second chamber 22 of the chamber 20 to different pressures from each other to divide the substrate 100; the pressure removal step (S23) is a step in which the user adjusts the pressure in the first chamber 21 and the second chamber 22 of the chamber 20 to remove the pressure in the first chamber 21 and the second chamber 22.
Among the steps S21 to S23, the steps S22 and S23 will be specifically described with reference to fig. 17 (a) to 17 (d).
Fig. 17 (a) to 17 (d) are cross-sectional views of the cavity 20 schematically showing states of the substrate 100 and the diaphragm 110 in steps S21 to S23 shown in the flowchart of fig. 15. In fig. 17 (a) to 17 (d), hatching is not added to the substrate 100 and the membrane sheet 110. In addition, the packing 330, the baffle 340, the first speed controller 430, and the hole 311f of the table 311 of the outer cover 310 shown in fig. 8 are omitted.
As shown in fig. 17 (a), the user properly positions the substrate 100 on the upper surface 211 of the housing 210. Then, the lid 300 is placed on the main body 200, and the main body 200 and the lid 300 are fixed by the toggle clamps 240 (S21). When the substrate 100 is held in the cavity 20 in this manner, the body 200 and the lid 300 are fixed. Fig. 17 (a) corresponds to the mounting step (S21) of fig. 15.
In addition, in step S21, the user can observe the inside of the cavity 20 from the cover 300, confirm whether the substrate 100 is properly positioned on the upper surface 211 of the case 210, and re-perform the position alignment of the substrate 100 as appropriate.
In the state of fig. 17 (a), when the user operates the switch 451 to open the valve 450, a pressure higher than the atmospheric pressure is applied to the second chamber 22. At this time, in order to adjust the pressure to a predetermined pressure, the user operates the knob 422 of the second adjuster 420 to adjust the degree of the gauge 421 to the predetermined pressure. Further, the knob 441 of the second speed controller 440 is rotated to adjust the flow rate of the air to a predetermined flow rate.
On the other hand, the first chamber 21 is opened to atmospheric pressure. As shown in fig. 2, the user switches the switching valve 470 so that the air from the compressed air source 460 does not flow into the first chamber 21 in advance. Thereby, the atmospheric pressure flows from the outside of the cavity 20 into the first chamber 21.
As shown in fig. 17 (b), when a pressure higher than atmospheric pressure is applied to the second chamber 22, the diaphragm 110 bulges toward the lid 300. The substrate 100 is suitably positioned at the body portion 200. That is, the substrate 100 is positioned at a central portion of the upper surface 211 of the case 210. Therefore, the diaphragm 110 is bulged such that the central portion is a top portion, and the substrate 100 is also curved in accordance with the bulging of the diaphragm 110.
When the pressure higher than atmospheric pressure is applied to the second chamber 22 to inflate the diaphragm 110, the atmospheric pressure of the first chamber 21 is released, and therefore the air in the first chamber 21 is discharged to the outside. As a result, the diaphragm 110 continues to bulge, and as shown in fig. 17 (c), the bottom surface 322 of the inner lid 320, which is the inner wall of the lid 300, comes into contact with the substrate 100. This prevents the diaphragm 110 from further bulging, and the bending of the substrate 100 stops when the substrate 100 contacts the bottom surface 322.
As shown in fig. 17 (b) and 17 (c), when the diaphragm 110 is swollen and the substrate 100 is bent, a force that opens the scribe lines L1 and L2 of the substrate 100 to the outside of the substrate 100 is applied. Thus, cracks generated along the scribe lines L1 and L2 penetrate in the thickness direction of the substrate 100, and such penetration of cracks extends along the scribe lines L1 and L2. Then, as shown in fig. 17 (d), the substrate 100 is divided along the scribe lines L1 and L2. Since the substrate 100 is in a bent state, when it is divided along the scribe lines L1, L2, a gap is formed between the adjacent individual pieces 10. The states of fig. 17 (b) to 17 (d) correspond to the pressure adjusting step (S22) of fig. 15.
Here, the case where the substrate 100 is divided along the scribe lines L1 and L2 after the substrate 100 comes into contact with the bottom surface 322 of the inner lid 320 is shown (fig. 17 (c) and fig. 17 (d)), and there are also cases where the substrate 100 is divided along the scribe lines L1 and L2 when the substrate 100 transits from the state of fig. 17 (b) to the state of fig. 17 (c).
The user can confirm that the substrate 100 is divided by viewing the cover 300 from above. When the substrate 100 is divided, the user operates the second regulator 420 and the second speed controller 440 to reduce the pressure of the second chamber 22 to the atmospheric level. Thereby, the swollen diaphragm 110 gradually descends to return to the original state shown in fig. 17 (a). The substrate 100 also returns from the bent state to a state parallel to the X-Y plane along with the deformation of the diaphragm 110. In the divided substrate 100, a gap is formed between the adjacent single pieces 10 in a bent state, and when the substrate returns to a state parallel to the X-Y plane, no gap is formed between the adjacent single pieces 10, and the adjacent single pieces 10 are in contact with each other. This state corresponds to the pressure removal process (S23) of fig. 16. In this way, the substrate 100 is divided by the dividing apparatus 1.
