CN112733989A - 一种基于MXene墨水印制的柔性RFID无源测温标签 - Google Patents
一种基于MXene墨水印制的柔性RFID无源测温标签 Download PDFInfo
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- CN112733989A CN112733989A CN202011560011.7A CN202011560011A CN112733989A CN 112733989 A CN112733989 A CN 112733989A CN 202011560011 A CN202011560011 A CN 202011560011A CN 112733989 A CN112733989 A CN 112733989A
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Abstract
本发明公开了一种基于MXene墨水印制的柔性RFID无源测温标签。在室温下,RFID天线通过挤出打印技术直接在不同的柔性基底上采用MXene墨水印制而成,RFID测温芯片直接与RFID天线(1)通过使用MXene墨水作为粘结剂相连接,无需额外的导电银浆等金属墨水材料或粘结剂粘接。本发明的MXene墨水具有与传统金属墨水相当的高导电性和机械性能等物理化学特性;基于MXene墨水印制的RFID天线相比于传统金属墨水印制的天线,其在印刷后无需高温后处理,对柔性基底的选择没有限制,没有重金属污染回收的问题;基于MXene墨水制备的RFID无源测温标签在完成封装后具媲美传统工艺制造的金属标签的寿命,这项技术有助于促进RFID无源测温标签向批量化和集约化生产的方向发展。
Description
技术领域
本发明涉及射频识别通信技术领域的一种测温标签,尤其涉及一种基于MXene墨水印制的柔性RFID无源测温标签。
背景技术
RFID(Radio Frequency Identification,无线射频识别技术)是一种非接触式的数据自动采集识别技术,它是基于电感耦合或电磁波方式传递信号,以完成对目标对象的自动识别和定位。RFID标签最大的特点是信息采集速度快,不需要机械或光学接触,完全通过无线通信技术完成,且信息采集准确率高。同时,如果将环境温度传感器技术与现有RFID无源技术相融合,即能制备出RFID无源温度标签,允许在没有电池的条件下远距离地对环境温度进行实时无源无线感知,并将数据传输到阅读器进行记录,这能够满足多种领域的测温需求,在冷链加工、食品保存、农作物生产等场景下均具有极大的应用潜力。
传统的RFID电子标签常采用刻蚀法、电镀法、铜线绕制法、直接印刷法等技术手段制备。其中,直接印刷法被认为是降低标签制备成本的根本途径。目前,金属导电墨水以其较好的电导率和机械性能成为印刷RFID天线中最常用的导电墨水。但其缺点也十分突出,以银纳米导电墨水为例,虽然其导电性能优异,但其价格也往往偏高。相比之下,虽然铜和铝的导电墨水在价格上会有一定优势,但它们在空气中易被氧化形成不导电的氧化物。另外。这些金属导电墨水往往在印刷后需要极高的固化温度(通常大于150℃),这会限制柔性基底材料的选择,且其生产时通常需要消耗极大的能源,并容易对环境造成不利的重金属污染。
而基于新型二维材料的导电墨水被认为是金属导电墨水的一种极具潜力的替代品,其中,MXene材料因其具有的金属般的高电导率、大的比表面积和杰出的机械性能成为近几年来最具吸引力和前景的替代材料之一。MXene是一种新型的层状二维晶体材料,其化学式为Mn+1Xn(n=1、2、3),M为元素周期表中第3副族至第7副族中的所有过渡金属元素,包括镧系和锕系元素,(例如Ti、Nb、Ta、Cr、V、Zn、Y、Lu、Hf、Zr、Mo、Sc、W),X为单独的碳、氮元素或碳氮两种元素。MXene的母相材料是一类的三元层状化合物(化学式为Mn+1AXn,A为主族元素,以Al和Si为最常见)。由母相材料MAX相制备而来的MXene材料具有独特的二维层状形貌、表面化学的可调性以及化学组成形式的多样性等特性,这也使MXene二维材料具有优异的金属导电性、机械性能以及功能可调性,可以通过表面官能团的改变及其化学组分的调节来获得满足不同性质需求的特性。
从母相材料MAX相剥离制备的无添加高浓度MXene导电墨水在直接打印后无需高温处理即可展现出极高的电导率(~7000S/cm)和良好的机械性能。高浓度的MXene导电墨水可以在室温条件下,采用直接挤出打印的方式,在多种柔性基底上制备定制的RFID天线,以满足不同应用场景的需求。且直接挤出打印这种印刷方式效率高、生产时间短、生产产品稳定性高。在经封装之后,这些MXene墨水印刷的RFID无源测温标签具有媲美传统金属标签的使用寿命。
发明内容
为了解决背景技术中存在的问题和不足,本发明的目的在于克服现有RFID天线直接印刷技术中使用金属导电墨水时需要的高温处理以及降低材料成本等问题,利用新型二维纳米材料MXene高导电的无添加墨水,将其用于印刷制备新型RFID无源测温标签。
本发明的技术方案是:
本发明包括RFID天线、RFID测温芯片和柔性基底,在常温下,RFID天线通过挤出打印技术直接在不同的柔性基底上采用MXene墨水印制而成,RFID天线的尺寸根据应用场景调整设计;RFID测温芯片直接与RFID天线通过使用MXene墨水作为粘结剂相连接,无需额外的导电银浆等金属墨水材料或粘结剂粘接。
所述的柔性基底是聚合物柔性基底或者常见柔性基底。
所述的聚合物柔性基底是聚二甲基硅氧烷(PDMS)、聚酰亚胺(PI)、聚对苯二甲酸乙二醇酯(PET)、聚乙酸醇(PVA)、聚乳酸(PLA)中的一种或几种。
所述的常见柔性基底是纸、织物和玻璃片中的一种或几种。
所述的RFID测温芯片自带温度传感器。
所述的MXene墨水是一种高浓度,高导电,无添加的墨水,由母相材料MAX相,例如Ti3AlC2、Ti2AlC、Hf3AlC2、Ta3AlC2、Ta2AlC、Zr3AlC5、V2AlC等刻蚀,得到的MXene材料例如Ti3C2、Ti2C、Hf3C2、Ta3C2、Ta2C、Zr3C5、V2C等,得到的MXene材料即二维过渡金属碳化物或碳氮化物,是一种类石墨烯的新型层状二维晶体材料,化学式为Mn+1Xn,其中n=1、2、3。
所述的母相材料MAX相是一类化学式为Mn+1AXn的三元层状化合物,其中n=1、2、3,M为元素周期表中第3副族至第7副族中的所有过渡金属元素,包括镧系和锕系元素,A为主族元素,最常见的为Al,Si元素,X为碳、氮元素中的至少一种。
本发明中所制备的MXene墨水以Ti3C2Tx(Tx=O,OH,F)为例,通过使用氟化锂(LiF)和盐酸(HCl)对其母相Ti3AlC2进行温和刻蚀剥离制备而来。
MXene墨水的制备过程具体如下:
S1:将1g LiF粉末加入到20mL,浓度为9M的HCl溶液中,加入磁性转子进行搅拌,在常温和搅拌速率为500rpm下,将溶液搅拌至澄清,得到混合刻蚀剂;
S2:采取少量多次加入的方式,取1g过筛后的Ti3AlC2粉体(>400目)缓慢加入到S1中的混合刻蚀剂中;加入完成后,封闭混合刻蚀剂,并放置于恒温磁力搅拌装置中,在35℃和200rpm的搅拌速率下刻蚀反应24小时,得到刻蚀后的溶液;
S3:刻蚀完成之后,将刻蚀后的溶液转移到塑料离心管中,在3500rpm的转速下离心3分钟;离心后,去除上清液,留取沉淀物,沉淀物中既有Ti3C2Tx片又有没剥离开的母相材料,向沉淀物中加入去离子水,充分震荡,使得沉淀物重新悬浮,重复离心操作,直至上清液pH达到6;
S4:S3完成之后,将上清液倒出,向沉淀物中加入去离子水,充分摇匀20分钟,使沉淀物中的Ti3C2Tx片脱层;然后再在3500rpm的转速下离心30分钟,然后收集离心后的上清液,即得到MXene纳米片溶液;
S5:将S4中的MXene纳米片溶液再离心,并将含有小片径MXene纳米片或杂质的上清液倒出,最后向沉淀物中加入去离子水,即可获得浓度约为60mg/ml的MXene无添加水性高导电墨水。
利用上述方法得到的浓度约为60mg/ml的MXene墨水在选定的柔性基底上通过挤出打印的方式进行RFID天线的印制,在常温下干燥后,即可得到所需的定制RFID天线;在完成RFID天线的印制后,使用浓度约为60mg/ml的MXene墨水作为粘结剂即可将RFID测温芯片与RFID天线相连,最终完成RFID无源测温标签的制备,整个过程无需额外的金属墨水材料或粘结剂。且上述方法的操作较为简便易控,而且成本较低,制备的MXene纳米片可在液相中稳定分散,其表面带有羟基,氧基等官能团。
