CN112764510A - Computer hardware heat sink - Google Patents
Computer hardware heat sink Download PDFInfo
- Publication number
- CN112764510A CN112764510A CN202110281089.3A CN202110281089A CN112764510A CN 112764510 A CN112764510 A CN 112764510A CN 202110281089 A CN202110281089 A CN 202110281089A CN 112764510 A CN112764510 A CN 112764510A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- side wall
- barrel
- fixing
- container barrel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 59
- 230000017525 heat dissipation Effects 0.000 claims abstract description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- 238000007789 sealing Methods 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000110 cooling liquid Substances 0.000 claims abstract description 11
- 239000000741 silica gel Substances 0.000 claims abstract description 10
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 238000010586 diagram Methods 0.000 description 5
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a computer hardware cooling device, which belongs to the technical field of computer hardware equipment and comprises a container barrel, wherein a detachable fixing device is installed on the container barrel, the bottom of the container barrel is fixedly connected with a CPU (Central processing Unit) heat dissipation patch, the bottom of the CPU heat dissipation patch is provided with heat conduction silica gel through a sealing device, the top of the CPU heat dissipation patch is fixedly provided with a fixing barrel, the fixing barrel is positioned in the container barrel, and the outer side wall of the bottom of the fixing barrel is provided with a plurality of liquid outlet holes. According to the computer hardware cooling device, the fan blades are driven to rotate by the aid of the double-shaft motor, the propeller is driven to rotate at the same time, the fan can rotate to cool and radiate the heat dissipation copper sheet, liquid above the inner portion of the container barrel can be conveyed downwards by the aid of the rotation of the propeller, cooling liquid at the bottom of the inner portion of the container barrel rolls upwards to be in contact with the heat dissipation copper sheet, heat is transmitted to the heat dissipation copper sheet, the effect of reducing the temperature of the cooling liquid is achieved, and the function of cooling a CPU is achieved.
Description
Technical Field
The invention relates to the technical field of computer hardware equipment, in particular to a computer hardware cooling device.
Background
The computer is a modern electronic computer for high-speed calculation, can perform numerical calculation and logic calculation, has a memory function, can run according to a program, and automatically processes mass data at high speed.
The CPU is a product of a super-large-scale integrated circuit technology and is a core of computer operation, the CPU can generate a large amount of heat during working, if the heat is not discharged in time, the CPU is halted if the heat is light, the CPU can be burnt out if the heat is heavy, the CPU radiator is used for radiating the CPU, and along with the development progress of the CPU technology, the radiating efficiency of the CPU is required to be higher and higher. The desktop CPU radiator in the market at present mainly has three forms, namely an air cooling radiator, a water cooling radiator and a heat pipe radiator, wherein the heat pipe radiator is a heat transfer element with extremely high heat conductivity, the heat is transferred by evaporation and condensation of liquid in a totally-enclosed vacuum tube, and the existing heat pipe radiator basically adopts an air cooling form to cool a condensation end of the heat pipe radiator. Compared with the air, the water has large specific heat capacity and good heat load capacity, and the heat dissipation efficiency can be effectively improved by cooling the condensation end of the heat pipe in a water cooling mode, so that the radiator has the advantages of heat pipe heat dissipation and water cooling heat dissipation.
In view of the above problems, the prior art also proposes solutions, such as: the invention discloses a novel CPU heat pipe radiator (application date is 2018.08.29, application number is 201810993290.2), the technical scheme discloses the novel CPU heat pipe radiator, the radiator comprises a heat pipe, a heat dissipation end, a heat absorption end, a CPU heat dissipation attaching end, a heat absorption water tank, a heat dissipation fan, a heat dissipation box, a return pipe, a water inlet pipe section, a water outlet pipe section, a heat dissipation pipe section, a second return pipe and water inlet/outlet holes, the CPU radiator adopts a water cooling mode to cool a condensation end of the heat pipe, and compared with the traditional air cooling mode, the novel CPU heat pipe radiator has the advantages of strong heat load capacity, small heat fluctuation and the like.
However, the inside of the CPU radiator needs to be equipped with a water-cooling heat exchange pump body, which is used to exchange heat and cold with water in the heat absorption water tank, and the water-cooling heat exchange pump body increases the power consumption of the radiator when in use, resulting in an increase in the heat inside the computer and also increasing the requirement for the power of the computer.
Therefore, a computer hardware cooling device is provided to solve the above problems.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a computer hardware cooling device.
