CN112745497A - 一种半芳香族聚酰胺树脂及其制备方法与应用 - Google Patents
一种半芳香族聚酰胺树脂及其制备方法与应用 Download PDFInfo
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- CN112745497A CN112745497A CN202011599220.2A CN202011599220A CN112745497A CN 112745497 A CN112745497 A CN 112745497A CN 202011599220 A CN202011599220 A CN 202011599220A CN 112745497 A CN112745497 A CN 112745497A
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- Prior art keywords
- semi
- polyamide resin
- aromatic polyamide
- containing compound
- compound
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- 229920006012 semi-aromatic polyamide Polymers 0.000 title claims abstract description 75
- 229920005989 resin Polymers 0.000 title claims abstract description 68
- 239000011347 resin Substances 0.000 title claims abstract description 68
- 238000002360 preparation method Methods 0.000 title abstract description 11
- 150000001875 compounds Chemical class 0.000 claims abstract description 55
- -1 aromatic amine compound Chemical class 0.000 claims abstract description 40
- 239000011574 phosphorus Substances 0.000 claims abstract description 36
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 36
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000000203 mixture Substances 0.000 claims abstract description 29
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000011593 sulfur Substances 0.000 claims abstract description 28
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 28
- 238000000465 moulding Methods 0.000 claims abstract description 17
- 239000000178 monomer Substances 0.000 claims description 28
- 239000012763 reinforcing filler Substances 0.000 claims description 16
- 150000004985 diamines Chemical class 0.000 claims description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 10
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 claims description 6
- 239000012767 functional filler Substances 0.000 claims description 6
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 235000011037 adipic acid Nutrition 0.000 claims description 5
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000004408 titanium dioxide Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical class OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims description 4
- 239000001361 adipic acid Substances 0.000 claims description 4
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- 239000003153 chemical reaction reagent Substances 0.000 claims description 4
- KUMNEOGIHFCNQW-UHFFFAOYSA-N diphenyl phosphite Chemical compound C=1C=CC=CC=1OP([O-])OC1=CC=CC=C1 KUMNEOGIHFCNQW-UHFFFAOYSA-N 0.000 claims description 4
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 4
