CN112694840A - 半导体加工用片 - Google Patents
半导体加工用片 Download PDFInfo
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- CN112694840A CN112694840A CN202011446311.2A CN202011446311A CN112694840A CN 112694840 A CN112694840 A CN 112694840A CN 202011446311 A CN202011446311 A CN 202011446311A CN 112694840 A CN112694840 A CN 112694840A
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- adhesive layer
- adhesive
- semiconductor processing
- semiconductor wafer
- semiconductor
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- 238000012545 processing Methods 0.000 title claims abstract description 148
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- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016069603 | 2016-03-30 | ||
| JP2016-069603 | 2016-03-30 | ||
| CN201780020092.1A CN109005665B (zh) | 2016-03-30 | 2017-03-22 | 半导体加工用片 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780020092.1A Division CN109005665B (zh) | 2016-03-30 | 2017-03-22 | 半导体加工用片 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112694840A true CN112694840A (zh) | 2021-04-23 |
Family
ID=59965360
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780020092.1A Active CN109005665B (zh) | 2016-03-30 | 2017-03-22 | 半导体加工用片 |
| CN202011446311.2A Pending CN112694840A (zh) | 2016-03-30 | 2017-03-22 | 半导体加工用片 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780020092.1A Active CN109005665B (zh) | 2016-03-30 | 2017-03-22 | 半导体加工用片 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6883019B2 (ko) |
| KR (1) | KR102313586B1 (ko) |
| CN (2) | CN109005665B (ko) |
| SG (1) | SG11201808291YA (ko) |
| TW (1) | TWI719178B (ko) |
| WO (1) | WO2017170021A1 (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7035347B2 (ja) * | 2017-10-05 | 2022-03-15 | 昭和電工マテリアルズ株式会社 | 半導体加工用テープ |
| JP7067904B2 (ja) * | 2017-11-16 | 2022-05-16 | リンテック株式会社 | 半導体装置の製造方法 |
| JP7174518B2 (ja) * | 2017-11-16 | 2022-11-17 | リンテック株式会社 | 半導体装置の製造方法 |
| KR20210141490A (ko) * | 2019-03-15 | 2021-11-23 | 린텍 가부시키가이샤 | 지지 시트 부착 필름상 소성 재료, 롤체, 적층체, 및 장치의 제조 방법 |
| EP3979300A4 (en) * | 2019-05-24 | 2023-11-29 | Lintec Corporation | FILM-TYPE COOKING MATERIAL WITH BACKING SHEET, ROLLER BODY, MULTI-LAYER BODY AND DEVICE PRODUCTION METHOD |
| WO2022210154A1 (ja) * | 2021-04-01 | 2022-10-06 | 東レ株式会社 | 積層体および半導体装置の製造方法 |
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| WO2008132852A1 (ja) * | 2007-04-19 | 2008-11-06 | Sekisui Chemical Co., Ltd. | ダイシング・ダイボンディングテープ及び半導体チップの製造方法 |
| US20110189835A1 (en) * | 2010-02-01 | 2011-08-04 | Yuki Sugo | Film for manufacturing semiconductor device and method of manufacturing semiconductor device |
| CN102190973A (zh) * | 2010-02-01 | 2011-09-21 | 日东电工株式会社 | 半导体装置制造用薄膜及半导体装置的制造方法 |
| CN102533147A (zh) * | 2010-12-29 | 2012-07-04 | 第一毛织株式会社 | 切割芯片粘合膜、半导体晶片和半导体装置 |
| WO2013103116A1 (ja) * | 2012-01-06 | 2013-07-11 | 古河電気工業株式会社 | ウエハ加工用テープ及びこれを使用した半導体装置の製造方法 |
| US20150225613A1 (en) * | 2012-08-02 | 2015-08-13 | Lintec Corporation | Film-Like Adhesive, Adhesive Sheet for Semiconductor Junction, and Method for Producing Semiconductor Device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4805549B2 (ja) * | 2004-03-29 | 2011-11-02 | リンテック株式会社 | 粘着シート |
