CN112791976A - Double-sided wafer appearance defect detector - Google Patents
Double-sided wafer appearance defect detector Download PDFInfo
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- CN112791976A CN112791976A CN202110134535.8A CN202110134535A CN112791976A CN 112791976 A CN112791976 A CN 112791976A CN 202110134535 A CN202110134535 A CN 202110134535A CN 112791976 A CN112791976 A CN 112791976A
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- 230000007547 defect Effects 0.000 title claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims abstract description 83
- 230000033001 locomotion Effects 0.000 claims abstract description 71
- 230000007246 mechanism Effects 0.000 claims abstract description 65
- 238000001514 detection method Methods 0.000 claims abstract description 59
- 230000000007 visual effect Effects 0.000 claims abstract description 44
- 230000001360 synchronised effect Effects 0.000 claims description 15
- 238000011179 visual inspection Methods 0.000 claims description 9
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000002950 deficient Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 238000007689 inspection Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 210000003813 thumb Anatomy 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a double-sided wafer appearance defect detector which is a multilayer structure and comprises a rack, wherein an A-side Y-axis motion module, a B-side Y-axis motion module and a B-side X-axis motion module are respectively arranged on the rack, the A-side X-axis motion module is arranged on the A-side Y-axis motion module, an A-side visual detection mechanism is arranged on the A-side X-axis motion module, a B-side visual detection mechanism is arranged on the B-side X-axis motion module, and a transmission device is arranged between the A-side visual detection mechanism and the B-side visual detection mechanism on the rack. The detection machine provided by the invention has the beneficial effects that the detection machine can synchronously detect the double surfaces of the wafer, the detection rate is very high, the equipment has various alarm control functions, large-scale quality abnormity occurs in a production line, the process can be found and improved in time, unnecessary loss of a factory is avoided, the detection efficiency can be effectively improved, the expenditure of labor cost is reduced, and the defective rate is effectively reduced.
Description
Technical Field
The invention relates to the technical field of wafer appearance detection, in particular to a double-sided wafer appearance defect detector.
Background
The silicon wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the wafer is a basic raw material for manufacturing an IC, and in the process of producing the silicon wafer, the yield is an important condition, the requirement on the quality of the silicon wafer is very strict, and in the mass production, the appearance of the silicon wafer is often required to be inspected, for example: size, breakage, cracking, porosity, cracking, poor nickel coating, and the like.
At present, the semiconductor field is being developed vigorously, the appearance detection (and the selective inspection) of the silicon wafer is usually carried out manually through the manual work, time and labor are wasted, and the silicon wafer is easily damaged due to the action of human external force.
Disclosure of Invention
The invention aims to solve the problems and designs a double-sided wafer appearance defect detector.
The technical scheme of the invention is that the double-sided wafer appearance defect detector is a multilayer structure body and comprises a rack, wherein an A-side Y-axis motion module, a B-side Y-axis motion module and a B-side X-axis motion module are respectively arranged on the rack, the A-side Y-axis motion module is provided with the A-side X-axis motion module, the A-side X-axis motion module is provided with an A-side visual detection mechanism, the B-side X-axis motion module is provided with a B-side visual detection mechanism, and a transmission device is arranged between the A-side visual detection mechanism and the B-side visual detection mechanism on the rack.
As a further explanation of the present invention, the a-plane Y-axis motion module includes guide rails, a limiting member, a transmission motor, a lead screw and a fixing member, the guide rails are installed on both sides of the upper end of the frame, the transmission motor is installed on the frame near the end of one of the guide rails, the fixing member is installed on the frame and faces the transmission motor, the lead screw passes through the bottom of the a-plane X-axis motion module, one end of the lead screw is fixedly connected with the transmission motor, the other end is slidably connected with the fixing member, the limiting member is respectively installed on both ends of the other guide rail, and the a-plane X-axis motion module is slidably connected with the guide rails.
As a further description of the present invention, the a-plane X-axis motion module includes a sliding base, a screw rod, a transmission motor installed at an end of the sliding base, and a guide rail installed on the sliding base, the screw rod passes through the a-plane visual detection mechanism, and one end of the screw rod is fixedly connected with the transmission motor, and the other end is slidably connected with the sliding base, and the a-plane visual detection mechanism is installed on the sliding base and slidably connected with the guide rail.