In order to achieve the purpose, the invention adopts the following technical scheme:
a computer hardware cooling device comprises a container barrel, wherein a detachable fixing device is installed on the container barrel, the bottom of the container barrel is fixedly connected with a CPU heat dissipation patch, the bottom of the CPU heat dissipation patch is provided with heat conduction silica gel through a sealing device, the top of the CPU heat dissipation patch is fixedly provided with a fixed barrel, the fixed barrel is positioned in the container barrel, the outer side wall of the bottom of the fixed barrel is provided with a plurality of liquid outlet holes, the inner side wall of the fixed barrel is connected with a rotatable driving shaft through a supporting device a, the bottom of the driving shaft is provided with a propeller, and cooling liquid is arranged in the container barrel;
the top of the container barrel is fixedly provided with a heat dissipation copper sheet, the top of the heat dissipation copper sheet is connected with a double-shaft motor through a supporting device b, one output shaft of the double-shaft motor is fixedly connected with a fan blade, and the top of the driving shaft penetrates through the heat dissipation copper sheet and is connected with the other output shaft of the double-shaft motor;
the outer side wall of the container barrel is fixedly sleeved with a radiating fin.
Preferably, the fixing device comprises a circular ring support sleeved on the outer side wall of the container barrel, a plurality of support legs are fixedly connected to the outer side wall of the circular ring support, screw holes used for fixing the support legs on a computer motherboard are formed in the support legs, a support block is fixedly connected to the inner side wall of the circular ring support, a fixed block b is fixedly connected to the outer side wall of the bottom of the container barrel, and the top of the support block is in contact with the bottom of the fixed block b;
the container comprises a container barrel and is characterized in that two limiting blocks which are symmetrically arranged are fixedly connected to the outer side wall of the circular ring support, and the container barrel is connected with the limiting blocks through clamping pieces.
Preferably, the sealing device comprises a plastic frame bonded at the bottom of the CPU heat dissipation patch, the plastic frame is matched with the CPU heat dissipation patch, the heat-conducting silica gel is arranged in the plastic frame, and a sealing film for sealing is arranged at the bottom of the plastic frame.
Preferably, the supporting device a comprises a supporting piece rotatably sleeved on the outer side wall of the driving shaft, and the outer side wall of the supporting piece is fixedly connected with the inner side wall of the fixed cylinder through a supporting rod.
Preferably, strutting arrangement b includes solid fixed ring, gu fixed ring's bottom is passed through the bracing piece and is connected with the top of a container section of thick bamboo, gu fixed ring inside wall fixedly connected with fixed block a, the bottom at fixed block a is installed to the biax motor.
Preferably, the inner side wall of the fixing ring is provided with a lamp strip, and the lamp strip is arranged in a ring shape.
Preferably, the CPU heat dissipation patch is made of copper.
Preferably, the heat dissipation fins are arranged in a circle.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
1. compared with the prior art, the computer hardware cooling device adopts the double-shaft motor to drive the fan blades to rotate and simultaneously drive the propeller to rotate, the fan can rotate to cool and radiate the heat of the heat radiating copper sheet, the propeller can rotate to convey liquid above the inner part of the container cylinder downwards, the cooling liquid at the bottom of the inner part of the container cylinder rolls upwards to be in contact with the heat radiating copper sheet, the heat is transmitted to the heat radiating copper sheet, the effect of reducing the temperature of the cooling liquid is achieved, and the function of cooling the CPU is achieved;
2. compared with the prior art, the computer hardware cooling device structure adopts the double-shaft motor to drive the fan blades to rotate and simultaneously drive the propeller to rotate, so that the power of the electric energy required by the cooling device is reduced, and the effect of reducing the requirement on the power of the computer power supply is achieved;
3. compared with the prior art, the computer hardware cooling device simultaneously combines the characteristics of air cooling and water cooling, has a cooling effect superior to that of the traditional air cooling and heat pipe cooling, and has lower power consumption requirement than that of the water cooling.
Drawings
FIG. 1 is a schematic structural diagram of a computer hardware cooling device according to the present invention;
FIG. 2 is a schematic diagram of an internal structure of a computer hardware cooling device according to the present invention;
FIG. 3 is a schematic view of the structure at A in FIG. 2;
FIG. 4 is a schematic structural diagram of the interior of a stationary cylinder in a computer hardware cooling device according to the present invention;
FIG. 5 is a schematic view of the structure at B in FIG. 4;
FIG. 6 is a schematic structural diagram of a fixing device in a computer hardware cooling device according to the present invention;
FIG. 7 is a schematic structural diagram of a plastic frame in a computer hardware cooling device according to the present invention;
fig. 8 is a schematic top view of the structure of fig. 1.
