CN112672560A - Temperature control device - Google Patents
Temperature control device Download PDFInfo
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- CN112672560A CN112672560A CN202011508567.1A CN202011508567A CN112672560A CN 112672560 A CN112672560 A CN 112672560A CN 202011508567 A CN202011508567 A CN 202011508567A CN 112672560 A CN112672560 A CN 112672560A
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- temperature control
- temperature
- control device
- main board
- fixing piece
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Abstract
The application discloses a temperature control device, wherein a bottom plate of the temperature control device is sequentially provided with a shielding shell, a temperature control layer and a temperature control mainboard from bottom to top through a first fixing piece; an annular nonmetallic temperature-control heat-insulation pad sleeved outside the first fixing piece is arranged below the temperature-control main board; a second fixing piece for fixing a temperature-controlled body is arranged on the temperature control main board, and the temperature control layer is a non-metal layer; the method effectively controls the heat transfer speed to the base plate, and ensures that the temperature-controlled body of the rubidium clock normally works within an effective temperature range, so that the performance index of the rubidium clock overall machine can meet the overall requirement under the condition that the temperature keeps a steady state.
Description
Technical Field
The application relates to the technical field of temperature control, in particular to a temperature control device.
Background
The temperature control structure device is an important component of a rubidium clock, and selection of various structural materials below a temperature-controlled body becomes a key point. The temperature control structure device in the prior art mostly has the problem that heat is difficult to be effectively utilized in the heating process, the normal work in an effective temperature range cannot be guaranteed, and the problem that whether the performance index of a rubidium clock complete machine can meet the overall requirement under the condition that the temperature keeps a steady state or not cannot be guaranteed.
Disclosure of Invention
The application provides a temperature regulating device, aims at solving the heating process that prior art's temperature regulating structure device exists, and the heat is difficult to by the problem of efficient utilization, and it can't guarantee normally work in effectual temperature range, can't guarantee that the performance index of rubidium clock complete machine can accord with the problem of overall requirement under the temperature keeps the steady state condition.
The invention provides a temperature control device, which comprises a bottom plate, wherein a shielding shell, a temperature control layer and a temperature control mainboard are sequentially arranged on the bottom plate from bottom to top through a first fixing piece; an annular nonmetallic temperature-control heat-insulation pad sleeved outside the first fixing piece is arranged below the temperature-control main board; the temperature control main board is provided with a second fixing part for fixing a controlled temperature body, and the temperature control layer is a non-metal layer.
According to the temperature control device, the temperature control layer made of the non-metal material is added between the shielding shell and the temperature control main board, and the temperature control heat insulation pad made of the non-metal material is placed between the temperature control main board and the first fixing piece connected with the bottom board, so that the speed of heat transfer to the bottom board is effectively controlled.
The temperature control device can achieve the following beneficial effects:
the utility model provides a temperature control device, in its heating process to prior art's temperature control structure device existence, the heat is difficult to the problem of effectively utilized, it can't guarantee normally to work in effectual temperature range, can't guarantee that the performance index of rubidium clock complete machine can accord with the problem of overall requirement under the temperature steady state circumstances, through the accuse temperature layer that adds non-metallic material between shielding shell and accuse temperature mainboard, put into non-metallic material's accuse temperature heat insulating mattress simultaneously between the first mounting that accuse temperature mainboard and bottom plate are connected, the effectual speed of heat to the bottom plate transmission of control, guarantee that it can accord with the overall requirement by the accuse temperature body in effectual temperature range, thereby guarantee that the performance index of rubidium clock complete machine can accord with the overall requirement under the circumstances that the temperature keeps the steady state.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic structural diagram of a temperature control device according to the present application.
FIG. 2 is a front view of a base plate of the temperature control device of the present application.
FIG. 3 is a right side view of a base plate of the temperature control device of the present application.
FIG. 4 is a front view of a shielded enclosure of a temperature control device of the present application.
FIG. 5 is a front view of a temperature control layer of the temperature control device of the present application.
Fig. 6 is a front view of the temperature control main board of the temperature control device of the present application.
FIG. 7 is a front view of a temperature controlled insulating mat of the temperature control device of the present application.
FIG. 8 is a front view of a first fixture of the temperature control device of the present application.
FIG. 9 is a right side view of a first fixture of the temperature control device of the present application.
Fig. 10 is a front view of a temperature-controlled body of the temperature control device of the present application.
FIG. 11 is a right side view of a temperature controlled body of the temperature control device of the present application.