As a further explanation of the present invention, the B-plane Y-axis motion module includes transmission assemblies installed on two sides of the middle portion of the frame, wherein a transmission motor is installed at an end portion of one of the transmission assemblies, the transmission motor is connected with a lead screw gear on the transmission assembly, a manual dial wheel is installed at an end portion of the other transmission assembly, the manual dial wheel is fixedly connected with a lead screw on the transmission assembly, and two ends of the transmission device are respectively connected with the transmission assemblies in a sliding manner.
As a further explanation of the present invention, the B-plane X-axis motion module includes a fixed base installed on the frame, a transmission motor installed at an end of the fixed base, and a lead screw and a guide rail installed on the fixed base, the lead screw passes through the B-plane visual detection mechanism, and one end of the lead screw is fixedly connected with the transmission motor, and the other end is slidably connected with the fixed base, and the B-plane visual detection mechanism is installed on the fixed base and is slidably connected with the guide rail.
As a further explanation of the invention, the A-plane visual inspection mechanism and the B-plane visual inspection mechanism both comprise a differential adjustment assembly and a visual camera assembly mounted on the differential adjustment assembly.
As a further explanation of the present invention, the transmission device includes a track assembly, a synchronous belt, a transmission motor installed outside the track assembly, and a plurality of synchronous wheels installed inside the track assembly, wherein the transmission motor is provided with a transmission wheel, and the synchronous wheels are connected with the transmission wheel through the synchronous belt.
As a further explanation of the present invention, a clamping plate mechanism is further provided on the conveying device.
The detection machine has the advantages that double faces of a wafer can be synchronously detected, the detection rate is very high, the wafer is conveyed to the position of the clamping plate mechanism through the conveying device and is pressed and fixed through the clamping plate mechanism, then the appearances of the double faces of the A face and the B face of the wafer are detected through the arranged A face visual detection mechanism and the B face visual detection mechanism, defective products are marked, the defective products are prevented from flowing into rear-section wafer finished products, information processing such as detection data and the like can be traced to any node, the detection machine has various alarm control functions, large-scale quality abnormity occurs in a production line, a manufacturing process can be timely found and improved, unnecessary loss of a factory is avoided, the detection efficiency can be effectively improved, the expenditure of labor cost is reduced, and the defective rate is effectively reduced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of the present invention with the A-plane X-axis motion module and the A-plane vision inspection mechanism removed;
FIG. 3 is a schematic structural diagram of an A-plane X-axis motion module and an A-plane vision inspection mechanism according to the present invention;
FIG. 4 is a schematic structural diagram of a B-plane Y-axis motion module and a transmission device according to the present invention;
fig. 5 is a schematic structural diagram of a B-plane X-axis motion module and a B-plane visual inspection mechanism according to the present invention.
In the figure, 1, a frame; 2. the A surface Y-axis motion module; 3. an A-plane X-axis motion module; 4. a B-plane Y-axis motion module; 5. a transmission device; 6. a B-plane X-axis motion module; 7. a surface A visual detection mechanism; 8. a B-side visual detection mechanism; 9. a clamping plate mechanism; 10. a drive motor; 11. a guide rail; 12. a fixing member; 13. a screw rod; 14. a limiting member; 15. a slide base; 16. a differential adjustment component; 17. a visual camera component; 18. a transmission assembly; 19. a manual thumb wheel; 20. a track assembly; 21. a driving wheel; 22. a synchronizing wheel; 23. a synchronous belt; 24. a fixed base; .
Detailed Description
The invention is described in detail with reference to the accompanying drawings, as shown in fig. 1-5, a double-sided wafer appearance defect detector includes a frame 1, the detector is a multi-layer structure, and may include three layers in total, which are respectively an a-side visual inspection mechanism 7 installed on an upper layer of the frame 1, a middle-layer transmission device 5, and a B-side visual inspection mechanism 8 located on a lower layer of the frame 1, the transmission device 5 is used for transmitting a wafer, and transmitting the wafer to a designated position to be detected, then performing appearance defect detection on an upper surface of the wafer by the a-side visual inspection mechanism 7, performing appearance defect detection on a lower surface of the wafer by the B-side visual inspection mechanism 8, and for convenience of detection, the wafer slides when placed on the detection, and a clamping plate mechanism 9 is further provided on the transmission device 5; the position of wafer may deviate during the detection, for the convenience of more accurate detection, still be provided with A face Y axle motion module 2 on frame 1, B face Y axle motion module 4 and B face X axle motion module 6, and still be provided with A face X axle motion module 3 on A face Y axle motion module 2, wherein A face visual detection mechanism 7 is just installed on A face X axle motion module 3, B face visual detection mechanism 8 is installed on B face X axle motion module 6, adjust visual detection mechanism's position through several motion modules that set up.