制备后的RFID无源测温标签与阅读器进行无线通讯,实时反映环境中的温度变化情况。在柔性基底上制备的RFID无源测温标签可紧密贴合在被测物表面,再通过阅读器实时采集RFID无源测温标签反馈的温度数据,即可完成对被测物所处环境的实时无线无源温度感知。
在本发明中制备了高浓度的二维材料MXene导电墨水,通过室温直接挤出打印的方式在多种柔性柔性基底上一步印刷制备高性能的折叠偶极子天线,并结合现有的RFID测温芯片,开发了柔性RFID无源测温标签,能够满足多种场景下的无源无线测温需求。此项基于MXene墨水打印偶极子天线的研究,将为RFID标签的制备和发展开辟新的道路,具有极大的应用潜力。
基于MXene纳米材料印制的RFID天线无需高温后处理过程,可在多种柔性柔性基底上制备,在封装之后具有可媲美传统金属天线的使用寿命。另外,该RFID无源测温标签的制备过程更简单、印刷技术的批量化生产潜力有助于进一步地降低RFID无源测温标签的生产成本低廉,且可以在天线设计完成后快速地进行打印制备。
本发明的有益效果:
1)高浓度的MXene导电墨水具有与传统金属墨水相当物理化学特性,如高导电性和机械性能等,因此非常适合于RFID天线的直接印刷;
2)基于MXene导电墨水印制的RFID天线相比于传统金属墨水印制的天线,其在印刷后无需高温后处理,对柔性基底的选择没有限制,没有重金属污染回收的问题;
3)基于MXene导电墨水制备的RFID无源测温标签在完成封装后具媲美传统工艺制造的金属标签的寿命,这项技术可以促进RFID无源测温标签向批量化和集约化的生产方向发展。
附图说明
图1是本发明中基于高浓度MXene无添加导电墨水制备的RFID无源测温标签的一种示意图;
图2是本发明中基于高浓度MXene无添加导电墨水制备的RFID无源测温标签的另一种示意图;
图3是本发明中从MAX相剥离而来的MXene纳米片的扫描电镜图;
图4是是本发明中基于高浓度MXene无添加导电墨水制备的RFID无源测温标签对环境中温度变化的响应曲线。
图中,1RFID天线、2RFID测温芯片、3柔性基底。
具体实施方式
为使本发明的上述目的、特征和优势能够更加明显易懂,下面将结合附图对本发明的具体实施方式展开详细的说明。在以下描述中阐明了很多具体细节以便于充分理解本发明。但是本发明的实施方式并不局限于在此描述的情况,而是能够根据具体应用场景进行设计调整,并以其他类似于此处描述的方式进行实施和改进,故本发明不受限于以下公开的具体实例的限制。
如图1和图2所示,本发明包括RFID天线1、RFID测温芯片2和柔性基底3,在常温下,RFID天线1通过挤出打印技术直接在不同的柔性基底3上采用MXene墨水印制而成,RFID天线1的尺寸根据应用场景调整设计;RFID测温芯片2直接与RFID天线1通过使用MXene墨水作为粘结剂相连接,无需额外的导电银浆等金属墨水材料或粘结剂粘接。具体实施的MXene墨水是一种高导电、无添加、高浓度的墨水,RFID测温芯片2自带温度传感器。
柔性基底3可以是聚二甲基硅氧烷(PDMS)、聚酰亚胺(PI)、聚对苯二甲酸乙二醇酯(PET)、聚乙酸醇(PVA)、聚乳酸(PLA)等聚合物柔性基底中的一种或几种,也可以是纸、织物和玻璃片等常见柔性基底中的一种或几种。
MXene墨水由母相材料MAX相,例如Ti3AlC2、Ti2AlC、Hf3AlC2、Ta3AlC2、Ta2AlC、Zr3AlC5、V2AlC等刻蚀,得到的MXene材料例如Ti3C2、Ti2C、Hf3C2、Ta3C2、Ta2C、Zr3C5、V2C等,即二维过渡金属碳化物或碳氮化物,是一种类石墨烯的新型层状二维晶体材料,化学式为Mn+ 1Xn,其中n=1、2、3。
母相材料MAX相是一类化学式为Mn+1AXn的三元层状化合物,其中n=1、2、3,M为元素周期表中第3副族至第7副族中的所有过渡金属元素,包括镧系和锕系元素,A为主族元素,最常见的为Al,Si元素,X为碳、氮元素中的至少一种。
如图3是从MAX相剥离而来的MXene纳米片的扫描电镜图,从图中可以看出所制备的MXene(Ti3C2Tx型)纳米片具有规整的二维纳米片形貌和较大的片径(大于500nm)。具体实施的MXene墨水由其母相MAX刻蚀剥离制备,在RFID天线印制前,将MXene墨水装入打印机针筒中,通过预设程序,打印机可以通过挤出打印的方式印制所需的RFID天线,该打印过程在室温下进行即可,无需高温等后处理工序。通过高浓度MXene墨水的粘性,RFID测温芯片可与印制的RFID天线牢固连接,无需额外的导电粘结剂。整个RFID无源测温标签没有额外的金属成分,加工工艺简单,利于降低成本和批量化制造。
本发明中所制备的MXene墨水以Ti3C2Tx(Tx=O,OH,F)为例,通过使用氟化锂LiF和盐酸HCl对其母相Ti3AlC2进行温和刻蚀剥离制备而来。
MXene墨水的制备过程具体如下:
S1:将1g LiF粉末加入到20mL,浓度为9M的HCl溶液中,加入磁性转子进行搅拌,在常温和搅拌速率为500rpm下,将溶液搅拌至澄清,得到混合刻蚀剂;
S2:采取少量多次加入的方式,取1g过筛后的Ti3AlC2粉体(>400目)缓慢加入到S1中的混合刻蚀剂中;加入完成后,封闭混合刻蚀剂,并放置于恒温磁力搅拌装置中,在35℃和200rpm的搅拌速率下刻蚀反应24小时,得到刻蚀后的溶液;
S3:刻蚀完成之后,将刻蚀后的溶液转移到塑料离心管中,在3500rpm的转速下离心3分钟;离心后,去除上清液,留取沉淀物,沉淀物中既有Ti3C2Tx片又有没剥离开的母相材料,向沉淀物中加入去离子水,充分震荡,使得沉淀物重新悬浮,重复离心操作,直至上清液pH达到6;
S4:S3完成之后,将上清液倒出,向沉淀物中加入去离子水,充分摇匀20分钟,使沉淀物中的Ti3C2Tx片脱层;然后再在3500rpm的转速下离心30分钟,然后收集离心后的上清液,即得到MXene纳米片溶液;
S5:将S4中的MXene纳米片溶液再离心,并将含有小片径MXene纳米片或杂质的上清液倒出,最后向沉淀物中加入去离子水,即可获得浓度约为60mg/ml的MXene无添加水性高导电墨水。
利用上述方法得到的浓度约为60mg/ml的MXene墨水在选定的柔性基底上通过挤出打印的方式进行RFID天线的印制,在常温下干燥后,即可得到所需的定制RFID天线;在完成RFID天线的印制后,使用浓度约为60mg/ml的MXene墨水作为粘结剂即可将RFID测温芯片与RFID天线相连,最终完成RFID无源测温标签的制备,整个过程无需额外的金属墨水材料或粘结剂。且上述方法的操作较为简便易控,而且成本较低,制备的MXene纳米片可在液相中稳定分散,其表面带有羟基,氧基等官能团。
制备后的RFID无源测温标签与阅读器进行无线通讯,实时反映环境中的温度变化情况。在柔性基底上制备的RFID无源测温标签可紧密贴合在被测物表面,再通过阅读器实时采集RFID无源测温标签反馈的温度数据,即可完成对被测物所处环境的实时无线无源温度感知。
对测温标签进一步进行结构设计优化,RFID折叠偶极子天线的设计有助于减少天线的尺寸,适合应用于一些对天线尺寸有要求的场景。通过挤出打印的方式,RFID天线的形状设计可以根据应用场景快速更新,如图2和图3所示的两种设计,以满足不同的尺寸需求,RFID天线尺寸设计的更改不会影响RFID无源测温标签的工作效率。
RFID无源测温标签的一种具体应用实施:
以采用PDMS柔性基底制备的RFID无源标签为例,该标签可以紧密贴合于被测物表面,如人体皮肤表面和植物叶片表面。
以对植物生长微环境的监测为例,将两个RFID无源测温标签分别贴于一棵植物的上部叶片和下部叶片(标签二和标签一),监测植株生长过程中温度微环境的变化。利用热吹风机模拟自然环境中的热风,向上部分叶片施加电吹风的热风,由此导致的温度微环境变化可由贴于植物上部叶片的RFID无源测温标签(标签二)精确感知,与未受影响的贴于下部叶片的RFID无源测温标签(标签一)所收集的温度值进行对比,可以精确地反映出植物生长温度微环境的变化,实验结果如图4所示。
本实施例中与RFID无源测温标签进行无线通讯的阅读器可以是920MHz超高频测温读写器,数据读取量大,抗干扰能力更强。
RFID无源测温标签的另一种具体应用实施:
RFID无源测温标签具有至少3m的工作距离,可以远距离精确监测待测物表面温度情况。以采用PDMS柔性基底制备的RFID无源标签为例,该标签可以紧密贴合于被测人员的额头,感知被测人员的体温变化。由于RFID无源测温标签不需要电池即可工作,自身体积小,重量轻,因此佩戴较为舒适,且数据采集准确,适合大批量监测人员体温,在当年防疫的背景下应用潜力巨大。本实施例中与RFID无源测温标签进行无线通讯的阅读器可以是920MHz超高频测温读写器,数据读取量大,抗干扰能力更强。
以上公开的本发明专利优选实施例只是用于帮助阐述本发明专利。优选实施例并没有详尽叙述所有的细节,也不限制该发明专利仅为所述的具体实施方式。显然,根据本说明书的内容,可作很多的修改和变化。本说明书选取并具体描述这些实施例,是为了更好地解释本发明专利的原理和实际应用,从而使所属技术领域技术人员能很好地理解和利用本发明专利。本发明专利仅受权利要求书及其全部范围和等效物的限制。
Claims (7)
1.一种基于MXene墨水印制的柔性RFID无源测温标签,其特征在于:包括RFID天线(1)、RFID测温芯片(2)和柔性基底(3),在常温下,RFID天线(1)通过挤出打印技术直接在不同的柔性基底(3)上采用MXene墨水印制而成,RFID测温芯片(2)直接与RFID天线(1)通过使用MXene墨水作为粘结剂相连接,无需额外的金属墨水材料或粘结剂粘接。
2.根据权利要求1所述的一种基于MXene墨水印制的柔性RFID无源测温标签,其特征在于:所述的柔性基底(3)是聚合物柔性基底或者常见柔性基底。
3.根据权利要求2所述的一种基于MXene墨水印制的柔性RFID无源测温标签,其特征在于:所述的聚合物柔性基底是聚二甲基硅氧烷(PDMS)、聚酰亚胺(PI)、聚对苯二甲酸乙二醇酯(PTE)、聚乙酸醇(PVA)、聚乳酸(PLA)中的一种或几种。
4.根据权利要求2所述的一种基于MXene墨水印制的柔性RFID无源测温标签,其特征在于:所述的常见柔性基底是纸、织物和玻璃片中的一种或几种。
5.根据权利要求1所述的一种基于MXene墨水印制的柔性RFID无源测温标签,其特征在于:所述的RFID测温芯片(2)自带温度传感器。
6.根据权利要求1所述的一种基于MXene墨水印制的柔性RFID无源测温标签,其特征在于:所述的MXene墨水由母相材料MAX相刻蚀,得到的MXene材料即二维过渡金属碳化物或碳氮化物,是一种类石墨烯的新型层状二维晶体材料,化学式为Mn+1Xn,其中n=1、2、3。
7.根据权利要求6所述的一种基于MXene墨水印制的柔性RFID无源测温标签,其特征在于:所述的母相材料MAX相是一类化学式为Mn+1AXn的三元层状化合物,其中n=1、2、3,M为元素周期表中第3副族至第7副族中的所有过渡金属元素,包括镧系和锕系元素,A为主族元素X为碳、氮元素中的至少一种。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113907744A (zh) * | 2021-12-14 | 2022-01-11 | 河北工业大学 | 一种纸基压力传感器及可监测呼吸的穿戴装置 |
WO2022134774A1 (zh) * | 2020-12-25 | 2022-06-30 | 浙江大学 | 一种基于MXene墨水印制的柔性RFID无源测温标签 |
CN115441169A (zh) * | 2022-08-17 | 2022-12-06 | 武汉理工大学 | 一种基于高粘度MXene墨水的丝网印刷柔性RFID标签天线及其制备方法 |
CN115466538A (zh) * | 2022-08-17 | 2022-12-13 | 武汉理工大学 | 一种无添加高粘度MXene墨水及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107220694A (zh) * | 2017-08-05 | 2017-09-29 | 国网辽宁省电力有限公司营口供电公司 | Rfid测温标签以及基于rfid测温标签的电缆标识和测温方法 |
CN108929598A (zh) * | 2018-08-13 | 2018-12-04 | 湖北汽车工业学院 | 一种基于喷墨打印的MXene墨水的制备方法及其在MXene柔性电极中的应用 |
CN109299624A (zh) * | 2018-08-28 | 2019-02-01 | 上海幂方电子科技有限公司 | 一种rfid天线的制备方法 |
CN110401030A (zh) * | 2019-07-08 | 2019-11-01 | 江苏携尔泰智能设备科技有限公司 | 一种喷墨打印式rfid标签天线 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3504288A4 (en) * | 2016-08-25 | 2020-05-06 | Drexel University | ANTENNAS WITH MX-EN FILMS AND COMPOSITES |