FIG. 12 is a front view of a second fixture of the temperature control device of the present application.
FIG. 13 is a right side view of a second fixture of the temperature control device of the present application.
In the figure, 1 is a bottom plate, 2 is a shielding shell, 3 is a temperature control layer, 4 is a temperature control main plate, 5 is a temperature control heat insulation pad, 6 is a first fixing piece, 7 is a temperature controlled body, and 8 is a second fixing piece.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Example 1
A temperature control device, as shown in figure 1, comprises a bottom plate 1, as shown in figures 2 and 3, wherein a shielding shell 2, a temperature control layer 3 and a temperature control main plate 4 are sequentially arranged on the bottom plate 1 from bottom to top through a first fixing piece 6; referring to fig. 6 to 9, an annular non-metal temperature-control heat-insulation pad 5 sleeved outside the first fixing member 6 is arranged below the temperature-control main board 4; referring to fig. 10 to 13, the temperature control main board 4 is provided with a second fixing member 8 for fixing the temperature controlled body 7, and referring to fig. 4 and 5, the temperature control layer 3 is a non-metal layer.
The temperature control device of the embodiment can achieve a good temperature control effect within a temperature range by adjusting relevant electrical performance parameters of the whole set of components.
Example 2
The utility model provides a temperature control device, is similar with embodiment 1, and the difference is that first mounting 6 is countersunk screw, is provided with on the accuse temperature mainboard 4 to be located the counter sink of first screw top, the diameter of counter sink is greater than the diameter of first screw, and the screwhead of first mounting 6 is located in the counter sink, accuse temperature heat insulating mattress 5 sets up in the counter sink.
Further, the material of the bottom plate 1 is 2A 12. The material of the shielding shell 2 is 1J 85. The temperature control layer 3 is made of polytetrafluoroethylene. The main material of the temperature control main board 4 is 2A 12. The material of the temperature-control heat-insulation pad 5 is an epoxy laminated glass cloth plate. The first fixing member 6 is made of 304. The second fixing member 8 is made of 304. The main material of the temperature controlled body 7 is red copper.
Furthermore, the bottom plate 1 and the temperature control main plate 4 are made of 2A12 materials, so that good heat dissipation performance is guaranteed; the shielding shell 2 is made of 1J85 material, and the bottom stability is good. The temperature control layer 3 is made of polytetrafluoroethylene materials, and the temperature control heat insulation pad 5 is an epoxy laminated glass cloth plate, so that heat can be effectively controlled to be rapidly dissipated. The first fixing piece 6 and the second fixing piece 8 are made of No. 45 steel, and firmness and stability of connection of the whole structure can be guaranteed.
Furthermore, be provided with first screw on the bottom plate 1, be provided with first unthreaded hole on shielding shell 2, accuse temperature layer 3 and the accuse temperature mainboard 4 respectively, the quantity of first screw and first unthreaded hole equals, the upper and lower position corresponds, first mounting 6 is the screw that sets up in first unthreaded hole and first screw. First screw, shielding shell 2, accuse temperature layer 3 on the bottom plate 1 and accuse temperature 4 on the mainboard the quantity of first unthreaded hole is at least three respectively, and at least three first screw evenly distributed on same circumference, the quantity of first unthreaded hole and first screw can be nine respectively. And a second screw hole is formed in the temperature control main board 4, and the second fixing piece 8 is a screw arranged in the second screw hole. The number of the second screw holes is at least three, and the at least three second screw holes are uniformly distributed on the same circumference. The countersunk hole on the temperature control main board 4 and the first unthreaded hole on the temperature control main board 4 form a stepped hole with a T-shaped longitudinal section. The first screw holes of the bottom plate 1 are symmetrically distributed, so that the shielding shell 2, the temperature control layer 3 and the temperature control main board 4 are uniformly stressed and tightly contacted under the fixation of the first fixing piece 6, and a good heat transfer path is ensured.
Still further, the top surface of the bottom plate 1 is provided with grid grooves shaped like Chinese character 'tian'. The shielding shell 2 is a rectangular groove which is sunken upwards, the shielding shell 2 is buckled on the bottom plate 1, namely, the rectangular annular groove wall of the shielding shell 2 surrounds the outer side of the upper part of the outer wall of the bottom plate 1. The temperature control layer 3 is rectangular plate-shaped. The temperature control main board 4 is a rectangular board. The side lengths of the bottom plate 1, the shielding shell 2, the temperature control layer 3 and the temperature control mainboard 4 are correspondingly equal.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A temperature control device comprises a bottom plate, and is characterized in that a shielding shell, a temperature control layer and a temperature control main plate are sequentially arranged on the bottom plate from bottom to top through a first fixing piece; an annular nonmetallic temperature-control heat-insulation pad sleeved outside the first fixing piece is arranged below the temperature-control main board; the temperature control main board is provided with a second fixing part for fixing a controlled temperature body, and the temperature control layer is a non-metal layer.