In the figure: 1. a canister; 2. a heat sink; 3. a CPU heat dissipation patch; 4. a plastic frame; 5. a sealing film; 6. heat conducting silica gel; 7. a circular ring support; 8. a support leg; 9. a limiting block; 10. a fastener; 11. a support bar; 12. a fixing ring; 13. a dual-axis motor; 14. a fixed block a; 15. a fan blade; 16. a light strip; 17. a heat dissipation copper sheet; 18. cooling liquid; 19. a fixed cylinder; 20. a drive shaft; 21. a liquid outlet hole; 22. a propeller; 23. a strut; 24. a support member; 25. a support block; 26. and a fixed block b.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-8, a computer hardware cooling device comprises a container barrel 1, wherein a detachable fixing device is installed on the container barrel 1, a CPU heat dissipation patch 3 is fixedly connected to the bottom of the container barrel 1, heat conduction silica gel 6 is arranged at the bottom of the CPU heat dissipation patch 3 through a sealing device, a fixing barrel 19 is fixedly arranged at the top of the CPU heat dissipation patch 3, the fixing barrel 19 is located in the container barrel 1, a plurality of liquid outlet holes 21 are formed in the outer side wall of the bottom of the fixing barrel 19, the inner side wall of the fixing barrel 19 is connected with a rotatable driving shaft 20 through a supporting device a, a propeller 22 is installed at the bottom of the driving shaft 20, and cooling liquid 18 is arranged in the;
the top of the container barrel 1 is fixedly provided with a heat dissipation copper sheet 17, the top of the heat dissipation copper sheet 17 is connected with a double-shaft motor 13 through a supporting device b, one output shaft of the double-shaft motor 13 is fixedly connected with a fan blade 15, and the top of a driving shaft 20 penetrates through the heat dissipation copper sheet 17 and is connected with the other output shaft of the double-shaft motor 13;
the outer side wall of the container barrel 1 is fixedly sleeved with a radiating fin 2.
The fixing device is used for fixing the cooling device on a mainboard of a computer and cooling a CPU (central processing unit) arranged on the mainboard of the computer.
The direct coating of heat conduction silica gel 6 is on the CPU heat dissipation paster 3 of copper material, and the purpose is convenient for transmit CPU's heat for CPU heat dissipation paster 3 to this heat sink cools down CPU.
The double-shaft motor 13 is connected with a computer main board through a connecting wire, and the computer main board is used for supplying power to the double-shaft motor 13.
The fan blades 15 are driven to rotate rapidly through the double-shaft motor 13, the air flow around the fan blades 15 is changed due to the rapid rotation of the fan blades 15, the air flow is changed to form air, the air blows the heat dissipation copper sheets 17, the heat on the heat dissipation copper sheets 17 is carried, and finally the effect of cooling the CPU is achieved.
The driving shaft 20 and the heat-dissipating copper sheet 17 are sealed, so that the coolant 18 in the container 1 cannot flow out through the connection between the driving shaft 20 and the heat-dissipating copper sheet 17.
The cooling liquid 18 is used for absorbing heat on the surface of the CPU heat dissipation patch 3 and transmitting the heat on the CPU heat dissipation patch 3 to the container barrel 1 and the heat dissipation copper sheet 17, the heat on the container barrel 1 is cooled through the heat dissipation fins 2, and the heat on the heat dissipation copper sheet 17 is cooled through the fan blades 15 rotating at a high speed.
It should be noted that the material of the container 1 is copper, and copper has good thermal conductivity.
More specifically, the fixing device comprises a circular ring support 7 sleeved on the outer side wall of the container barrel 1, a plurality of support legs 8 are fixedly connected to the outer side wall of the circular ring support 7, screw holes used for fixing the support legs 8 on a computer mainboard are formed in the support legs 8, a supporting block 25 is fixedly connected to the inner side wall of the circular ring support 7, a fixed block b26 is fixedly connected to the outer side wall of the bottom of the container barrel 1, and the top of the supporting block 25 is in contact with the bottom of the fixed block b 26;
two symmetrically-arranged limiting blocks 9 are fixedly connected to the outer side wall of the circular ring support 7, and the container barrel 1 is connected with the limiting blocks 9 through the clamping pieces 10.
