CN112672491A

CN112672491A - Printed circuit board heat radiation structure and printed circuit board

Info

Publication number: CN112672491A
Application number: CN202011452562.1A
Authority: CN
Inventors: 李子考
Original assignee: Yancheng Huayu Photoelectric Technology Co ltd
Current assignee: Yancheng Huayu Photoelectric Technology Co ltd
Priority date: 2020-12-12
Filing date: 2020-12-12
Publication date: 2021-04-16

Abstract

The invention discloses a printed circuit board heat dissipation structure and a printed circuit board, the printed circuit board heat dissipation structure comprises a first substrate, a first heat conducting fin is embedded at the bottom of the first substrate, the bottom of the first substrate is fixedly connected with a first heat dissipation plate, a first through hole is arranged at the top of the first heat dissipation plate, a first heat dissipation hole is arranged on one side surface of the heat dissipation plate, the bottom of the first heat dissipation plate is fixedly connected with a heat dissipation fin, and the bottom of the heat dissipation fin is fixedly connected with a second heat dissipation plate. The heat dissipation effect is improved.

Description

Printed circuit board heat radiation structure and printed circuit board

Technical Field

The invention relates to the field of printed circuit board manufacturing, in particular to a printed circuit board heat dissipation structure and a printed circuit board.

Background

The PCB board widely used at present is a copper-clad/epoxy glass cloth base material or a phenolic resin glass cloth base material, and a small amount of used paper-based copper-clad board. These substrates have excellent electrical properties and processability, but have poor heat dissipation properties, and heat dissipation from the surface of the element into the ambient air is hardly expected as a heat dissipation path for high-heat-generating elements because heat is conducted by the resin of the PCB itself. However, as electronic products have come to the age of miniaturization of parts, high-density mounting, and high-heat generation assembly, it is not enough to rely on the surface of a very small-surface-area component to dissipate heat. Meanwhile, because of the use of a large number of surface mount components such as QFPs and BGAs, the heat generated by the components is largely transferred to the PCB, so the best method for solving the problem of heat dissipation is to improve the self heat dissipation capability of the PCB directly contacting with the heating component, and to conduct or dissipate the heat through the PCB.

Disclosure of Invention

The invention aims to provide a printed circuit board heat dissipation structure and a printed circuit board, and aims to solve the problem that the printed circuit board is poor in heat dissipation effect.

In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides a printed circuit board heat radiation structure, includes first base plate, the bottom of first base plate is inlayed and is had conducting strip one, the bottom and the first fixed connection of heating panel of first base plate, the top of heating panel one is provided with through-hole one, a heating panel side is provided with louvre one, the bottom and the fin fixed connection of heating panel one, the bottom and the second fixed connection of heating panel of fin, the side of heating panel two is provided with louvre two, the bottom of heating panel two is provided with through-hole two, the bottom and the second base plate fixed connection of heating panel two, the top of second base plate is inlayed and is had conducting strip two, first base plate and second base plate electric connection.

Furthermore, the connection surface of the first substrate and the first heat dissipation plate is provided with a groove and a bump, the groove and the bump at the bottom of the first substrate are correspondingly arranged corresponding to the bump and the groove at the top of the first heat dissipation plate, and the second substrate and the second heat dissipation plate are also arranged in the same way.

Furthermore, the first through hole is communicated with the heat dissipation hole, and the second through hole is communicated with the heat dissipation hole.

Furthermore, the first substrate and the second substrate are arranged in a vertically symmetrical mode, and the first heat dissipation plate and the second heat dissipation plate are arranged in a vertically symmetrical mode.

Furthermore, the position of the first through hole corresponds to the position of the first heat-conducting fin, and the position of the second through hole corresponds to the position of the second heat-conducting fin.

Furthermore, the radiating fins are arranged on the wavy bent plates, and the first radiating plate, the second radiating plate and the radiating fins are made of aluminum alloy materials.

Furthermore, the first heat conducting fin and the second heat conducting fin are both copper foils, and the thickness of each copper foil is 0.1 mm.

