CN112798618A

CN112798618A - Circuit board detection device

Info

Publication number: CN112798618A
Application number: CN202110162814.5A
Authority: CN
Inventors: 陈鸣; 黄祖理; 林毅强; 丁晓华; 周翔
Original assignee: Dongguan Yingyan Online Electronic Technology Co ltd
Current assignee: Dongguan Yingyan Online Electronic Technology Co ltd
Priority date: 2021-02-05
Filing date: 2021-02-05
Publication date: 2021-05-14

Abstract

The application discloses circuit board detection device includes the board and locates conveying alignment assembly, send board subassembly and optical detection subassembly on the board. The conveying alignment assembly comprises a feeding conveying module and an alignment module. The feeding conveying module is used for conveying the circuit board along a first direction. The alignment module comprises an alignment movable plate and an alignment reference plate which are arranged on the feeding conveying module. The alignment movable plate and the alignment reference plate are respectively positioned at two opposite sides of the circuit board. The alignment movable plate moves along the second direction to push the first side edge of the circuit board to abut against the alignment reference plate. The plate feeding assembly is located on one side of the feeding conveying module and is close to the alignment reference plate. The board conveying assembly is used for grabbing the circuit board and conveying the circuit board along the first direction after the side plate of the circuit board abuts against the alignment reference plate. The optical detection assembly is arranged at the tail end of the feeding conveying module along the first direction. The optical detection component is used for detecting the circuit board. The application provides a circuit board detection device for improving detection efficiency of a circuit board.

Description

Circuit board detection device

Technical Field

The application relates to the field of circuit board detection, in particular to a circuit board detection device.

Background

With the wide application of circuit boards in various fields, the quality inspection requirements for the circuit boards are also higher and higher. At present, the hole type circuit board is detected in various ways in the industry, including detection of coaxiality of a back drilling hole and a stepped hole or detection of positions, sizes and geometrical shapes of through holes, and how to improve detection efficiency of the circuit board becomes a technical problem to be solved.

Disclosure of Invention

The application provides a circuit board detection device for improving detection efficiency of a circuit board.

The circuit board detection device that this application embodiment provided includes:

a machine platform;

the conveying alignment assembly is arranged on the machine table and comprises a feeding conveying module and an alignment module, the feeding conveying module is used for conveying the circuit board along a first direction, the alignment module comprises an alignment movable plate and an alignment reference plate, the alignment movable plate and the alignment reference plate are arranged on the feeding conveying module and are respectively positioned on two opposite sides of the circuit board, the alignment movable plate is used for moving along a second direction so as to push a first side edge of the circuit board to abut against the alignment reference plate, and the second direction is a direction perpendicular to the first direction in a conveying plane of the feeding conveying module;

the plate conveying assembly is arranged on the machine table; the feeding assembly is positioned on one side of the feeding conveying module and is arranged close to the alignment reference plate, and the feeding assembly is used for grabbing the circuit board after a side plate of the circuit board abuts against the alignment reference plate and conveying the circuit board along the first direction; and

the optical detection assembly is arranged on the machine table and is arranged at the tail end of the feeding conveying module along the first direction, and the optical detection assembly is used for detecting the circuit board.

According to the circuit board detection device, the feeding transmission module is arranged to transmit the circuit board to the position below the optical detection assembly, so that the automation degree is high, and the detection speed is high; the alignment movable plate and the alignment reference plate are arranged on the feeding conveying module, when the circuit board is conveyed between the alignment movable plate and the alignment reference plate, the alignment movable plate is controlled to move towards the alignment reference plate, so that the first side edge of the circuit board is aligned with the alignment reference plate, the board conveying assembly is close to the alignment reference plate, the board conveying assembly can grab the circuit board aligned with the alignment reference plate and convey the circuit board to the lower side of the optical detection assembly for detection, and due to the design of the alignment movable plate and the alignment reference plate, the circuit board can be quickly aligned after being fed, so that the board conveying assembly can quickly grab and convey the circuit board, the detection efficiency of the circuit board is improved, and the production efficiency of the circuit board can be effectively improved for batch detection of the circuit boards.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a circuit board detection device provided in an embodiment of the present application;

FIG. 2 is a schematic view of a partial structure of the circuit board inspection device shown in FIG. 1;

FIG. 3 is a schematic view of the feed transport module and the alignment module shown in FIG. 2 from a first perspective;

FIG. 4 is a second perspective view of the feed transport module and alignment module of FIG. 2;

FIG. 5 is a third perspective view of the feed transport module and alignment module of FIG. 2;

FIG. 6 is a schematic view of a portion of the alignment module shown in FIG. 2;

FIG. 7 is a fourth perspective view of the feed transport module and alignment module of FIG. 2;

FIG. 8 is a schematic diagram of the feed transport module and the alignment module shown in FIG. 2 from a fifth perspective;

FIG. 9 is a schematic view of the feed transfer module, alignment module and plate feed assembly shown in FIG. 2;

FIG. 10 is a schematic view of the feed transport assembly, plate feed assembly, backlight, and camera light source of FIG. 2;

FIG. 11 is a schematic structural diagram of another view angle of the circuit board inspection device shown in FIG. 1;

FIG. 12 is a schematic view of another perspective of a portion of the circuit board inspection device shown in FIG. 2;

FIG. 13 is a schematic view of a partial structure of the circuit board inspection device shown in FIG. 11;

fig. 14 is a partial structural schematic diagram of a pressure plate assembly of the circuit board inspection device shown in fig. 13.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The embodiments listed in the present application may be appropriately combined with each other.

