CN112719573A - Method for efficiently improving laser etching efficiency of product - Google Patents

Method for efficiently improving laser etching efficiency of product Download PDF

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Publication number
CN112719573A
CN112719573A CN202011430742.XA CN202011430742A CN112719573A CN 112719573 A CN112719573 A CN 112719573A CN 202011430742 A CN202011430742 A CN 202011430742A CN 112719573 A CN112719573 A CN 112719573A
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CN
China
Prior art keywords
laser etching
laser
head
top surface
height
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Pending
Application number
CN202011430742.XA
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Chinese (zh)
Inventor
肖浩
刘斐
周强
付涛
李�杰
于辉洋
张德强
李天龙
周容
刘升涛
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Chengdu Homin Technology Co Ltd
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Chengdu Homin Technology Co Ltd
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Publication date
Application filed by Chengdu Homin Technology Co Ltd filed Critical Chengdu Homin Technology Co Ltd
Priority to CN202011430742.XA priority Critical patent/CN112719573A/en
Publication of CN112719573A publication Critical patent/CN112719573A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment

Abstract

The invention discloses a method for efficiently improving the laser etching efficiency of a product, which comprises the following steps: s1, adjusting the laser carving head (4) to enable the laser carving light-gathering point to be gathered on the top surface of the part top plate (1), measuring the height between the laser carving light-gathering point and the laser carving head (4), and recording the height as h 1; s3, adjusting the laser carving head (4) to enable the laser carving light-gathering point to be gathered on the top surface of the bottom plate (2), measuring the height between the laser carving light-gathering point and the laser carving head (4), and recording the height as h 3; and S4, adding the value of h1 and the value of h3, and dividing the total value by 2 to obtain h2, wherein h2 is the height between the middle point of the distance from the top surface of the top plate (1) to the top surface of the bottom plate (2) and the laser engraving head (4). The invention has the beneficial effects that: improve radium carving efficiency, improve part production efficiency, easy operation.

