CN112739048A - Roll type manufacturing method of double-sided flexible circuit board and flexible circuit board manufactured by same - Google Patents
Roll type manufacturing method of double-sided flexible circuit board and flexible circuit board manufactured by same Download PDFInfo
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- CN112739048A CN112739048A CN202011434383.5A CN202011434383A CN112739048A CN 112739048 A CN112739048 A CN 112739048A CN 202011434383 A CN202011434383 A CN 202011434383A CN 112739048 A CN112739048 A CN 112739048A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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Abstract
The invention discloses a roll-type manufacturing method of a double-sided flexible circuit board and the manufactured flexible circuit board, and the method comprises the following steps: step A: RTR double-sided pretreatment, step B: and (C) RTR double-sided coating PSPI and nitrogen prebaking, step C: and (D) performing RTR double-sided PSPI exposure, and performing step D: RTR double-sided PSPI development, and step E: baking RTR double-sided nitrogen; the invention can greatly reduce the product manufacturing flow, greatly shorten the product processing period, greatly reduce the corresponding required equipment, tools, materials and the like, greatly improve the production efficiency, reduce the labor input and reduce the production cost.
Description
Technical Field
The invention relates to the technical field of processing of printed circuit boards, in particular to a roll type manufacturing method of a double-sided flexible circuit board and the flexible circuit board manufactured by the same.
Background
The insulating protective layer of the existing flexible circuit board is mainly laminated after windowing processing of a cover film (CVL), the processing cycle of the cover film is long, the thickness of the cover film is larger than or equal to 27.5um, the cover film is influenced by the capacity of an existing mold, the windowing capacity of the cover film (CVL) is limited, for example, flexible circuit board products with small pad windowing such as a CCM (CMOS Camera Module) flexible circuit board and the like need to be manufactured by adopting photosensitive ink in a matched mode, and for example, LCM (LCD Module, namely LCD display Module) flexible circuit board products need to be manufactured by adopting thermosetting ink in a matched mode. Taking the process flow of the LCM module flexible circuit board as an example, a series of process flows such as cover film (CVL) drilling, die cutting, false sticking, pressing, baking, pre-processing, screen printing photosensitive ink, pre-baking, exposure, developing, post-curing, pre-processing, screen printing thermosetting ink, baking and the like, and equipment, tools and materials thereof are required in the processing step, so that the existing flexible circuit board manufacturing process has many process flows, long processing period, extremely high labor occupation and production cost, and has certain limitations in the aspects of product yield, manufacturing precision and the like.
Therefore, a few enterprises in the industry are actively developing a replacement product PSPI, namely Photo Sensitive PI, also called photosensitive polyimide, which is a high-precision photosensitive developing type polyimide material, but the existing PSPI manufacturing process mainly adopts a chip-to-chip production mode, abbreviated as SBS, and takes an LCM module double-sided flexible circuit board as an example, as shown in fig. 1, the existing manufacturing process flow of the insulation protection layer by replacing the original flexible circuit board with PSPI is as follows: the chip substrate with the manufactured circuit is subjected to SBS first surface pretreatment → SBS first surface coating PSPI → SBS first surface nitrogen prebaking → SBS first surface PSPI exposure → SBS first surface PSPI development → SBS first surface nitrogen postcuring → SBS second surface pretreatment → SBS second surface coating PSPI → SBS second surface nitrogen prebaking → SBS second surface PSPI exposure → SBS second surface PSPI development → SBS second surface nitrogen postcuring, namely the PSPI insulation protective layer manufacturing is completed through 12 processes, and then the subsequent product manufacturing processes of sand blasting, chemical nickel plating and the like are carried out, the processing period is longer, multiple processes and corresponding equipment, tools, materials and the like are required, the production cost is higher, the chip-to-chip production mode is limited by equipment capacity, particularly influenced by human factors, the product yield is not high, the production efficiency is low, and the labor is occupied, so that the requirements of pursuing low-cost, high-aging and ultra-thinning electronic products are not met, the existing PSPI manufacturing process and equipment are matched with chip-to-chip production, and a related PSPI roll-to-roll production process (RTR for short) and equipment thereof are not available temporarily. In view of the above, the present invention is particularly proposed.