At present, in the industry, most of scanning detection equipment for hole circuit boards (such as PCBs, FPCs and the like), such as detection of back drilled holes, detection of other types of stepped holes or through holes and the like, adopts a manual sampling detection mode by using a microscope; also there are few off-line equipment scanning detection, need artifical mode of going up unloading to realize promptly, to the shoulder hole of types such as back drilling hole, need use the mode of being shaded and can detect the defect, consequently most off-line board has used the glass mesa to realize off-line scanning as work. The defects of these two detection methods have the following problems. In the manual detection mode, because the number of holes of the hole circuit board is huge, and about hundreds of thousands to millions of holes are different on one circuit board, the manual detection mode only can be sampling detection, the full detection of the holes cannot be realized, and the detection leakage of defects is easily caused; the efficiency of the manual detection mode is low; the detection quality of the manual detection mode is low, and the detection effect of the manual detection mode is easily influenced by the artificial emotion; moreover, for the detection of some special holes, the circuit board needs to be sliced at the hole position, the circuit board can be manually detected after being cut open, and the circuit board can only be scrapped after the detection, so that the cost waste can be caused. In the off-line equipment scanning detection mode, a large amount of time is occupied by a manual feeding and discharging mode, and the feeding and discharging time is almost twice of the scanning detection time, so that the production efficiency is seriously influenced; the glass workbench in an off-line equipment scanning detection mode is easy to wear, short in service life and high in material consumption cost, the glass workbench needs to be used due to the fact that backlight is needed optically, the glass workbench has a wear problem, and the glass workbench is high in cost and easy to wear; the off-line equipment scanning detection mode has low compatibility, the glass workbench has low compatibility for different board thicknesses, and generally can only be compatible to the range of 6mm, so that the detection of all circuit board specifications of customers cannot be met; the standardization degree of the off-line equipment scanning detection mode is low, manual intervention is needed in processing, manual loading and unloading modes are adopted, manual reference positioning is needed, the situation that the positioning reference is inaccurate easily occurs, and at the moment, the scanning pattern can be matched with standard data for comparison and calculation only through manual intervention.

The application provides a circuit board detection device 1000 with high detection efficiency, high detection quality, high compatibility and high automation degree.

Referring to fig. 1, the circuit board inspection apparatus 1000 includes a machine 100, and a conveying alignment assembly 200, a board conveying assembly 300, and an optical inspection assembly 400 disposed on the machine 100.

For convenience of description, the height direction of the machine 100 is defined as the Z-axis direction, the board feeding direction of the circuit board 2000 on the machine 100 is the X-axis direction, and the direction perpendicular to the board feeding direction on the top surface of the machine 100 is the Y-axis direction. Wherein the direction indicated by the arrow is the forward direction.

The transfer alignment assembly 200 is disposed on the machine 100. Specifically, the transferring and aligning assembly 200 is fixedly installed on the top of the machine 100.

Referring to fig. 2, the transfer alignment assembly 200 includes a feeding transfer module 210 and an alignment module 220.

The feeding and transferring module 210 is fixedly installed at one end of the table top of the machine table 100. The infeed conveyor module 210 is adapted to convey the circuit boards 2000 in a first direction. Wherein the first direction is the X-axis positive direction.

Optionally, referring to fig. 3 and 4, the feeding conveying module 210 includes a first fixing plate 211, a second fixing plate 212, a plurality of conveying wheels 213 and a conveying wheel driving member 214. The first fixing plate 211 and the second fixing plate 212 are fixed on the table top of the machine 100. The first fixing plate 211 and the second fixing plate 212 are oppositely disposed in the second direction. Wherein the second direction is the Y-axis direction (see also fig. 1).

Referring to fig. 5, two opposite ends of the transmission wheel 213 are rotatably connected to the first fixing plate 211 and the second fixing plate 212, respectively. Optionally, transfer wheel 213 is cylindrical. A plurality of transfer wheels 213 are provided in the same X-Y plane (see also fig. 1). The plurality of transmission wheels 213 are arranged at intervals along the first direction, and the transmission surface 215 is formed on the surface of the plurality of transmission wheels 213 supporting the circuit board 2000, and the transmission surface 215 is parallel to the table surface of the machine table 100.

The transmission wheel driving member 214 is fixedly connected to the first fixing plate 211 or the second fixing plate 212. The transmission wheel driving member 214 is used for driving the transmission wheels 213 to rotate so as to drive the circuit board 2000 disposed on the transmission wheels 213 to move along the first direction. Specifically, the plurality of transfer wheels 213 are rotated in synchronization by the transfer wheel drive 214. When the circuit board 2000 is picked up by the robot or the board loading machine and placed on the transfer surface 215 formed by the plurality of transfer wheels 213, the circuit board 2000 is moved in the first direction by the frictional force of the plurality of transfer wheels 213.

The alignment module 220 is disposed on the feeding conveying module 210 or embedded on the feeding conveying module 210 to improve the modularity and the integrity of the feeding conveying module 210 and the alignment module 220, thereby reducing the overall volume of the assembled feeding conveying module 210 and the alignment module 220 and promoting the miniaturization of the circuit board inspection device 1000.

Referring to fig. 3 and 5, the alignment module 220 includes an alignment plate 221 and an alignment reference plate 222 disposed on the feeding transport module 210. Specifically, the alignment movable plate 221 and the alignment reference plate 222 are disposed opposite to each other along a second direction, wherein the second direction is a Y-axis direction. An alignment datum plate 222 is secured to one side of the feed transport module 210. For example, the alignment reference plate 222 is fixed to the second fixing plate 212 or to the side of the second fixing plate 212. The alignment movable plate 221 is at least partially disposed above the conveying surface 215. The upper side of the conveying surface 215 refers to a side of the conveying surface 215 facing away from the machine 100. The alignment flap 221 is movable in the second direction. Further, the alignment movable plate 221 can move along the positive direction of the Y axis or the negative direction of the Y axis.

The alignment active plate 221 and the alignment reference plate 222 are respectively located on two opposite sides of the circuit board 2000. The alignment movable plate 221 is configured to move along the second direction to push the first side of the circuit board 2000 against the alignment reference plate 222. When the circuit board 2000 moves between the alignment movable plate 221 and the alignment reference plate 222, the alignment movable plate 221 moves along the second direction to push the circuit board 2000 to move along the second direction until the first side of the circuit board 2000 is aligned with the alignment reference plate 222. The alignment reference plate 222 extends in the X-axis direction. Thus, the first side of the circuit board 2000 is arranged along the X-axis direction. Further, the position aligned with the alignment reference plate 222 is a target position in the Y-axis direction after the circuit board 2000 is completely mounted, so as to facilitate subsequent quick grasping and conveying of the circuit board 2000. Wherein the second direction is a direction perpendicular to the first direction within the conveying surface 215 of the feed conveyor module 210.

Referring to fig. 1 and 2, the plate feeding assembly 300 is disposed on the machine 100. The plate feed assembly 300 is located on one side of the feed transfer module 210. The plate feeding assembly 300 is disposed adjacent to the alignment datum plate 222. The plate feeding assembly 300 is used for precisely conveying the circuit board 2000. Further, the plate feeding assembly 300 is located on a side of the second fixing plate 212 facing away from the first fixing plate 211. The plate feeding assembly 300 is slidably connected to the top of the machine 100 along the X-axis direction. The board feeding assembly 300 is used for grabbing the circuit board 2000 after the first side edge of the circuit board 2000 abuts against the alignment reference board 222 and conveying the circuit board 2000 in the first direction.

Referring to fig. 1 and 2, the optical inspection assembly 400 is disposed on the machine 100. The optical detection assembly 400 is disposed at an end of the feed transport module 210 in the first direction. The board feeding module 300 feeds the circuit board 2000 to a position below the optical inspection module 400, and the optical inspection module 400 is used for inspecting the circuit board 2000 for defects. Defects include, but are not limited to, whether the holes on the wiring board 2000 are accurately located, whether the size meets specifications, whether the through holes extend through the wiring board 2000, whether the centers of the back-drilled holes and the stepped holes are aligned, and the like.

According to the circuit board detection device 1000 provided by the application, the feeding transmission module 210 is arranged to transmit the circuit board 2000 to the lower part of the optical detection assembly 400, so that the automation degree is high, and the detection speed is high; the feeding and conveying module 210 is provided with the alignment movable plate 221 and the alignment reference plate 222, when the circuit board 2000 is conveyed between the alignment movable plate 221 and the alignment reference plate 222, the alignment movable plate 221 is controlled to move towards the alignment reference plate 222, so that the first side edge of the circuit board 2000 is aligned with the alignment reference plate 222, the board feeding assembly 300 is close to the alignment reference plate 222, so that the board feeding assembly 300 grabs the circuit board 2000 aligned with the alignment reference plate 222 and conveys the circuit board 2000 to the lower part of the optical detection assembly 400 for detection, and the design of the alignment movable plate 221 and the alignment reference plate 222 realizes quick alignment of the circuit board 2000 after feeding, so that the board feeding assembly 300 grabs and conveys the circuit board 2000 quickly, the detection efficiency of the circuit board 2000 is improved, and the production efficiency of the circuit board 2000 can be improved effectively for batch detection of the circuit boards 2000.

The application provides a circuit board detection device 1000 has following beneficial effect for traditional artifical detection mode and off-line equipment scanning detection mode: the production efficiency is high, the automatic scanning detection mechanism greatly shortens the time of feeding and discharging, improves the production efficiency and realizes the full detection function of the circuit board 2000; the detection quality is high, and compared with manual detection, the detection quality is greatly improved by a mechanical automatic scanning detection mechanism; the service life of the mechanism is long, and the automatic scanning detection mechanism avoids the use of wearing parts such as a glass workbench and the like, and improves the service life of the detection mechanism; the compatibility is high, and the automatic scanning detection mechanism can realize the detection of the thickness of all the existing circuit boards 2000; the standardization degree is high, the step of manual alignment is avoided by an automatic scanning detection mechanism, and the mechanical operation standardization degree is high.

Optionally, referring to fig. 2, the transfer alignment assembly 200 further includes an out-feed transfer module 230. The outfeed conveyor module 230 and the infeed conveyor module 210 are aligned in a first direction. The outfeed conveyor module 230 is spaced from the infeed conveyor module 210 to form a sensing position 240. The board feed assembly 300 is used to transport the circuit board 2000 from the infeed conveyor module 210 to the inspection location 240. The optical detection assembly 400 is disposed corresponding to the detection position 240. The optical inspection assembly 400 is used to inspect the circuit board 2000 at the inspection position 240. The board feeding assembly 300 is further used for conveying the circuit board 2000 from the detection position 240 to the discharging conveying module 230 after the optical detection assembly 400 finishes detection. The output transfer module 230 is used to transfer the circuit board 2000 to the next station.

The present application will be further described with respect to the transfer alignment assembly 200 in the following embodiments, but it is understood that the transfer alignment assembly 200 provided in the present application includes, but is not limited to, the following embodiments.

Referring to fig. 4, the transmission wheel driving member 214 further includes a transmission wheel motor 241. The transfer wheel motor 241 drives the plurality of transfer wheels 213 to rotate.

The transfer wheel motor 241 is fixedly mounted to the infeed transfer module 210. The plurality of transfer wheels 213 are spaced apart from the top of the machine 100 to prevent other structures from blocking the rotation of the plurality of transfer wheels 213. The transmission wheel motor 241 is located at an interval between the plurality of transmission wheels 213 and the top of the machine 100 to reasonably utilize the interval between the plurality of transmission wheels 213 and the top of the machine 100, thereby improving the compactness of the structure.

Optionally, referring to fig. 4, the transmission wheel driving member 214 further includes a transmission driving wheel 242 and a plurality of transmission driven wheels 243. Wherein, the axle center of the transmission driving wheel 242 is coaxially connected with the rotating shaft of the transmission wheel motor 241. The driving transmission wheel 242 and the driven transmission wheels 243 are connected by a first transmission belt 245, and two adjacent driven transmission wheels 243 are connected by second transmission belts 246, so that the driving transmission wheel 242 and the driven transmission wheels 243 rotate synchronously. The transmission driven pulley 243 is provided on the first fixing plate 211 and faces away from the second fixing plate 212. Each driven transmission wheel 243 is coaxially connected with one transmission wheel 213, and the rotation of the driven transmission wheel 243 can drive the rotation of the transmission wheel. In this way, the conveying wheel motor 241 drives the plurality of conveying wheels 213 to rotate synchronously via the conveying driving wheel 242, the first conveying belt 245, the conveying driven wheel 243, the second conveying belt 246, and the like.

In this embodiment, the transmission wheel driving member 214 is driven by a motor and a flat belt, but in other embodiments, the transmission wheel driving member 214 may be driven by a motor and a sprocket, a motor and a synchronous belt, or the like.

Referring to fig. 6, the initial position of the alignment movable plate 221 is close to the first fixing plate 211. The alignment module 220 further includes a movable plate driving member 223. The movable plate driving member 223 is fixedly connected to the first fixing plate 211 or the second fixing plate 212. The movable plate driving member 223 drives the alignment movable plate 221 to move toward the second fixing plate 212.

