CN112735968A - 新型集成电路失效分析检测方法 - Google Patents
新型集成电路失效分析检测方法 Download PDFInfo
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- CN112735968A CN112735968A CN202110353143.0A CN202110353143A CN112735968A CN 112735968 A CN112735968 A CN 112735968A CN 202110353143 A CN202110353143 A CN 202110353143A CN 112735968 A CN112735968 A CN 112735968A
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- 238000004458 analytical method Methods 0.000 title claims abstract description 21
- 238000001514 detection method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 74
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- 238000000034 method Methods 0.000 claims description 27
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- 238000004806 packaging method and process Methods 0.000 claims 2
- 238000007789 sealing Methods 0.000 abstract description 7
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- 238000005498 polishing Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
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- 238000001723 curing Methods 0.000 description 4
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- 238000011109 contamination Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
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- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000001892 vitamin D2 Nutrition 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2898—Sample preparation, e.g. removing encapsulation, etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2866—Grinding or homogeneising
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110353143.0A CN112735968B (zh) | 2021-04-01 | 2021-04-01 | 集成电路失效分析检测方法 |
Applications Claiming Priority (1)
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CN202110353143.0A CN112735968B (zh) | 2021-04-01 | 2021-04-01 | 集成电路失效分析检测方法 |
Publications (2)
Publication Number | Publication Date |
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CN112735968A true CN112735968A (zh) | 2021-04-30 |
CN112735968B CN112735968B (zh) | 2021-10-01 |
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CN202110353143.0A Active CN112735968B (zh) | 2021-04-01 | 2021-04-01 | 集成电路失效分析检测方法 |
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CN (1) | CN112735968B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116338443A (zh) * | 2023-05-31 | 2023-06-27 | 上海聚跃检测技术有限公司 | 一种sot芯片的热点定位方法及其制样方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6395580B1 (en) * | 1999-11-29 | 2002-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Backside failure analysis for BGA package |
CN101211073A (zh) * | 2006-12-28 | 2008-07-02 | 中华映管股份有限公司 | 基板电路接合结构与其检测方法 |
CN105206546A (zh) * | 2015-09-10 | 2015-12-30 | 宜特(上海)检测技术有限公司 | 覆晶芯片失效分析方法及电性定位中检测样品的制备方法 |
CN112526315A (zh) * | 2020-11-05 | 2021-03-19 | 长江存储科技有限责任公司 | 一种封装芯片的测试方法 |
-
2021
- 2021-04-01 CN CN202110353143.0A patent/CN112735968B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6395580B1 (en) * | 1999-11-29 | 2002-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Backside failure analysis for BGA package |
CN101211073A (zh) * | 2006-12-28 | 2008-07-02 | 中华映管股份有限公司 | 基板电路接合结构与其检测方法 |
CN105206546A (zh) * | 2015-09-10 | 2015-12-30 | 宜特(上海)检测技术有限公司 | 覆晶芯片失效分析方法及电性定位中检测样品的制备方法 |
CN112526315A (zh) * | 2020-11-05 | 2021-03-19 | 长江存储科技有限责任公司 | 一种封装芯片的测试方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116338443A (zh) * | 2023-05-31 | 2023-06-27 | 上海聚跃检测技术有限公司 | 一种sot芯片的热点定位方法及其制样方法 |
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CN112735968B (zh) | 2021-10-01 |
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Address after: 215101 No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee after: Riyuexin semiconductor (Suzhou) Co.,Ltd. Address before: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee before: SUZHOU ASEN SEMICONDUCTORS Co.,Ltd. |
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Effective date of registration: 20221130 Address after: 215,101 Second Floor, Building 10, No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone, Suzhou, Jiangsu Province Patentee after: Riyue New Testing Technology (Suzhou) Co.,Ltd. Address before: 215101 No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: Riyuexin semiconductor (Suzhou) Co.,Ltd. |
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