After the pressure removing process (S23), the user operates the switch 451 to close the valve 450. Then, the lid 300 is opened together with the frame 120 to take out the substrate 100. The individual pieces 10 are separated from the substrate 100 taken out by a predetermined method.
As described above, in modification 1, the substrate 100 can be divided by the pressure difference between the first chamber 21 and the second chamber 22 without using the dividing mechanism 30.
In the case of modification 1, tension may be applied to the diaphragm 110 in advance.
Generally, for simple processing, the substrate 100 is stuck to the membrane 110 before forming the scribing lines L1, L2, and the membrane 110 is held on the frame 120. Therefore, in modification 1, when tension is applied to the diaphragm 110 in advance, tension is applied to the diaphragm 110 before the scribe lines L1 and L2 are formed.
When tension is previously given to the diaphragm 110, the tension is uniformly applied to the entire area of the diaphragm 110. When the substrate 100 is bonded to the diaphragm 110 and the pressures of the first chamber 21 and the second chamber 22 are adjusted so that the pressure of the second chamber 22 becomes higher than that of the first chamber 21, the diaphragm 110 is more likely to bulge toward the cover 300. Therefore, the substrate 100 is also easily bent, and can be more easily and satisfactorily divided along the scribe line L.
In this case, when a tensile force is applied to the film 110 in the same direction as the forming direction of the scribe lines L1, L2 of the substrate 100, it becomes easy to appropriately apply a force to the scribe lines L1, L2 to open to the outside of the substrate 100 when the substrate 100 is bent. This makes it possible to more easily and satisfactorily divide the substrate 100.
In modification 1, as in embodiment (2) described above, the pressure may be adjusted by the control unit 500.
< second embodiment (1) >
As shown in fig. 20, the substrate 100 is divided by the dividing apparatus 1 according to the second embodiment by the following steps: a mounting step (S11) for holding the substrate 100 in the cavity 20; a pressure adjustment step (S12) in which the user adjusts the pressure in the first chamber 21 and the second chamber 22 of the chamber 20 to different pressures to divide the substrate 100; in the pressure removal step (S13), the user adjusts the pressures of the first chamber 21 and the second chamber 22 of the cavity 20 to remove the pressures of the first chamber 21 and the second chamber 22.
The steps of steps S11 to S13, particularly the steps S12 and S13, will be described in detail with reference to fig. 21 (a) to 21 (d).
Fig. 21 (a) to 21 (d) are cross-sectional views of the cavity 20 schematically showing states of the substrate 100 and the diaphragm 110 in steps S11 to S13 shown in the flowchart of fig. 20. In fig. 21 (a) to 21 (d), hatching is not provided to the substrate 100 and the membrane sheet 110. In addition, the packing 330, the baffle 340, the first speed controller 430, and the hole 311f of the table 311 of the outer cover 310 shown in fig. 8 are omitted.
As shown in fig. 21 (a), the user properly positions the substrate 100 on the upper surface 211 of the housing 210. Then, the lid 300 is placed on the main body 200, and the main body 200 and the lid 300 are fixed by the toggle clamps 240 (S11). Thus, the main body 200 and the lid 300 are fixed while the substrate 100 is held in the cavity 20. Fig. 21 (a) corresponds to the mounting step (S11) of fig. 10.
In step S11, the user can observe the inside of the cavity 20 from the lid 300, confirm whether or not the substrate 100 is properly positioned on the upper surface 211 of the case 210, and perform the positional alignment of the substrate 100 again as appropriate.
In the state of fig. 21 (a), when the user operates the switch 451 to open the valve 450, a pressure higher than the atmospheric pressure is applied to the second chamber 22. At this time, in order to adjust the pressure to a predetermined pressure, the user operates the knob 422 of the second adjuster 420 to adjust the degree of the gauge 421 to the predetermined pressure. Further, the knob 441 of the second speed controller 440 is rotated to adjust the flow rate of the air to a predetermined flow rate.
On the other hand, since the first chamber 21 is opened to atmospheric pressure, atmospheric pressure flows into the first chamber 21 from the outside of the cavity 20.
As shown in fig. 21 (b), when a pressure higher than atmospheric pressure is applied to the second chamber 22, the diaphragm 110 bulges toward the lid 300. The substrate 100 is suitably positioned at the body portion 200. That is, the substrate 100 is positioned at a central portion of the upper surface 211 of the case 210. Therefore, the diaphragm 110 is bulged so that the central portion becomes the top, and the substrate 100 is also curved along with the bulging of the diaphragm 110.
When the second chamber 22 is pressurized to a pressure higher than the atmospheric pressure and the diaphragm 110 is expanded, the atmospheric pressure in the first chamber 21 is released, and the air in the first chamber 21 is discharged to the outside. As a result, the diaphragm 110 continues to bulge, and as shown in fig. 21 (c), the substrate 100 contacts the bottom surface 322 of the inner lid 320, which is the inner wall of the lid 300. As a result, the membrane 110 cannot continue to bulge, and the bending of the substrate 100 stops at the point when the substrate 100 contacts the bottom surface 322.