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 claims description 4
- XHWQYYPUYFYELO-UHFFFAOYSA-N ditridecyl phosphite Chemical compound CCCCCCCCCCCCCOP([O-])OCCCCCCCCCCCCC XHWQYYPUYFYELO-UHFFFAOYSA-N 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 150000003464 sulfur compounds Chemical class 0.000 claims description 4
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 claims description 4
- 239000012463 white pigment Substances 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical class OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 3
- 125000001741 organic sulfur group Chemical group 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- GGISPEWAEPDJDE-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) 2-phenylacetate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC1=CC=CC=C1 GGISPEWAEPDJDE-UHFFFAOYSA-N 0.000 claims description 2
- YEYCMBWKTZNPDH-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) benzoate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC=C1 YEYCMBWKTZNPDH-UHFFFAOYSA-N 0.000 claims description 2
- ZMSFWAFVCKJWKT-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) n-[2-methyl-5-[(2,2,6,6-tetramethylpiperidin-4-yl)oxycarbonylamino]phenyl]carbamate Chemical compound C1=C(NC(=O)OC2CC(C)(C)NC(C)(C)C2)C(C)=CC=C1NC(=O)OC1CC(C)(C)NC(C)(C)C1 ZMSFWAFVCKJWKT-UHFFFAOYSA-N 0.000 claims description 2
- GSTKDOVQEARANU-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) n-phenylcarbamate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)NC1=CC=CC=C1 GSTKDOVQEARANU-UHFFFAOYSA-N 0.000 claims description 2
- PHJMLWHPHSYYQI-UHFFFAOYSA-N 1,1-bis(2,6-ditert-butyl-4-ethylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)CC)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)C)CC)C(C)(C)C PHJMLWHPHSYYQI-UHFFFAOYSA-N 0.000 claims description 2
- IUKIOUVQRQCBOX-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-phenoxypiperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OC1=CC=CC=C1 IUKIOUVQRQCBOX-UHFFFAOYSA-N 0.000 claims description 2
- WDYYJEFALNLPOT-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-phenylmethoxypiperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OCC1=CC=CC=C1 WDYYJEFALNLPOT-UHFFFAOYSA-N 0.000 claims description 2
- ACHSSZBFQZOESE-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)-1,1-bis[4-methyl-2,6-bis(2,4,4-trimethylpentan-2-yl)phenyl]propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(CC(C)(C)C)C1=C(C(=CC(=C1)C)C(C)(C)CC(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)CC(C)(C)C)C)C(C)(C)CC(C)(C)C ACHSSZBFQZOESE-UHFFFAOYSA-N 0.000 claims description 2
