CN112752865A - 使用正向参数校正和增强的逆向工程的涂布控制 - Google Patents

使用正向参数校正和增强的逆向工程的涂布控制 Download PDF

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Publication number
CN112752865A
CN112752865A CN201880098099.XA CN201880098099A CN112752865A CN 112752865 A CN112752865 A CN 112752865A CN 201880098099 A CN201880098099 A CN 201880098099A CN 112752865 A CN112752865 A CN 112752865A
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China
Prior art keywords
runs
coating
information
parameter
target
Prior art date
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Pending
Application number
CN201880098099.XA
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English (en)
Chinese (zh)
Inventor
马库斯·K·提尔斯科
乔治·J·欧肯法斯
马吕斯·格里戈尼斯
安德鲁·克拉克
彭东工
夏银翔
袁照
埃里克·尼班克
尼尔·平克顿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weiyawei Communication Technology Co ltd
Viavi Solutions Inc
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Weiyawei Communication Technology Co ltd
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Filing date
Publication date
Application filed by Weiyawei Communication Technology Co ltd filed Critical Weiyawei Communication Technology Co ltd
Publication of CN112752865A publication Critical patent/CN112752865A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0042—Controlling partial pressure or flow rate of reactive or inert gases with feedback of measurements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3476—Testing and control
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/28—Interference filters
    • G02B5/285—Interference filters comprising deposited thin solid films

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Physical Vapour Deposition (AREA)
  • Optical Filters (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
CN201880098099.XA 2018-09-28 2018-09-28 使用正向参数校正和增强的逆向工程的涂布控制 Pending CN112752865A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/108297 WO2020062016A1 (en) 2018-09-28 2018-09-28 Coating control using forward parameter correction and enhanced reverse engineering

Publications (1)

Publication Number Publication Date
CN112752865A true CN112752865A (zh) 2021-05-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880098099.XA Pending CN112752865A (zh) 2018-09-28 2018-09-28 使用正向参数校正和增强的逆向工程的涂布控制

Country Status (7)

Country Link
US (1) US11692263B2 (enExample)
EP (1) EP3841227A4 (enExample)
JP (2) JP7724153B2 (enExample)
KR (1) KR102761027B1 (enExample)
CN (1) CN112752865A (enExample)
TW (1) TWI793371B (enExample)
WO (1) WO2020062016A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11481524B2 (en) * 2020-06-26 2022-10-25 Microsoft Technology Licensing, Llc Conformal coating iteration
WO2022240385A1 (en) 2021-05-10 2022-11-17 Carl Zeiss Vision International Gmbh A method for calibrating optical coating apparatuses
US12526655B2 (en) 2023-07-10 2026-01-13 T-Mobile Usa, Inc. Managing bandwidth consumption associated with multiple interaction channels of a wireless telecommunication network related to information campaigns

Citations (7)

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US5772861A (en) * 1995-10-16 1998-06-30 Viratec Thin Films, Inc. System for evaluating thin film coatings
US6217720B1 (en) * 1997-06-03 2001-04-17 National Research Council Of Canada Multi-layer reactive sputtering method with reduced stabilization time
US6556947B1 (en) * 1999-10-28 2003-04-29 Nova Measuring Instruments Ltd. Optical measurements of patterned structures
JP2004151492A (ja) * 2002-10-31 2004-05-27 Ulvac Japan Ltd 誘電体多層膜の製造装置
CN101265568A (zh) * 2007-03-13 2008-09-17 Jds尤尼弗思公司 用于沉积由混合物组成并具有预定折射率的层的方法和系统
CN102912306A (zh) * 2012-10-20 2013-02-06 大连理工大学 计算机自动控制的高功率脉冲磁控溅射设备及工艺
CN103540906A (zh) * 2013-09-29 2014-01-29 中国科学院上海光学精密机械研究所 光控-晶控综合膜厚监控方法

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JPH0733573B2 (ja) * 1988-10-14 1995-04-12 日本電信電話株式会社 薄膜形成方法
US5911856A (en) 1993-09-03 1999-06-15 Canon Kabushiki Kaisha Method for forming thin film
JPH0772307A (ja) * 1993-09-03 1995-03-17 Canon Inc 薄膜形成方法及び装置
AU2001259504A1 (en) 2000-05-24 2001-12-03 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
JP3965935B2 (ja) 2000-07-26 2007-08-29 セイコーエプソン株式会社 電気光学装置及び投射型表示装置
JP4805469B2 (ja) 2001-03-30 2011-11-02 芝浦メカトロニクス株式会社 成膜装置および成膜装置用プログラム
US7324865B1 (en) * 2001-05-09 2008-01-29 Advanced Micro Devices, Inc. Run-to-run control method for automated control of metal deposition processes
DE10124609B4 (de) 2001-05-17 2012-12-27 Aixtron Se Verfahren zum Abscheiden aktiver Schichten auf Substraten
US20060196765A1 (en) 2005-03-07 2006-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Metallization target optimization method providing enhanced metallization layer uniformity
JP2007072307A (ja) 2005-09-08 2007-03-22 Matsushita Electric Works Ltd 光モジュール
JP4929842B2 (ja) 2006-05-30 2012-05-09 ソニー株式会社 Ｎｄフィルターおよびｎｄフィルターの製造方法
CN102191475B (zh) * 2011-04-15 2012-10-10 中国科学院上海光学精密机械研究所 提高薄膜光谱性能的膜厚监控方法
US10113228B2 (en) * 2014-06-20 2018-10-30 Taiwan Semiconductor Manufacturing Company Ltd. Method for controlling semiconductor deposition operation
JP6619934B2 (ja) 2015-01-07 2019-12-11 日東電工株式会社 多層光学膜の膜厚制御方法、多層光学膜の製造方法および多層光学膜のスパッタ装置
JP6822807B2 (ja) 2015-09-30 2021-01-27 キヤノンメディカルシステムズ株式会社 Ｘ線コンピュータ断層撮影装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5772861A (en) * 1995-10-16 1998-06-30 Viratec Thin Films, Inc. System for evaluating thin film coatings
US6217720B1 (en) * 1997-06-03 2001-04-17 National Research Council Of Canada Multi-layer reactive sputtering method with reduced stabilization time
US6556947B1 (en) * 1999-10-28 2003-04-29 Nova Measuring Instruments Ltd. Optical measurements of patterned structures
JP2004151492A (ja) * 2002-10-31 2004-05-27 Ulvac Japan Ltd 誘電体多層膜の製造装置
CN101265568A (zh) * 2007-03-13 2008-09-17 Jds尤尼弗思公司 用于沉积由混合物组成并具有预定折射率的层的方法和系统
CN102912306A (zh) * 2012-10-20 2013-02-06 大连理工大学 计算机自动控制的高功率脉冲磁控溅射设备及工艺
CN103540906A (zh) * 2013-09-29 2014-01-29 中国科学院上海光学精密机械研究所 光控-晶控综合膜厚监控方法

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Publication number Publication date
WO2020062016A1 (en) 2020-04-02
TW202031919A (zh) 2020-09-01
KR20210063424A (ko) 2021-06-01
US20210332474A1 (en) 2021-10-28
JP2022511320A (ja) 2022-01-31
TWI793371B (zh) 2023-02-21
JP7724153B2 (ja) 2025-08-15
US11692263B2 (en) 2023-07-04
EP3841227A4 (en) 2021-10-06
JP2023134537A (ja) 2023-09-27
KR102761027B1 (ko) 2025-01-31
EP3841227A1 (en) 2021-06-30

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