Description

Method for efficiently improving laser etching efficiency of product
Technical Field
The invention relates to the technical field of laser etching of Z-shaped parts, in particular to a method for efficiently improving the laser etching efficiency of a product.
Background
The structure of the Z-shaped part is shown in figure 1, and comprises a top plate (1), a bottom plate (2) and a connecting plate (3) butted between the top plate (1) and the bottom plate (2), wherein the height h between the top surface of the top plate (1) and the top surface of the bottom plate (2) is 2mm, and laser engraving treatment is required to be carried out on the top surface of the top plate (1) and the top surface of the bottom plate (2) in the process. The existing laser engraving process of Z-shaped parts is to arrange the Z-shaped parts in a carrying disc; placing the carrying disc on a laser etching table of a laser etching machine; an operator moves a laser engraving head of the laser engraving machine to be right above a top plate (1) of the Z-shaped part; adjusting a laser etching head of the laser etching machine to enable a laser etching condensation point to focus on the top surface of the top plate (1); opening the laser engraving machine, and performing laser engraving on the top surface of the top plate (1) by using laser beams emitted by the laser engraving head, so that the laser engraving on the top surface of the top plate (1) is realized; after roof (1) radium carving, operating personnel remove radium carving head behind the bottom plate (2) of Z shape part directly over, and radium carving head can't carry out radium carving to the top surface of bottom plate (2), its leading cause is that radium carving range of radium carving head is for the height in 0~1mm scope above the radium carving focal point, and for the height in 0~1mm scope below the radium carving focal point as shown in figure 2, and because roof (1) top surface apart from bottom plate (2) top surface height h be 2mm, even after removing radium carving head to the top surface of bottom plate (2), also can't carry out radium carving to the top surface of bottom plate (2). In order to realize carrying out radium carving to bottom plate (2), need readjust radium carving head and make its radium carving focus on the top surface of bottom plate (2), open radium carving machine once more, can carry out radium carving to the top surface of bottom plate (2) to finally realize the radium carving to Z shape part. However, this kind of radium carving mode is though the top surface of roof (1) and bottom plate (2) that can radium carving Z shape part, but when carrying out radium carving bottom plate (2), needs the radium carving focal point of radium carving head of second adjustment, and the quantity of the Z shape part of splendid attire on the year dish is very much, when every radium carving a part, all need adjust radium carving focal point of radium carving head, this has reduced radium carving efficiency undoubtedly, and then has reduced the production efficiency of Z shape part.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a method for efficiently improving the laser etching efficiency of a product, which is simple to operate and can improve the laser etching efficiency of parts.
The purpose of the invention is realized by the following technical scheme: a method for efficiently improving the laser etching efficiency of a product comprises the following steps:
s1, respectively placing a Z-shaped part to be laser etched in each accommodating groove of the carrying disc, and placing the carrying disc on the table top of a laser etching table of the laser etching machine;
s2, moving the position of the laser engraving head of the laser engraving machine on the horizontal plane, enabling the laser engraving head to move right above the top plate of any part in the first row of Z-shaped parts, adjusting the laser engraving head to enable the laser engraving light-gathering point to be gathered on the top surface of the top plate of the part, measuring the height between the laser engraving light-gathering point and the laser engraving head, and recording the height as h 1;
s3, moving the laser engraving machine on the horizontal plane to enable the laser engraving head to move right above the bottom plate of the part in the step S2, adjusting the laser engraving head to enable laser engraving light-gathering points to be gathered on the top surface of the bottom plate, measuring the height between the laser engraving light-gathering points and the laser engraving head, and recording the height as h 3;
s4, adding the value of h1 and the value of h3, and dividing the total value by 2 to obtain h2, wherein h2 is the height between the midpoint of the distance from the top surface of the top plate to the top surface of the bottom plate and the laser carving head;
s5, adjusting the position of a laser etching light-focusing point of the laser etching head to enable the height between the laser etching light-focusing point and the laser etching head to be h 3;
s6, moving the laser etching head to a position right above a top plate of a first part of the first row of Z-shaped parts, opening the laser etching machine, and performing laser etching on the top surface of the top plate of the first part by using the laser etching head; after laser etching, moving the laser etching head to be right above the bottom plate of the first part, and performing laser etching on the top surface of the bottom plate by the laser etching head, so that laser etching on the first Z-shaped part is realized;
s7, moving the laser etching head right above the top plate of the second part, repeating S6 to perform laser etching on the second part, repeating S6-S7 for multiple times, and performing laser etching on all parts in the first row of Z-shaped parts.
And repeating the step S7 for multiple times to perform laser etching on all Z-shaped parts on the carrying disc.
In the step S1, the distances between two adjacent accommodating grooves are equal.
The invention has the following advantages: the laser etching method improves laser etching efficiency and part production efficiency, and is simple to operate.
Drawings
FIG. 1 is a schematic structural view of a Z-shaped part;
FIG. 2 is a schematic diagram of a laser etching range of the laser etching head;
FIG. 3 is a schematic illustration of calculation h 2;
in the figure, 1-top plate, 2-bottom plate, 3-connecting plate, 4-laser etching head and 5-laser etching light-gathering point.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 3, a method for efficiently improving laser etching efficiency of a product includes the following steps:
s1, respectively placing a Z-shaped part to be laser etched in each accommodating groove of the carrying disc, and placing the carrying disc on the table top of a laser etching table of the laser etching machine; the distance between two adjacent accommodating grooves is equal;
s2, moving the position of the laser carving head 4 of the laser carving machine on the horizontal plane, enabling the laser carving head 4 to move right above the top plate 1 of any part in the first row of Z-shaped parts, adjusting the laser carving head 4 to enable laser carving light-gathering points of the laser carving head to be gathered on the top surface of the top plate 1 of the part, measuring the height between the laser carving light-gathering points and the laser carving head 4, and recording the height as h 1;
s3, moving the laser engraving machine on the horizontal plane to enable the laser engraving head 4 to move to the position right above the bottom plate 2 of the part in the step S2, adjusting the laser engraving head 4 to enable laser engraving light-gathering points of the laser engraving head 4 to be gathered on the top surface of the bottom plate 2, measuring the height between the laser engraving light-gathering points and the laser engraving head 4, and recording the height as h 3;
s4, adding the value of h1 and the value of h3, and dividing the total value by 2 to obtain h2, wherein h2 is the height between the midpoint of the distance from the top surface of the top plate 1 to the top surface of the bottom plate 2 and the laser carving head 4;
s5, adjusting the position of a laser etching condensation point of the laser etching head 4 to enable the height between the laser etching condensation point and the laser etching head 4 to be h 3;
s6, moving the laser engraving head 4 to a position right above the top plate 1 of the first part of the first row of Z-shaped parts, opening the laser engraving machine, and performing laser engraving on the top surface of the top plate 1 of the first part by using the laser engraving head 4; after laser etching, moving the laser etching head 4 right above the bottom plate 2 of the first part, and performing laser etching on the top surface of the bottom plate 2 by the laser etching head 4, so that laser etching on the first Z-shaped part is realized;
s7, moving the laser etching head 4 right above a top plate of the second part, repeating S6 to perform laser etching on the second part, repeating S6-S7 for multiple times, and performing laser etching on all parts in the first row of Z-shaped parts. And repeating the step S7 for multiple times to perform laser etching on all Z-shaped parts on the carrying disc.
In the steps S5-S6, because the laser etching condensation point of the laser etching head 4 is just at the middle point of the distance from the top surface of the top plate 1 to the top surface of the bottom plate 2, when the laser etching head 4 moves right above the top plate 1, because the laser etching range of the laser etching head 4 is the height which is 0-1 mm above the laser etching condensation point, the laser beam of the laser etching head 4 just performs laser etching on the top surface of the top plate 1; when the laser etching head 4 moves to the bottom plate 2, because the laser etching range of the laser etching head 4 is relative to the height of the laser etching focus within the range of 0-1 mm below the laser etching focus, the laser beam of the laser etching head 4 just performs laser etching on the top surface of the bottom plate 2. Therefore, the laser etching method can be used for carrying out laser etching on all parts on the carrying disc only by adjusting the position of the laser etching light-gathering point once, and compared with the traditional method that the laser etching light-gathering point of the laser etching head 4 needs to be adjusted for the second time, the laser etching efficiency is greatly improved, and further the production efficiency of Z-shaped parts is greatly improved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (3)