Specifically, referring to fig. 6, the alignment module 220 further includes a pair of alignment brackets 224 and at least one alignment guide 225 connected between the pair of alignment brackets 224. The pair of alignment brackets 224 are respectively disposed on the first fixing plate 211 and the second fixing plate 212. The alignment guide bar 225 extends in the Y-axis direction. Optionally, the movable plate driving member 223 includes a movable plate motor 231. The movable plate driving member 223 is mounted on an alignment bracket 224, and the alignment bracket 224 is fixedly connected to the second fixing plate 212. The flap driving part 223 further includes a flap driving pulley 232, a flap driven pulley (shielded), and a flap belt 233. The movable plate belt 233 is disposed in parallel with the alignment guide 225. The axis of the movable plate driving wheel 232 is coaxially connected with the rotating shaft of the movable plate motor 231. The movable plate driven wheel is fixed to the first fixing plate 211.

The pair of alignment brackets 224 and the alignment guide bar 225 are disposed in the space between the plurality of transfer wheels 213 and the top of the machine 100, so as to utilize the existing space as much as possible, improve the compactness of the feeding transfer module 210, and reduce the overall size of the transfer alignment assembly 200.

Referring to fig. 6, the alignment module 220 further includes a movable plate support 226. The movable plate support 226 is disposed in a space between the plurality of transfer wheels 213 and the top of the machine 100. The flap bracket 226 is fixedly coupled to the flap belt 233 to move together with the flap belt 233. The movable plate support 226 is further slidably connected to an alignment guide rod 225 to ensure the stability of the movable plate support 226 during the moving process. The movable plate bracket 226 is also fixedly connected to the movable plate driving member 223. When the movable plate motor 231 drives the movable plate belt 233 to move through the movable plate driving pulley 232 and the movable plate driven pulley, the movable plate belt 233 drives the movable plate support 226 to move along the Y-axis positive direction or negative direction, and further drives the alignment movable plate 221 to move along the Y-axis positive direction or negative direction.

Optionally, referring to fig. 4 and fig. 6, the alignment movable plate 221 includes a bottom plate 2211, a top plate 2212 and a plurality of connecting rods 2213, wherein the bottom plate 2211 is disposed between the plurality of transmission wheels 213 and the top of the machine 100. The bottom plate 2211 extends in the X-axis direction. The top plate 2212 is disposed opposite to the bottom plate 2211, and the top plate 2212 is disposed on a side of the plurality of transmission wheels 213 away from the top of the machine 100. The top plate 2212 extends in the X-axis direction. Each connecting rod 2213 passes through a gap between two adjacent transfer wheels 213 and is connected between the bottom plate 2211 and the top plate 2212. When the alignment flap 221 is moved in the Y-axis direction by the flap drive 223, the connecting rod 2213 moves in the gap between the adjacent two transfer wheels 213. The connecting rod 2213 pushes the circuit board 2000 to align with the alignment reference plate 222 by abutting the circuit board 2000.

Alternatively, the movable plate driving member 223 includes, but is not limited to, a motor and flat belt assembly, a motor and sprocket assembly, a motor and timing belt assembly, a cylinder, etc.

Optionally, the alignment reference plate 222 is disposed on a side of the second fixing plate 212 away from the first fixing plate 211, so that the alignment reference plate 222 and the plurality of transmission driven wheels 243 are not interfered with each other, and the space on the discharging transmission module 230 can be further effectively utilized.

Referring to fig. 7, the alignment module 220 further includes a reference plate driving member 227. The reference plate driving member 227 is used for driving the alignment reference plate 222 to extend and retract along the third direction relative to the conveying surface 215 of the feeding conveying module 210. The third direction is a normal direction of the conveying surface 215.

Optionally, referring to fig. 7, the reference plate driving member 227 is a cylinder. In still other aspects, the reference plate drive 227 includes, but is not limited to, a motor and flat belt combination, a motor and sprocket combination, a motor and timing belt combination, and the like. The alignment module 220 further includes a first transmission member 228 and a reference plate rail 229. One end of the first transmission member 228 is engaged with the alignment reference plate 222, and the other end of the first transmission member 228 is connected to the reference plate driving member 227. The second fixing plate 212 is also provided with a reference plate guide groove 251. The reference plate guide 229 is provided in the reference plate guide groove 251 to move in the Z-axis direction. The reference plate driving unit 227 moves the alignment reference plate 222 via the first transmission unit 228, and when the alignment reference plate 222 moves, the reference plate guide rail 229 moves along the reference plate guide groove 251 to extend and contract the alignment reference plate 222 in the Z-axis direction. When the circuit board 2000 is aligned, the alignment reference plate 222 is controlled to at least partially extend out of the transmission surface 215, and the circuit board 2000 is pushed by the alignment movable plate 221 to abut against the alignment reference plate 222, so that the first side edge of the circuit board 2000 is aligned with the alignment reference plate 222 along the X-axis direction. After the first side of the circuit board 2000 is aligned, the alignment reference plate 222 is controlled to move in the opposite direction along the Z-axis, so that the alignment reference plate 222 is lowered below the conveying surface 215, so that the board feeding assembly 300 can grasp the circuit board 2000 by passing through the alignment reference plate 222. After the board feeding assembly 300 moves the circuit board 2000 out of the position corresponding to the positioning reference board 222, the positioning reference board 222 is lifted again to perform reference positioning on the next circuit board 2000.

Optionally, referring to fig. 8, the alignment module 220 further includes an alignment baffle 252 and a baffle driving member (not shown). The alignment baffle 252 is located near the front end of the optical inspection assembly 400 (the front end of the optical inspection assembly 400 refers to the end of the optical inspection assembly 400 near the in-feed transport module 210). The alignment baffle 252 is disposed between two adjacent transfer wheels 213. The alignment fence 252 extends in the Y-axis direction. The baffle driving member is used for driving the alignment baffle 252 to extend and retract along the third direction relative to the conveying surface 215 of the feeding conveying module 210. The third direction is a normal direction of the conveying surface 215. The alignment shutter 252 is configured to abut the second side edge of the circuit board 2000 against the alignment shutter 252 when the conveying surface 215 is protruded.

Optionally, the baffle driving member includes, but is not limited to, a motor and flat belt assembly, a motor and sprocket assembly, a motor and timing belt assembly, a cylinder, etc.

