CN112757161B - Trimming method of polishing carrier - Google Patents
Trimming method of polishing carrier Download PDFInfo
- Publication number
- CN112757161B CN112757161B CN202011633942.5A CN202011633942A CN112757161B CN 112757161 B CN112757161 B CN 112757161B CN 202011633942 A CN202011633942 A CN 202011633942A CN 112757161 B CN112757161 B CN 112757161B
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- polishing
- trimmed
- polishing carrier
- carrier
- polished
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Abstract
The invention discloses a trimming method of a polishing carrier, belonging to the technical field of polishing. The trimming method comprises the following steps: selecting an adjusting gasket according to the existing appearance of the surface to be trimmed of the polishing carrier and the target appearance required to be obtained after finishing trimming; placing the adjusting gasket on the other surface of the polishing carrier opposite to the surface to be trimmed; the polishing device carries out polishing operation on the surface to be trimmed of the polishing carrier, and trimming is finished by grinding the surface to be trimmed; the adjusting shim is capable of changing the amount of grinding of the surface to be finished at different positions in a direction away from the center of rotation thereof. The invention effectively solves the problems that the contact surface of the polishing carrier and the piece to be polished is uniform in shape, easy to wear, high in replacement cost and the like.
Description
Technical Field
The invention relates to the technical field of polishing, in particular to a trimming method of a polishing carrier.
Background
The rapid development of the electronic technology relies on the performance improvement of the base materials such as the silicon wafer, the surface flatness of the silicon wafer is the main control parameter, and the final surface flatness of the silicon wafer is controlled by adopting the technology of double mechanical grinding and single-sided chemical mechanical polishing. According to the single-side chemical mechanical polishing technology, a silicon wafer is placed between a polishing carrier and a polishing pad, and a cylinder polishing head applies downward pressure to the silicon wafer to be matched with the circular motion of the polishing pad, so that the surface finishing of the silicon wafer is realized. However, because the linear velocities of the points are different when the polishing pad makes circular motion, the surface of the trimmed silicon wafer is locally different, and the surface flatness is not optimal.
For the above problems, a common solution is to trim the surface of the polishing pad with a diamond conditioning wheel to offset the linear velocity difference between each point of the polishing pad, but this solution is complicated and difficult to operate. In the prior art, the difference of linear velocities of various points of a polishing pad is offset by changing the appearance of a contact surface of a polishing carrier and a silicon wafer so as to improve the surface flatness of the silicon wafer; because the contact surfaces of a polishing carrier and a piece to be polished in the market are made in a unified standard, the shape of the contact surface of the piece to be polished and a polishing pad can not be changed adaptively according to needs to offset the linear velocity difference of each point of the polishing pad, and the polishing carrier is worn after being used for a certain time, so that the shape of the contact surface of the polishing carrier is changed, and the surface precision of a final silicon wafer is influenced; in addition, in view of cost, the polishing carrier is not easily replaced frequently, and only the contact surface thereof is dressed.
Accordingly, it is desirable to provide a method for dressing a polishing carrier to solve the above problems.
Disclosure of Invention
The invention aims to provide a method for dressing a polishing carrier, which can rapidly and efficiently dress the polishing carrier.
In order to realize the purpose, the following technical scheme is provided:
a method of conditioning a polishing carrier, the method comprising the steps of:
s1: selecting an adjusting gasket according to the existing appearance of the surface to be trimmed of the polishing carrier and the target appearance required to be obtained after finishing trimming;
s2: placing the adjusting gasket on the other surface of the polishing carrier, which is opposite to the surface to be modified;
s3: the polishing device carries out polishing operation on the surface to be trimmed of the polishing carrier, and the surface to be trimmed is ground for trimming; the adjusting shim is capable of changing the amount of grinding of the surface to be finished at different positions in a direction away from the center of rotation thereof.
As an alternative to the above-described dressing method, the spacer is arranged coaxially with the surface to be dressed.
As an alternative to the above-described dressing method, the conditioning shim is of a solid disc structure, and the conditioning shim causes the grinding amount of the surface to be dressed to have a decreasing tendency in a direction away from the center of rotation.
As an alternative to the above dressing method, the spacer is of a ring structure, and the spacer causes the grinding amount of the face to be dressed to exhibit an increasing tendency in a direction away from the center of rotation.
As an alternative to the above-described dressing method, the outer diameter of the spacer shim is the same as the outer diameter of the surface to be dressed.