Disclosure of Invention
One of the objectives of the present invention is to overcome the deficiencies of the prior art and to provide a roll-type manufacturing method for a double-sided flexible printed circuit board, which can improve the product quality, improve the production efficiency and reduce the production cost.
In order to achieve the above purpose, the solution of the invention is:
a roll-type manufacturing method of a double-sided flexible circuit board comprises the following steps:
step A: RTR double-sided pretreatment, namely performing RTR double-sided pretreatment on the roll-to-roll substrate with the manufactured circuit, and roughening and cleaning the surfaces of the two circuit layers of the roll-to-roll substrate;
and B: coating PSPI on the two sides of an RTR (room temperature resistor) and prebaking with nitrogen, uniformly coating liquid PSPI on circuit layers on the two sides of a roll-to-roll substrate, and prebaking the roll-to-roll substrate coated with the liquid PSPI with nitrogen, wherein the step is carried out for 1-3 times according to the thickness requirement of the PSPI layer of a product;
and C: exposing the RTR double-sided PSPI, exposing the two PSPI layers on the reel-to-reel substrate, and respectively exposing and transferring the two insulating protection pattern layers required by the double-sided flexible circuit board to the corresponding PSPI layers;
step D: developing RTR double-sided PSPI, namely developing the two PSPI layers on the exposed reel-to-reel substrate, and developing the two insulating protection pattern layers;
step E: and (3) RTR double-sided nitrogen baking, namely performing nitrogen baking treatment on the two-sided PSPI layer on the roll-to-roll substrate subjected to developing treatment, and curing and molding the PSPI layer.
Further, in the step A, the pretreatment process is browning treatment or micro-etching treatment, and the micro-etching amount is 0.7-1.5 um.
Further, in the step B, the thickness of the coated PSPI layer is 10-25 um; the baking temperature is 75-85 deg.C, and the baking time is 10-20 min.
Further, the coated PSPI layer was 18 ± 3um thick.
Further, the coated PSPI layer was 12 ± 2um thick.
Further, the coated PSPI layer was 22 ± 3um thick.
Further, the baking temperature is preferably 80 ℃ and the baking time is preferably 10 min.
Further, the baking temperature is preferably 80 ℃ and the baking time may be 20 min.
Further, in the step C, a 21-order exposure ruler is adopted, and the energy level is 8-11 orders; in the step D, the adopted developing solution is Na2CO3 or K2CO3, the developing concentration is 1-1.2%, the developing temperature is 30 +/-2 ℃, and the developing point is 50-60%.
Further, a 21-step exposure ruler is adopted in the step C, and the energy level is 8 or 9; in the step D, the developing solution is K2CO3, the developing concentration is 1.2%, and the developing temperature is 30 ℃.
Further, in the step E, the baking temperature is 140-160 ℃, and the baking time is 45-90 min.
Further, the baking temperature is 160 ℃, and the baking time is 60 min.
Further, the baking temperature is 150 ℃, and the baking time is 60 min.
Further, the baking temperature is 140 ℃, and the baking time is 60 min.
Further, the roll-type manufacturing method of the double-sided flexible circuit board of the invention further comprises the following steps:
f, performing RTR double-sided sand blasting, and performing sand blasting treatment on two sides of the roll-to-roll substrate obtained in the step E;
step G, RTS cutting and automatic blue loading, wherein the roll-to-roll substrate obtained in the step F is cut into sheet-shaped substrates, and the sheet-shaped substrates are automatically loaded into a metal hanging blue; and
step H, electroless nickel and gold; and G, placing the gold dissolving hanging blue with the flaky substrate into a chemical nickel gold wire for chemical nickel gold treatment.
The invention also aims to provide a flexible circuit board manufactured by the roll-type manufacturing method of the double-sided flexible circuit board.