Specifically, the angle at which the circuit board 2000 moves on the plurality of transfer wheels 213 in the X-axis direction is not determined, and the second side of the circuit board 2000 may be in the Y-axis direction or may intersect the Y-axis direction. By arranging the alignment baffle 252 on the moving path of the circuit board 2000, when the second side edge of the circuit board 2000 is intersected with the Y-axis direction, one corner of the circuit board 2000 abuts against the alignment baffle 252 extending out of the conveying surface 215, and the angle of the circuit board 2000 under the friction action of the plurality of driving wheels changes until the second side edge of the circuit board 2000 abuts against the alignment baffle 252, so that the alignment of the circuit board 2000 in the X-axis direction is realized. In other words, the alignment baffle 252 is used to level the circuit board 2000 inclined with respect to the Y-axis direction, so that the second side of the circuit board 2000 is flush with the Y-axis direction.

Optionally, a position sensor is provided at or near the alignment stop 252. The position sensor is used to detect whether the second side of the circuit board 2000 is flush with the Y-axis direction. In particular, the in-place sensor includes, but is not limited to, a sensor that can emit a light signal, a sound wave signal, and the like. The number of the in-place sensors is multiple. The number of in-position sensors is not particularly limited in this application. The position sensors are close to the alignment baffle 252 and located on one side of the alignment baffle 252 facing the incoming material direction of the circuit board 2000. The plurality of in-position sensors are arranged at intervals in the Y-axis direction. Each in-position sensor transmits a signal towards the positive direction of the Z axis. When the second side of the circuit board 2000 is not aligned with the Y-axis direction, the circuit board 2000 does not block the signal transmission path of the position sensor. When the at least two in-position sensors detect the reflected signals, it can be determined that the second side of the circuit board 2000 is flush with the Y-axis direction.

After the second side edge of the circuit board 2000 abuts against the alignment baffle 252, the alignment movable plate 221 pushes the first side edge of the circuit board 2000 against the alignment reference plate 222, so that the circuit board 2000 is aligned in the X, Y axial direction. In other words, the alignment baffle 252, the alignment reference plate 222, and the alignment movable plate 221 are used to control the circuit board 2000 at the target position on the conveying surface 215, so that the board feeding assembly 300 can grasp the circuit board 2000 at the target position, thereby improving the feeding automation of the circuit board 2000 during the detection process.

The alignment module 220 and the feeding transport module 210 position the circuit board 2000 to a uniform reference edge, providing a scanning start reference for the optical inspection assembly 400. The alignment module 220 and the feeding and conveying module 210 are matched with each other to realize the uniform reference positioning of the circuit boards 2000 fed at different angles, so that manual feeding is not needed, the positioning is accurate, and the automation degree is high.

When the circuit board 2000 is located at the target position of the conveying surface 215, the circuit board 2000 is grasped by the board conveying assembly 300 and the circuit board 2000 is conveyed to the inspection position 240 for inspection. The present application will be further described with respect to the plate feeding assembly 300 by the following embodiments, but it is needless to say that the plate feeding assembly 300 provided by the present application includes, but is not limited to, the following embodiments.

Optionally, referring to fig. 9, the plate feeding assembly 300 includes a plate feeding guide 310, a plate feeding clamp assembly 320 and a plate feeding driving member 330. The board feeding guide 310 is disposed on the top of the machine 100 and extends along a first direction. The board feeding clip assembly 320 includes a clip holder 321 and a plurality of board feeding clips 322 provided on the clip holder 321. The gripper bracket 321 slides along the board feed rail 310 under the drive of the board feed drive 330. The plate feeding driving component 330 includes but is not limited to a motor + screw rod + guide rail, a motor + belt + guide rail, or a linear motor + guide rail. The plurality of plate feeding clips 322 are arranged at intervals in the X-axis direction. The number of the plate feeding clips 322 is not particularly limited in the present application. In one embodiment, the number of plate feed clips 322 is 3.

Referring to fig. 9, the plate feeding clamp 322 includes a clamp base plate 323, a clamp pressing plate 324, and a clamp driving member 325. The middle section of the clamp base plate 323 is rotatably connected with the middle section of the clamp pressing plate 324. One end of the clip presser 324 is connected to a clip driver 325. The clip driver 325 includes, but is not limited to, a motor. The other end of the clip presser plate 324 is adapted to cooperate with one end of the clip base plate 323 to hold the wiring board 2000. When the clip driving member 325 lowers one end of the clip presser 324, the other end of the clip presser 324 is separated from one end of the clip base plate 323 to open the opening of the plate feeding clip 322. When the clip driving member 325 lifts one end of the clip presser 324, the other end of the clip presser 324 comes close to one end of the clip base plate 323 to close the opening of the plate feeding clip 322.

The circuit board 2000 with different thicknesses can be clamped by the board feeding clamp 322, so that the circuit board detection device 1000 provided by the application can detect the circuit boards 2000 with different thicknesses.

Referring to fig. 9 and 10, after the alignment datum plate 222 is lowered, the board feeding driving member 330 drives the board feeding clip 322 assembly 320 to move along the board feeding guide rail 310 to the vicinity of the second fixing plate 212, so that the opening of the board feeding clip 322 is opened and the first side edge of the circuit board 2000 is disposed in the opening of the board feeding clip 322. Subsequently, the clip driving member 325 drives one end of the clip pressing plate 324 to rise, so that the other end of the clip pressing plate 324 and one end of the clip base plate 323 clamp the circuit board 2000 and drive the circuit board 2000 to move to the detection position 240 along the X-axis direction.

Alternatively, the clamp drive 325 includes, but is not limited to, a motor and flat belt combination, a motor and sprocket combination, a motor and timing belt combination, an air cylinder, and the like.

The structure of the discharging conveying module 230 is similar to that of the feeding conveying module 210, and is not described in detail here.

The present application further describes the optical detection assembly 400 with reference to the following embodiments, but it is understood that the optical detection assembly 400 provided by the present application includes, but is not limited to, the following embodiments.

Optionally, referring to fig. 11 and 12, the optical inspection assembly 400 includes a camera bracket 410, a camera guide 420, a camera support 430, an inspection assembly 440, an inspection driving assembly 450, a backlight 460 and a backlight driving member 470.