| JP2010171402A (ja) * | 2008-12-24 | 2010-08-05 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム |
| KR101353331B1 (ko) * | 2009-03-03 | 2014-01-17 | 히다치 막셀 가부시키가이샤 | 방사선 경화성 점착제 조성물, 그것을 사용한 다이싱용 점착 필름 및 절단편의 제조방법 |
| JP5513866B2 (ja) * | 2009-12-11 | 2014-06-04 | リンテック株式会社 | 電子部品加工用粘着シート |
| TWI509043B (zh) * | 2010-09-09 | 2015-11-21 | Hitachi Chemical Co Ltd | Adhesive composition, method for manufacturing connection of circuit member and semiconductor device |
| WO2014157329A1 (ja) * | 2013-03-27 | 2014-10-02 | リンテック株式会社 | 半導体チップの製造方法 |
| JP6033734B2 (ja) * | 2013-04-30 | 2016-11-30 | 日東電工株式会社 | フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法 |
| JP5778721B2 (ja) * | 2013-07-19 | 2015-09-16 | 日東電工株式会社 | 熱剥離型粘着テープ及び電子部品の切断方法 |
| JPWO2015064574A1 (ja) * | 2013-10-30 | 2017-03-09 | リンテック株式会社 | 半導体接合用接着シートおよび半導体装置の製造方法 |
| JP5828881B2 (ja) * | 2013-12-24 | 2015-12-09 | 日東電工株式会社 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
| KR101722137B1 (ko) * | 2014-01-03 | 2017-03-31 | 주식회사 엘지화학 | 다이싱 필름 및 다이싱 다이본딩 필름 |
| JP6306362B2 (ja) * | 2014-02-13 | 2018-04-04 | リンテック株式会社 | 伸長可能シートおよび積層チップの製造方法 |
| JP5697061B1 (ja) * | 2014-03-24 | 2015-04-08 | 古河電気工業株式会社 | 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法 |
| JP6522617B2 (ja) * | 2014-07-31 | 2019-05-29 | リンテック株式会社 | ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法 |
| JP6390034B2 (ja) * | 2014-08-01 | 2018-09-19 | リンテック株式会社 | 粘着シート |
-
2017
- 2017-03-22 CN CN201780020092.1A patent/CN109005665B/zh active Active
- 2017-03-22 WO PCT/JP2017/011377 patent/WO2017170021A1/ja active Application Filing
- 2017-03-22 CN CN202011446311.2A patent/CN112694840A/zh active Pending
- 2017-03-22 SG SG11201808291YA patent/SG11201808291YA/en unknown
- 2017-03-22 KR KR1020187026994A patent/KR102313586B1/ko active IP Right Grant
- 2017-03-22 JP JP2018509116A patent/JP6883019B2/ja active Active
- 2017-03-27 TW TW106110145A patent/TWI719178B/zh active
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| WO2008132852A1 (ja) * | 2007-04-19 | 2008-11-06 | Sekisui Chemical Co., Ltd. | ダイシング・ダイボンディングテープ及び半導体チップの製造方法 |
| US20110189835A1 (en) * | 2010-02-01 | 2011-08-04 | Yuki Sugo | Film for manufacturing semiconductor device and method of manufacturing semiconductor device |
| CN102190973A (zh) * | 2010-02-01 | 2011-09-21 | 日东电工株式会社 | 半导体装置制造用薄膜及半导体装置的制造方法 |
| CN102533147A (zh) * | 2010-12-29 | 2012-07-04 | 第一毛织株式会社 | 切割芯片粘合膜、半导体晶片和半导体装置 |
| WO2013103116A1 (ja) * | 2012-01-06 | 2013-07-11 | 古河電気工業株式会社 | ウエハ加工用テープ及びこれを使用した半導体装置の製造方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6883019B2 (ja) | 2021-06-02 |
| JPWO2017170021A1 (ja) | 2019-02-14 |
| TW201802903A (zh) | 2018-01-16 |
| SG11201808291YA (en) | 2018-10-30 |
| WO2017170021A1 (ja) | 2017-10-05 |
| KR20180127984A (ko) | 2018-11-30 |
| CN109005665A (zh) | 2018-12-14 |
| KR102313586B1 (ko) | 2021-10-15 |
| CN109005665B (zh) | 2020-12-25 |
| TWI719178B (zh) | 2021-02-21 |
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