As an alternative to the trimming method described above, the target profile of the surface to be trimmed in step S1 is obtained by:
s100: selecting a certain polishing carrier, wherein the surface of the polishing carrier, which is in contact with the piece to be polished, has an initial appearance, putting the piece to be polished into the polishing device, polishing the piece to be polished, and detecting and recording the surface flatness X of the piece to be polished after polishing is finished;
s200: s100, repeating for N-1 times to obtain surface flatness X1, X2 and X3 … … XN of the to-be-polished pieces corresponding to the N polishing carriers with different initial appearances;
s300: and selecting the minimum value Xmin of X1, X2 and X3 … … XN, and taking the initial topography of the polishing carrier corresponding to the minimum value Xmin as the target topography of the surface to be modified.
As an alternative to the trimming method described above, step S3 includes the steps of:
after the polishing carrier is trimmed for a certain time, detecting whether the current appearance of the surface to be trimmed is consistent with the target appearance; if the two are consistent, finishing; and if not, continuing to trim until the current appearance of the surface to be trimmed is consistent with the target appearance.
As an alternative to the above-described dressing method, the dressing method is used before the polishing apparatus performs a polishing operation on a member to be polished for the first time; and/or
The dressing method is used in the process of polishing a workpiece to be polished by the polishing device.
As an alternative to the above-described dressing method, the existing topography of the surface to be dressed of the polishing carrier is a positive disk type, a negative disk type, or a planar type; the positive disc shape is a shape that the rotation center of the surface to be trimmed protrudes and the protruding height gradually decreases along the direction far away from the rotation center; the negative disc type is a shape that the rotation center of the surface to be trimmed is sunken and the depth of the sunken part is gradually reduced along the direction far away from the rotation center; the plane is the shape that the plane to be modified is the plane.
As an alternative to the above dressing method, the target topography of the surface to be dressed of the polishing carrier is a positive disk type, a negative disk type, or a flat type.
Compared with the prior art, the invention has the beneficial effects that:
the method for dressing the polishing carrier provided by the invention has the advantages that the surface of the polishing carrier far away from the surface to be dressed is provided with the proper adjusting gasket to change the grinding amount of the surface to be dressed at different positions along the direction far away from the rotation center of the surface to be dressed, and then the polishing carrier is put into the polishing device to dress the surface to be dressed, so that the problems of uniform contact surface shape of the polishing carrier and the member to be polished, incapability of improving the polishing effect of the member to be polished, easiness in abrasion, high replacement cost and the like are effectively solved while the surface flatness of the member to be polished is ensured.
Drawings
FIG. 1 is a flow chart of a trimming method in an embodiment of the invention;
FIG. 2 is a flowchart of selecting a target feature of a surface to be modified according to an embodiment of the present invention;
FIG. 3 is a schematic view of an embodiment of a spacer according to the present invention;
FIG. 4 is a schematic view of another embodiment of a spacer according to the present invention;
FIG. 5 is a schematic view showing the structure of a polishing apparatus according to an embodiment of the present invention.
Reference numerals:
1. a polishing device;
11. a polishing disk; 12. a compression member; 13. a polishing carrier.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally placed when the products of the present invention are used, and are used only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements to be referred to must have specific orientations, be constructed in specific orientations, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
As shown in fig. 1-5, the present embodiment provides a dressing method for a polishing carrier, as shown in fig. 1, the dressing method comprising the steps of:
s1: selecting an adjusting gasket according to the existing appearance of the surface to be trimmed of the polishing carrier and the target appearance required to be obtained after finishing trimming;
s2: placing the adjusting pad on the other surface of the polishing carrier, which is opposite to the surface to be trimmed;
s3: the polishing device performs polishing operation on the surface to be trimmed of the polishing carrier, and finishes trimming by grinding the surface to be trimmed; the adjusting shim is capable of changing the amount of grinding of the surface to be finished at different positions in a direction away from the center of rotation thereof.
The dressing method provided by the embodiment is characterized in that the surface of the polishing carrier far away from the surface to be dressed is provided with the proper adjusting gasket to change the grinding amount of the surface to be dressed at different positions along the direction far away from the rotation center of the surface, and then the polishing carrier is placed into the polishing device to dress the surface to be dressed.
As shown in fig. 2, further, the obtaining of the target feature of the surface to be modified in step S1 specifically includes the following steps:
s100: selecting a certain polishing carrier, wherein the surface of the polishing carrier, which is in contact with the piece to be polished, has an initial appearance, putting the piece to be polished into a polishing device, polishing the piece to be polished, and detecting and recording the surface flatness X of the piece to be polished after polishing is finished;
s200: s100, repeating for N-1 times to obtain the surface flatness X1, X2 and X3 … … XN of the to-be-polished piece corresponding to N polishing carriers with different initial appearances;
s300: and selecting the minimum value Xmin of the X1, the X2 and the X3 … … XN, and taking the initial topography of the polishing carrier corresponding to the minimum value Xmin as the target topography to be trimmed.