The following description will be made for the above-mentioned mechanisms, wherein the a-plane X-axis motion module 3 and the a-plane Y-axis motion module 2 are used to adjust the position of the a-plane vision inspection mechanism 7 in the X direction and the Y direction, the above-mentioned a-plane Y-axis motion module 2 includes guide rails 11 installed on both sides of the upper end of the frame 1, a transmission motor 10 installed on the frame 1, a limiting member 14, a lead screw 13 and a fixing member 12, wherein the transmission motor 10 is installed at the end of one of the guide rails 11, the fixing member 12 is located at the other end of the guide rail 11 and faces the transmission motor 10, the lead screw 13 passes through the bottom of the a-plane X-axis motion module 3, one end is fixedly connected with the transmission motor 10, the other end is slidably connected with the fixing member 12, both ends of the a-plane X-axis motion module 3 are slidably connected with two guide rails 11 of the a-plane Y-axis, the position of the A-surface visual detection mechanism 7X direction is adjusted, and the limiting pieces 14 are arranged at two ends of the other guide rail 11 and used for limiting the sliding distance of the A-surface X-axis movement module 3 and preventing the A-surface X-axis movement module from sliding out of the guide rail 11.
The above-mentioned a face X axis motion module 3 is composed of parts such as slide base 15, lead screw 13, drive motor 10 and guide rail 11 installed on slide base 15, its function is the same as a face Y axis motion module 2, wherein drive motor 10 is installed at the end of slide base 15, lead screw 13 passes a face visual detection mechanism 7, and one end of lead screw 13 is fixedly connected with drive motor 10, another end and slide base 15 sliding connection, a face visual detection mechanism 7 is installed on slide base 15 and sliding connection with guide rail 11 as a whole, the motion principle is also through lead screw 13 transmission.
The B surface X-axis motion module 6 and the B surface X-axis motion module 6 are used for adjusting the positions of the B surface visual detection mechanism 8 in the X direction and the Y direction, wherein the B surface Y-axis motion module 4 comprises transmission assemblies 18 arranged on two sides of the middle of the rack 1, a transmission motor 10 is arranged at the end part of one transmission assembly 18, the transmission motor 10 is in gear connection with a screw rod 13 on the transmission assembly 18, a manual thumb wheel 19 is arranged at the end part of the other transmission assembly 18, the manual thumb wheel 19 is fixedly connected with the screw rod 13 on the transmission assembly 18, two ends of the transmission device 5 are respectively in sliding connection with the transmission assemblies 18, the transmission motor 10 drives the screw rod 13 on the transmission assembly 18 to rotate through a gear, and the screw rod 13 rotates to drive the transmission device 5 to move on the transmission assembly 18 along the Y direction. Here, it should be mentioned that the transmission device 5 includes a track assembly 20, a synchronous belt 23, a transmission motor 10 installed outside the track assembly 20, and a plurality of synchronous wheels 22 installed inside the track assembly 20, a transmission wheel 21 is provided on the transmission motor 10, the synchronous wheels 22 are connected with the transmission wheel 21 through the synchronous belt 23, the distance between the two track assemblies 20 is directly matched with the diameter of the wafer, the transmission motor 10 drives the synchronous belt 23 to move, after the wafer moves to a designated position through the synchronous belt 23, the clamping plate mechanism 9 clamps and fixes the wafer, which is beneficial to the later-stage appearance detection and reduces the error rate.