The camera support 410 is disposed on the machine 100 and traverses the feeding transport module 210, the detecting position 240 and the discharging transport module 230 along the second direction. The camera guide 420 is provided on the camera bracket 410 and extends in the second direction. Specifically, the number of the camera guide rails 420 is 3, and the 3 camera guide rails 420 are sequentially arranged in an X-axis direction. Of course, the number of the camera guide rails 420 may be plural.

The camera support 430 is slidably coupled to the camera guide 420. The detection drive assembly 450 includes a Y-axis drive 451. The Y-axis driving member 451 includes, but is not limited to, a combination of a motor and a lead screw, a combination of a motor and a belt, a combination of a motor and a chain, a cylinder, and the like. The Y-axis driving member 451 is used to drive the detecting assembly 440 to move along the camera guide 420, so that the detecting assembly 440 can move in the Y-axis direction. During the inspection, the inspection unit 440 moves in the Y-axis direction to inspect an area on the wiring board 2000 in the Y-axis direction.

Referring to fig. 11 and 12, the detecting position 240, the hollow area on the camera support 410, and the mounting hole on the camera support 430 are disposed correspondingly. The detection assembly 440 is disposed on the camera support 430. Specifically, the inspection unit 440 includes an inspection camera 441, an inspection lens 442, and a camera light source 443. The inspection camera 441, the inspection lens 442, and the camera light source 443 are sequentially connected. The inspection camera 441 is connected to the inspection lens 442. The inspection camera 441 and the inspection lens 442 are disposed on one side of the support camera bracket 410. The camera light source 443 is close to the detection position 240, and is used for supplementing light to the circuit board 2000 when the detection camera 441 collects an image, so as to improve the definition of the detection image. The camera light sources 443 extend through mounting holes in the camera support 430 into the hollowed-out area on the camera support 410.

Referring to fig. 11 and 12, the detection driving assembly 450 is used for driving the detection assembly 440 to move along the camera guide 420 and along the third direction. The third direction is the normal direction of the conveying surface 215 of the feed conveying module 210. The detection drive assembly 450 also includes a Z-axis drive 452. The Z-axis driving member 452 includes, but is not limited to, a combination of a motor and a lead screw, a combination of a motor and a belt, a combination of a motor and a chain, a cylinder, and the like. The Z-axis driving member 452 is used for driving the detecting assembly 440 to move along the Z-axis direction, so that the detecting assembly 440 can move in the Z-axis direction, and the Z-direction adjusting function of the optical device is realized, so as to adapt to the adjustment of the collecting heights of different plate thicknesses. In the detection process, the detection assembly 440 moves along the Z-axis direction to adjust the height of the detection camera 441 when corresponding to the circuit boards 2000 with different thicknesses, so as to adjust the focal length of the detection camera 441, improve the image acquisition quality of the circuit boards 2000, and further improve the quality detection accuracy of the circuit boards 2000. Simultaneously, the detection subassembly 440 of this application can realize height-adjustable in the Z axle direction to the focus that the circuit board 2000 that adapts to different thickness can both be adjusted to the preferred, and then all has the image acquisition definition of preferred to the circuit board 2000 of different thickness, and then improves the quality detection accuracy to the circuit board 2000 of different thickness, improves circuit board detection device 1000's detection range of application.

It will be appreciated that the inspection camera 441 is capable of image capture and transmission such that the processor compares the final captured image with the stored reference image to output a detection of whether and where defects are present.

When the circuit board detection device 1000 provided by the present application is applied to the back drilling hole of the circuit board 2000 and whether the center of the stepped hole is aligned, the backlight 460 needs to be set. The backlight 460 and the camera light source 443 illuminate the two opposite sides of the circuit board 2000 together to illuminate the outlines of the two holes of the back drilling hole and the stepped hole, so as to acquire clear outlines, and further improve the detection accuracy of whether the centers of the back drilling hole and the stepped hole of the circuit board 2000 are aligned.

The backlight 460 is disposed on a side of the detection position 240 facing away from the detection assembly 440. The backlight driver 470 is used to drive the backlight 460 to move along the second direction synchronously with the detection assembly 440.

Optionally, the backlight driving member 470 includes, but is not limited to, a combination of a motor and a lead screw, a combination of a motor and a belt, a combination of a motor and a chain, an air cylinder, and the like.

Optionally, referring to fig. 13 and 14, the circuit board inspection apparatus 1000 further includes a pressing plate assembly 500. The platen assembly 500 includes a first support plate 510, a second support plate 520, a first platen support 530, a first platen 540, a second platen support 550, a second platen 560, and a platen driver 570. The first support plate 510 and the second support plate 520 are disposed on the table top of the machine table 100. The first and second support plates 510 and 520 extend in the Y-axis direction. The first support plate 510 is disposed at an end of the infeed conveyor module 210 adjacent to the outfeed conveyor module 230. A second support plate 520 is provided at an end of the outfeed conveyor module 230 adjacent to the infeed conveyor module 210. The sensing position 240 is formed between the first support plate 510 and the second support plate 520.

Referring to fig. 13 and 14, the first platen holder 530 and the second platen holder 550 are disposed on the top of the machine 100. The first platen support 530 and the second platen support 550 span across the infeed and

outfeed transfer modules

210 and 230, respectively. The first platen bracket 530 and the second platen bracket 550 are connected in the X-axis direction. The first platen bracket 530 and the second platen bracket 550 are provided in the inner space of the camera bracket 410.

The first and

second platens

540 and 560 each extend in the Y-axis direction. The first pressing plate 540 is disposed corresponding to the first support plate 510. The first pressure plate 540 is slidably coupled to the first pressure plate holder 530. The first press plate 540 is moved in the third direction by the press plate driving unit 570 to be engaged with the first support plate 510 and press-fit the circuit board 2000. The second pressing plate 560 is disposed corresponding to the second support plate 520. The second platen 560 is slidably coupled to the second platen bracket 550. The second press plate 560 is moved in the third direction by the press plate driving unit 570 to be engaged with the second support plate 520 and press-fit the circuit board 2000. The first pressing plate 540 and the second pressing plate 560 are made of plastic material to reduce the abrasion to the surface of the circuit board 2000.