As shown in fig. 21 (b) and 21 (c), when the diaphragm 110 is swollen and the substrate 100 is bent, a force that opens the scribe line L of the substrate 100 to the outside of the substrate 100 is applied. Therefore, cracks generated along the scribing line L penetrate in the thickness direction of the substrate 100, and such penetration of cracks extends along the scribing line L. Then, as shown in fig. 21 (d), the substrate 100 is divided along the scribe lines L. Since the substrate 100 is in a bent state, when divided along the scribing line L, a gap is formed between the adjacent individual pieces 10. The states of fig. 21 (b) to 21 (d) correspond to the pressure adjusting step (S12) of fig. 20.
Here, the case where the substrate 100 is divided along the scribing line L after the substrate 100 comes into contact with the bottom surface 322 of the inner lid 320 is shown (fig. 21 (c) and 21 (d)), and the substrate 100 may be divided along the scribing line L when the substrate 100 transits from the state of fig. 21 (b) to the state of fig. 21 (c).
The user can confirm that the substrate 100 is divided by viewing the lid 300 from above. When the substrate 100 is divided, the user operates the second regulator 420 and the second speed controller 440 to reduce the pressure of the second chamber 22 to the atmospheric level. Thereby, the swollen diaphragm 110 is gradually lowered back to the original state shown in fig. 21 (a). The substrate 100 also returns from the bent state to a state parallel to the X-Y plane along with the deformation of the diaphragm 110. In the divided substrate 100, a gap is formed between the adjacent single pieces 10 in a bent state, and when the substrate returns to a state parallel to the X-Y plane, no gap is formed between the adjacent single pieces 10, and the adjacent single pieces 10 are in contact with each other. This state corresponds to the pressure removal process (S13) of fig. 20. In this way, the substrate 100 is divided by the dividing apparatus 1.
After the pressure removing process (S13), the user operates the switch 451 to close the valve 450. Then, the lid 300 is opened together with the frame 120 to take out the substrate 100. The individual pieces 10 are separated from the substrate 100 taken out by a predetermined method.
< Effect of the second embodiment >
According to the apparatus of the second embodiment, the following effects can be obtained.
As shown in fig. 8 and fig. 20 to 21 (d), in the cavity 20 of the partitioning device 1, a first chamber 21 which is a space on the lid 300 side and a second chamber 22 which is a space on the body 200 side are formed with the diaphragm 110 interposed therebetween. When the pressure of the first chamber 21 and the second chamber 22 is adjusted by the pressure adjusting portion 400 and a higher pressure is applied to the second chamber 22 than the first chamber 21, the diaphragm 110 bulges in the direction of the lid portion 300. The substrate 100 is bent with the swelling of the membrane 110. Thereby, a force that opens to the outside of the substrate 100 is applied to the scribing line L formed on the substrate 100. Therefore, the crack generated along the scribe line L penetrates in the thickness direction of the substrate 100 and extends along the scribe line L. As a result, the substrate 100 is divided into the individual pieces 10. In this manner, by applying pressure to the first chamber 21 and the second chamber 22, the substrate 100 can be easily divided.
Further, as described above, the substrate 100 is not bent by some members, but is bent only by a pressure difference. In this manner, the substrate 100 is bent without contacting the substrate 100. Therefore, after the division, the occurrence of chipping and burr on the end face of the single piece 10 can be suppressed. Therefore, the substrate 100 can be divided satisfactorily.
When the first chamber 21 of the cavity 20 is opened to atmospheric pressure and the second chamber 22 is pressurized to a pressure higher than atmospheric pressure, the diaphragm 110 is raised toward the lid 300. Thereby, the air in the first chamber 21 is discharged to the outside of the cavity 20.
Here, when the bottom surface 322 of the inner cover 320 is not curved as shown in fig. 8 but formed in a horizontal plane, the diaphragm 110 and the substrate 100 are deformed in a horizontal plane at the time when the substrate 100 contacts the bottom surface 322. In this case, the force of opening the scribe line L on the substrate 100 to the outside of the substrate 100 does not sufficiently act, the penetration of the crack generated along the scribe line L is insufficient, and the crack cannot satisfactorily extend along the scribe line L. Therefore, it becomes difficult to divide the substrate 100 along the scribing line L.
In this regard, according to the present embodiment, as shown in fig. 18 and 19 (a) to 8, and 21 (a) to 21 (d), the bottom surface 322 of the inner lid 320 of the partitioning device 1 has a shape curved in a concave shape. Therefore, the diaphragm 110 and the substrate 100 are deformed into a concave shape similar to the shape of the bottom surface 322. Therefore, a force for opening the scribe line L on the substrate 100 to the outside of the substrate 100 is appropriately applied, and a crack generated along the scribe line L penetrates and extends. This enables the substrate 100 to be smoothly and satisfactorily divided along the scribing line L.
