CN112670818B

CN112670818B - Film reversing device and method for COS of semiconductor laser

Info

Publication number: CN112670818B
Application number: CN201910933713.6A
Authority: CN
Inventors: 张广明; 刘琦; 赵克宁
Original assignee: Weifang Huaguang Photoelectronics Co ltd
Current assignee: Weifang Huaguang Photoelectronics Co ltd
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2022-06-10
Anticipated expiration: 2039-09-29
Also published as: CN112670818A

Abstract

The invention relates to a film pouring device and a film pouring method for a semiconductor laser COS (chip operating system); a fixing plate I is arranged on a base of a main body of the device, a first sliding mechanism is arranged between the base and the fixing plate I, and a fixing seat I and a fixing seat II are arranged on the fixing plate I; be provided with fixed plate II on the curb plate of main part, be provided with second slide mechanism between curb plate and the fixed plate II, be provided with fixed plate III on the fixed plate II, be provided with third slide structure between fixed plate II and the fixed plate III, be provided with start button on the fixed plate III, the lower extreme of fixed plate III is provided with glues and gets the mechanism. The device provided by the invention has the advantages of simple structure, low cost and convenience in operation, and can realize automatic and rapid film pouring; compared with the manual membrane turning efficiency, the COS membrane turning qualification rate is improved to more than 95% from the original 85%, and only 20-30 seconds are needed for one-time membrane turning, so that the working efficiency is greatly improved, and the labor cost is saved.

Description

Film reversing device and method for COS of semiconductor laser

Technical Field

The invention relates to a film pouring device and a film pouring method for COS (chip on chip) of a semiconductor laser, and belongs to the technical field of semiconductor laser packaging.

Background

The semiconductor laser has the advantages of small volume, light weight, high electro-optical conversion efficiency, long service life, high reliability and the like, so that the semiconductor laser gradually replaces the use of gas and solid lasers in the fields of communication, medical treatment, display, industrial manufacture, security and the like, and the application range of the semiconductor laser is gradually expanded. When the semiconductor laser works, waste heat generated by a chip needs to be timely and effectively discharged, otherwise, the temperature of the laser chip is overhigh, the luminous efficiency of a device is reduced, and the failure of the laser is induced. The technical scheme widely applied at present is to fix the semiconductor laser chip on a heat sink block with strong heat dissipation capability, and effectively evacuate heat generated by the chip during working through the heat sink block. The process of die bonding the chip and the heat sink block together is called COS die bonding, and the assembly of the chip and the heat sink block after die bonding is COS. The technology adopted by the COS die bonding of the semiconductor laser at present is a gold-tin technology and an indium technology, and the technical method adopted by the COS die bonding of the indium technology is that a laser chip is die bonded on a rectangular heat sink through an automatic die bonding machine, and more than 500 heat sink blocks are uniformly arranged on each heat sink, so that more than 500 COS can be produced by one heat sink. After the heat sink chip is fixed, the COS is required to be cut, so that all the COS can be separated from the heat sink chip independently. The cut COS needs to keep the original arrangement order, so the COS is stuck on a white film with the size equivalent to that of the heat sink sheet after being cut, so that the separated COS cannot move left and right and back and forth on the white film, and then the COS stuck on the white film is downloaded to a packaging process so as to be assembled on a laser tube seat.