Selecting the target morphology of the surface to be modified, which enables the polishing effect of the part to be polished to achieve the optimal polishing effect, determining the required grinding quantity at different positions of the surface to be modified when the target morphology is to be obtained according to the target morphology and the existing morphology of the surface to be modified, and selecting a proper adjusting gasket according to the variation trend of the required grinding quantity along the direction far away from the rotation center of the surface to be modified.
In particular, with reference to fig. 3-4, the spacer is a solid disk structure when the grinding amount of the surface to be modified is decreasing in a direction away from the center of rotation. Further optionally, the slower the above-described decreasing trend, the larger the contact area of the conditioning pad with the polishing carrier, i.e., the larger the diameter of the conditioning pad. When the grinding amount of the surface to be trimmed is in an increasing trend along the direction far away from the rotation center, the adjusting shim is in a circular ring structure. Further alternatively, the more aggressive the above-described increasing trend, the smaller the contact area of the conditioning pad with the polishing carrier, i.e., the larger the inner diameter of the conditioning pad. Further optionally, the outer diameter of the adjusting gasket is the same as that of the surface to be trimmed, so that the outer diameter of the adjusting gasket is determined, the appearance of the surface to be trimmed, which is uneven after trimming, is avoided, and the polishing carrier is prevented from being incapable of smoothly mounting the part to be polished.
Further optionally, the existing topography of the surface to be modified of the polishing carrier is a positive disk type, a negative disk type or a planar type; the positive disc shape is a shape that the rotation center of the surface to be trimmed protrudes and the protruding height gradually decreases along the direction far away from the rotation center; the negative disc type is a shape that the rotation center of the surface to be trimmed is sunken and the depth of the sunken part is gradually reduced along the direction far away from the rotation center; the plane is the shape that the plane to be modified is the plane. Further optionally, the target topography of the surface to be modified of the polishing carrier is a positive disk type, a negative disk type, or a planar type.
For example, when the existing profile of the surface to be modified of the polishing carrier is a positive disk type, the positive disk value is +150 μm, and the target profile is a planar type, the adjusting pad with a solid disk structure is selected to modify the polishing carrier because the grinding amount on the surface to be modified close to the rotation center is larger than the grinding amount on the surface to be modified far away from the rotation center. When the existing appearance of the to-be-modified surface of the polishing carrier is a negative disc type, the negative disc value is-150 microns, and the target appearance is the negative disc type with the negative disc value of-50 microns, the grinding amount close to the rotation center on the to-be-modified surface is smaller than the grinding amount far away from the rotation center, so that the adjusting gasket with the circular ring structure is selected to modify the to-be-polished carrier.
That is, the dressing method of the present embodiment changes the pressure distribution of the polishing carrier by selecting a suitable conditioning pad and placing the selected conditioning pad on the other surface of the polishing carrier opposite to the surface to be dressed. And putting the polishing carrier and the adjusting pad into a polishing device, so that the grinding amount of different positions on the surface to be modified of the polishing carrier is changed, and the required target morphology is obtained. Specifically, the adjusting pad and the surface to be trimmed are coaxially arranged to ensure that the pressure distribution on the polishing carrier is correct and to avoid obtaining wrong morphology after trimming.
Further optionally, step S3 includes the steps of: after the polishing carrier is trimmed for a certain time, detecting whether the current appearance of the surface to be trimmed of the polishing carrier is consistent with the target appearance; if the polishing carrier is consistent with the polishing carrier, finishing, putting the finished polishing carrier into a polishing device, and polishing a workpiece to be polished; and if not, continuing to trim until the current appearance of the surface to be trimmed is consistent with the target appearance. The steps judge the trimming effect of the surface to be trimmed, so that whether the trimming is continuously performed or the trimming process is stopped is selected, and the accuracy of the trimming process is improved.
Further optionally, the dressing method is used for obtaining a polishing carrier which can enable the polishing effect of the piece to be polished to be optimal before the polishing device performs polishing operation on the piece to be polished for the first time, so that the adaptability between the polishing carrier and the polishing device is the highest; and/or the finishing method is used for preventing the polishing carrier from reducing the polishing effect of the piece to be polished after abrasion deformation and the like occur in the finishing process in the process of polishing the piece to be polished by the polishing device, so that the polishing effect of the piece to be polished is maintained in a better range.