- DFCWBHWOHAWROH-UHFFFAOYSA-N 2,2-diphenylethyl dihydrogen phosphite Chemical compound C=1C=CC=CC=1C(COP(O)O)C1=CC=CC=C1 DFCWBHWOHAWROH-UHFFFAOYSA-N 0.000 claims description 2
- IXNXCCLDPLCSJK-UHFFFAOYSA-N 2,4,6-tris(2,2,6,6-tetramethylpiperidin-4-yl)benzene-1,3,5-tricarboxylic acid Chemical compound C1C(C)(C)NC(C)(C)CC1C1=C(C(O)=O)C(C2CC(C)(C)NC(C)(C)C2)=C(C(O)=O)C(C2CC(C)(C)NC(C)(C)C2)=C1C(O)=O IXNXCCLDPLCSJK-UHFFFAOYSA-N 0.000 claims description 2
- MWANTFVULLQTHU-UHFFFAOYSA-N 3,5,6-tris(2,2,6,6-tetramethylpiperidin-4-yl)benzene-1,2,4-tricarboxylic acid Chemical compound C1C(C)(C)NC(C)(C)CC1C(C(=C(C1CC(C)(C)NC(C)(C)C1)C(C(O)=O)=C1C(O)=O)C(O)=O)=C1C1CC(C)(C)NC(C)(C)C1 MWANTFVULLQTHU-UHFFFAOYSA-N 0.000 claims description 2
- ZKZRAZXPGWHRIW-UHFFFAOYSA-N 3-(2,6-ditert-butyl-4-methylphenyl)-2,2-bis(hydroxymethyl)butane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)(C(CO)(CO)CO)C ZKZRAZXPGWHRIW-UHFFFAOYSA-N 0.000 claims description 2
- KVBMUYJHWZCRKR-UHFFFAOYSA-N 4-(2,5-dimethylphenoxy)-2,2,6,6-tetramethylpiperidine Chemical group CC1=CC=C(C)C(OC2CC(C)(C)NC(C)(C)C2)=C1 KVBMUYJHWZCRKR-UHFFFAOYSA-N 0.000 claims description 2
- AZOKEAVWRNFNHE-UHFFFAOYSA-N 4-cyclohexyloxy-2,2,6,6-tetramethylpiperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OC1CCCCC1 AZOKEAVWRNFNHE-UHFFFAOYSA-N 0.000 claims description 2
- LBSJFUFSEQQYFC-UHFFFAOYSA-N 8,8-diphenyloctyl dihydrogen phosphite Chemical compound C=1C=CC=CC=1C(CCCCCCCOP(O)O)C1=CC=CC=C1 LBSJFUFSEQQYFC-UHFFFAOYSA-N 0.000 claims description 2
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002656 Distearyl thiodipropionate Substances 0.000 claims description 2
- FDBMBOYIVUGUSL-UHFFFAOYSA-N OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)C)C)C(C)(C)C Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)C)C)C(C)(C)C FDBMBOYIVUGUSL-UHFFFAOYSA-N 0.000 claims description 2
- SQGYCBIXLIRWFA-UHFFFAOYSA-N OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)C(CO)(CO)CO Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)C(CO)(CO)CO SQGYCBIXLIRWFA-UHFFFAOYSA-N 0.000 claims description 2
- RYWGBGIYPRBUNX-UHFFFAOYSA-N OP(O)OP(O)O.C(C)(C)(CC)C1=C(C(=CC(=C1)C)C(C)(C)CC)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)CC)C)C(C)(C)CC Chemical compound OP(O)OP(O)O.C(C)(C)(CC)C1=C(C(=CC(=C1)C)C(C)(C)CC)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)CC)C)C(C)(C)CC RYWGBGIYPRBUNX-UHFFFAOYSA-N 0.000 claims description 2
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 2
- 239000004113 Sepiolite Substances 0.000 claims description 2
- 229910000004 White lead Inorganic materials 0.000 claims description 2
- 239000005083 Zinc sulfide Substances 0.000 claims description 2