The structure of the B-surface X-axis motion module 6 is similar to that of the A-surface X-axis motion module 3, and the B-surface X-axis motion module comprises a fixed base 24 installed on a rack 1, a transmission motor 10 installed at the end part of the fixed base 24, a screw rod 13 and a guide rail 11 installed on the fixed base 24, wherein the screw rod 13 penetrates through a B-surface visual detection mechanism 8, one end of the screw rod 13 is fixedly connected with the transmission motor 10, the other end of the screw rod is connected with the fixed base 24 in a sliding mode, the B-surface visual detection mechanism 8 is installed on the fixed base 24 and is connected with the guide rail 11 in a sliding mode, and the transmission motor 10 drives the B-surface visual detection mechanism 8 to move.
The above are the structure and principle of the motion module of the inspection machine provided by the present invention, after the wafer is transferred to the designated position on the transmission device 5, the position of the a-plane vision inspection mechanism 7 is adjusted by the a-plane X-axis motion module 3 and the a-plane Y-axis motion module 2, and then the position of the B-plane vision inspection mechanism 8 is adjusted by the B-plane X-axis motion module 6, wherein the a-plane vision inspection mechanism 7 and the B-plane vision inspection mechanism 8 both include a differential adjustment assembly 16 and a vision camera assembly 17 mounted on the differential adjustment assembly 16, the appearance of the wafer is inspected by the vision camera assembly 17, the focal length is adjusted by the vision camera assembly 17 according to the requirement, and the vision camera assembly 17 is vertically adjusted by the differential adjustment assembly 16.
The working principle is as follows: the position of a transmission device 5 is adjusted through a B-surface Y-axis motion module 4, the position of a B-surface visual detection mechanism 8 is adjusted through a B-surface X-axis motion module 6, the position of an A-surface visual detection mechanism is adjusted through an A-surface X-axis motion module 3 and an A-surface Y-axis motion module 2, the A-surface visual detection mechanism 7, a clamping plate mechanism 9 on the transmission device 5 and the B-surface visual detection mechanism 8 are located on the same vertical axis, the focal length of a visual camera component 17 is adjusted through a differential adjustment component 16, a wafer is clamped and fixed by a clamping plate device after being transmitted to a designated position through the transmission device 5, and then the A-surface visual detection mechanism 7 and the B-surface visual detection mechanism 8 detect the upper surface and the lower surface of the wafer.
The technical solutions described above only represent the preferred technical solutions of the present invention, and some possible modifications to some parts of the technical solutions by those skilled in the art all represent the principles of the present invention, and fall within the protection scope of the present invention.
Claims (8)
1. The utility model provides a two-sided wafer appearance imperfections detects machine, this detection machine is a multilayer structure body, includes frame (1), its characterized in that, be provided with A face Y axle motion module (2), B face Y axle motion module (4) and B face X axle motion module (6) on frame (1) respectively, be provided with A face X axle motion module (3) on A face Y axle motion module (2), be provided with A face visual detection mechanism (7) on A face X axle motion module (3), be provided with B face visual detection mechanism (8) on B face X axle motion module (6), lie in on frame (1) A face visual detection mechanism (7) with be provided with transmission device (5) between B face visual detection mechanism (8).
2. The double-sided wafer appearance defect detecting machine according to claim 1, wherein the A-sided Y-axis moving module (2) comprises guide rails (11), limit pieces (14), transmission motors (10), lead screws (13) and fixing pieces (12), the guide rails (11) are installed on two sides of the upper end of the frame (1), the transmission motors (10) are installed on the frame (1) and close to the end part of one of the guide rails (11), the fixing pieces (12) are installed on the frame (1) and face the transmission motors (10), the lead screws (13) penetrate through the bottom of the A-sided X-axis moving module (3), one ends of the lead screws (13) are fixedly connected with the transmission motors (10), the other ends of the lead screws are slidably connected with the fixing pieces (12), the limit pieces (14) are respectively installed at two ends of the other guide rail (11), the A-surface X-axis movement module (3) is connected with the guide rail (11) in a sliding mode.
3. The double-sided wafer appearance defect detector as claimed in claim 1, wherein the a-sided X-axis motion module (3) comprises a sliding base (15), a lead screw (13), a transmission motor (10) mounted at an end of the sliding base (15), and a guide rail (11) mounted on the sliding base (15), the lead screw (13) passes through the a-sided visual detection mechanism (7), and one end of the lead screw (13) is fixedly connected with the transmission motor (10) and one end is slidably connected with the sliding base (15), and the a-sided visual detection mechanism (7) is mounted on the sliding base (15) and slidably connected with the guide rail (11).