With the progress of semiconductor laser packaging technology, automated packaging equipment has replaced manual operation. In order to improve the production efficiency, the automatic packaging equipment generally needs a device special for bearing the COS, the COS bearing device adopted in the laser packaging at present is a circular wafer expanding ring, and the COS after wafer bonding needs to be transferred to a blue film in the middle of the circular wafer expanding ring from a square white film before the automatic packaging is carried out, so that the COS can be matched with the automatic packaging equipment. The process of transferring COS from a white film to a blue film of a wafer expanding ring is commonly called COS film inversion, and the COS film inversion method adopted at present is that the white film adhered with the COS is manually placed on a workbench, then a metal plate with a middle notch is buckled, the blue film is placed on the metal plate, two sides of the white film and the blue film are pressed by holding a sponge by hands, and the white film is taken down from the metal plate. And placing the metal plate on a circular fixture, then buckling the wafer expanding ring on the metal plate, pressing the blue film on the wafer expanding ring by hands, turning the metal plate for 180 degrees, taking the blue film out of the metal plate, taking the metal plate out of the wafer expanding ring, and finally taking the wafer expanding ring after the film is inverted out of the circular fixture. The method has simple tools, but the operation steps are more complicated, the operation can be carried out only by long-term professional training, and meanwhile, the production efficiency of the method is lower. The uniformity of pressure applied to the COS in the manual film pouring process is poor, so that the COS is difficult to ensure that the COS can not pour the film completely at one time, and the COS film remaining phenomenon is more. And the uniformity of the arrangement distance of the COS subjected to manual film inversion on the wafer expanding ring is poor, so that the image recognition of the equipment is difficult. Manual COS film inversion is difficult to avoid direct contact between an operator and a COS product, and pollution of the product due to human factors and impact of static electricity on COS are easily caused. Therefore, a fast film-pouring device and a fast film-pouring method for the COS of the semiconductor laser, which have the advantages of simple structure, convenient operation and inspection and high production efficiency, are needed to solve the problems of the film-pouring work of the semiconductor laser at present.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides the semiconductor laser COS rapid film-reversing device which is simple in structure, convenient to operate and high in production efficiency, and further provides a method for reversing the film of the semiconductor laser COS by using the device.

The technical scheme of the invention is as follows:

a film reversing device of a semiconductor laser COS comprises a main body, a fixing plate I, a fixing plate II, a fixing plate III, a sticking mechanism, a starting button, a fixing seat I and a fixing seat II;

a fixing plate I is arranged on a base of the main body, a first sliding mechanism is arranged between the base and the fixing plate I, a fixing seat I and a fixing seat II are arranged on the fixing plate I, a crystal expansion ring is arranged on the fixing seat I, and a blue film I is arranged on the crystal expansion ring; a fixing ring II is arranged on the fixing seat II, and a white film is arranged on the fixing ring II;

be provided with fixed plate II on the curb plate of main part, the curb plate with be provided with second slide mechanism between the fixed plate II, be provided with fixed plate III on the fixed plate II, fixed plate II with be provided with third slide structure between the fixed plate III, be provided with the start button on the fixed plate III, the lower extreme of fixed plate III is provided with glue and get the mechanism.

The sticking mechanism is used for sticking the COS off from the fixing ring II on the fixing seat II, inverting the film on the wafer expanding ring on the fixing seat I, starting the film inverting device through the starting button, and the operation is simple; the first sliding mechanism is used for controlling the fixing plate I to move back and forth on the base; the second sliding mechanism is used for controlling the left and right movement of the fixing plate II on the side plate; and the third sliding structure is used for controlling the fixing plate III to move up and down on the fixing plate II, and the COS is transferred to the crystal expansion ring from the fixing ring through the matching of the first sliding structure and the second sliding structure.

According to the invention, the sticking mechanism preferably comprises a motor IV, a positioning sheet, a blue film II, a pressing plate and a fixing ring I, wherein the motor IV is fixed at the lower end of the fixing plate III, and the positioning sheet, the blue film II and the fixing ring I are sequentially arranged below the motor IV from bottom to top;

a square hole is formed in the middle of the positioning sheet, a positioning convex ring III is arranged on the outer side of the square hole, two connecting shafts II are arranged on the outer side of the positioning convex ring III, the connecting shafts II penetrate through the fixing ring I, and the other ends of the connecting shafts II are connected with the lower end of the motor IV;

The blue film II is fixed on the positioning convex ring III, and the sticking surface of the blue film II faces downwards;

the pressing plate is connected with the lower end of the motor IV through a connecting shaft I and is arranged in the center of the fixing ring I;

fixed ring I is last to be provided with 2 handles I.

The design has the advantages that the blue film II and the positioning convex ring III are fixed together through the close fit of the fixing ring I and the positioning convex ring III; the motor IV is used for controlling the pressure plate to ascend and descend, and applying pressure through the pressure plate to transfer COS on the fixing ring II to a blue film II so as to facilitate subsequent film pouring to a crystal expansion ring at the upper end of the fixing seat I; can reciprocate solid fixed ring I along II directions of connecting axle through handle I, realize solid fixed ring I and the protruding cooperation and the separation of ring III of location, make the operation more convenient.