- BPYFSWZMFNSERP-UHFFFAOYSA-N [1-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]butyl]-2,2,6,6-tetramethylpiperidin-4-yl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound C=1C(C(C)(C)C)=C(O)C(C(C)(C)C)=CC=1CCC(=O)OC(CC)CN(C(C1)(C)C)C(C)(C)CC1OC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BPYFSWZMFNSERP-UHFFFAOYSA-N 0.000 claims description 2
- VSVVZZQIUJXYQA-UHFFFAOYSA-N [3-(3-dodecylsulfanylpropanoyloxy)-2,2-bis(3-dodecylsulfanylpropanoyloxymethyl)propyl] 3-dodecylsulfanylpropanoate Chemical compound CCCCCCCCCCCCSCCC(=O)OCC(COC(=O)CCSCCCCCCCCCCCC)(COC(=O)CCSCCCCCCCCCCCC)COC(=O)CCSCCCCCCCCCCCC VSVVZZQIUJXYQA-UHFFFAOYSA-N 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- 239000004760 aramid Substances 0.000 claims description 2
- 229920006231 aramid fiber Polymers 0.000 claims description 2
- 239000010425 asbestos Substances 0.000 claims description 2
- 229960000892 attapulgite Drugs 0.000 claims description 2
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 claims description 2
- 239000011324 bead Substances 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- QICVZJNIJUZAGZ-UHFFFAOYSA-N benzene;phosphorous acid Chemical compound OP(O)O.C1=CC=CC=C1 QICVZJNIJUZAGZ-UHFFFAOYSA-N 0.000 claims description 2
- GHJBIWHWRNKOFW-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) benzene-1,4-dicarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=C(C(=O)OC2CC(C)(C)NC(C)(C)C2)C=C1 GHJBIWHWRNKOFW-UHFFFAOYSA-N 0.000 claims description 2
- 239000000378 calcium silicate Substances 0.000 claims description 2
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 2
- UGGQKDBXXFIWJD-UHFFFAOYSA-N calcium;dihydroxy(oxo)silane;hydrate Chemical compound O.[Ca].O[Si](O)=O UGGQKDBXXFIWJD-UHFFFAOYSA-N 0.000 claims description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 229910052570 clay Inorganic materials 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 235000019305 distearyl thiodipropionate Nutrition 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001701 hydrotalcite Inorganic materials 0.000 claims description 2
- 229960001545 hydrotalcite Drugs 0.000 claims description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 2
- 229910052945 inorganic sulfide Inorganic materials 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229910001463 metal phosphate Inorganic materials 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 2
- 229910052625 palygorskite Inorganic materials 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052903 pyrophyllite Inorganic materials 0.000 claims description 2
- 239000012783 reinforcing fiber Substances 0.000 claims description 2
