CN112749431A - Wafer floor rapid arrangement method based on BIM technology - Google Patents
Wafer floor rapid arrangement method based on BIM technology Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000005516 engineering process Methods 0.000 title claims abstract description 16
- 235000012773 waffles Nutrition 0.000 claims abstract description 32
- 238000012216 screening Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- 238000005457 optimization Methods 0.000 claims abstract description 5
- 238000004458 analytical method Methods 0.000 claims abstract description 4
- 239000002131 composite material Substances 0.000 claims abstract description 4
- 238000010276 construction Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 238000011179 visual inspection Methods 0.000 claims description 3
- 239000002699 waste material Substances 0.000 abstract description 4
- 230000008569 process Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000006872 improvement Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/13—Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The invention provides a waffle slab rapid arrangement method based on a BIM technology, which comprises the following steps: checking a composite structure BIM model; establishing a plate surface division model of the waffle plate; establishing a cell panel model of the wafer cylinder; replacing the unit panel model in bulk; rapidly screening and replacing the modules of the units needing to be cut by relying on the detailed list; collision analysis, optimization and adjustment of conflicting panel elements; modeling and screening multiple groups optimally; and providing a layout chart and a blanking list. The quick waffle slab arrangement method based on the BIM technology is accurate and optimized in wafer slab arrangement, the disassembly, cutting and using amount of the wafer cylinder units are accurately controlled, materials are saved, and waste is avoided.
Description
Technical Field
The invention relates to the technical field of waffle slab arrangement, in particular to a waffle slab rapid arrangement method based on a BIM (building information modeling) technology.
Background
Most of wafer floor slabs of clean plants in the current stage are arranged by secondary plane arrangement deepening of manufacturers according to a structural construction drawing, the optimization of the drawing process is slow, the adjustment is not easy, details in later-stage construction cannot be considered comprehensively, and the collision of edges and corners is easy to ignore, so that workers often encounter places with unsatisfied sizes and need to perform temporary splitting or cutting in the arrangement construction process of the wafer cylinders. This undoubtedly causes the reduction of the construction efficiency and the waste of labor and materials, and further causes the defects of the construction period delay, the cost increase and even the construction quality of the waffle slab system.
Disclosure of Invention
The invention provides a quick waffle slab arrangement method based on a BIM (building information modeling) technology, which aims to solve the problems that in the prior art, waffle slab arrangement is slow in drawing, unreasonable in arrangement design, not optimized in design scheme and not easy to adjust.
In order to solve the technical problem, the invention provides a waffle slab rapid arrangement method based on a BIM technology, which comprises the following steps:
(1) checking the BIM model of the composite structure: checking the accuracy and the timeliness of the BIM model of the structure to ensure that the model is consistent with the actual construction condition and is modified one by one in different places;
(2) establishing a plate surface division model of the waffle plate: on the basis of an accurate structure BIM model, building a floor slab of a Revit curtain wall panel system according to the outline of a waffle slab in a design drawing, reasonably dividing the outline of the waffle slab and building a plurality of regular slab surfaces;
(3) establishing a cell panel model of the wafer cylinder: meshing the board surface according to the design requirement and the size of the waffle cone cells to obtain a waffle board panel system model with accurate meshing; establishing a parameterized wafer cylinder unit panel family model according to a wafer cylinder production drawing, and completely loading the established parameterized wafer cylinder unit panel family model into a wafer plate panel system model;
(4) batch replacement cell panel model: according to the design intention of the wafer plate system, the original default panel is replaced by the wafer cylinder unit required to be replaced;
(5) and (3) rapidly screening and replacing the modules of the units to be cut by relying on the detailed list: counting panel units of all wafer panel systems by means of a recipe function of Revit to obtain a data table hung with the model; quickly screening the default panel which is not replaced in the specification list, automatically corresponding to the corresponding position of the model, and manually replacing the default panel with the same size specification with the wafer cylinder unit which is correspondingly cut;
(6) collision analysis, optimization and adjustment of conflicting panel elements: after the model is preliminarily finished, running a 'collision check' command of Revit, detecting collision conflicts among the unit panels or between the unit panels and the structural model, and if the collision conflicts occur, carrying out fine adjustment or modified cutting on the collided unit panels;
(7) and (3) modeling and screening multiple groups to be optimal: repeating the steps (2) to (6), completing modeling of a plurality of groups of schemes, comparing the schemes, and screening out the optimal scheme according to table data derived from the detailed table and visual inspection of the three-dimensional model;
(8) providing a layout chart and a blanking list: according to the optimal scheme, the method is further refined in Revit, and an arrangement diagram and a blanking list are provided.