Furthermore, the first heat dissipation holes are uniformly distributed on four side surfaces of the first heat dissipation plate, and the second heat dissipation holes are uniformly distributed on four side surfaces of the second heat dissipation plate.

The invention also provides a printed circuit board which comprises the printed circuit board heat dissipation structure.

Compared with the prior art, the invention has the following beneficial effects: the invention divides the printed circuit board into a first substrate and a second substrate, and the first substrate and the second substrate are arranged up and down symmetrically, the first substrate and the second substrate are connected by a conducting strip, a first radiating plate and a second radiating plate are arranged in the middle of the first substrate and the second substrate, the first radiating plate and the second radiating plate are arranged up and down symmetrically, a wave-shaped radiating fin is arranged in the middle of the first radiating plate and the second radiating plate, the wave-shaped bent plate of the radiating fin increases the radiating area, and improves the radiating effect, a first conducting fin is embedded at the bottom of the first substrate, heat is rapidly guided to the inner part of the first radiating plate by the first conducting fin, a first through hole is arranged at the position of the first radiating plate corresponding to the first conducting fin, the first through hole is communicated with the first radiating holes arranged at the periphery of the first radiating plate, and external cold air is guided into the inner part of the first radiating plate, and similarly, a second heat conducting fin is embedded at the top of the second substrate, a second through hole is formed in the position, corresponding to the second heat conducting fin, of the second heat dissipation plate, and the second through hole is communicated with the second heat dissipation hole, so that the heat dissipation effect of the second substrate is accelerated.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the front cross-sectional structure of the present invention;

FIG. 2 is an enlarged view of A in FIG. 1;

FIG. 3 is an enlarged view of B in FIG. 1;

in the figure: 1 a first substrate, 2 a first heat conducting fin, 3 a first heat dissipation plate, 4 a first through hole, 5 a first heat dissipation hole, 6 a heat dissipation fin, 7 a conducting strip, 8 a second substrate, 9 a second heat conducting fin, 10 a second heat dissipation plate, 11 a second through hole and 12 a second heat dissipation hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides the following technical solutions: a heat dissipation structure of a printed circuit board comprises a first substrate 1: the bottom of the first substrate 1 is embedded with a first heat conducting sheet 2, the bottom of the first substrate 1 is fixedly connected with a first heat radiating plate 3, the top of the first heat radiating plate 3 is provided with a first through hole 4, the first through hole 4 is communicated with a first heat radiating hole 5, the position of the first through hole 4 is arranged corresponding to the position of the first heat conducting sheet 2, the side of the first heat radiating plate 3 is provided with the first heat radiating hole 5, the first heat radiating holes 5 are uniformly distributed on four sides of the first heat radiating plate 3, the bottom of the first heat radiating plate 3 is fixedly connected with a second heat radiating fin 6, the bottom of the second heat radiating fin 6 is fixedly connected with the second heat radiating plate 10, the heat radiating fin 6 is arranged in a wave-shaped curved plate manner, the first heat radiating plate 3, the second heat radiating plate 10 and the heat radiating fin 6 are all made of aluminum alloy materials, the side of the second heat radiating plate 10 is provided, the position of the second through hole 11 corresponds to the position of the second heat conducting sheet 9, the bottom of the second heat radiating plate 10 is fixedly connected with the second substrate 8, grooves and bumps are formed in the connecting surface of the first substrate 1 and the first heat radiating plate 3, the grooves and the bumps in the bottom of the first substrate 1 correspond to the bumps and the grooves in the top of the first heat radiating plate 3, the second substrate 8 and the second heat radiating plate 10 are also arranged in the same way, the second heat conducting sheet 9 is embedded in the top of the second substrate 8, the first heat conducting sheet 2 and the second heat conducting sheet 9 are both copper foils, the thickness of the copper foils is 0.1mm, the first substrate 1 is electrically connected with the second substrate 8, the first substrate 1 and the second substrate 8 are arranged symmetrically from top to bottom, and the first heat radiating plate 3 and the second heat radiating plate 10 are arranged;