- 229910052895 riebeckite Inorganic materials 0.000 claims description 2
- 229910052624 sepiolite Inorganic materials 0.000 claims description 2
- 235000019355 sepiolite Nutrition 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 claims description 2
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 claims description 2
- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 claims description 2
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 claims description 2
- QEDNBHNWMHJNAB-UHFFFAOYSA-N tris(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OCCCCCCCC(C)C QEDNBHNWMHJNAB-UHFFFAOYSA-N 0.000 claims description 2
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 claims description 2
- 239000010456 wollastonite Substances 0.000 claims description 2
- 229910052882 wollastonite Inorganic materials 0.000 claims description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 2
- 229960001763 zinc sulfate Drugs 0.000 claims description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 claims description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 2
- 150000002898 organic sulfur compounds Chemical class 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 230000032683 aging Effects 0.000 abstract description 33
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 238000004383 yellowing Methods 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 4
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 3
- 239000003381 stabilizer Substances 0.000 abstract description 3
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 230000002087 whitening effect Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 9
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Abstract
本发明公开了一种半芳香族聚酰胺树脂,属于化工领域。本发明所述半芳香族聚酰胺树脂通过在组分中添加特定比例的芳香胺化合物、含磷化合物和含硫化合物,这些组分作为耐热稳定剂和增白剂可显著提高所得产品的初始白度和耐热氧老化稳定性。本发明还公开了所述半芳香族聚酰胺树脂的制备方法,所述制备方法操作步骤简单,可实现工业化大规模生产。本发明还公开了由所述半芳香族聚酰胺树脂制备的模塑组合物,该产品同样具有高初始白度和良好的耐热防老黄化性能。
Description
技术领域
本发明涉及化工领域,具体涉及一种半芳香族聚酰胺树脂及其制备方法与应用。
背景技术
聚酰胺因具有良好的综合性能,包括优异的力学性能、耐磨损性、耐热性、耐化学药品性、自润滑性、摩擦系数低、易于加工等特点被广泛应于用玻璃纤维、矿物填充与阻燃改性等塑料制品领域。近10年以来,半芳香族聚酰胺由于突出的耐热性能和优异的力学性能越来越受到重视。
半芳香族聚酰胺广泛应用于电子电器领域,由于其具有突出的耐热性,在发光二极管(LED)领域被广泛用于制作LED的反射支架,尤其是PA10T及其衍生物,由于具有较高的熔点和耐热稳定性,其作为LED反射支架的效果要好于PA4T、PA6T等其它类型的半芳香族聚酰胺。
半芳香族聚酰胺在LED上的应用时,要求其具有良好的不透光性和优异的光反射特性;同时,LED制件在使用过程中,会暴露于光和高温环境下,容易导致发黄而影响其对光的反射效果。此外,LED在制备过程中,LED制件需加热到180℃左右维持1~2h以便固化环氧树脂或硅胶封装剂;在进行无铅焊锡表面贴装时,LED制件在回流焊炉中会暴露在高于265℃的峰值温度下维持2~4min;此外,在使用中如LED制件用于汽车照明设备上时,要长时间经受发光二极管芯片产生的高于120℃的环境温度。
随着LED反射支架在应用中被暴露于光和热中时,作为LED反射支架材料的半芳香族聚酰胺容易出现热氧老化和光老化,材料的白度和反射率快速下降,出现发黄、开裂甚至粉化的现象。
基于上述情况,现有技术在制作应用于LED反射支架材料的半芳香族聚酰胺组合物时,常常会加入二氧化钛作为填料,一方面可以提高材料的白度,一方面二氧化钛也具有出色的光反射性能。然而LED反射支架材料经过长期热氧老化和光老化后出现的发黄、脆化和粉化等现象的根本原因是半芳香族聚酰胺树脂基体的老化。现有技术中,改善老化的一般方法是在使用双螺杆挤出机制备聚酰胺组合物时加入抗氧剂、光稳定剂等助剂,有利于延缓聚酰胺组合物的老化,提升材料的耐老化性能。
然而,上述方法并不能从源头上提高材料的初始白度并解决材料经过长期热氧老化和光老化后出现的各类老化问题。原因在于,当选定一种半芳香族聚酰胺树脂以后,后期在制备组合物时无论添加怎样的抗氧剂、光反射填料还是光稳定剂,其效果都不明显,即半芳香族聚酰胺树脂本身的初始白度和耐老化性能基本决定了最终组合物的白度和耐老化性能。
发明内容
基于现有技术的不足,本发明的目的在于提供一种初始白度高且耐热氧老化性能优异的半芳香族聚酰胺树脂,该产品可从源头上提高其白度和耐老化性能,无需在加工使用时再添加其他额外助剂。
为了达到上述目的,本发明采取的技术方案为:
一种半芳香族聚酰胺树脂,按摩尔百分比计,包括以下重复单元的组分:二胺单体和二酸单体;所述二胺单体包括癸二胺,所述二酸单体包括芳香族二酸;所述组分中还包括芳香胺化合物、含磷化合物和含硫化合物。
优选地,所述芳香胺化合物、含磷化合物和含硫化合物的质量比为:芳香胺化合物:含磷化合物:含硫化合物=1~6:1~6:1~1.5。
发明人经过大量的实验后发现,当在半芳香族聚酰胺树脂制备的原料中添加芳香化合物、含磷化合物和含硫化合物,且三种物质的添加量为特定比例时,所得到的半芳香族聚酰胺树脂产品的初始白度和耐热氧老化稳定性能显著提高。
本发明所提供的半芳香族聚酰胺树脂通过在组分中添加特定比例的芳香胺化合物、含磷化合物和含硫化合物,这些组分作为耐热稳定剂和增白剂可显著提高所得产品的初始白度和耐热氧老化稳定性。
优选地,所述二胺单体还包括己二胺,所述二酸单体还包括己二酸;更优选地,所述每摩尔二胺单体中包括0.5~1mol癸二胺和0~0.5mol己二胺,所述每摩尔二酸单体中包括0.5~1mol芳香族二酸和0~0.5mol己二酸。
所述配比下的二胺单体和二酸单体可有效进行聚合反应,得到的聚酰胺树脂产品纯度高。
优选地,所述芳香胺化合物、含磷化合物和含硫化合物在所述半芳香族聚酰胺树脂组分中的总质量含量为0.2~3%。
更优选地,所述芳香胺化合物、含磷化合物和含硫化合物在所述半芳香族聚酰胺树脂组分中的总质量含量为0.6~1.5%。
所述含量下的添加剂不仅可有效提高产品的初始白度和耐热氧老化稳定性,同时不会影响产品的粘度、强度等功能性质。
优选地,所述半芳香族聚酰胺树脂中磷元素的质量含量为10~1000ppm,硫元素的质量含量为1~500ppm。更优选地,所述半芳香族聚酰胺树脂中磷元素的质量含量为20~600ppm,硫元素的质量含量为2~200ppm;更优选地,所述半芳香族聚酰胺树脂中磷元素的质量含量为30~500ppm,硫元素的质量含量为3~50ppm。
所述条件下添加的含磷化合物及含硫化合物可有效提升产品的交联程度,同时一定程度上提高树脂产品的机械强度。
优选地,所述芳香族二酸包括对苯二甲酸和间苯二甲酸。
优选地,所述芳香胺化合物为含有亚氨基的胺类化合物;更优选地,所述芳香胺化合物包括4-(苯基乙酰氧基)-2,2,6,6-四甲基哌啶、4-苯甲酰氧基-2,2,6,6-四甲基哌啶、4-环己氧基-2,2,6,6-四甲基哌啶、4-苄氧基-2,2,6,6-四甲基哌啶、4-苯氧基-2,2,6,6-四甲基哌啶、4-(苯基氨基甲酰氧基)-2,2,6,6-四甲基哌啶、双(2,2,6,6-四甲基-4-哌啶基)对苯二甲酸酯、α,α’-双(2,2,6,6-四甲基-4-哌啶氧基)对二甲苯、双(2,2,6,6-四甲基-4-哌啶基)-甲苯-2,4-二氨基甲酸酯、三(2,2,6,6-四甲基-4-哌啶基)-苯-1,3,5-三甲酸酯、三(2,2,6,6-四甲基-4-哌啶基)-苯-1,3,4-三甲酸酯、1-[2-{3-(3,5-二叔丁基-4-羟基苯基)丙酰氧基}丁基]-4-[3-(3,5-二叔丁基-4-羟基苯基)丙酰氧基]-2,2,6,6-四甲基哌啶、4.4’-双(α.α’-二甲基苄基)二苯胺中的至少一种。
优选地,所述含磷化合物包括无机含磷化合物、有机含磷化合物中的至少一种;所述无机含磷化合物包括无机磷酸类化合物、无机亚磷酸类化合物、无机次磷酸类化合物、磷酸金属盐类化合物、亚磷酸金属盐类化合物、次磷酸金属盐类化合物中的至少一种;所述有机含磷化合物包括亚磷酸三辛酯、亚磷酸三月桂酯、亚磷酸三癸酯、亚磷酸二苯辛酯、亚磷酸三异癸酯、亚磷酸一苯二异癸酯、亚磷酸一苯二(十三烷基)酯、亚磷酸二苯异辛酯、亚磷酸二苯异癸酯、亚磷酸二苯(十三烷基)酯、亚磷酸三苯酯、亚磷酸三(壬基苯基)酯、亚磷酸三(2,4-二叔丁基苯基)酯、2,6-二叔丁基-4-甲基苯基·苯基·季戊四醇二亚磷酸酯、2,6-二叔丁基-4-甲基苯基·甲基·季戊四醇二亚磷酸酯、双(2,6-二叔丁基-4-甲基苯基)季戊四醇二亚磷酸酯、双(2,6-二叔丁基-4-乙基苯基)季戊四醇二亚磷酸酯、双(2,6-二叔戊基-4-甲基苯基)季戊四醇二亚磷酸酯、双(2,6-二叔辛基-4-甲基苯基)季戊四醇二亚磷酸酯中的至少一种。
优选地,所述含硫化合物包括有机含硫化合物、无机含硫化合物中的至少一种;所述无机含硫化合物包括无机硫化物、无机硫酸类化合物、无机亚硫酸类化合物、硫化盐类化合物、硫酸盐类化合物、亚硫酸盐类化合物中的至少一种;所述有机含硫化合物包括季戊四醇四(3-月桂硫基丙酸酯)、3,3’-硫二丙酸二月桂酯、3,3’-硫二丙酸二肉豆蔻酯及3,3’-硫二丙酸二硬脂酯、双硬脂酰基硫代双丙酸酯、双肉桂酰基硫代双丙酸酯中的至少一种。
本发明的另一目的还在于提供所述半芳香族聚酰胺树脂的制备方法,所述制备方法为:在二胺单体和二酸单体中加入催化剂及封端剂并混合均匀后,加入芳香胺化合物、含磷化合物和含硫化合物并进行聚合反应,即得所述半芳香族聚酰胺树脂。
本发明所述制备方法操作步骤简单,可实现工业化大规模生产。
优选地,所述制备方法得到的半芳香族聚酰胺树脂在25℃下、浓度为98%的浓硫酸中的浓度为10mg/mL,相对粘度为1.8~2.7,优选为1.9~2.4;熔点为280~340℃,优选为295~325℃。
本发明的再一目的在于提供由本发明所述半芳香族聚酰胺树脂制备的模塑组合物,包括以下质量含量的组分:本发明所述半芳香族聚酰胺树脂40~90%以及功能填料10~60%;所述功能填料包括白色颜料、增强填料中的至少一种。
基于本发明所提供的的半芳香族聚酰胺树脂的高初始白度和耐热氧老化稳定性,将其与功能填料进行混合可进一步提高产品的白度或机械力学性能,使其应用于多个领域。
优选地,所述白色颜料包括二氧化钛、硫化锌、氧化锌、铅白、硫酸钡、硫酸锌、碳酸钙、氧化铝中的至少一种。
优选地,所述增强填料包括纤维状增强填料、平板状增强填料、针状增强填料中的至少一种;更优选地,所述纤维状增强填料包括玻璃纤维、碳纤维、芳族聚酰胺纤维、金属纤维中的至少一种;所述平板状增强纤维包括云母、滑石粉中的至少一种;所述针状增强填料包括钛酸钾晶须、硅灰石、硼酸铝晶须、硬硅钙石、碳酸钙晶须、海泡石、氧化锌晶须中的至少一种。
优选地,所述增强填料还包括二氧化硅、氮化铝、氧化铝、碳酸钡、氮化硼、钛酸钾(非晶须)、高岭土、绿坡缕石、粘土、叶腊石、碳纳米管、膨润土、硅酸钙、硼酸铝(非晶须)、硫酸钡、石棉、玻璃珠、石墨、碳化硅、绢云母、硫酸钙、水滑石、二硫化钼中的至少一种。
优选地,所述模塑组合物的组分中还包括抗氧剂、光老化剂及其他功能类助剂。
优选地,所述模塑组合物的制备方法为:将半芳香族聚酰胺树脂与各类助剂混合均匀后置入双螺杆挤出机中,加入功能填料并在330~340℃中熔融挤出造粒,即得所述模塑组合物。
本发明的有益效果在于:本发明提供了一种半芳香族聚酰胺树脂,该产品通过在组分中添加特定比例的芳香胺化合物、含磷化合物和含硫化合物,这些组分作为耐热稳定剂和增白剂可显著提高所得产品的初始白度和耐热氧老化稳定性。本发明还提供了所述半芳香族聚酰胺树脂的制备方法,所述制备方法操作步骤简单,可实现工业化大规模生产。本发明还提供了由所述半芳香族聚酰胺树脂制备的模塑组合物,该产品同样具有高初始白度和良好的耐热防老黄化性能。
具体实施方式
为了更好地说明本发明的目的、技术方案和优点,下面将结合具体实施例对本发明作进一步说明,其目的在于详细地理解本发明的内容,而不是对本发明的限制。
实施例1~6
本发明所述半芳香族聚酰胺树脂的实施例,各实施例中所述半芳香族聚酰胺树脂的配方如表1所示。
实施例所述半芳香族聚酰胺树脂的制备方法为:在配有冷凝管、磁力偶合搅拌、加料口、气相口、压力防爆装置的带压反应釜中加入二胺单体、二酸单体、催化剂、封端剂,再向其中加入占总投料量30wt%的去离子水,以及芳香胺化合物、含磷化合物和含硫化合物后,抽真空后充入高纯氮气作为保护气氛开始反应。
从室温开始将反应混合物逐步升温至220℃~230℃,在此温度下搅拌2~4h后,打开排气阀门慢慢泄压,从反应容器内排出水蒸汽,控制排水量以保持反应器内的温度和压力不变。一直排水至排水量达到投入去离子水量的约60~70%;此时开始升温,在3小时内升温至250℃~270℃,在此温度下恒定保温1~2h;反应完成后打开阀门出料,得到预聚物。
将预聚物于100℃下干燥4h后,加入到固相增粘装置中,使用高纯氮气作为保护气进行固相增粘反应:首先升温至210~220℃,恒温1~5h后,继续升温至250~260℃并恒温1~3h。待反应完成后,降温至180℃,恒温1~5h;最终降低至室温并出料。在上述反应过程中不断取样,通过取样测试粘度确定最终聚合终点,即得所述半芳香族聚酰胺树脂。
对比例1~3
对比例1~3所述半芳香族聚酰胺树脂与实施例1~8的差别仅在于配方上的不同,各对比例所述半芳香族聚酰胺树脂的配方如表1所示。
同时将实施例1~6和对比例1~3所述半芳香族聚酰胺树脂用于制备模塑组合物,各实施例中所述模塑组合物的配方如表2所示。
所述模塑组合物的制备方法为:使用高速搅拌机将干燥好的半芳香族聚酰胺树脂与各类助剂混合均匀,从双螺杆挤出机主喂料口加入,将二氧化钛与玻璃纤维通过侧喂料机加入双螺杆挤出机,在330~340℃的设置温度下通过双螺杆挤出机熔融挤出、造粒,得到颗粒状的模塑组合物;所述助剂中包括抗氧剂、光老化剂以及其他助剂,所述抗氧剂为尼龙常用受阻酚类抗氧剂,光老化剂为巴斯夫生产的TINUVIN 326,其他助剂为润滑剂及成核剂。
本发明具体实施例所述半芳香族聚酰胺树脂的组分中,所述二胺单体包括癸二胺和己二胺;所述二酸单体包括对苯二甲酸、间苯二甲酸和己二酸;所述催化剂为次亚磷酸钠;所述封端剂为苯甲酸;所述含磷化合物为2,6-二叔丁基-4-甲基苯基·苯基·季戊四醇二亚磷酸酯;所述芳香胺化合物为4.4’-双(α.α’-二甲基苄基)二苯胺;所述含硫化合物为季戊四醇四(3-月桂硫基丙酸酯。
为验证本发明所述半芳香族聚酰胺树脂的性能优异性,对实施例1~6及对比例1~3所得产品进行性能性质测试。
所述半芳香族聚酰胺树脂的相对粘度测试方法为GB12006.1-89;
所述半芳香族聚酰胺树脂熔点的测试方法为:ISO11357(2009);
所述半芳香族聚酰胺树脂及其制备的模塑组合物的亨特白度(W)测试方法为:使用注塑机将半芳香族聚酰胺树脂或模塑组合物注塑制得长度×宽度×厚度=80mm×50mm×2mm的长方形样板,然后使用爱色丽CE-7000A型色差计对样板进行测量。测试得到样品的L、a、b值,通过下式计算出样品的亨特白度值:
亨特白度W=100-[(100-L)2+a2+b2]0.5;
所述半芳香族聚酰胺树脂及其制备的模塑组合物的:将上述制得的长方形样板置于带有自动换气装置的恒温老化箱中进行热氧老化测试,老化箱温度为150℃,在此温度下维持24h后,取出样品冷却至室温,并再次测试样板的亨特白度。通过比较样品在老化前后的亨特白度来判断其耐热氧老化性能,经过恒温老化后亨特白度降低较多的样品,说明其耐热氧老化性能较差。
测试结果如表1和表2所示。
表1
从表1可知,实施例1~6与对比例1~3所得半芳香族聚酰胺树脂的相对粘度及熔点等性能相差不大,但实施例1~6所得半芳香族聚酰胺树脂的初始白度及经过老化后的白度显然高于对比例1~3所得产品,其中实施例所得产品的初始白度最高可达91.2,经过老化后最高也依然达到85.4,而缺少芳香胺化合物、含磷化合物以及含硫化合物组分的对比例1~2虽然初始白度还能达到80左右,但经过老化后也显著降低,而三种组分不在优选配比的对比例3所得产品,相比于实施例1其白度也具有一定差距。
表2
从表2可知,与其原料半芳香族聚酰胺树脂的性质相似,实施例1~6所得制备的模塑组合物相比于对比例1~3所得产品,其初始白度更高且耐热老化能力更强。值得注意的是,相比于对比例3,实施例1~6所得产品的初始白度均在95以上,而经过老化测试后白度依然保持90以上,说明半芳香族聚酰胺树脂的组分中芳香胺化合物、含磷化合物以及含硫化合物的配比对其制备的模塑组合物初始白度和耐热氧老化稳定性的影响更为明显。
最后所应当说明的是,以上实施例仅用以说明本发明的技术方案而非对本发明保护范围的限制,尽管参照较佳实施例对本发明作了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的实质和范围。
Claims (10)
1.一种半芳香族聚酰胺树脂,其特征在于,按摩尔百分比计,包括以下重复单元的组分:二胺单体和二酸单体;所述二胺单体包括癸二胺,所述二酸单体包括芳香族二酸;所述组分中还包括芳香胺化合物、含磷化合物和含硫化合物。
2.如权利要求1所述的半芳香族聚酰胺树脂,其特征在于,所述芳香胺化合物、含磷化合物和含硫化合物的质量比为:芳香胺化合物:含磷化合物:含硫化合物=1~6:1~6:1~1.5;所述芳香胺化合物、含磷化合物和含硫化合物在所述半芳香族聚酰胺树脂组分中的总质量含量为0.2~3%。
3.如权利要求1所述的半芳香族聚酰胺树脂,其特征在于,所述二胺单体还包括己二胺,所述二酸单体还包括己二酸;优选地,所述每摩尔二胺单体中包括0.5~1mol癸二胺和0~0.5mol己二胺,所述每摩尔二酸单体中包括0.5~1mol芳香族二酸和0~0.5mol己二酸,所述芳香族二酸包括对苯二甲酸和间苯二甲酸。
4.如权利要求1所述的半芳香族聚酰胺树脂,其特征在于,所述半芳香族聚酰胺树脂中磷元素的质量含量为10~1000ppm,硫元素的质量含量为1~500ppm;优选地,所述半芳香族聚酰胺树脂中磷元素的质量含量为20~600ppm,硫元素的质量含量为2~200ppm;优选地,所述半芳香族聚酰胺树脂中磷元素的质量含量为30~500ppm,硫元素的质量含量为3~50ppm。
5.如权利要求1所述的半芳香族聚酰胺树脂,其特征在于,所述芳香胺化合物为含有亚氨基的胺类化合物;优选地,所述芳香胺化合物包括4-(苯基乙酰氧基)-2,2,6,6-四甲基哌啶、4-苯甲酰氧基-2,2,6,6-四甲基哌啶、4-环己氧基-2,2,6,6-四甲基哌啶、4-苄氧基-2,2,6,6-四甲基哌啶、4-苯氧基-2,2,6,6-四甲基哌啶、4-(苯基氨基甲酰氧基)-2,2,6,6-四甲基哌啶、双(2,2,6,6-四甲基-4-哌啶基)对苯二甲酸酯、α,α’-双(2,2,6,6-四甲基-4-哌啶氧基)对二甲苯、双(2,2,6,6-四甲基-4-哌啶基)-甲苯-2,4-二氨基甲酸酯、三(2,2,6,6-四甲基-4-哌啶基)-苯-1,3,5-三甲酸酯、三(2,2,6,6-四甲基-4-哌啶基)-苯-1,3,4-三甲酸酯、1-[2-{3-(3,5-二叔丁基-4-羟基苯基)丙酰氧基}丁基]-4-[3-(3,5-二叔丁基-4-羟基苯基)丙酰氧基]-2,2,6,6-四甲基哌啶、4.4’-双(α.α’-二甲基苄基)二苯胺中的至少一种。
6.如权利要求1所述的半芳香族聚酰胺树脂,其特征在于,所述含磷化合物包括无机含磷化合物、有机含磷化合物中的至少一种;所述无机含磷化合物包括无机磷酸类化合物、无机亚磷酸类化合物、无机次磷酸类化合物、磷酸金属盐类化合物、亚磷酸金属盐类化合物、次磷酸金属盐类化合物中的至少一种;所述有机含磷化合物包括亚磷酸三辛酯、亚磷酸三月桂酯、亚磷酸三癸酯、亚磷酸二苯辛酯、亚磷酸三异癸酯、亚磷酸一苯二异癸酯、亚磷酸一苯二(十三烷基)酯、亚磷酸二苯异辛酯、亚磷酸二苯异癸酯、亚磷酸二苯(十三烷基)酯、亚磷酸三苯酯、亚磷酸三(壬基苯基)酯、亚磷酸三(2,4-二叔丁基苯基)酯、2,6-二叔丁基-4-甲基苯基·苯基·季戊四醇二亚磷酸酯、2,6-二叔丁基-4-甲基苯基·甲基·季戊四醇二亚磷酸酯、双(2,6-二叔丁基-4-甲基苯基)季戊四醇二亚磷酸酯、双(2,6-二叔丁基-4-乙基苯基)季戊四醇二亚磷酸酯、双(2,6-二叔戊基-4-甲基苯基)季戊四醇二亚磷酸酯、双(2,6-二叔辛基-4-甲基苯基)季戊四醇二亚磷酸酯中的至少一种。
7.如权利要求1所述的半芳香族聚酰胺树脂,其特征在于,所述含硫化合物包括有机含硫化合物、无机含硫化合物中的至少一种;所述无机含硫化合物包括无机硫化物、无机硫酸类化合物、无机亚硫酸类化合物、硫化盐类化合物、硫酸盐类化合物、亚硫酸盐类化合物中的至少一种;所述有机含硫化合物包括季戊四醇四(3-月桂硫基丙酸酯)、3,3’-硫二丙酸二月桂酯、3,3’-硫二丙酸二肉豆蔻酯及3,3’-硫二丙酸二硬脂酯、双硬脂酰基硫代双丙酸酯、双肉桂酰基硫代双丙酸酯中的至少一种。
8.如权利要求1~7任一项所述半芳香族聚酰胺树脂的制备方法,其特征在于,所述制备方法为:在二胺单体和二酸单体中加入催化剂及封端剂并混合均匀后,加入芳香胺化合物、含磷化合物和含硫化合物并进行聚合反应,即得所述半芳香族聚酰胺树脂。
9.一种由权利要求1~7任一项所述半芳香族聚酰胺树脂制备的模塑组合物,其特征在于,包括以下质量含量的组分:权利要求1~7任一项所述半芳香族聚酰胺树脂40~90%以及功能填料10~60%;所述功能填料包括白色颜料、增强填料中的至少一种。
10.如权利要求9所述的模塑组合物,其特征在于,所述白色颜料包括二氧化钛、硫化锌、氧化锌、铅白、硫酸钡、硫酸锌、碳酸钙、氧化铝中的至少一种;所述增强填料包括纤维状增强填料、平板状增强填料、针状增强填料中的至少一种;更优选地,所述纤维状增强填料包括玻璃纤维、碳纤维、芳族聚酰胺纤维、金属纤维中的至少一种;所述平板状增强纤维包括云母、滑石粉中的至少一种;所述针状增强填料包括钛酸钾晶须、硅灰石、硼酸铝晶须、硬硅钙石、碳酸钙晶须、海泡石、氧化锌晶须中的至少一种;所述增强填料还包括二氧化硅、氮化铝、氧化铝、碳酸钡、氮化硼、钛酸钾、高岭土、绿坡缕石、粘土、叶腊石、碳纳米管、膨润土、硅酸钙、硼酸铝、硫酸钡、石棉、玻璃珠、石墨、碳化硅、绢云母、硫酸钙、水滑石、二硫化钼中的至少一种。
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