In the step (2), on the basis of an accurate structure BIM model, a floor slab of a Revit curtain wall panel system is built according to the outline of a waffle slab in a design drawing by utilizing a roof-glass inclined window command in software.
In the step (3), a parameterized wafer tube unit panel family model is established by using a Revit metric curtain wall panel family according to a wafer tube production drawing.
In step (4), the default panel with non-matching size specification is encountered during replacement, and the system will not replace the default panel and will still retain the default panel.
In step (5), the data table attached to the model contains information such as size, area, type and number of unit panels.
In the step (8), according to the provided arrangement diagram and the blanking list, the method is used for guiding subsequent project purchase, on-site material taking and construction.
The invention has the following beneficial effects: the quick wafer floor arrangement method based on the BIM technology of the invention accelerates the deepening process of the arrangement of a wafer floor system of a clean factory building, realizes quick typesetting simulation before construction, further optimizes the splitting and cutting of wafer cylinders in real time, quickly provides a typesetting deepening drawing, and then carries out statistics on the use amount of the wafer cylinders with various specifications according to an accurate detail table which is provided immediately; the BIM waffle slab arrangement method based on the simulative property and the analyzability enables the arrangement scheme to be economical, accurate and implementable, enables the field construction in the later period to be high in efficiency and quality, can achieve the accuracy of material receiving, reasonably distributes materials, reduces waste, shortens the period of optimally adjusting to the construction drawing, and enables engineers to have sufficient time to compare different designs so as to discuss the optimal scheme.
Drawings
Fig. 1 is a flow chart of a wafer floor rapid arrangement method based on the BIM technology according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments.
As shown in fig. 1, the implementation of the present invention provides a wafer floor rapid arrangement method based on BIM technology, which includes the following steps:
(1) checking the BIM model of the composite structure: checking the accuracy and the timeliness of the BIM model of the structure to ensure that the model is consistent with the actual construction condition and is modified one by one in different places;
(2) establishing a plate surface division model of the waffle plate: on the basis of an accurate structure BIM model, building a floor slab of a Revit curtain wall panel system according to the outline of a waffle slab in a design drawing, reasonably dividing the outline of the waffle slab and building a plurality of regular slab surfaces;
(3) establishing a cell panel model of the wafer cylinder: meshing the board surface according to the design requirement and the size of the waffle cone cells to obtain a waffle board panel system model with accurate meshing; establishing a parameterized wafer cylinder unit panel family model according to a wafer cylinder production drawing, and completely loading the established parameterized wafer cylinder unit panel family model into a wafer plate panel system model;
(4) batch replacement cell panel model: according to the design intention of the wafer plate system, the original default panel is replaced by the wafer cylinder unit required to be replaced;
(5) and (3) rapidly screening and replacing the modules of the units to be cut by relying on the detailed list: counting panel units of all wafer panel systems by means of a recipe function of Revit to obtain a data table hung with the model; quickly screening the default panel which is not replaced in the specification list, automatically corresponding to the corresponding position of the model, and manually replacing the default panel with the same size specification with the wafer cylinder unit which is correspondingly cut;
(6) collision analysis, optimization and adjustment of conflicting panel elements: after the model is preliminarily finished, running a 'collision check' command of Revit, detecting collision conflicts among the unit panels or between the unit panels and the structural model, and if the collision conflicts occur, carrying out fine adjustment or modified cutting on the collided unit panels;
(7) and (3) modeling and screening multiple groups to be optimal: repeating the steps (2) to (6), completing modeling of a plurality of groups of schemes, comparing the schemes, and screening out the optimal scheme according to table data derived from the detailed table and visual inspection of the three-dimensional model;
(8) providing a layout chart and a blanking list: according to the optimal scheme, the method is further refined in Revit, and an arrangement diagram and a blanking list are provided.
Further, in the step (2), on the basis of the accurate structure BIM model, a floor slab of a Revit curtain wall panel system is established according to the outline of a waffle slab in a design drawing by using a 'roof-glass inclined window' command in software.
Further, in the step (3), a parameterized wafer tube unit panel family model is established by using a Revit' metric curtain wall panel family according to a wafer tube production drawing.
Further, in the step (4), when a default panel with a non-matching size specification is encountered, the system will not replace the default panel and will still retain the default panel.