1. A method for efficiently improving the laser etching efficiency of a product is characterized by comprising the following steps: it comprises the following steps:
s1, respectively placing a Z-shaped part to be laser etched in each accommodating groove of the carrying disc, and placing the carrying disc on the table top of a laser etching table of the laser etching machine;
s2, moving the position of a laser etching head (4) of the laser etching machine on a horizontal plane, enabling the laser etching head (4) to move right above a top plate (1) of any part in the first row of Z-shaped parts, adjusting the laser etching head (4) to enable laser etching light-focusing points to be converged on the top surface of the top plate (1) of the part, measuring the height between the laser etching light-focusing points and the laser etching head (4), and recording the height as h 1;
s3, moving the laser engraving machine on the horizontal plane to enable the laser engraving head (4) to move to be right above the bottom plate (2) of the part in the step S2, adjusting the laser engraving head (4) to enable laser engraving light-gathering points to be gathered on the top surface of the bottom plate (2), measuring the height between the distance between the laser engraving light-gathering points and the laser engraving head (4), and recording the height as h 3;
s4, adding the value of h1 and the value of h3, and dividing the total value by 2 to obtain h2, wherein h2 is the height between the midpoint of the distance from the top surface of the top plate (1) to the top surface of the bottom plate (2) and the laser engraving head (4);
s5, adjusting the position of a laser etching condensation point of the laser etching head (4) to enable the height between the laser etching condensation point and the laser etching head (4) to be h 3;
s6, moving the laser etching head (4) to a position right above the top plate (1) of the first part of the first row of Z-shaped parts, opening the laser etching machine, and performing laser etching on the top surface of the top plate (1) of the first part by using the laser etching head (4); after laser etching, moving the laser etching head (4) to a position right above the bottom plate (2) of the first part, and performing laser etching on the top surface of the bottom plate (2) by using the laser etching head (4), so that laser etching on the first Z-shaped part is realized;
s7, moving the laser etching head (4) right above a top plate of the second part, repeating S6 to perform laser etching on the second part, repeating S6-S7 for multiple times, and performing laser etching on all parts in the first row of Z-shaped parts.
2. The method for efficiently improving the laser etching efficiency of the product according to claim 1, wherein the method comprises the following steps: and repeating the step S7 for multiple times to perform laser etching on all Z-shaped parts on the carrying disc.
3. The method for efficiently improving the laser etching efficiency of the product according to claim 1, wherein the method comprises the following steps: in the step S1, the distances between two adjacent accommodating grooves are equal.
CN202011430742.XA 2020-12-09 2020-12-09 Method for efficiently improving laser etching efficiency of product Pending CN112719573A (en)