CN207895484U (zh) * | 2018-01-29 | 2018-09-21 | 厦门艾欧特科技有限公司 | 一种应用于冷链的温度检测电子标签 |
CN208298231U (zh) * | 2018-06-07 | 2018-12-28 | 上海东鸿印务有限公司 | 一种丝网印刷的rfid织物标签 |
CN112733989B (zh) * | 2020-12-25 | 2023-06-02 | 浙江大学 | 一种基于MXene墨水印制的柔性RFID无源测温标签 |
-
2020
- 2020-12-25 CN CN202011560011.7A patent/CN112733989B/zh active Active
-
2021
- 2021-10-18 WO PCT/CN2021/124489 patent/WO2022134774A1/zh active Application Filing
- 2021-10-18 US US18/560,403 patent/US20240202486A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107220694A (zh) * | 2017-08-05 | 2017-09-29 | 国网辽宁省电力有限公司营口供电公司 | Rfid测温标签以及基于rfid测温标签的电缆标识和测温方法 |
CN108929598A (zh) * | 2018-08-13 | 2018-12-04 | 湖北汽车工业学院 | 一种基于喷墨打印的MXene墨水的制备方法及其在MXene柔性电极中的应用 |
CN109299624A (zh) * | 2018-08-28 | 2019-02-01 | 上海幂方电子科技有限公司 | 一种rfid天线的制备方法 |
CN110401030A (zh) * | 2019-07-08 | 2019-11-01 | 江苏携尔泰智能设备科技有限公司 | 一种喷墨打印式rfid标签天线 |
Non-Patent Citations (4)
Title |
---|
材料委天津院: "都柏林圣三一学院张传芳Nature Commun:无添加计的MXene墨汁用于直接打印微型器", 《"前沿材料"微信公众号》 * |
章璐茜: "新型石墨烯&MXene基导电材料制备及其光电性能研究", 《中国优秀硕士学位论文全文数据库(工程科技I辑)》 * |
能源学人: "Yury Gogotsi新作:2D碳化钛(MXene)新用途——无线通信", 《"能源学人"微信公众号》 * |
颜川等: "纸基柔性RFID标签金属天线制备", 《电子科技》 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022134774A1 (zh) * | 2020-12-25 | 2022-06-30 | 浙江大学 | 一种基于MXene墨水印制的柔性RFID无源测温标签 |
CN113907744A (zh) * | 2021-12-14 | 2022-01-11 | 河北工业大学 | 一种纸基压力传感器及可监测呼吸的穿戴装置 |
CN115441169A (zh) * | 2022-08-17 | 2022-12-06 | 武汉理工大学 | 一种基于高粘度MXene墨水的丝网印刷柔性RFID标签天线及其制备方法 |
CN115466538A (zh) * | 2022-08-17 | 2022-12-13 | 武汉理工大学 | 一种无添加高粘度MXene墨水及其制备方法 |
CN115466538B (zh) * | 2022-08-17 | 2023-09-22 | 武汉理工大学 | 一种无添加高粘度MXene墨水及其制备方法 |
CN115441169B (zh) * | 2022-08-17 | 2024-05-17 | 武汉理工大学 | 一种基于高粘度MXene墨水的丝网印刷柔性RFID标签天线及其制备方法 |
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