Further, the flexible circuit board is an LCM module flexible circuit board or a CCM module flexible circuit board.
Further, the flexible circuit board comprises a PI base material layer, two circuit layers and two PSIP layers, wherein the two circuit layers are arranged on two sides of the PI base material layer respectively, and the two PSIP layers are arranged on the two circuit layers in a coating mode respectively.
Further, the thickness of the PI base material layer is 10-25 μm; the thickness of the circuit layer is 8-25 μm; the thickness of the PSIP layer is 10-25 mu m.
Furthermore, the circuit layer is manufactured by a line subtractive method or an additive method.
Further, in the double-sided flexible circuit board, the thickness of the PI base material layer is 12 +/-2 microns or 20 +/-2 microns; the thickness of the circuit layer is 9 +/-2 mu m; the thickness of the PSIP layer is 12 +/-2 mu m or 18 +/-3 mu m.
Further, in the double-sided flexible circuit board, the thickness of the PI base material layer can also be 25 +/-2 μm; the thickness of the circuit layer is 20 +/-2 mu m; the thickness of the PSIP layer is 22 +/-3 mu m.
After the scheme is adopted, the invention has the following beneficial effects:
the invention replaces the existing SBS production process with the RTR production process, simplifies the 12 processes required by the existing SBS production process to 5 processes of the RTR production process, namely, the steps from A to E, reduces the 7 processes, greatly reduces the product manufacturing flow, greatly shortens the product processing period, greatly reduces the corresponding required equipment, tools, materials and the like, and can greatly improve the production efficiency, reduce the labor input and reduce the production cost.
The flexible circuit board is thin and flexible, various defects caused by wrinkles and wrinkles are easy to wrinkle in the SBS production and manufacturing process, the RTR production process is more suitable for manufacturing the flexible circuit board, the RTR production process is higher in product manufacturing consistency and less influenced by factors such as rollers of sheet type production equipment, in addition, interference of human factors is relatively less, defects such as wrinkles, pressure points and the like of the product are less, the product yield is high, and the product quality is good. The invention can be used for manufacturing double-sided flexible circuit boards and can also be used for manufacturing inner layer double-layer boards of multilayer flexible circuit boards.
In the invention, the liquid PSPI is directly coated on the surface of the circuit layer as an insulating protective layer of the flexible circuit board, the liquid PSPI circuit has good filling property and high resolution, a smaller pad windowing product can be manufactured, the thickness of the PSPI layer can be adjusted according to the thickness requirement of the product, and the thickness of the insulating protective layer is reduced, so that the product is thinner and softer, the PSPI layer can be controlled within the range of 10-25 mu m, the thicker PSPI layer can be obtained if required, the step B1-3 of the manufacturing method can be repeated, and after exposure and development of the liquid PSPI, the problems of glue overflow and the like after the lamination of the covering films are avoided, the product quality can be improved, and the product yield can be improved.
In the step G of the invention, RTS cutting and automatic blue loading are carried out, after the roll-to-roll substrate is cut into the sheet substrate, the sheet substrate is automatically loaded into the golden hanging blue, the original action of loading the hand tool sheet substrate into the golden hanging blue is integrated into RTS cutting equipment to realize the operation of the automatic equipment, a blue loading operator is cancelled, and the poor product crease caused by the hand tool blue is avoided.
The flexible circuit board provided by the invention is manufactured by adopting the manufacturing process, has the corresponding advantages of the process, obtains the PSPI insulating protective layer with controllable thickness, is matched with substrates with various thicknesses to manufacture products with different required thicknesses, can be further manufactured with ultra-thin copper foils to obtain ultra-thin flexible circuit boards, such as products with the thickness of 54 +/-6 mu m, and is more suitable for the development trend of ultra-thinning of future electronic products.
Drawings
Fig. 1 is a flow chart illustrating a conventional manufacturing process of an SBS double-sided flexible circuit board using PSPI.
Fig. 2 is a flow chart of a roll-type manufacturing method of the RTR double-sided flexible circuit board of the present invention.
Fig. 3 is a schematic cross-sectional view of a double-sided flexible circuit board manufactured by the method of the present invention.
Fig. 4 shows the stacking thickness of the double-sided flexible circuit board of the present invention.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
As shown in fig. 2, the present invention is a roll-type manufacturing method of a double-sided flexible circuit board, which comprises the following steps:
step A: RTR double-sided pretreatment, namely performing RTR double-sided pretreatment on the roll-to-roll substrate 10 with the manufactured circuit, and roughening and cleaning the surfaces of the two circuit layers of the roll-to-roll substrate;
and B: coating PSPI on the two sides of an RTR (room temperature resistor) and prebaking with nitrogen, uniformly coating liquid PSPI on circuit layers on the two sides of a roll-to-roll substrate, and prebaking the roll-to-roll substrate coated with the liquid PSPI with nitrogen, wherein the step is carried out for 1-3 times according to the thickness requirement of the PSPI layer of a product;
and C: exposing the RTR double-sided PSPI, exposing the two PSPI layers on the reel-to-reel substrate, and respectively exposing and transferring the two insulating protection pattern layers required by the double-sided flexible circuit board to the corresponding PSPI layers;
step D: developing RTR double-sided PSPI, namely developing the two PSPI layers on the exposed reel-to-reel substrate, and developing the two insulating protection pattern layers;
step E: and (3) RTR double-sided nitrogen baking, namely performing nitrogen baking treatment on the two-sided PSPI layer on the roll-to-roll substrate subjected to developing treatment, and curing and molding the PSPI layer.
Further, in the step A, the pretreatment process is browning treatment or micro-etching treatment, and the micro-etching amount is 0.7-1.5 um.
Further, in the step B, the thickness of the coated PSPI layer is 10-25 um; the baking temperature is 75-85 deg.C, and the baking time is 10-20 min.
Further, the coated PSPI layer was 18 ± 3um thick.
Further, the coated PSPI layer was 12 ± 2um thick.
Further, the coated PSPI layer was 22 ± 3um thick.
Further, the baking temperature is preferably 80 ℃ and the baking time is preferably 10 min.
Further, the baking temperature is preferably 80 ℃ and the baking time may be 20 min.
Further, in the step C, a 21-order exposure ruler is adopted, and the energy level is 8-11 orders; in the step D, the adopted developing solution is Na2CO3 or K2CO3, the developing concentration is 1-1.2%, the developing temperature is 30 +/-2 ℃, and the developing point is 50-60%.
Further, a 21-step exposure ruler is adopted in the step C, and the energy level is 8 or 9; in the step D, the developing solution is K2CO3, the developing concentration is 1.2%, and the developing temperature is 30 ℃.
Further, in the step E, the baking temperature is 140-160 ℃, and the baking time is 45-90 min.
Further, the baking temperature is 160 ℃, and the baking time is 60 min.
Further, the baking temperature is 150 ℃, and the baking time is 60 min.
Further, the baking temperature is 140 ℃, and the baking time is 60 min.
Further, the roll-type manufacturing method of the double-sided flexible circuit board of the invention further comprises the following steps:
f, performing RTR double-sided sand blasting, and performing sand blasting treatment on two sides of the roll-to-roll substrate obtained in the step E;
step G, RTS cutting and automatic blue loading, wherein the roll-to-roll substrate obtained in the step F is cut into sheet-shaped substrates, and the sheet-shaped substrates are automatically loaded into a metal hanging blue; and
step H, electroless nickel and gold; and G, placing the gold dissolving hanging blue with the flaky substrate into a chemical nickel gold wire for chemical nickel gold treatment.
As shown in fig. 3, the present invention also discloses a flexible circuit board 100 manufactured by the roll-type manufacturing method of the double-sided flexible circuit board.
Further, the flexible circuit board 100 is an LCM module flexible circuit board or a CCM module flexible circuit board.