More specifically, the sealing device comprises a plastic frame 4 bonded to the bottom of the CPU heat dissipation patch 3, the plastic frame 4 is matched with the CPU heat dissipation patch 3, heat-conducting silica gel 6 is arranged in the plastic frame 4, and a sealing film 5 for sealing is arranged at the bottom of the plastic frame 4.
Through sealing device with 6 direct seals of heat conduction silica gel on CPU heat dissipation paster 3, when needs use this computer hardware heat sink, directly tear plastic frame 4 from CPU heat dissipation paster 3 can.
More specifically, the supporting device a comprises a supporting piece 24 rotatably sleeved on the outer side wall of the driving shaft 20, and the outer side wall of the supporting piece 24 is fixedly connected with the inner side wall of the fixed cylinder 19 through a supporting rod 23.
The support member 24 comprises a support ring and a bearing installed in the support ring, and is intended to provide support for the driving shaft 20, so as to prevent the driving shaft 20 from shaking during the rapid rotation of the driving shaft 20, and prevent the propeller 22 from hitting the inner side wall of the fixed cylinder 19.
More specifically, the supporting device b comprises a fixing ring 12, the bottom of the fixing ring 12 is connected with the top of the container barrel 1 through a supporting rod 11, a fixing block a14 is fixedly connected to the inner side wall of the fixing ring 12, and the two-shaft motor 13 is installed at the bottom of the fixing block a 14.
The support means b functions to provide support for the biaxial motor 13.
More specifically, the inner side wall of the fixing ring 12 is provided with a light strip 16, and the light strip 16 is arranged in a ring shape.
The light strip 16 is used for improving the ornamental value of the computer hardware cooling device, and it should be noted that the light strip 16 and the dual-shaft motor 13 are powered in the same manner.
More specifically, the CPU heat sink 3 is made of copper.
More specifically, the fins 2 are arranged in a circular shape.
In the invention, when the computer hardware cooling device is required to be used for cooling the CPU on the computer mainboard, firstly, the support legs 8 on the circular ring support 7 are fixed on the computer mainboard by using fixing screws, then the buckling piece 10 arranged on the container barrel 1 is connected with the limiting block 9 on the circular ring support 7 together to achieve the effect of installing the container barrel 1 on the circular ring support 7, then the double-shaft motor 13 is powered, the output shaft of the double-shaft motor 13 is rapidly rotated after power is supplied, the output shaft of the double-shaft motor 13 is rapidly rotated to drive the driving shaft 20 and the fan blades 15 to rapidly rotate, the driving shaft 20 is rapidly rotated to drive the liquid in the fixed barrel 19 to move downwards, the cooling liquid 18 positioned outside the fixed barrel 19 moves upwards, the cooling liquid 18 contacted with the CPU cooling patch 3 carries the heat on the CPU cooling patch 3, and transmits the heat on the CPU cooling patch 3 to the container barrel 1 and the cooling copper sheets 17, the cooling fin 2 arranged on the outer side wall of the container barrel 1 cools the container barrel 1, the fan blades 15 arranged on the output shaft of the double-shaft motor 13 rotate to cool the heat dissipation copper sheets 17, the computer hardware cooling device combines the characteristics of air cooling heat dissipation and water cooling heat dissipation at the same time, the cooling effect is superior to that of traditional air cooling heat dissipation and heat pipe heat dissipation, and meanwhile, the power consumption requirement is lower than that of water cooling heat dissipation.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A computer hardware cooling device comprises a container barrel (1) and is characterized in that a detachable fixing device is installed on the container barrel (1), a CPU heat dissipation patch (3) is fixedly connected to the bottom of the container barrel (1), heat conduction silica gel (6) is arranged at the bottom of the CPU heat dissipation patch (3) through a sealing device, a fixing barrel (19) is fixedly arranged at the top of the CPU heat dissipation patch (3), the fixing barrel (19) is located in the container barrel (1), a plurality of liquid outlet holes (21) are formed in the outer side wall of the bottom of the fixing barrel (19), the inner side wall of the fixing barrel (19) is connected with a rotatable driving shaft (20) through a supporting device a, a propeller (22) is installed at the bottom of the driving shaft (20), and cooling liquid (18) is arranged in the container barrel (1);
the top of the container barrel (1) is fixedly provided with a heat dissipation copper sheet (17), the top of the heat dissipation copper sheet (17) is connected with a double-shaft motor (13) through a supporting device b, one output shaft of the double-shaft motor (13) is fixedly connected with fan blades (15), and the top of the driving shaft (20) penetrates through the heat dissipation copper sheet (17) and is connected with the other output shaft of the double-shaft motor (13);
the outer side wall of the container barrel (1) is fixedly sleeved with a radiating fin (2).