the printed circuit board is divided into a first substrate 1 and a second substrate 8, the first substrate 1 and the second substrate 8 are arranged up and down symmetrically, the first substrate 1 and the second substrate 8 are connected through a conducting strip 7, a first heat dissipation plate 3 and a second heat dissipation plate 10 are arranged in the middle of the first substrate 1 and the second substrate 8, the first heat dissipation plate 3 and the second heat dissipation plate 10 are arranged up and down symmetrically, a wavy heat dissipation fin 6 is arranged in the middle of the first heat dissipation plate 1 and the second heat dissipation plate 10, the wavy bent plate of the heat dissipation fin 6 is arranged to increase the heat dissipation area, the heat dissipation effect is improved, a first heat conduction fin 2 is embedded at the bottom of the first substrate 1, heat is rapidly guided into the first heat dissipation plate 3 through the first heat conduction fin 2, a first through hole 4 is arranged at a position of the first heat dissipation fin, the first through hole 4 is communicated with a first heat dissipation fin 5 arranged around the first heat dissipation plate 3, and external cold air is guided into the first heat dissipation plate 3 through the first through, the heat dissipation speed is further increased, similarly, the second heat conducting sheet 9 is embedded at the top of the second substrate 8, the second heat dissipation plate 10 is provided with a second through hole 11 corresponding to the second heat conducting sheet 9, and the second through hole 11 is communicated with the second heat dissipation hole 12, so that the heat dissipation effect of the second substrate 8 is accelerated;

a printed circuit board comprises the printed circuit board heat dissipation structure.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A printed circuit board heat radiation structure comprises a first substrate (1), and is characterized in that: the bottom of first base plate (1) is inlayed and is had conducting strip (2), the bottom and heating panel (3) fixed connection of first base plate (1), the top of heating panel (3) is provided with through-hole (4), heating panel (3) side is provided with louvre (5), the bottom and fin (6) fixed connection of heating panel (3), the bottom and heating panel two (10) fixed connection of fin (6), the side of heating panel two (10) is provided with louvre two (12), the bottom of heating panel two (10) is provided with through-hole two (11), the bottom and second base plate (8) fixed connection of heating panel two (10), the top of second base plate (8) is inlayed and is had conducting strip two (9), first base plate (1) and second base plate (8) electric connection.

2. The heat dissipating structure of a printed circuit board of claim 1, wherein: the connection face of first base plate (1) and heating panel (3) all is provided with recess and lug, and the recess and the lug of first base plate (1) bottom correspond the lug and the recess of heating panel (3) top and correspond the setting, second base plate (8) also the same setting with heating panel two (10).

3. The heat dissipating structure of a printed circuit board of claim 1, wherein: the first through hole (4) is communicated with the first heat dissipation hole (5), and the second through hole (11) is communicated with the second heat dissipation hole (12).

4. The heat dissipating structure of a printed circuit board of claim 1, wherein: the first substrate (1) and the second substrate (8) are arranged in an up-down symmetrical mode, and the first heat dissipation plate (3) and the second heat dissipation plate (10) are arranged in an up-down symmetrical mode.

5. The heat dissipating structure of a printed circuit board of claim 1, wherein: the position of the first through hole (4) corresponds to the position of the first heat conducting sheet (2), and the position of the second through hole (11) corresponds to the position of the second heat conducting sheet (9).

6. The heat dissipating structure of a printed circuit board of claim 1, wherein: the radiating fins (6) are arranged by wave-shaped bent plates, and the radiating plate I (3), the radiating plate II (10) and the radiating fins (6) are all made of aluminum alloy materials.

7. The heat dissipating structure of a printed circuit board of claim 1, wherein: the first heat conducting fins (2) and the second heat conducting fins (9) are both copper foils, and the thickness of each copper foil is 0.1 mm.

8. The heat dissipating structure of a printed circuit board of claim 1, wherein: the first heat dissipation holes (5) are uniformly distributed on four side faces of the first heat dissipation plate (3), and the second heat dissipation holes (12) are uniformly distributed on four side faces of the second heat dissipation plate (10).

9. A printed circuit board, characterized by: a printed circuit board heat dissipation structure comprising any of claims 1 to 8.