As shown in fig. 8 and fig. 20 to 21 (d), when the atmospheric pressure of the first chamber 21 of the cavity 20 is released and the pressure higher than the atmospheric pressure is applied to the second chamber 22, the diaphragm 110 bulges toward the lid 300 and deforms into a spherical shape. That is, the substrate 100 is bent with a certain curvature. Thereby, a force to open the scribing line L on the substrate 100 to the outside of the substrate 100 is uniformly applied. Therefore, it becomes easy for the crack to uniformly penetrate along the scribing line L, and the penetrated crack smoothly extends. This makes it possible to favorably and easily divide the substrate 100 along the scribe lines L.
As shown in fig. 19 (a), 10 (a) to 10 (d), a position adjuster is provided to position the substrate 100 at an appropriate position in the cavity 20. The position adjustment unit includes a frame 120 holding the diaphragm 110 and pins 220 and 221 provided in the housing 210 of the main body 200.
The pin 220 is fitted in the first groove 121 formed in the frame 120, and the pin 221 is fitted in the second groove 122. In this case, since the pin 220 is in two-point contact with the first groove part 121, the frame 120 is prevented from moving in the X-axis direction. On the other hand, since the pin 221 is in single-point contact with the second groove portion 122, the frame 120 is prevented from rotating. This allows the frame 120 to be positioned at a predetermined position of the main body 200.
As shown in fig. 18 and 19 (b), the dividing device 1 includes a guide plate 230 for appropriately guiding the lid 300 to the upper surface 211 of the main body 200.
The guide plate 230 is installed in such a manner that the upper portion 232 protrudes from the side surface 214 of the housing 210. In the upper portion 232, a slope 233 that descends toward the housing 210 is formed on the surface on the housing 210 side.
With this configuration, when the user places the lid 300 on the body section 200, the lid 300 can be appropriately placed on the body section 200 from above while the side surface 311c of the outer lid 310 is along the inclined surface 233 formed on the upper portion 232.
As shown in fig. 18, the main body 200 and the lid 300 are fixed by toggle clamps 240. This secures the body 200 and the lid 300 without a gap between the body 200 and the lid 300. Thus, when different pressures are applied to the first chamber 21 and the second chamber 22, the first chamber 21 and the second chamber 22 can be sealed. Therefore, the first chamber 21 and the second chamber 22 are adjusted to predetermined pressures. When the first chamber 21 is opened to atmospheric pressure and a positive pressure is applied to the second chamber 22, only the second chamber 22 can be sealed.
Alternatively, the chamber 20 may be formed by a hinged housing.
Further, as described above, the main body 200 and the lid 300 are firmly fixed by the toggle clamps 240, but it is assumed that the toggle clamps 240 are released from the fixing, and the pin cylinder 235 is used. When the internal pressure of the cavity 20 becomes too high and the toggle clamp 240 is released from being fixed, the lid 300 may be detached from the body 200. Thereby, the body 200 and the lid 300 are also fixed by the pin cylinder 235. This further secures the body 200 and the lid 300.
As shown in fig. 18 and 7 (a) to 7 (c), the inner lid 320 constituting the inner wall of the lid 300 is formed as a member capable of visually observing the inside of the cavity 20. Also, the inner lid 320 is fitted into the hole 311b of the outer lid 310. Thereby, the user can observe the inside of the cavity 20 from the lid 300. Therefore, for example, the user can confirm whether or not the substrate 100 is held in the cavity 20 at an appropriate position, and therefore, the user can correct the posture of the substrate 100 as appropriate, and can divide the substrate 100 more stably.
As shown in fig. 19 (a), although the scribe lines L are formed in a lattice shape in the present embodiment, they may be formed only in the X-axis direction or the Y-axis direction.
< second embodiment (2) >
In the second embodiment (1), in step S11 of fig. 20, the user holds the board 100 in the cavity 20, and the main body 200 and the lid 300 are fixed by the toggle clamps 240. In steps S12 and S13, the user operates the pressure adjustment unit 400 to apply pressure to the first chamber 21 and the second chamber 22. Further, after the substrate 100 is divided, the user performs an operation of taking out the substrate 100 from the cavity 20. In embodiment (2), the control unit 500 controls these operations.
Fig. 22 is a side view schematically showing the partitioning device 1 according to the second embodiment (2). In fig. 22, the pressure adjusting unit 400 is omitted.
In the second embodiment (1), the main body 200 and the lid 300 are fixed by toggle clamps 240. In the case of embodiment (2), as shown in fig. 22, for example, an air cylinder 260 is used instead of the toggle clamp 240. In this case, the air cylinder 260 can be provided in the recess 311e of the table 311 of the outer cover 310. That is, four air cylinders 260 are provided in the cover 300.
The lid 300 is placed on the body 200, and when the cylinder 260 is pressurized, the lid 300 is pressed against the body 200. Thereby, the body 200 and the lid 300 are fixed.