Further, in the step (5), the data table attached to the model contains information such as size, area, type and number of unit panels.
Further, in the step (8), the layout chart and the blanking list are provided for guiding subsequent project purchasing, on-site material taking and construction.
In conclusion, the wafer floor rapid arrangement method based on the BIM technology of the invention accelerates the deepening process of the arrangement of the wafer floor system of the clean factory building, realizes rapid typesetting simulation before construction, further optimizes the splitting and cutting of the wafer cylinders in real time, rapidly issues the typesetting deepening drawing, and then counts the use amount of the wafer cylinders with various specifications according to the precise detail table issued in real time; the BIM waffle slab arrangement method based on the simulative property and the analyzability enables the arrangement scheme to be economical, accurate and implementable, enables the field construction in the later period to be high in efficiency and quality, can achieve the accuracy of material receiving, reasonably distributes materials, reduces waste, shortens the period of optimally adjusting to the construction drawing, and enables engineers to have sufficient time to compare different designs so as to discuss the optimal scheme.
The above description is only an example of the present invention, and is not intended to limit the present invention, and it is obvious to those skilled in the art that various modifications and variations can be made in the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (6)
1. A waffle slab rapid arrangement method based on BIM technology is characterized in that: the method comprises the following steps:
(1) checking the BIM model of the composite structure: checking the accuracy and the timeliness of the BIM model of the structure to ensure that the model is consistent with the actual construction condition and is modified one by one in different places;
(2) establishing a plate surface division model of the waffle plate: on the basis of an accurate structure BIM model, building a floor slab of a Revit curtain wall panel system according to the outline of a waffle slab in a design drawing, reasonably dividing the outline of the waffle slab and building a plurality of regular slab surfaces;
(3) establishing a cell panel model of the wafer cylinder: meshing the board surface according to the design requirement and the size of the waffle cone cells to obtain a waffle board panel system model with accurate meshing; establishing a parameterized wafer cylinder unit panel family model according to a wafer cylinder production drawing, and completely loading the established parameterized wafer cylinder unit panel family model into a wafer plate panel system model;
(4) batch replacement cell panel model: according to the design intention of the wafer plate system, the original default panel is replaced by the wafer cylinder unit required to be replaced;
(5) and (3) rapidly screening and replacing the modules of the units to be cut by relying on the detailed list: counting panel units of all wafer panel systems by means of a recipe function of Revit to obtain a data table hung with the model; quickly screening the default panel which is not replaced in the specification list, automatically corresponding to the corresponding position of the model, and manually replacing the default panel with the same size specification with the wafer cylinder unit which is correspondingly cut;
(6) collision analysis, optimization and adjustment of conflicting panel elements: after the model is preliminarily finished, running a 'collision check' command of Revit, detecting collision conflicts among the unit panels or between the unit panels and the structural model, and if the collision conflicts occur, carrying out fine adjustment or modified cutting on the collided unit panels;
(7) and (3) modeling and screening multiple groups to be optimal: repeating the steps (2) to (6), completing modeling of a plurality of groups of schemes, comparing the schemes, and screening out the optimal scheme according to table data derived from the detailed table and visual inspection of the three-dimensional model;
(8) providing a layout chart and a blanking list: according to the optimal scheme, the method is further refined in Revit, and an arrangement diagram and a blanking list are provided.
2. The BIM technology-based waffle slab rapid arrangement method according to claim 1, wherein in the step (2), on the basis of an accurate structural BIM model, the floor of a Revit curtain wall panel system is established according to the contour of a waffle slab in design drawings by using a 'roof-glass inclined window' command in software.
3. A wafer floor rapid arrangement method based on BIM technology as claimed in claim 1, wherein in said step (3), a parameterized wafer tube unit panel family model is established using the Revit "metric curtain wall panel" family according to wafer tube production drawings.
4. A method for quickly arranging waffle slab according to claim 1, wherein in step (4), when a default panel with inconsistent size specifications is encountered, the default panel is not replaced by the system, and the default panel is still reserved.
5. A wafer floor rapid arrangement method based on BIM technology as claimed in claim 1, wherein in said step (5), the data table attached to the model contains information of size, area, type and number of unit panels.
6. A wafer floor rapid arrangement method based on BIM technology as claimed in claim 1, wherein in step (8), according to the arrangement chart and the blanking list, it is used to guide the project purchase, the on-site material receiving and construction.
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