Specifically, referring to fig. 13 and 14, the pressing plate driving member 570 includes a first pressing plate driving member 571 and a second pressing plate driving member 572. The first pressing plate driving member 571 and the second pressing plate driving member 572 include, but are not limited to, a cylinder, a combination of a motor and a lead screw, a combination of a motor and a belt, a combination of a motor and a chain, and the like. The first and second pressing

plate driving members

571 and 572 are used to drive the first and second

pressing plates

540 and 560 to ascend or descend, respectively.

In the initial state, the distance between the first support plate 510 and the first pressing plate 540 is relatively large, and the distance is larger than the thickness of the circuit board 2000; the distance between the second support plate 520 and the second pressing plate 560 is relatively large, and is greater than the thickness of the wiring board 2000.

When the board feeding assembly 300 conveys the circuit board 2000 to the detection position 240, the circuit board 2000 is disposed on the first support plate 510 and the second support plate 520, the first pressing plate 540 descends under the action of the first pressing plate driving member 571, the circuit board 2000 is clamped between the first pressing plate 540 and the first support plate 510, the circuit board 2000 is clamped between the second pressing plate 560 and the second support plate 520, and the circuit board 2000 is fixed by the second pressing plate 560 and the second support plate 520. The inspection assembly 440 scans the wiring board 2000 between the first platen 540 and the second platen 560 in the Y-axis direction.

When the length of the circuit board 2000 along the X-axis direction is relatively long, one-time scanning of the detection assembly 440 along the Y-axis direction cannot perform full detection on the circuit board 2000; alternatively, a partial region of the first and second

pressing plates

540 and 560 forms a detection dead zone of the detection assembly 440, resulting in a reduction in detection accuracy of the entire wiring board 2000. As such, the circuit board inspection device 1000 further includes a controller (not shown). The controller is used for controlling the detection driving assembly 450 to drive the detection assembly 440 to scan the circuit board 2000 between the first pressing plate 540 and the second pressing plate 560 along the second direction. The controller is further configured to control the board feeding driving component 330 to drive the board feeding clip 322 component 320 to drive the circuit board 2000 to move the target distance along the first direction after the last scanning of the detecting component 440 is completed, and then control the detecting driving component 450 to drive the detecting component 440 to scan the circuit board 2000 between the first pressing plate 540 and the second pressing plate 560 along the second direction. The target distance may be a detection width of the detection assembly 440 in the X-axis direction. Thus, when the length of the circuit board 2000 along the X-axis direction is relatively long, after the detection assembly 440 performs one horizontal scanning, the board feeding clip 322 is driven to convey the circuit board 2000 by a target distance along the X-axis positive direction, and the detection assembly 440 is driven to perform the next horizontal scanning on the circuit board 2000, so as to scan the entire circuit board 2000 after multiple scanning.

The plate feeding assembly 300 and the driving assembly of the detecting assembly 440 are cooperated with each other to realize image scanning in the Y-axis direction while precisely transferring the wiring board 2000 in the X-axis direction.

The application provides a circuit board detection device 1000, the front end of the detection station is designed with an alignment module 220, the scanning station adopts a longitudinal (Y-axis direction) scanning mode, and is perpendicular to the board feeding direction (X-axis direction) of a circuit board 2000, the board feeding direction (X-axis direction) of the circuit board 2000 adopts a clamping mode of a linear module board feeding assembly 300 to feed the board, a detection assembly 440 is installed on a longitudinal detection driving assembly 450, and a Z-axis driving member 452 is designed on the detection assembly 440 to realize the adjustment of the detection heights of different board thicknesses, and other principles and basic structures are the same as or similar to those of the invention and are all within the protection scope of the application.

According to the circuit board detection device 1000 provided by the application, the circuit board 2000 is grabbed by a manipulator or a board loading machine and then placed on the transmission wheel 213, the circuit board 2000 is transmitted to the position of the alignment baffle 252 (ascending in an initial state) through the transmission wheels 213, and the irregular circuit board 2000 is blocked by the alignment baffle 252; the movable plate driving member 223 of the alignment module 220 drives the alignment movable plate 221 to move toward the alignment reference plate 222, and the circuit board 2000 is conveyed to the alignment reference plate 222 during the movement of the alignment movable plate 221, thereby completing the whole automatic alignment process.

After the circuit board 2000 is automatically aligned through the front end automatic alignment station, the alignment reference plate 222 and the alignment baffle 252 are lowered, the board feeding driving member 330 drives the board feeding clamp 322 to enter the positioning and edge-abutting position to take out the circuit board 2000, the circuit board 2000 is clamped by the clamp driving member 325 after being in place, then the board feeding driving member 330 drives the clamped circuit board 2000 to be conveyed in the X-axis direction, when the circuit board 2000 is conveyed below the detection position 240, the board feeding assembly 300 stops conveying, the circuit board 2000 is flattened by the first pressing plate 540 and the second pressing plate 560, the detection driving assembly 450 drives the detection assembly 440 to perform Y-axis direction scanning, after each scanning is completed, the pressing plate assembly 500 is raised, the board feeding assembly 300 continues to drive the circuit board 2000 to be conveyed in the X-axis direction for a certain distance (length of each scanning), the pressing plate assembly 500 is lowered, the detection driving assembly 450 drives the detection assembly 440, this is repeated to complete the scanning of one circuit board 2000 after the entire circuit board 2000 is completely scanned in the X-axis direction. The rear discharging and conveying module 230 completes discharging and conveying of the circuit board 2000, at this time, the front end automatic alignment device has completed an automatic positioning function on the next circuit board 2000, and the board feeding assembly 300 returns to repeat the board taking and conveying of the next circuit board 2000.

The circuit board detection device 1000 provided by the embodiment of the application is designed for the current hole detection requirements of the circuit board 2000 industry, and an automatic scanning detection mechanism is designed, so that the application uses a full-automatic detection mode to replace the detection mode of off-line equipment or the detection of a manual mode, and the problem of low efficiency of the off-line scanning mode and the manual detection mode is effectively solved; the scanning mode of the detection breaks through the traditional mobile scanning mode of the workbench, and the automatic and accurate transmission scanning mode of the circuit board 2000 is realized; the detection mode has high efficiency, can realize the full detection of the client products, improves the detection quality compared with the traditional spot inspection, and solves the problem of low manual detection quality; the problems that the off-line scanning workbench is abraded and the service life is short are solved; the circuit board 2000 with all the thicknesses of the client side can be compatible, and the problem of low compatibility of the circuit board 2000 in the common technology is solved; the full automated inspection's of this application standardization level is high, has improved the management quality of mill and has solved the problem that the trade detects this type of board standardization level low.