2. The computer hardware cooling device according to claim 1, wherein the fixing device comprises a circular ring support (7) sleeved on the outer side wall of the container barrel (1), the outer side wall of the circular ring support (7) is fixedly connected with a plurality of support legs (8), the support legs (8) are provided with screw holes for fixing the support legs (8) on a computer mainboard, the inner side wall of the circular ring support (7) is fixedly connected with a support block (25), the outer side wall of the bottom of the container barrel (1) is fixedly connected with a fixed block b (26), and the top of the support block (25) is in contact with the bottom of the fixed block b (26);
the container comprises a container barrel (1) and is characterized in that two limiting blocks (9) which are symmetrically arranged are fixedly connected to the outer side wall of a circular ring support (7), and the container barrel (1) is connected with the limiting blocks (9) through clamping pieces (10).
3. The computer hardware cooling device according to claim 1, wherein the sealing device comprises a plastic frame (4) adhered to the bottom of the CPU heat dissipation patch (3), the plastic frame (4) is matched with the CPU heat dissipation patch (3), the heat-conducting silica gel (6) is arranged in the plastic frame (4), and a sealing film (5) for sealing is arranged at the bottom of the plastic frame (4).
4. The computer hardware cooling device according to claim 1, wherein the supporting device a comprises a supporting member (24) rotatably sleeved on the outer side wall of the driving shaft (20), and the outer side wall of the supporting member (24) is fixedly connected with the inner side wall of the fixed cylinder (19) through a supporting rod (23).
5. The computer hardware cooling device according to claim 1, wherein the supporting device b comprises a fixing ring (12), the bottom of the fixing ring (12) is connected with the top of the container barrel (1) through a supporting rod (11), a fixing block a (14) is fixedly connected to the inner side wall of the fixing ring (12), and the double-shaft motor (13) is installed at the bottom of the fixing block a (14).
6. The computer hardware cooling device according to claim 5, wherein the inner side wall of the fixing ring (12) is provided with a light strip (16), and the light strip (16) is arranged in a ring shape.
7. The computer hardware cooling device according to claim 1, wherein the CPU heat sink (3) is made of copper.
8. The computer hardware cooling device according to claim 1, wherein the heat sink (2) is arranged in a circular shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110281089.3A CN112764510A (en) | 2021-03-16 | 2021-03-16 | Computer hardware heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110281089.3A CN112764510A (en) | 2021-03-16 | 2021-03-16 | Computer hardware heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112764510A true CN112764510A (en) | 2021-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110281089.3A Pending CN112764510A (en) | 2021-03-16 | 2021-03-16 | Computer hardware heat sink |
Country Status (1)
| Country | Link |
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| CN (1) | CN112764510A (en) |
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| CN109582096A (en) * | 2018-10-26 | 2019-04-05 | 曾福明 | A kind of dust-proof, shockproof, cooling type computer shell |
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| CN110865700A (en) * | 2019-12-21 | 2020-03-06 | 李建春 | Temperature-adjustable heat dissipation equipment |
| CN210270795U (en) * | 2019-10-14 | 2020-04-07 | 东北林业大学 | CPU heat abstractor for computer |
| CN210348396U (en) * | 2019-10-09 | 2020-04-17 | 淮北师范大学 | Efficient heat dissipation mechanism for computer CPU |
| CN210721327U (en) * | 2019-10-26 | 2020-06-09 | 兰州工业学院 | Novel computer CPU heat dissipation device |
| CN211044111U (en) * | 2019-11-22 | 2020-07-17 | 邓志龙 | Quick radiating computer machine case |
-
2021
- 2021-03-16 CN CN202110281089.3A patent/CN112764510A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
| CN205540541U (en) * | 2016-04-13 | 2016-08-31 | 高云涛 | High -efficient heat abstractor of dedicated CPU treater of computer |
| CN206819280U (en) * | 2017-06-23 | 2017-12-29 | 商丘职业技术学院 | A kind of novel C PU radiators |
| CN109582096A (en) * | 2018-10-26 | 2019-04-05 | 曾福明 | A kind of dust-proof, shockproof, cooling type computer shell |
| CN109976484A (en) * | 2019-04-16 | 2019-07-05 | 山东劳动职业技术学院（山东劳动技师学院） | A kind of cooling device for computer CPU |
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Application publication date: 20210507 |
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