Fig. 23 is a block diagram showing the configuration of the dividing apparatus 1. As shown in fig. 23, the splitting apparatus 1 includes a control unit 500, an input unit 510, a detection unit 520, a solenoid valve driving unit 530, a first driving unit 540, a second driving unit 550, a robot 560, and a cylinder driving unit 570.
The input unit 510 receives a start of dividing the substrate 100 by the dividing apparatus 1. Further, the start and end of applying pressure to the cavity 20 are received. The detection unit 520 detects the position of the substrate 100 of the dividing apparatus 1. For example, a sensor or an imaging device can be used as the detection unit 520.
The solenoid valve driving unit 530 opens and closes the valve 450. In embodiment (2), the valve 450 is a solenoid valve. The first driving part 540 drives the first regulator 410. The second driving part 550 drives the second regulator 420. In embodiment (2), the first regulator 410 and the second regulator 420 are electric proportional valves.
When the robot 560 conveys the substrate 100 on which the scribing line L is formed to the dividing apparatus 1, the robot receives the substrate 100 and appropriately places the substrate on the upper surface 211 of the housing 210. The robot arm 560 places the lid unit 300 on the body unit 200. The cylinder driving part 570 drives the cylinder 260.
The control unit 500 includes an arithmetic processing circuit such as a CPU, and a memory such as a ROM, a RAM, and a hard disk. The control unit 500 controls each unit according to a program stored in a memory.
Next, the substrate 100 dividing operation by the dividing apparatus 1 according to the second embodiment (2) will be described. This action is the same as the flowchart of fig. 20. Further, a cross-sectional view of the cavity 20 schematically showing the states of the substrate 100 and the diaphragm 110 is shown in fig. 21 (a) to 21 (d).
In step S11 of fig. 20, when the substrate 100 on which the scribing line L is formed is conveyed by the conveying mechanism (not shown) and the input unit 510 receives the start of the division by the dividing apparatus 1, the control unit 500 controls the robot 560 to receive the substrate 100. In this case, the substrate 100 is bonded to and held by the membrane 110 of the frame 120.
The controller 500 places the robot 560 on the upper surface 211 of the housing 210 (see fig. 2). In this case, the frame 120 is aligned with the main body 200 as described with reference to fig. 10 (a) to 10 (d) in embodiment (1) above.
Next, the controller 500 causes the hand 560 to place the lid 300 on the body 200. The controller 500 controls the cylinder driver 570 to apply positive pressure to the cylinder 260 to fix the body 200 and the lid 300. The states of the substrate 100 and the diaphragm 110 at this time are shown in fig. 21 (a).
In step S12 of fig. 20, when the user operates the switch 451 and the input unit 510 receives the start of pressure application, the control unit 500 causes the electromagnetic valve driving unit 530 to open the valve 450. The control unit 500 drives the second driving unit 550 to adjust the second regulator 420, and applies a pressure higher than the atmospheric pressure to the second chamber 22.
In addition, the first chamber 21 is opened to the atmospheric pressure by the user operating the switching valve 470 in advance, as in the above-described embodiment (1).
As shown in fig. 21 (b), the diaphragm 110 bulges toward the cover 300 side, and the substrate 100 is bent. Then, as shown in fig. 21 (c), the substrate 100 is brought into contact with the bottom surface 322 of the inner lid 320. This prevents the diaphragm 110 from further bulging, and the deformation of the substrate 100 is also stopped. As a result, as shown in fig. 21 (d), the substrate 100 is divided along the scribe line L on the substrate 100.
At this time, a camera is used as the detection unit 520, and an image captured by this camera is displayed on the display. The user can confirm that the substrate 100 is divided by observing the image.
In step S13 of fig. 20, when the substrate 100 is divided, the controller 500 drives the second driver 550 to adjust the second regulator 420, thereby depressurizing the second chamber 22. When the user operates the switch 451 and the input unit 510 receives the end of the pressure application, the control unit 500 causes the electromagnetic valve driving unit 530 to close the valve 450.
Next, the controller 500 gives a negative pressure to the cylinder 260 by the cylinder driving unit 570, and releases the fixation of the lid 300 and the body 200. The controller 500 controls the robot 560 to take out the substrate 100 from the main body 200, which is the chamber 20. In this way, the substrate 100 is divided by the dividing apparatus 1 according to embodiment (2).
In the above description, the first and second regulators 410 and 420 are driven by the first and second pressure driving units 540 and 550, respectively, and the first and second regulators 410 and 420 may be operated by the user.
In this case, the user previously adjusts the second regulator 420 and the second speed controller 440 to give a prescribed pressure to the second chamber 22.
< modification example 1 of the second embodiment >
In modification 1 of the second embodiment, tension is applied to the diaphragm 110 in advance.
In order to simplify the process, the substrate 100 is generally attached to the film 110 before the scribe line L is formed, and the film 110 is held by the frame 120. Therefore, in modification 1, when tension is applied to the diaphragm 110 in advance, the tension is applied to the diaphragm 110 before the scribe line L is formed.
A scribe line L is formed on the substrate 100 to which the film 110 to which tension is applied in advance is attached, and the substrate 100 is conveyed to the dividing apparatus 1. The subsequent steps are as described with reference to fig. 20 to 21 (d), and therefore, the description thereof is omitted.