The foregoing is a partial description of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.

Claims

1. A circuit board detection device, comprising:

a machine platform;

the plate conveying assembly is arranged on the machine table; the feeding plate assembly is positioned on one side of the feeding conveying module and is arranged close to the alignment reference plate, and the feeding plate assembly is used for grabbing the circuit board after the first side edge of the circuit board abuts against the alignment reference plate and conveying the circuit board along the first direction; and

2. The apparatus for inspecting circuit boards according to claim 1, wherein the transport alignment assembly further comprises an outfeed transport module, the outfeed transport module and the infeed transport module being arranged along the first direction, a detection position being formed between the outfeed transport module and the infeed transport module; the board feeding assembly is used for conveying the circuit board from the feeding conveying module to the detection position, and the optical detection assembly is arranged corresponding to the detection position and is used for detecting the circuit board at the detection position; the board sending assembly is also used for sending the circuit board to the discharging and conveying module from the detection position after the optical detection assembly finishes detection.

3. The device for detecting circuit boards according to claim 2, wherein the feeding and conveying module comprises a first fixing plate, a second fixing plate, a plurality of conveying wheels and a conveying wheel driving member, wherein the first fixing plate and the second fixing plate are fixed on the machine table and are oppositely arranged; the two opposite ends of the conveying wheel are respectively rotatably connected with the first fixing plate and the second fixing plate and are arranged at intervals along the first direction, the conveying wheel driving part is fixedly connected with the first fixing plate or the second fixing plate, and the conveying wheel driving part is used for driving the plurality of conveying wheels to rotate so as to drive a circuit board arranged on the plurality of conveying wheels to move along the first direction.

4. The device for inspecting circuit board according to claim 3, wherein the movable alignment plate is close to the first fixing plate; the alignment module further comprises a movable plate driving member, the movable plate driving member is fixedly connected to the first fixing plate or the second fixing plate, and the movable plate driving member is used for driving the alignment movable plate to move towards the second fixing plate.

5. The circuit board detection device according to claim 4, wherein the alignment reference plate is disposed on a side of the second fixing plate away from the first fixing plate; the alignment module further comprises an alignment reference plate driving piece, the alignment reference plate driving piece is used for driving the alignment reference plate to stretch relative to the conveying surface of the feeding conveying module along a third direction, and the third direction is the normal direction of the conveying surface.

6. The device for inspecting circuit board according to claim 3, wherein the alignment module further comprises an alignment baffle and a baffle driving member, the alignment baffle is close to the optical inspection assembly, and the alignment baffle is disposed between two adjacent conveying wheels; the baffle driving piece is used for driving the alignment baffle plate to stretch along a third direction relative to the conveying surface of the feeding conveying module, the third direction is the normal direction of the conveying surface, and the alignment baffle plate extends out of the conveying surface and is used for enabling the second side edge of the circuit board to abut against the alignment baffle plate.

7. The circuit board detection device according to any one of claims 1 to 6, wherein the board feeding assembly comprises a board feeding guide rail, a board feeding clip assembly and a board feeding driving member, the board feeding guide rail extends along the first direction, the board feeding clip assembly comprises a clip support and a plurality of board feeding clips arranged on the clip support, and the clip support slides along the board feeding guide rail under the driving of the board feeding driving member; send the board clip to include clip bottom plate, clip clamp plate and clip driving piece, the interlude of clip bottom plate with the interlude of clip clamp plate rotates to be connected, the one end of clip clamp plate is connected the clip driving piece, the other end of clip clamp plate be used for with the one end of clip bottom plate cooperatees with the centre gripping the circuit board.

8. The circuit board inspection device according to any one of claims 2 to 6, the optical detection component comprises a camera bracket, a camera guide rail, a detection component, a detection driving component, a backlight source and a backlight source driving component, the camera bracket is arranged on the machine table, and traverses the feed transfer module along the second direction, the camera guide rail is arranged on the camera bracket and extends along the second direction, the detection component comprises a detection camera, a detection lens and a camera light source, the detection camera, the detection lens and the camera light source are connected in sequence, the camera light source is close to the detection position, the detection driving assembly is used for driving the detection assembly to move along the camera guide rail and along a third direction, and the third direction is the normal direction of the conveying surface of the feeding conveying module; the backlight source is arranged on one side, deviating from the detection assembly, of the detection position, and the backlight source driving piece is used for driving the backlight source to move synchronously with the detection assembly along the second direction.

9. The device for inspecting circuit board according to claim 8, further comprising a pressing plate assembly, wherein the pressing plate assembly comprises a first supporting plate, a second supporting plate, a first pressing plate bracket, a first pressing plate, a second pressing plate bracket, a second pressing plate and a pressing plate driving member, the first supporting plate and the second supporting plate are both disposed on the machine platform, the first supporting plate is disposed at one end of the feeding transmission module close to the discharging transmission module, the second supporting plate is disposed at one end of the discharging transmission module close to the feeding transmission module, the first pressing plate bracket and the second pressing plate bracket are both disposed on the machine platform, the first pressing plate bracket and the second pressing plate bracket respectively cross over the feeding transmission module and the discharging transmission module, the first pressing plate is disposed corresponding to the first supporting plate, the first pressing plate is connected with the first pressing plate bracket in a sliding manner, and moves along the third direction under the action of the pressing plate driving piece so as to be matched with the first supporting plate and press-fit the circuit board; the second pressing plate is arranged corresponding to the second supporting plate, the second pressing plate is connected with the second pressing plate support in a sliding mode, and the second pressing plate moves along the third direction under the action of the pressing plate driving piece so as to be matched with the second supporting plate and press-fit the circuit board.

10. The circuit board inspection device according to claim 9, further comprising a controller for controlling the inspection driving assembly to drive the inspection assembly to scan the circuit board between the first pressing plate and the second pressing plate along the second direction; the controller is further used for controlling the board feeding driving part to drive the board feeding clamp component to drive the circuit board to move a target distance along the first direction after the last scanning of the detection component is completed, and then controlling the detection driving component to drive the detection component to scan the circuit board between the first pressing plate and the second pressing plate along the second direction.