4. The double-sided wafer appearance defect detector according to claim 1, wherein the B-sided Y-axis motion module (4) comprises transmission assemblies (18) mounted on two sides of the middle of the rack (1), a transmission motor (10) is arranged at one end of one transmission assembly (18), the transmission motor (10) is in gear connection with a screw rod (13) on the transmission assembly (18), a manual shifting wheel (19) is arranged at the other end of the other transmission assembly (18), the manual shifting wheel (19) is fixedly connected with the screw rod (13) on the transmission assembly (18), and two ends of the transmission device (5) are respectively in sliding connection with the transmission assemblies (18).
5. The double-sided wafer appearance defect detector as claimed in claim 1, wherein the B-side X-axis motion module (6) comprises a fixed base (24) installed on the frame (1), a transmission motor (10) installed at an end of the fixed base (24), and a lead screw (13) and a guide rail (11) installed on the fixed base (24), the lead screw (13) passes through the B-side visual detection mechanism (8), and one end of the lead screw (13) is fixedly connected with the transmission motor (10), and one end is slidably connected with the fixed base (24), and the B-side visual detection mechanism (8) is installed on the fixed base (24) and is slidably connected with the guide rail (11).
6. A double-sided wafer appearance defect detector as claimed in claim 1, wherein said a-side visual inspection mechanism (7) and said B-side visual inspection mechanism (8) each comprise a differential adjustment assembly (16) and a visual camera assembly (17) mounted on the differential adjustment assembly (16).
7. A double-sided wafer appearance defect detecting machine according to claim 1, wherein the conveying device (5) comprises a rail assembly (20), a synchronous belt (23), a transmission motor (10) installed outside the rail assembly (20) and a plurality of synchronous wheels (22) installed inside the rail assembly (20), a transmission wheel (21) is arranged on the transmission motor (10), and the synchronous wheels (22) are connected with the transmission wheel (21) through the synchronous belt (23).
8. A double-sided wafer appearance defect detector as claimed in claim 1, wherein a clamping mechanism (9) is further provided on the transport device (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110134535.8A CN112791976A (en) | 2021-02-02 | 2021-02-02 | Double-sided wafer appearance defect detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110134535.8A CN112791976A (en) | 2021-02-02 | 2021-02-02 | Double-sided wafer appearance defect detector |
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| CN112791976A true CN112791976A (en) | 2021-05-14 |
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| CN202110134535.8A Pending CN112791976A (en) | 2021-02-02 | 2021-02-02 | Double-sided wafer appearance defect detector |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115228774A (en) * | 2022-08-04 | 2022-10-25 | 深圳市振华兴智能技术有限公司 | Automatic two-sided optics outward appearance detector |
| CN116147680A (en) * | 2023-03-27 | 2023-05-23 | 深圳智机视觉科技有限公司 | 2D and 3D double-sided combined visual detection equipment |
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| JP2020183907A (en) * | 2019-05-08 | 2020-11-12 | アスリートＦａ株式会社 | Electronic component inspection device |
| CN111940306A (en) * | 2020-07-27 | 2020-11-17 | 深圳连硕自动化科技有限公司 | Detection device and detection method for semiconductor chip |
| CN214347979U (en) * | 2021-02-02 | 2021-10-08 | 苏州矩浪科技有限公司 | Double-sided wafer appearance defect detector |
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2021
- 2021-02-02 CN CN202110134535.8A patent/CN112791976A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109712918A (en) * | 2018-12-29 | 2019-05-03 | 铜陵富仕三佳机器有限公司 | Chip detects collecting device and its application method |
| JP2020183907A (en) * | 2019-05-08 | 2020-11-12 | アスリートＦａ株式会社 | Electronic component inspection device |
| CN110369306A (en) * | 2019-08-23 | 2019-10-25 | 十堰隆深机器人有限公司 | A kind of membrane electrode detection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115228774A (en) * | 2022-08-04 | 2022-10-25 | 深圳市振华兴智能技术有限公司 | Automatic two-sided optics outward appearance detector |
| CN116147680A (en) * | 2023-03-27 | 2023-05-23 | 深圳智机视觉科技有限公司 | 2D and 3D double-sided combined visual detection equipment |
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