According to the invention, the upper end of the fixed seat I is provided with a positioning convex ring I, the middle of the positioning convex ring I is provided with a square platform I, and the size of the square platform I is matched with that of the square hole; the benefit of this design lies in, fixing base I is used for the location and fixes the brilliant ring that expands, expands brilliant ring through closely cooperating with protruding ring I of location, makes to expand brilliant ring and can not appear removing on fixing base I, carries out the accurate positioning. And the square platform I is matched with the square hole, and the COS on the blue film II is inverted to the wafer expanding ring under the action of the adhering mechanism.

The height of square platform I is higher than the height of location bellying ring I. Be convenient for square platform I and I lower extreme of blue membrane in upper end fully contact, make blue membrane II that is stained with COS and blue membrane I of square platform I upper end fully contact at the membrane in-process of falling, improve the membrane efficiency of falling.

According to the invention, the crystal expansion ring is preferably arranged at the upper end of the fixing seat I and positioned at the outer side of the positioning protrusion ring I, the size of the inner ring of the crystal expansion ring is matched with that of the positioning protrusion ring I, a blue film I is arranged in the middle of the crystal expansion ring, and the sticking surface of the blue film I faces upwards. The benefit of this design lies in, guarantees to expand brilliant ring and fixes accurately at fixing base I, prevents to take place the skew, improves the efficiency of falling the membrane.

According to the invention, the fixing seat II is preferably arranged on one side of the fixing seat I, the upper end of the fixing seat II is provided with a positioning convex ring II, the middle of the positioning convex ring II is provided with a square platform II, and the size of the fixing seat II is the same as that of the fixing seat I; a white film is arranged on the positioning convex ring II, and the sticking surface of the white film faces upwards; the height of the square platform II is higher than that of the positioning convex ring II. The benefit of this design lies in, the tunica albuginea is used for pasting the COS of waiting to carry out the tunica albuginea, fixes the tunica albuginea with fixed ring II cooperations in protruding ring II of location, and square platform II is used for spacing to the COS, realizes through the cooperation of square platform II with the square hole that the COS shifts to the tunica albuginea II from the tunica albuginea.

According to the invention, preferably, the fixing ring II is arranged at the upper end of the fixing seat II, the inner diameter of the fixing ring II is matched with the outer diameter of the positioning bulge ring II, the outer diameter of the fixing ring II is matched with the size of the fixing seat II, and 2 handles II are arranged on the fixing ring II.

Through the cooperation of solid fixed ring II and location bulge loop II, realize the fixed to the tunica albuginea, handle II is convenient for get solid fixed ring II and puts.

Preferably, according to the invention, the viscosity of the blue film i is greater than the viscosity of the blue film ii, which is greater than the viscosity of the white film.

The COS can be adhered from the white film by the blue film II and then is inversely coated on the blue film I on the wafer expanding ring.

According to the invention, the first sliding mechanism preferably comprises a motor I, a guide rail I, a screw I, a nut seat I and a screw supporting seat I; the motor I and the lead screw supporting seat I are fixed on the base, and two guide rails I are arranged between the motor I and the lead screw supporting seat I;

the screw I is arranged between two guide rails I, the nut seat I is sleeved on the screw I, one end of the screw I is connected with the output end of the motor I, and the other end of the screw I is sleeved on the screw supporting seat I in a threaded manner; the nut seat I is connected with the bottom surface of the fixing plate;

Be provided with slider I on the bottom surface of fixed plate I, slider I sets up in the guide rail I.

The advantage of this design lies in, motor I drives lead screw I and rotates, and lead screw I drives fixed plate I seesaw on guide rail I through nut seat I, realizes the position control of fixing base I and fixing base II on the base, better with glue and get mechanism cooperation work.

According to the invention, the second sliding mechanism preferably comprises a motor II, a guide rail II, a lead screw II, a nut seat II and a lead screw supporting seat II; the motor II and the lead screw supporting seat II are fixed on the side plate, and two guide rails II are arranged between the motor II and the lead screw supporting seat II;

the screw II is arranged between the two guide rails II, the nut seat II is sleeved on the screw II, one end of the screw II is connected with the output end of the motor II, and the other end of the screw II is sleeved on the screw support seat II in a threaded manner; the nut seat II is connected with the bottom surface of the fixing plate II;

and a sliding block II is arranged on the bottom surface of the fixing plate II and arranged in the guide rail II.