When tension is given to the diaphragm 110 in advance in this manner, the tension is uniformly applied to the entire area of the diaphragm 110. When the substrate 100 is bonded to the diaphragm 110 and the pressures of the first chamber 21 and the second chamber 22 are adjusted so that the pressure of the second chamber 22 becomes higher than that of the first chamber 21, the diaphragm 110 is more likely to bulge toward the cover 300. This also facilitates the bending of the substrate 100, and the substrate 100 can be more easily and satisfactorily divided along the scribe line L.
In this case, when the film 110 is given a tensile force in the same direction as the direction in which the scribe line L of the substrate 100 is formed, it becomes easy to more appropriately apply a force for opening the scribe line L to the outside of the substrate 100 when the substrate 100 is bent. This makes it possible to more easily and satisfactorily divide the substrate 100.
< modification 2 of the second embodiment >
The inner wall of the lid 300, i.e., the bottom surface 322 of the inner lid 320, in the second embodiment (1) and (2) and modification 1 is hemispherical. In modification 2, the bottom surface 322 of the inner lid 320 is formed in a horizontal plane parallel to the X-Y plane.
Fig. 24 (a) to 24 (d) are cross-sectional views schematically showing the cavity 20 in the state of the substrate 100 and the diaphragm 110 when the substrate 100 is divided by the dividing apparatus 1 according to modification 2. In fig. 24 (a) to 24 (d), hatching is not applied to the substrate 100 and the membrane sheet 110. Similarly to fig. 24 (a) to 24 (d), the gasket 330, the baffle 340, the first speed controller 430, and the hole 311f of the base 311 of the outer cover 310 shown in fig. 8 are omitted.
In the above-described (1) and (2) of the second embodiment, when a pressure higher than atmospheric pressure is applied to the second chamber 22, the diaphragm 110 bulges. Since the first chamber 21 is open to atmospheric pressure, the air in the second chamber 22 is discharged. Therefore, the diaphragm 110 and the substrate 100 are in contact with the inner wall surface of the lid 300, i.e., the bottom surface 322 of the inner lid 320.
At this time, since the bottom surface 322 of the inner lid 320 is formed in a hemispherical shape, the diaphragm 110 and the substrate 100 are bent with a constant curvature, similarly to the bottom surface 322. Accordingly, the substrate 100 is divided along the scribing line L of the substrate 100.
In contrast, in modification 2, the bottom surface 322 of the inner lid 320 is formed in a horizontal plane parallel to the X-Y plane. As shown in (1) and (2) of the above embodiment, when the pressure is applied to the second chamber 22 in a state where the atmospheric pressure of the first chamber 21 is open and the diaphragm 110 and the substrate 100 are in contact with the bottom surface 322 of the inner cover 320, the diaphragm 110 and the substrate 100 are deformed into a horizontal plane parallel to the X-Y plane.
When the diaphragm 110 and the substrate 100 are deformed into such a shape, there is a case where, for example, the diaphragm 110 is broken. Further, a force to open the substrate 100 to the outside acts on the substrate 100 at a position other than the scribe line L of the substrate 100, and as a result, the substrate 100 may be cracked at an undesired portion.
Therefore, in modification 2, it is necessary to control the state of swelling of the diaphragm 110, that is, the pressures of the first chamber 21 and the second chamber 22 so that the substrate 100 and the diaphragm 110 do not contact the bottom surface 322 of the inner cover 320.
The dividing process by the dividing apparatus 1 according to the modification 2 will be described. The dividing step by the dividing apparatus 1 according to modification 2 is performed by the mounting step (S11), the pressure adjusting step (S12), and the depressurizing step (S13) in the same manner as the flowchart of fig. 20. In the following description, the user operates the splitting apparatus 1 as in the embodiment (1).
As shown in fig. 24 (a), the substrate 100 is held in the cavity 20, and the body 200 and the lid 300 are fixed (S11 in fig. 20).
The user applies pressure to the first and second chambers 21 and 22, respectively. In order to adjust the pressure of the first chamber 21 to a predetermined pressure, the user operates the knob 412 of the first adjuster 410 to adjust the degree of the gauge 411 to a predetermined pressure. Further, the knob 431 of the first speed controller 430 is operated to adjust the flow rate of the air to a predetermined flow rate.
Similarly, in the second chamber 22, in order to adjust the pressure to a predetermined pressure, the user operates the knob 422 of the second adjuster 420 to adjust the degree of the gauge 421 to the predetermined pressure. Further, the knob 441 of the second speed controller 440 is operated to adjust the flow rate of the air to a predetermined flow rate.
At this time, the diaphragm 110 and the substrate 100 are not in contact with the bottom surface 322 of the inner cover 320, and the pressure at which the diaphragm 110 and the substrate 100 bend is adjusted. The user can also observe the cap 300, confirm the swelling state of the diaphragm 110, and appropriately adjust the pressure.
As a result, as shown in fig. 24 (b) and 24 (c), the diaphragm 110 and the substrate 100 do not contact the bottom surface 322 of the inner cover 320, and the diaphragm 110 and the substrate 100 are bent. As a result, as shown in fig. 24 d, the substrate 100 is divided into the individual pieces 10 (S12 of fig. 20).
When the substrate 100 is divided, the user operates the first regulator 410, the first speed controller 430, the second regulator 420, and the second speed controller 440 to reduce the pressure of the first chamber 21 and the second chamber 22 to the atmospheric pressure level. Thereby, the swollen diaphragm 110 gradually descends to return to the original state as shown in fig. 24 (a) (S13 in fig. 20). Thereafter, the same as in embodiment (1) above is applied. In this way, the substrate 100 is divided by the dividing apparatus 1 according to modification 2.
In addition, as in the case of the embodiment (2), the control unit 500 may perform the division operation in the modification 2. Although the pressure can be adjusted by the user, the pressure can be instantaneously adjusted according to the swelling state of the diaphragm 110 by the control of the control unit 500.
The embodiments of the present invention may be modified in various ways within the scope of the technical idea described in the claims.
Description of the reference numerals
1: cutting device
10: single sheet
20: cavity body
21: first chamber
22: second chamber
30: dividing mechanism
31: first dividing mechanism
32: second dividing mechanism
40: press unit
41: pressing member
42: receiving part
43: magnet body
50: mobile unit
51: support part
52: shaft part
53: card fixing part
56: collar
60: eccentric cam
100: substrate
101: first side
102: second surface
110: diaphragm
120: frame structure
121: a first groove part
122: the second groove part
200: main body part
210: shell body
214: side surface
220. 221: pin (position adjusting part)
230: guide plate (position adjusting part)
240: toggle clamp
300: cover part
310: outer cover
311 c: side surface
320: inner cover
322: bottom surface
400: pressure regulating part
500: control unit
L1, L2: scribing line

Claims (30)

1. A dividing apparatus for dividing a substrate, on which a predetermined scribe line is formed on a first surface and a second surface opposite to the first surface is bonded to a film, along the scribe line, the dividing apparatus comprising:
a cavity having a lid and a body, and holding the substrate by the lid and the body so that a first chamber on the first surface side and a second chamber on the second surface side are formed with the diaphragm interposed therebetween;
a pressure adjusting unit that individually adjusts pressures of the first chamber and the second chamber, and maintains the substrate in a predetermined posture in the chamber; and
a dividing mechanism that divides the substrate along the scribing line,
the dividing mechanism is disposed in the second chamber, and pushes up the substrate toward the first chamber while moving along the second surface of the substrate.
2. The partitioning device according to claim 1, wherein there is a control portion that controls said pressure adjusting portion,
the control unit adjusts the pressure of the first chamber and the second chamber to maintain the substrate in a predetermined posture in the chamber.
3. The segmenting device of claim 1,
the dividing mechanism includes:
a pressing unit that pushes up the substrate toward the first chamber side; and
a moving unit for moving the pressing unit,
the pressing unit includes:
a pressing member extending along a forming direction of the scribing line,
the mobile unit includes:
a support portion that detachably supports the pressing unit; and
and a shaft portion coupled to the support portion for moving the support portion in an arrangement direction of the scribe lines.
4. The segmenting device of claim 3,
the mobile unit includes:
an engaging portion that engages the support portion with one end portion of the shaft portion; and
a collar that restricts movement of the shaft portion in an arrangement direction of the scribe lines.
5. The segmenting device of claim 3 or 4,
the support portion has an eccentric cam that moves the pressing unit in the vertical direction in accordance with the rotation of the shaft portion.
6. The segmenting device of claim 3 or 4,
the pressing unit includes a receiving portion that receives the pressing member,
the receiving portion detachably supports the pressing member.
7. The segmenting device of claim 6,
the pressing member is a magnetic member, and a magnet is provided on the receiving portion.
8. The segmenting device of claim 3 or 4,
the pressing member has a curved shape with a uniform curvature over the entire length.
9. The segmenting device of claim 8,
the pressing member is a roller extending in a forming direction of the scribing line.
10. The segmenting device of claim 1 or 2,
the scribe lines are formed in a lattice shape on the substrate,
the dividing mechanism includes a first dividing mechanism that moves in a first arrangement direction of the scribe lines, and a second dividing mechanism that moves in a second arrangement direction orthogonal to the first arrangement direction of the scribe lines.
11. The segmenting device of claim 1 or 2,
the diaphragm is mounted on the main body at a predetermined position.
12. The singulation engine of claim 11,
the peripheral edge portion of the diaphragm is fixed to the frame,
the frame has a groove portion recessed toward an inner side of the diaphragm,
the position adjusting part is provided with a pin,
the pin is provided in the main body and fitted into the groove of the frame.
13. The segmenting device of claim 12,
the frame has two of the groove portions in a V-shape,
two pins engaged with the respective grooves are provided,
one of the pins contacts both sides of one of the groove portions,
the other pin is in contact with both sides of the other groove portion.
14. The segmenting device of claim 1 or 2,
having a guide plate for guiding the lid section to an upper surface of the main body section,
the guide plate is attached to a side surface of the main body such that an upper portion thereof protrudes from a side surface of the main body, and an inclined surface that descends toward the main body is formed on a surface of the upper portion on the side of the main body.
15. The segmenting device of claim 1 or 2,
the main body and the cover are fixed at two diagonal positions by toggle clamps.
16. The segmenting device of claim 1 or 2,
the cover portion has a transparent portion capable of viewing the substrate held in the cavity.
17. A substrate obtained by dividing a substrate having a first surface on which a predetermined scribe line is formed and a second surface opposite to the first surface and bonded to a film along the scribe line,
holding the substrate in a cavity so as to form a first chamber on the first surface side and a second chamber on the second surface side with the diaphragm interposed therebetween,
adjusting pressures of the first chamber and the second chamber to maintain the substrate in a predetermined posture in the chamber,
in the second chamber, the substrate is pushed up toward the first chamber side while moving a pressing member in an arrangement direction of the scribe lines.
18. A dividing apparatus for dividing a substrate, in which a predetermined scribe line is formed on a first surface and a second surface opposite to the first surface is bonded to a film, along the scribe line, the dividing apparatus comprising:
a chamber that holds the substrate so as to form a first chamber on the first surface side and a second chamber on the second surface side with the diaphragm interposed therebetween; and
and a pressure adjusting unit that individually adjusts pressures of the first chamber and the second chamber.
19. The segmenting device of claim 18,
a control portion for controlling the pressure adjusting portion,
the control unit adjusts the pressures of the first chamber and the second chamber, and bends the diaphragm and the substrate along the scribe line until the substrate is divided by a pressure difference between the first chamber and the second chamber.
20. The segmenting device of claim 18,
the cavity is composed of a lid portion forming the first chamber and a body portion forming the second chamber,
the inner wall surface of the lid portion has a shape curved in a concave shape.
21. The segmenting device of claim 20,
a control portion for controlling the pressure adjusting portion,
the control unit adjusts the pressure of the first chamber and the pressure of the second chamber during the division of the substrate so that the first surface of the substrate is in contact with the inner wall surface of the lid.
22. The segmenting device of claim 20 or 21,
the inner wall surface of the cover part is spherical.
23. The segmenting device of claim 20 or 21,
the diaphragm is mounted on the main body at a predetermined position.
24. The segmenting device of claim 23,
the peripheral edge portion of the diaphragm is fixed to the frame,
the frame has a groove portion recessed toward an inner side of the diaphragm,
the position adjusting part is provided with a pin,
the pin is provided in the main body and fitted into the groove of the frame.
25. The segmenting device of claim 24,
the frame has two of the groove portions in a V-shape,
two pins engaged with the respective grooves are provided,
one of the pins contacts both sides of one of the groove portions,
the other pin is in contact with both sides of the other groove portion.
26. The segmenting device of claim 20 or 21,
having a guide plate for guiding the lid section to an upper surface of the main body section,
the guide plate is attached to a side surface of the main body such that an upper portion thereof protrudes from a side surface of the main body, and an inclined surface that descends toward the main body is formed on a surface of the upper portion on the side of the main body.
27. The segmenting device of claim 20 or 21,
the main body and the cover are fixed at two diagonal positions by toggle clamps.
28. The segmenting device of claim 20 or 21,
the cover portion has a transparent portion capable of viewing the substrate held in the cavity.
29. A substrate obtained by dividing a substrate having a first surface on which a predetermined scribe line is formed and a second surface opposite to the first surface and bonded to a film along the scribe line,
holding the substrate in a cavity so as to form a first chamber on the first surface side and a second chamber on the second surface side with the diaphragm interposed therebetween,
the pressures of the first and second chambers are adjusted such that the pressure of the second chamber is higher than the pressure of the first chamber.
30. The segmentation method according to claim 29,
after the film is given a tension in advance, the substrate is attached to the film.
CN202011130648.2A 2019-11-14 2020-10-21 Dividing device and dividing method Pending CN112793013A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019206478A JP2021082634A (en) 2019-11-14 2019-11-14 Cutting device and cutting method
JP2019-206480 2019-11-14
JP2019-206478 2019-11-14
JP2019206480A JP2021082635A (en) 2019-11-14 2019-11-14 Cutting device and cutting method

Publications (1)

Publication Number Publication Date
CN112793013A true CN112793013A (en) 2021-05-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011130648.2A Pending CN112793013A (en) 2019-11-14 2020-10-21 Dividing device and dividing method

Country Status (3)

Country Link
KR (1) KR20210058664A (en)
CN (1) CN112793013A (en)
TW (1) TW202121522A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009143197A (en) 2007-12-18 2009-07-02 Mitsubishi Materials Corp Divided body manufacturing method and apparatus

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KR20210058664A (en) 2021-05-24
TW202121522A (en) 2021-06-01

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Application publication date: 20210514