Further, as shown in fig. 4, the structure of the flexible circuit board 100 includes a PI substrate layer 1, two circuit layers 2 and two PSIP layers 3, the two circuit layers 2 are respectively disposed on two sides of the PI substrate layer 1, and the two PSIP layers 3 are respectively coated on the two circuit layers 2.
Further, the thickness of the PI base material layer 1 is 10-25 μm; the thickness of the circuit layer 2 is 8-25 μm; the thickness of the PSIP layer 3 is 10-25 μm.
Further, the circuit layer 2 is manufactured by a line subtractive method or an additive method.
Further, in the double-sided flexible circuit board, the thickness of the PI base material layer 1 is 12 +/-2 microns or 20 +/-2 microns; the thickness of the circuit layer 2 is 9 +/-2 mu m; the thickness of the PSIP layer 3 is 12 +/-2 mu m or 18 +/-3 mu m;
further, in the double-sided flexible circuit board, the thickness of the PI base material layer 1 can also be 25 +/-2 μm; the thickness of the circuit layer 2 is 20 +/-2 mu m; the thickness of the PSIP layer 3 is 22 +/-3 mu m.
The invention replaces the existing SBS production technology with the RTR production technology, simplifies and shortens 12 processes required by the existing SBS production technology to 5 processes of the RTR production technology of the invention, namely, the steps from A to E, reduces 7 processes, greatly reduces the product manufacturing flow, greatly shortens the product processing period, greatly reduces the corresponding required equipment, tools and materials, and the like, and can greatly improve the production efficiency, reduce the manpower input and reduce the production cost;
the flexible circuit board is thin and flexible, various defects caused by wrinkles and wrinkles are easy to wrinkle in the SBS production and manufacturing process, the RTR production process is more suitable for manufacturing the flexible circuit board, the RTR production process is higher in product manufacturing consistency and less influenced by factors such as rollers of sheet type production equipment, in addition, interference of human factors is relatively less, defects such as wrinkles, pressure points and the like of the product are less, the product yield is high, and the product quality is good. The invention can be used for manufacturing double-sided flexible circuit boards and can also be used for manufacturing inner layer double-layer boards of multilayer flexible circuit boards.
In the invention, the liquid PSPI is directly coated on the surface of the circuit layer as an insulating protective layer of the flexible circuit board, the liquid PSPI circuit has good filling property and high resolution, a smaller pad windowing product can be manufactured, the thickness of the PSPI layer can be adjusted according to the thickness requirement of the product, and the thickness of the insulating protective layer is reduced, so that the product is thinner and softer, the PSPI layer can be controlled within the range of 10-25 mu m, the thicker PSPI layer can be obtained if required, the step B1-3 of the manufacturing method can be repeated, and after exposure and development of the liquid PSPI, the problems of glue overflow and the like after the lamination of the covering films are avoided, the product quality can be improved, and the product yield can be improved.
In the step G of the invention, RTS cutting and automatic blue loading are carried out, after the roll-to-roll substrate is cut into the sheet substrate, the sheet substrate is automatically loaded into the golden hanging blue, the original action of loading the hand tool sheet substrate into the golden hanging blue is integrated into RTS cutting equipment to realize the operation of the automatic equipment, a blue loading operator is cancelled, and the poor product crease caused by the hand tool blue is avoided.
The flexible circuit board provided by the invention is manufactured by adopting the manufacturing process, has the corresponding advantages of the process, obtains the PSPI insulating protective layer with controllable thickness, is matched with substrates with various thicknesses to manufacture products with different required thicknesses, can be further manufactured with ultra-thin copper foils to obtain ultra-thin flexible circuit boards, such as products with the thickness of 54 +/-6 mu m, and is more suitable for the development trend of ultra-thinning of future electronic products.
The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications thereof by those skilled in the art should be considered as not departing from the scope of the present invention.
