CN112703829A - 显示屏、显示装置及电子装置 - Google Patents
显示屏、显示装置及电子装置 Download PDFInfo
- Publication number
- CN112703829A CN112703829A CN201880096058.7A CN201880096058A CN112703829A CN 112703829 A CN112703829 A CN 112703829A CN 201880096058 A CN201880096058 A CN 201880096058A CN 112703829 A CN112703829 A CN 112703829A
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- Prior art keywords
- display screen
- layer
- heat
- heat dissipation
- screen body
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 101
- 230000005855 radiation Effects 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 31
- 239000011248 coating agent Substances 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 24
- 229910021389 graphene Inorganic materials 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 19
- 238000005452 bending Methods 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 13
- 239000002041 carbon nanotube Substances 0.000 claims description 10
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 10
- 239000002238 carbon nanotube film Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000005751 Copper oxide Substances 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- -1 copper nitride Chemical class 0.000 claims description 2
- 229910000431 copper oxide Inorganic materials 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 117
- 239000010408 film Substances 0.000 description 17
- 239000012790 adhesive layer Substances 0.000 description 13
- 229910001338 liquidmetal Inorganic materials 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 230000003139 buffering effect Effects 0.000 description 7
- 239000003292 glue Substances 0.000 description 7
- 230000008093 supporting effect Effects 0.000 description 7
- 239000011247 coating layer Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000006059 cover glass Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种电子装置(100)，其包括壳体(20)及设置于壳体(20)内的若干电子元器件(214)，以及显示装置(30)，显示装置(30)包括显示屏(32)及贴接于显示屏(32)的背面的支撑片(36)，显示屏(30)包括屏体(320)及层叠于屏体(320)的正面的盖板(329)，屏体(320)与盖板(329)之间设置有透明的第一散热层(321)，第一散热层(321)用于将屏体(320)工作时产生的热量转化为红外线经盖板(329)辐射至外部，若干电子元器件(214)产生的热量经显示装置(30)的第一散热层(321)转化为红外线辐射散发。
Description
PCT国内申请，说明书已公开。
Claims (26)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/113993 WO2020093207A1 (zh) | 2018-11-05 | 2018-11-05 | 显示屏、显示装置及电子装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112703829A true CN112703829A (zh) | 2021-04-23 |
Family
ID=70611238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880096058.7A Pending CN112703829A (zh) | 2018-11-05 | 2018-11-05 | 显示屏、显示装置及电子装置 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112703829A (zh) |
| WO (1) | WO2020093207A1 (zh) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150000885A1 (en) * | 2013-06-28 | 2015-01-01 | Hon Hai Precision Industry Co., Ltd. | Enclosure of high heat dispersion capacity and electronic device using same |
| CN106973549A (zh) * | 2017-04-10 | 2017-07-21 | 上海天马微电子有限公司 | 一种柔性显示装置 |
| CN107507518A (zh) * | 2017-09-05 | 2017-12-22 | 武汉华星光电半导体显示技术有限公司 | 柔性显示装置 |
| CN206948792U (zh) * | 2017-04-28 | 2018-01-30 | 昆山国显光电有限公司 | 一种显示装置 |
| CN107787167A (zh) * | 2017-10-18 | 2018-03-09 | 维沃移动通信有限公司 | 一种移动终端 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014109608A1 (ko) * | 2013-01-10 | 2014-07-17 | 엘지전자 주식회사 | 디스플레이 장치 |
| CN104254217A (zh) * | 2013-06-28 | 2014-12-31 | 鸿富锦精密工业（深圳）有限公司 | 外壳件及使用该外壳件的电子装置 |
| CN104883859A (zh) * | 2015-05-29 | 2015-09-02 | 联想(北京)有限公司 | 一种电子设备和壳体 |
| CN106061198A (zh) * | 2016-04-29 | 2016-10-26 | 广东欧珀移动通信有限公司 | 屏组件和移动终端 |
| CN108102576A (zh) * | 2018-02-08 | 2018-06-01 | 衡山县佳诚新材料有限公司 | 用于lcd、oled显示屏的石墨烯泡棉胶带 |
-
2018
- 2018-11-05 WO PCT/CN2018/113993 patent/WO2020093207A1/zh active Application Filing
- 2018-11-05 CN CN201880096058.7A patent/CN112703829A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150000885A1 (en) * | 2013-06-28 | 2015-01-01 | Hon Hai Precision Industry Co., Ltd. | Enclosure of high heat dispersion capacity and electronic device using same |
| CN106973549A (zh) * | 2017-04-10 | 2017-07-21 | 上海天马微电子有限公司 | 一种柔性显示装置 |
| CN206948792U (zh) * | 2017-04-28 | 2018-01-30 | 昆山国显光电有限公司 | 一种显示装置 |
| CN107507518A (zh) * | 2017-09-05 | 2017-12-22 | 武汉华星光电半导体显示技术有限公司 | 柔性显示装置 |
| CN107787167A (zh) * | 2017-10-18 | 2018-03-09 | 维沃移动通信有限公司 | 一种移动终端 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020093207A1 (zh) | 2020-05-14 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210423 |
|
| WD01 | Invention patent application deemed withdrawn after publication |