The advantage of this design lies in, and II drive lead screw II rotations of motor, and lead screw II drives fixed plate II side-to-side movement on II guide rails through nut seat II, realizes gluing the position control of getting the mechanism between fixing base I and fixing base II.

According to the optimization of the invention, the third sliding mechanism comprises a motor III, a guide rail III, a screw III, a nut seat III and a screw supporting seat III, wherein the motor III and the screw supporting seat III are both fixed on the fixing plate II, and two guide rails III are arranged between the motor III and the screw supporting seat III;

the screw III is arranged between the two guide rails III, the nut seat III is sleeved on the screw III, one end of the screw III is connected with the output end of the motor III, and the other end of the screw III is sleeved on the screw supporting seat III in a threaded manner; the nut seat III is connected with the bottom surface of the fixing plate III;

and a sliding block III is arranged on the bottom surface of the fixing plate II, and the sliding block III is arranged in the guide rail III.

The benefit of this design lies in, and motor III drives lead screw III and rotates, and lead screw III drives fixed plate III through nut seat III and carries out up-and-down motion on II guide rails, and then drives and glues the in-process up-and-down motion of getting the mechanism at falling the membrane, accomplishes and falls the membrane.

The film pouring method of the film pouring device of the semiconductor laser COS comprises the following steps:

(1) fixing the white film on the fixing seat II through a fixing ring II;

(2) placing the crystal expansion ring provided with the blue film I on the fixing seat I;

(3) Fixing a blue film II at the upper end of the positioning sheet through a fixing ring I;

(4) pressing a start button to start the equipment;

(5) the first sliding mechanism and the second sliding mechanism drive the sticking mechanism to move above the fixed seat II, the third sliding mechanism drives the sticking mechanism to move, and a blue film II of the sticking mechanism sticks up the COS from the white film;

(6) the first sliding mechanism and the second sliding mechanism drive the sticking mechanism to move above the fixing seat I, and the blue film I on the wafer expanding ring sticks the COS down from the blue film II of the sticking mechanism;

(7) the equipment automatically resets, and the brilliant ring that expands after will falling the membrane is taken off from fixing base I, accomplishes COS and falls the membrane work.

The invention has the beneficial effects that:

1. adopt the mode of automatic mechanical film inversion to replace manual film inversion, efficiency improves greatly, adopts this device to carry out COS film inversion, can guarantee COS to blue I, blue II atress homogeneity of membrane to make blue I, blue II and COS of membrane fully contact, and then reduced COS after the COS film inversion and carried out remaining phenomenon on blue II of membrane, COS film inversion arranges the homogeneity uniformity after expanding the brilliant ring and obtains improving.

2. This device mainly adopts mechanical structure and electrical control to combine together, and long service life device precision is high, and the maintenance is maintained conveniently, and this device easy operation, the key formula starts, and it is loaded down with trivial details to have solved the manual operation step, and the difficult problem that operating method is difficult to master, and the operator only needs just can the independent operation after simple training.

3. By adopting the device to carry out COS film inversion, an operator is effectively prevented from being in direct contact with a COS product, so that pollution of the product caused by human factors and impact of static electricity on the COS are reduced, and damage to the COS film inversion process is reduced; compared with the manual membrane turning efficiency, the COS membrane turning qualification rate is improved to more than 95% from the original 85%, and only 20-30 seconds are needed for one-time membrane turning, so that the working efficiency is greatly improved, and the labor cost is saved.

4. The device provided by the invention has the advantages of simple structure, low cost and convenience in operation, and can realize automatic and rapid film pouring.

Drawings

Fig. 1 is a schematic perspective view i of a COS film-reversing device of a semiconductor laser according to the present invention.

Fig. 2 is a schematic perspective view ii of a COS reverse film device of a semiconductor laser according to the present invention.

Fig. 3 is a partial perspective view of the present invention.

Fig. 4 is a schematic perspective view of the sticking mechanism of the present invention.

Fig. 5 is a schematic perspective view of the spacer of the present invention.

Fig. 6 is a schematic perspective view of the fixing base i and the wafer expanding ring of the present invention.

Fig. 7 is a schematic separated three-dimensional structure of the fixing base ii, the white film and the fixing ring ii of the invention.

Fig. 8 is a schematic perspective view of the COS fixed by the fixing base ii according to the present invention.

Fig. 9 is a schematic perspective view of the COS after falling film to the wafer-expanding ring in the present invention.

Fig. 10 is an enlarged schematic view of COS according to the present invention.

1. The main part, 2, fixing base I, 3, motor I, 4, motor II, 5, fixed plate II, 6, start button, 7, motor III, 8, fixed plate III, 9, motor IV, 10, glue and get the mechanism, 11, fixing base II, 12, fixed plate I, 13, guide rail I, 14, expand brilliant ring, 15, guide rail II, 16, guide rail III, 17, location protruding ring I, 18, square platform I, 19, the outer loop, 20, the inner loop, 21, blue membrane I, 22, the clamp plate, 23, solid fixed ring I, 24, the spacer, 25, connecting axle II, 26, handle I, 27, blue membrane II, 28, the square hole, 29, location protruding ring III, 30, location protruding ring II, 31, the white membrane, 32, solid fixed ring II, 33, handle II, 34, COS,35, square platform II, 36, connecting axle I.

Detailed Description

The invention is further described below, but not limited thereto, with reference to the following examples and the accompanying drawings.

Example 1

A semiconductor laser COS34 film-reversing device is shown in figures 1-3 and comprises a main body 1, a fixing plate I12, a fixing plate II 5, a fixing plate III 8, a gluing mechanism 10, a starting button 6, a fixing seat I2 and a fixing seat II 11;

A fixing plate I12 is arranged on a base of the main body 1, a first sliding mechanism is arranged between the base and the fixing plate I12, a fixing seat I2 and a fixing seat II 11 are arranged on the fixing plate I12, a crystal expansion ring 14 is arranged on the fixing seat I2, and a blue film I21 is arranged on the crystal expansion ring 14; a fixing ring II 32 is arranged on the fixing seat II 11, and a white film 31 is arranged on the fixing ring II 32;

be provided with fixed plate II 5 on the curb plate of main part 1, be provided with second slide mechanism between curb plate and the fixed plate II 5, be provided with fixed plate III 8 on the fixed plate II 5, be provided with third slide mechanism between II 5 of fixed plate and the fixed plate III 8, be provided with start button 6 on the fixed plate III 8, the lower extreme of fixed plate III 8 is provided with glues and gets mechanism 10.

The sticking mechanism 10 is used for sticking the COS34 from the fixing ring II 32 on the fixing seat II 11, pouring a film on the crystal expansion ring 14 on the fixing seat I2, starting the film pouring device through the starting button 6, and the operation is simple; the first sliding mechanism is used for controlling the fixing plate I12 to move back and forth on the base; the second sliding mechanism is used for controlling the fixed plate II 5 to move left and right on the side plate; and the third sliding mechanism is used for controlling the fixing plate III 8 to move up and down on the fixing plate II 5, and the COS34 is transferred from the fixing ring to the wafer expanding ring 14 through the cooperation of the first sliding mechanism and the second sliding mechanism. The one-button starting is adopted, the problems that manual operation steps are complicated and an operation method is difficult to master are solved, and an operator can independently operate the operation system only through simple training.

As shown in fig. 4 and 5, the sticking mechanism 10 comprises a motor iv 9, a positioning piece 24, a blue film ii 27, a pressing plate 22 and a fixing ring i 23, the motor iv 9 is fixed at the lower end of the fixing plate iii 8, and the positioning piece 24, the blue film ii 27 and the fixing ring i 23 are sequentially arranged below the motor iv 9 from bottom to top;

a square hole 28 is formed in the middle of the positioning sheet 24, a positioning convex ring III 29 is arranged on the outer side of the square hole 28, two connecting shafts II 25 are arranged on the outer side of the positioning convex ring III 29, the connecting shafts II 25 penetrate through the fixing ring I23, and the other ends of the connecting shafts II 25 are connected with the lower end of the motor IV 9;

the blue film II 27 is fixed on the positioning convex ring III 29, and the adhesive surface of the blue film II 27 faces downwards;

the pressing plate 22 is connected with the lower end of the motor IV 9 through a connecting shaft I36, and the pressing plate 22 is arranged in the center of the fixing ring I23;

the fixed ring I23 is provided with 2 handles I26.