Claims (10)
1. A roll-type manufacturing method of a double-sided flexible circuit board is characterized by comprising the following steps:
step A: RTR double-sided pretreatment, namely performing RTR double-sided pretreatment on the roll-to-roll substrate with the manufactured circuit, and roughening and cleaning the surfaces of the two circuit layers of the roll-to-roll substrate;
and B: coating PSPI on the two sides of the RTR and prebaking with nitrogen, uniformly coating liquid PSPI on the circuit layers on the two sides of the roll-to-roll substrate, and prebaking the roll-to-roll substrate coated with the liquid PSPI with nitrogen;
and C: exposing the RTR double-sided PSPI, exposing the two PSPI layers on the reel-to-reel substrate, and respectively exposing and transferring the two insulating protection pattern layers required by the double-sided flexible circuit board to the corresponding PSPI layers;
step D: developing RTR double-sided PSPI, namely developing the two PSPI layers on the exposed reel-to-reel substrate, and developing the two insulating protection pattern layers;
step E: and (3) RTR double-sided nitrogen baking, namely performing nitrogen baking treatment on the two-sided PSPI layer on the roll-to-roll substrate subjected to developing treatment, and curing and molding the PSPI layer.
2. The roll-type manufacturing method of the double-sided flexible circuit board according to claim 1, characterized in that: in the step A, the pretreatment process is browning treatment or microetching treatment, and the microetching amount is 0.7-1.5 um.
3. The roll-type manufacturing method of the double-sided flexible circuit board according to claim 1, characterized in that: in the step B, the thickness of the coated PSPI layer is 10-25 um; the baking temperature is 75-85 deg.C, and the baking time is 10-20 min.
4. The roll-type manufacturing method of the double-sided flexible circuit board according to claim 1, characterized in that: in the step C, a 21-order exposure ruler is adopted, and the energy level is 8-11 orders; in the step D, the adopted developing solution is Na2CO3 or K2CO3, the developing concentration is 1-1.2%, the developing temperature is 30 +/-2 ℃, and the developing point is 50-60%; in the step E, the baking temperature is 140-.
5. The roll-to-roll manufacturing method of double-sided flexible circuit board according to claim 1, further comprising:
f, performing RTR double-sided sand blasting, and performing sand blasting treatment on two sides of the roll-to-roll substrate obtained in the step E;
step G, RTS cutting and automatic blue loading, wherein the roll-to-roll substrate obtained in the step F is cut into sheet-shaped substrates, and the sheet-shaped substrates are automatically loaded into a metal hanging blue; and
step H, electroless nickel and gold; and G, placing the gold dissolving hanging blue with the flaky substrate into a chemical nickel gold wire for chemical nickel gold treatment.
6. A flexible circuit board manufactured by using the roll-to-roll manufacturing method of the double-sided flexible circuit board according to any one of claims 1 to 5.
7. A flexible circuit board according to claim 6, wherein: the flexible circuit board is an LCM module flexible circuit board or a CCM module flexible circuit board.
8. The flexible circuit board of claim 6, comprising: the circuit comprises a PI substrate layer, two circuit layers and two PSIP layers, wherein the two circuit layers are arranged on two sides of the PI substrate layer respectively, the two PSIP layers are coated on the two circuit layers respectively, and the circuit layers are manufactured by a line subtractive method or an additive method.
9. A flexible circuit board according to claim 8, wherein: the thickness of the PI base material layer is 10-25 mu m; the thickness of the circuit layer is 8-25 μm; the thickness of the PSIP layer is 10-25 mu m.
10. A flexible circuit board according to claim 9, wherein: the thickness of the PI base material layer is 12 +/-2 mu m or 20 +/-2 mu m; the thickness of the circuit layer is 9 +/-2 mu m; the thickness of the PSIP layer is 12 +/-2 mu m or 18 +/-3 mu m.
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| CN110662358A (en) * | 2018-06-29 | 2020-01-07 | 日铁化学材料株式会社 | Method for manufacturing metal-clad laminate, method for manufacturing coated pressure roller, and method for repairing metal-clad laminate |
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