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CN202011430742.XA CN112719573A (en) 2020-12-09 2020-12-09 Method for efficiently improving laser etching efficiency of product

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Application Number Priority Date Filing Date Title
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Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2368228A1 (en) * 1999-04-30 2000-11-09 Visx, Incorporated Method and system for ablating surfaces with partially overlapping craters having consistent curvature
CN101386112A (en) * 2007-09-13 2009-03-18 张立国 Laser cutting method based on inner carving
CN202114396U (en) * 2011-04-27 2012-01-18 华中科技大学 Three-coordinate galvanometer scanning type laser machining head
CN102974936A (en) * 2012-11-02 2013-03-20 中国人民解放军国防科学技术大学 System for laser focus positioning and method for positioning material on laser focus point
CN103350281A (en) * 2013-06-20 2013-10-16 深圳市大族激光科技股份有限公司 Automatic focusing device and automatic focusing method for laser marking machine
CN203390388U (en) * 2013-08-09 2014-01-15 陕西恒通智能机器有限公司 Accurate location device for laser focus
US20150209898A1 (en) * 2012-08-13 2015-07-30 Korea Advanced Institute Of Science And Technology Method and dicing device of processing transparent specimen using ultrafast pulse laser
CN107214418A (en) * 2017-07-14 2017-09-29 中国科学院微电子研究所 A kind of method and device for laser machining wafer
CN207464488U (en) * 2017-11-13 2018-06-08 深圳市正和忠信股份有限公司 Laser engraving machine
CN108326433A (en) * 2017-01-17 2018-07-27 神讯电脑(昆山)有限公司 Radium-shine carrier device
CN109530937A (en) * 2018-12-28 2019-03-29 北京中科镭特电子有限公司 A kind of method and system laser machining wafer
CN109590289A (en) * 2018-12-27 2019-04-09 吴忠仪表有限责任公司 A kind of method of valve non-planar surfaces laser cleaning
CN111360395A (en) * 2020-03-27 2020-07-03 伊诺福科光学技术有限公司 Surface automatic tracking method and system for laser processing and storage medium

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2368228A1 (en) * 1999-04-30 2000-11-09 Visx, Incorporated Method and system for ablating surfaces with partially overlapping craters having consistent curvature
CN101386112A (en) * 2007-09-13 2009-03-18 张立国 Laser cutting method based on inner carving
CN202114396U (en) * 2011-04-27 2012-01-18 华中科技大学 Three-coordinate galvanometer scanning type laser machining head
US20150209898A1 (en) * 2012-08-13 2015-07-30 Korea Advanced Institute Of Science And Technology Method and dicing device of processing transparent specimen using ultrafast pulse laser
CN102974936A (en) * 2012-11-02 2013-03-20 中国人民解放军国防科学技术大学 System for laser focus positioning and method for positioning material on laser focus point
CN103350281A (en) * 2013-06-20 2013-10-16 深圳市大族激光科技股份有限公司 Automatic focusing device and automatic focusing method for laser marking machine
CN203390388U (en) * 2013-08-09 2014-01-15 陕西恒通智能机器有限公司 Accurate location device for laser focus
CN108326433A (en) * 2017-01-17 2018-07-27 神讯电脑(昆山)有限公司 Radium-shine carrier device
CN107214418A (en) * 2017-07-14 2017-09-29 中国科学院微电子研究所 A kind of method and device for laser machining wafer
CN207464488U (en) * 2017-11-13 2018-06-08 深圳市正和忠信股份有限公司 Laser engraving machine
CN109590289A (en) * 2018-12-27 2019-04-09 吴忠仪表有限责任公司 A kind of method of valve non-planar surfaces laser cleaning
CN109530937A (en) * 2018-12-28 2019-03-29 北京中科镭特电子有限公司 A kind of method and system laser machining wafer
CN111360395A (en) * 2020-03-27 2020-07-03 伊诺福科光学技术有限公司 Surface automatic tracking method and system for laser processing and storage medium

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Application publication date: 20210430