2. The temperature control device according to claim 1, wherein the first fixing member is a countersunk screw, a countersunk hole is formed in the temperature control main board and located above the first screw hole, the diameter of the countersunk hole is larger than that of the first screw hole, the head of the screw of the first fixing member is located in the countersunk hole, and the temperature control heat insulation pad is disposed in the countersunk hole.
3. A temperature control device according to claim 1 or 2, wherein the base material is 2a 12.
4. The temperature control device of claim 1 or 2, wherein the shielding enclosure material is 1J 85.
5. A temperature control device according to claim 1 or claim 2, wherein the temperature control layer material is polytetrafluoroethylene.
6. The temperature control device according to claim 1 or 2, wherein the main body material of the temperature control main board is 2A 12.
7. A temperature control device according to claim 1 or claim 2, wherein the temperature control insulating mat material is an epoxy laminated glass cloth sheet.
8. The temperature control device of claim 1 or 2, wherein the first fastener material is 304.
9. A temperature control device according to claim 1 or claim 2, wherein the second fixing member material is 304.
10. The temperature control device according to claim 1 or 2, wherein the main body material of the temperature-controlled body is red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011508567.1A CN112672560A (en) | 2020-12-18 | 2020-12-18 | Temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011508567.1A CN112672560A (en) | 2020-12-18 | 2020-12-18 | Temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112672560A true CN112672560A (en) | 2021-04-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011508567.1A Pending CN112672560A (en) | 2020-12-18 | 2020-12-18 | Temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112672560A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114967408A (en) * | 2022-07-19 | 2022-08-30 | 北京大学 | Chip atomic clock with complete machine vacuum package and implementation method thereof |
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| CN111613509A (en) * | 2019-02-25 | 2020-09-01 | 北京北方华创微电子装备有限公司 | Chuck structure and reaction chamber |
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2020
- 2020-12-18 CN CN202011508567.1A patent/CN112672560A/en active Pending
Patent Citations (17)
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| JPH10284866A (en) * | 1997-04-02 | 1998-10-23 | Alps Electric Co Ltd | Shielding case for high frequency equipment and its mounting structure |
| US20010021851A1 (en) * | 1998-07-20 | 2001-09-13 | Roland Eberlein | Fastening assembly |
| KR20010078818A (en) * | 2001-04-04 | 2001-08-22 | 이창화 | The coaxial filters with S/N enhancer |
| JP2003218564A (en) * | 2002-01-25 | 2003-07-31 | Shimada Phys & Chem Ind Co Ltd | Parts case and method of manufacturing the same |
| CN101943280A (en) * | 2009-07-10 | 2011-01-12 | 范宏 | Novel Y-shaped inner thread check valve |
| CN105122966B (en) * | 2011-10-18 | 2014-09-10 | 上海卫星工程研究所 | For the heat insulation connecting device between spatial metal surface |
| CN204168509U (en) * | 2014-11-14 | 2015-02-18 | 郭茂容 | A kind of electric heater |
| CN204795648U (en) * | 2015-07-28 | 2015-11-18 | 江西科技学院 | Novel 3D printer heating bottom plate |
| CN105806328A (en) * | 2016-03-09 | 2016-07-27 | 浙江大学 | Shielding structure capable of improving properties of optical fiber loop of optical fiber gyroscope |
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| CN107404820A (en) * | 2017-08-17 | 2017-11-28 | 武汉领达科技有限公司 | Multifunctional measuring type GNSS receiver shell |
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| CN111613509A (en) * | 2019-02-25 | 2020-09-01 | 北京北方华创微电子装备有限公司 | Chuck structure and reaction chamber |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114967408A (en) * | 2022-07-19 | 2022-08-30 | 北京大学 | Chip atomic clock with complete machine vacuum package and implementation method thereof |
| CN114967408B (en) * | 2022-07-19 | 2023-12-12 | 北京大学 | Chip atomic clock of whole machine vacuum package and implementation method thereof |
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Application publication date: 20210416 |