Referring to fig. 5, specifically, the polishing apparatus 1 includes a polishing disk 11 and a pressing member 12, the polishing carrier 13 is placed between the polishing disk 11 and the pressing member 12, and the pressing member 12 provides a pressing force for pressing the polishing carrier 13 and the polishing disk 11 against each other; the polishing disc 11 actively rotates and generates relative rotation with the polishing carrier 13, so as to grind the polishing carrier 13 by the polishing disc 11. The above-described polishing apparatus 1 is prior art, and its specific structure and operation principle will not be described herein.
It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (9)
1. A method of conditioning a polishing carrier, the method comprising the steps of:
s1: selecting an adjusting gasket according to the existing appearance of the surface to be trimmed of the polishing carrier and the target appearance required to be obtained after finishing trimming;
s2: placing the adjusting gasket on the other surface of the polishing carrier, which is opposite to the surface to be modified;
s3: the polishing device carries out polishing operation on the surface to be trimmed of the polishing carrier, and the surface to be trimmed is ground for trimming; the adjusting shim can change the grinding amount of the surface to be modified at different positions in the direction away from the rotation center of the surface to be modified;
the target topography of the surface to be modified in step S1 is obtained by the following steps:
s100: selecting a certain polishing carrier, wherein the surface of the polishing carrier, which is in contact with the piece to be polished, has an initial appearance, putting the piece to be polished into the polishing device, polishing the piece to be polished, and detecting and recording the surface flatness X of the piece to be polished after polishing is finished;
s200: s100, repeating for N-1 times to obtain surface flatness X1, X2 and X3 … … XN of the to-be-polished pieces corresponding to the N polishing carriers with different initial appearances;
s300: and selecting the minimum value Xmin of X1, X2 and X3 … … XN, and taking the initial topography of the polishing carrier corresponding to the minimum value Xmin as the target topography of the surface to be modified.
2. A dressing method according to claim 1, wherein the spacer is arranged coaxially with the surface to be dressed.
3. The dressing method of claim 2, wherein the adjusting shim has a solid disk structure, and the adjusting shim makes the grinding amount of the surface to be dressed gradually decrease in a direction away from the rotation center.
4. The dressing method according to claim 2, wherein the spacer is of a ring structure, and the spacer causes the grinding amount of the surface to be dressed to exhibit an increasing tendency in a direction away from the center of rotation.
5. The finishing method according to claim 4, wherein an outer diameter of the spacer is the same as an outer diameter of the surface to be finished.
6. The finishing method according to claim 1, wherein step S3 includes the steps of:
after the polishing carrier is trimmed for a certain time, detecting whether the current appearance of the surface to be trimmed is consistent with the target appearance; if the two are consistent, finishing; and if not, continuing to trim until the current appearance of the surface to be trimmed is consistent with the target appearance.
7. A dressing method according to claim 1, wherein the dressing method is used before the polishing apparatus performs a polishing operation on a member to be polished for the first time; and/or
The dressing method is used in the process of polishing a workpiece to be polished by the polishing device.
8. The dressing method of claim 1, wherein the existing topography of the surface to be dressed of the polishing carrier is a positive disk type, a negative disk type, or a planar type; the positive disc shape is a shape that the rotation center of the surface to be trimmed protrudes and the protruding height gradually decreases along the direction far away from the rotation center; the negative disc type is a shape that the rotation center of the surface to be trimmed is sunken and the depth of the sunken part is gradually reduced along the direction far away from the rotation center; the plane is the shape that the plane to be modified is the plane.
9. The dressing method of claim 1, wherein the target topography of the surface to be dressed of the polishing carrier is a positive disk type, a negative disk type, or a planar type.
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| CN202011633942.5A CN112757161B (en) | 2020-12-31 | 2020-12-31 | Trimming method of polishing carrier |
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| CN202011633942.5A CN112757161B (en) | 2020-12-31 | 2020-12-31 | Trimming method of polishing carrier |
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| CN112757161B true CN112757161B (en) | 2022-04-19 |
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Address after: 201616 No. 1-15, Lane 150, dingsong Road, Songjiang District, Shanghai Applicant after: Shanghai Chaosi Semiconductor Co.,Ltd. Applicant after: CHONGQING ADVANCED SILICON TECHNOLOGY Co.,Ltd. Address before: No.158, Lane 258, Shuangjin Road, Shihudang Town, Songjiang District, Shanghai, 201617 Applicant before: SHANGHAI ADVANCED SILICON TECHNOLOGY Co.,Ltd. Applicant before: CHONGQING ADVANCED SILICON TECHNOLOGY Co.,Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |