CN210348396U - Efficient heat dissipation mechanism for computer CPU - Google Patents

Efficient heat dissipation mechanism for computer CPU Download PDF

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Publication number
CN210348396U
CN210348396U CN201921678183.7U CN201921678183U CN210348396U CN 210348396 U CN210348396 U CN 210348396U CN 201921678183 U CN201921678183 U CN 201921678183U CN 210348396 U CN210348396 U CN 210348396U
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China
Prior art keywords
cpu
copper pipe
fan
working block
base
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Expired - Fee Related
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CN201921678183.7U
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Chinese (zh)
Inventor
郭宇燕
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Huaibei Normal University
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Huaibei Normal University
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Abstract

The utility model provides a high-efficient heat dissipation mechanism for computer CPU, includes the computer motherboard, mainboard upside fixed mounting CPU, and the side is at the CPU bilateral symmetry installation baffle on the mainboard, and the side is at the vertical first copper pipe of CPU both sides equipartition several on the base, fin and second copper pipe fixed connection, fin upper end fixed connection fan bracket, the inside center fixed mounting fan of fan bracket, the fan is bloied upwards. The utility model is suitable for an use fan radiating's main frame, the second copper pipe of the heat direction bottommost of CPU production, the first copper pipe of second copper pipe with heat direction, first copper pipe gives all the other first copper pipes with heat transfer, and first copper pipe transmits the fin with heat dispersion, only needs the articulated department rotation of board action work piece top edge bracing piece that makes it respectively, simple structure, and is with low costs, easy dismounting need not other instruments and can easily dismantle fan radiator.

Description

Efficient heat dissipation mechanism for computer CPU
Technical Field
The utility model belongs to the radiator field, specifically speaking are a high-efficient heat dissipation mechanism for computer CPU.
Background
At present, a plurality of computer hosts all adopt fan heat dissipation, and a plurality of fan heat dissipaters are installed on the CUP and all adopt small-sized bolt connection, sometimes when the dust removal is carried out on the fan by oneself, no proper tool is used for screwing the small-sized bolt off, so that the fan is quite inconvenient, and if the small-sized bolt is not placed well, the small-sized bolt is easy to lose, so that the fan is quite inconvenient to disassemble.
SUMMERY OF THE UTILITY MODEL
The utility model provides a high-efficient heat dissipation mechanism for computer CPU for solve the defect among the prior art.
The utility model discloses a following technical scheme realizes:
a high-efficiency heat dissipation mechanism for a computer CPU comprises a computer main board, wherein a CPU is fixedly arranged on the upper side of the main board, baffles are symmetrically arranged on two sides of the CPU on the upper side of the main board, two support rods are respectively arranged between the baffles and the CPU and are positioned at two ends of the baffles, a working block is arranged between the CPU and the two support rods positioned between the same side baffle, two ends of the working block are rotatably connected with the corresponding support rods through rotating shafts, the working block is concave, the concave surface of the working block faces towards the CPU, the concave surface of the working block inclines downwards, the top of the outer side of the working block is connected with the baffles through first springs, the first springs are in a stretching state, the bottom of the inner side of the working block is in contact connection with the end surface of a base of a heat radiator, a plurality of vertical first copper pipes are uniformly distributed on two sides of the upper side of the base, the bottoms of the first, the middle part of the lower side face of the second copper pipe positioned at the bottommost part is connected with the upper side face of the CPU, the radiating fins in the vertical direction of the plurality are uniformly distributed on the side face of the second copper pipe, the radiating fins are fixedly connected with the second copper pipe, the upper end of each radiating fin is fixedly connected with a fan support, a fan is fixedly installed in the center inside the fan support, and the fan blows upwards.
According to the efficient heat dissipation mechanism for the CPU of the computer, the joint of the second copper pipe and the CPU is filled with the heat conduction silicone grease.
According to the efficient heat dissipation mechanism for the CPU of the computer, through holes are formed in the two end faces of the base, the cushion blocks are installed in the through holes, one ends of the cushion blocks are fixedly connected with the center of the bottom of the through holes through the uniformly distributed second springs, and the distance between the two end faces of the base is smaller than the distance between the two end faces of the two cushion blocks.
The efficient heat dissipation mechanism for the computer CPU is characterized in that the top of the working block is fixedly provided with the bump.
According to the efficient heat dissipation mechanism for the CPU of the computer, the distance between the two end faces of the base is larger than the distance between the two concave faces at the hinged joint of the working block and the supporting rod, and the base is made of deformable materials.
The utility model has the advantages that: the utility model is suitable for a computer host machine using a fan for heat dissipation, when in use, the heat generated by a CPU is guided to the bottommost second copper pipe, the bottommost second copper pipe guides the heat to the first copper pipe, the first copper pipe transmits the heat to the other first copper pipes, the first copper pipe transmits the heat to the radiating fins in a dispersing way, the radiating fins rapidly radiate the heat to the air, the fan absorbs the heat radiated by the radiating fins out to be diffused outside the host machine, when the fan radiator is required to be disassembled for ash removal, only the top of the working block needs to be respectively pressed to rotate along the hinged part of the supporting rod, the bottom plate connected with the working block is deformed by pressure and the base moves upwards (as shown in figure 2), namely, the fan radiator can be taken out, under the action of the first spring, the concave side of the working block inclines upwards, when the fan radiator needs to be installed, the base only needs to be placed on the upper, extrude downwards, make the base warp to can adorn the base in the inboard lower part of work piece (as shown in figure 1), because the work piece downward sloping, so the work piece gives the interior decurrent power of slant of base, thereby makes the base fine fix on CPU, should use novel simple structure, at the bottom of the cost, easy dismounting need not other instruments and can easily dismantle fan radiator.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural view of the present invention; FIG. 2 is a diagram illustrating the usage of the present invention; FIG. 3 is an enlarged view of a portion of FIG. 1 at I; fig. 4 is a cross-sectional view taken along line B-B of fig. 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
A high-efficiency heat dissipation mechanism for a computer CPU comprises a computer mainboard 1, a CPU2 is fixedly installed on the upper side of the mainboard 1, baffles 3 are symmetrically installed on two sides of a CPU2 on the upper side of the mainboard 1, two support rods 4 are installed between each baffle 3 and a CPU2, the two support rods 4 are located at two ends of each baffle 3, a working block 5 is arranged between each CPU2 and each two support rods 4 located between the baffles 3 on the same side, two ends of each working block 5 are rotatably connected with the corresponding support rods 4 through rotating shafts, each working block 5 is concave, the concave surface of each working block 5 faces towards the CPU2, the concave surface of each working block 5 inclines downwards, the top of the outer side of each working block 5 is connected with the corresponding baffle 3 through a first spring 6, each first spring 6 is in a stretching state, the bottom of the inner side surface of each working block 5 is in contact connection with the end surface of a base 7 of a heat radiator, a plurality of vertical first copper pipes 8 are uniformly distributed on the upper side, the several second copper pipes 9 are fixedly installed between the two symmetrical first copper pipes 8, the middle of the lower side face of the second copper pipe 9 located at the bottommost is connected with the upper side face of the CPU2, the radiating fins 10 in the several vertical directions are evenly distributed on the side face of the second copper pipe 9, the radiating fins 10 are fixedly connected with the second copper pipes 9, the fan support 11 is fixedly connected with the upper end of the radiating fins 10, the fan 12 is fixedly installed in the center inside the fan support 11, and the fan 12 blows upwards. The utility model is suitable for a computer host machine using fan for heat radiation, when in use, the heat generated by the CPU2 is guided to the bottommost second copper pipe 9, the bottommost second copper pipe 9 guides the heat to the first copper pipe 8, the first copper pipe 8 transmits the heat to the other first copper pipes 9, the first copper pipe 9 transmits the heat to the radiating fin 10 in a dispersing way, the radiating fin 10 quickly radiates the heat to the air, the fan 12 absorbs the heat radiated by the radiating fin 10 and diffuses out of the host machine, when the deashing of the fan radiator is needed, only the top of the working block 5 needs to be respectively driven to rotate along the hinged part of the supporting rod 5, the bottom plate connected with the working block is deformed by pressure and the base 7 moves upwards (as shown in figure 2), namely, the fan radiator can be taken out, under the action of the first spring 6, the concave side of the working block 7 inclines upwards, when the fan radiator needs to be installed, the base only needs to be placed at the upper part of the inner side, extrude downwards, make base 7 warp to can adorn base 7 in the inboard lower part of work piece 5 (as shown in fig. 1), because work piece 5 downward sloping, so work piece 5 gives base 7 an interior slant decurrent power, thereby make base 7 fine fix on CPU2, should use novel simple structure, with low costs, easy dismounting need not other instruments and can easily dismantle fan radiator.
Specifically, as shown in the figure, the joint between the second copper tube 9 and the CPU2 in the present embodiment is filled with the heat conductive silicone grease 13. This design can make CPU 2's heat faster direction second copper pipe 9, makes the radiating effect better.
Specifically, as shown in the figure, through holes 14 are formed in two end faces of the base 7, cushion blocks 15 are installed in the through holes 14, one ends of the cushion blocks 15 are fixedly connected with the center of the bottom of the through holes 14 through uniformly distributed second springs 16, and the distance between the two end faces of the base 7 is smaller than the distance between the two end faces of the two cushion blocks 15. This design is when dismantling the radiator, and base 7 rebound, when cushion 15 moved the concave surface position that work piece 5 and bracing piece 4 articulated are connected, work piece 5 gave cushion 15 power, made cushion 15 compression spring 16 to reduce the distance of two terminal surfaces of two cushion 15, make the radiator take off more easily.
Further, as shown in the figure, the top of the working block 5 of the present embodiment is fixedly provided with a projection 17. The design can save more labor for the plate moving working block 5, and the radiator can be detached more conveniently.
Furthermore, as shown in the figure, the distance between the two end surfaces of the base 7 is greater than the distance between the two concave surfaces at the hinged joint of the working block 5 and the supporting rod 4, and the base 7 is made of a deformable material. This design enables the base 1 to be more stably fixed between the work blocks 5.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (5)

1. An efficient heat dissipation mechanism for a computer CPU, characterized in that: comprises a computer mainboard (1), a CPU (2) is fixedly arranged on the upper side of the mainboard (1), baffles (3) are symmetrically arranged on the two sides of the CPU (2) on the upper side of the mainboard (1), two support rods (4) are respectively arranged between the baffles (3) and the CPU (2), the two support rods (4) are positioned at the two ends of the baffles (3), a working block (5) is arranged between the CPU (2) and the two support rods (4) positioned between the same side baffles (3), the two ends of the working block (5) are rotatably connected with the corresponding support rods (4) through a rotating shaft, the working block (5) is concave, the concave surface of the working block (5) faces towards the CPU (2), the concave surface of the working block (5) inclines downwards, the top of the outer side of the working block (5) is connected with the baffles (3) through a first spring (6), the first spring (6) is in a stretching state, the bottom of the inner side surface of the working block (5) is connected with the end surface, base (7) upward flank is at the vertical first copper pipe of CPU (2) both sides equipartition several (8), base (7) are run through to first copper pipe (8) bottom, equal fixed mounting several second copper pipe (9) between the first copper pipe (8) of bisymmetry, second copper pipe (9) downside middle part that is located the bottommost all with CPU (2) side connection, fin (10) of the vertical direction of second copper pipe (9) side equipartition several, fin (10) and second copper pipe (9) fixed connection, fin (10) upper end fixed connection fan bracket (11), fan bracket (11) inside center fixed mounting fan (12), fan (12) are upwards bloied.
2. The efficient heat dissipation mechanism for a computer CPU of claim 1, wherein: and the joint of the second copper pipe (9) and the CPU (2) is filled with heat-conducting silicone grease (13).
3. The efficient heat dissipation mechanism for a computer CPU of claim 1, wherein: through holes (14) are formed in two end faces of the base (7), cushion blocks (15) are installed in the through holes (14), one ends of the cushion blocks (15) are fixedly connected with the center of the bottom of the through holes (14) through uniformly distributed second springs (16), and the distance between the two end faces of the base (7) is smaller than that between the two end faces of the two cushion blocks (15).
4. The efficient heat dissipation mechanism for a computer CPU of claim 1, wherein: the top of the working block (5) is fixedly provided with a convex block (17).
5. The efficient heat dissipation mechanism for a computer CPU of claim 1, wherein: the distance between the two end faces of the base (7) is larger than the distance between the two concave faces at the hinged joint of the working block (5) and the supporting rod (4), and the base (7) is made of deformable materials.
CN201921678183.7U 2019-10-09 2019-10-09 Efficient heat dissipation mechanism for computer CPU Expired - Fee Related CN210348396U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921678183.7U CN210348396U (en) 2019-10-09 2019-10-09 Efficient heat dissipation mechanism for computer CPU

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921678183.7U CN210348396U (en) 2019-10-09 2019-10-09 Efficient heat dissipation mechanism for computer CPU

Publications (1)

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CN210348396U true CN210348396U (en) 2020-04-17

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112764510A (en) * 2021-03-16 2021-05-07 上海理工大学 Computer hardware heat sink
CN112799487A (en) * 2021-01-21 2021-05-14 湖南电子科技职业学院 Computer CPU self-heat-dissipation structure
CN112916535A (en) * 2021-01-21 2021-06-08 湖南电子科技职业学院 Computer heat abstractor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112799487A (en) * 2021-01-21 2021-05-14 湖南电子科技职业学院 Computer CPU self-heat-dissipation structure
CN112916535A (en) * 2021-01-21 2021-06-08 湖南电子科技职业学院 Computer heat abstractor
CN112764510A (en) * 2021-03-16 2021-05-07 上海理工大学 Computer hardware heat sink

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200417

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