The blue film II 27 and the positioning bulge ring III 29 are fixed together through the close fit of the fixing ring I23 and the positioning bulge ring III 29; the motor IV 9 is used for controlling the ascending and descending of the pressure plate 22, and applying pressure through the pressure plate 22 to transfer COS34 on the fixing ring II 32 to the blue film II 27 so as to be convenient for subsequent film pouring to the crystal expanding ring 14 at the upper end of the fixing seat I2; can reciprocate solid fixed ring I23 along II 25 directions of connecting axle through handle I26, realize solid fixed ring I23 and protruding ring III 29's of location cooperation and separation, make the operation more convenient.

As shown in fig. 6, a positioning convex ring i 17 is arranged at the upper end of the fixing seat i 2, a square platform i 18 is arranged in the middle of the positioning convex ring i 17, and the size of the square platform i 18 is matched with that of the square hole 28; the benefit of this design lies in, fixing base I2 is used for the location with fixed brilliant ring 14 that expands, expands brilliant ring 14 through closely cooperating with protruding ring I17 of location, makes to expand brilliant ring 14 and can not appear moving on fixing base I2, carries out the accurate positioning. The square platform I18 is matched with the square hole 28, and the COS34 on the blue film II 27 is filmed onto the crystal expanding ring 14 under the action of the sticking mechanism 10. The COS34 is shown in fig. 8 after being flipped to the wafer ring 14.

The height of the square platform I18 is higher than that of the positioning convex ring I17. The lower end of the blue membrane I21 on the square platform I18 and the upper end can be in full contact conveniently, the blue membrane II 27 adhered with the COS34 can be in full contact with the blue membrane I21 on the upper end of the square platform I18 in the membrane pouring process, and the membrane pouring efficiency is improved.

Expand brilliant ring 14 and set up in the upper end of fixing base I2, and be located the outside of location bulge loop I17, expand brilliant ring 14 outside and be equipped with outer loop 19, expand brilliant ring 14 inboard and be equipped with inner ring 20, expand brilliant ring 14's inner ring 20 size and location bulge loop I17's external diameter size phase-match for expand brilliant ring 14 and just in time fix in the outside of location bulge loop I17, expand the centre of brilliant ring 14 and be provided with blue membrane I21, blue membrane I21's the face of pasting is upwards. The benefit of this design lies in, guarantees to expand brilliant ring 14 and fixes accurately at fixing base I2, prevents to take place the skew, improves the efficiency of falling the membrane.

The fixing seat II 11 is arranged on one side of the fixing seat I2, as shown in FIG. 7, a positioning convex ring II 30 is arranged at the upper end of the fixing seat II 11, a square platform II 35 is arranged in the middle of the positioning convex ring II 30, and the size of the fixing seat II 11 is the same as that of the fixing seat I2; a white film 31 is arranged on the positioning convex ring II 30, and the adhesive surface of the white film 31 faces upwards; the height of the square platform II 35 is higher than that of the positioning convex ring II 30.

The white film 31 is used for attaching COS34 to be subjected to film-rewinding, and the state of the white film 31 after attaching COS34 is shown in fig. 8. The white film 31 is fixed by the cooperation of the positioning convex ring II 30 and the fixing ring II 32, the square table II 35 is used for limiting the COS34, and the COS34 is transferred from the white film 31 to the blue film II 27 of the sticking mechanism 10 through the cooperation of the square table II 35 and the square hole 28.

The upper end of II 11 of fixing base is provided with solid fixed ring II 32, gu fixed ring II 32's internal diameter size and the external diameter size phase-match of protruding ring II 30 in location, gu fixed ring II 32's external diameter size and II 11's of fixing base size phase-match are provided with 2 handles II 33 on the fixed ring II 32.

Through the cooperation of II 32 of solid fixed ring and the protruding ring of location II 30, realize the fixed to tunica albuginea 31, handle II 33 is convenient for get solid fixed ring II 32 and is put.

The viscosity of the blue film I21 is greater than that of the blue film II 27, and the viscosity of the blue film II 27 is greater than that of the white film 31. Therefore, after the blue film II 27 sticks COS34 from the white film 31, the blue film I21 on the crystal expansion ring 14 is inverted.

In the embodiment, the first sliding mechanism comprises a motor I3, a guide rail I13, a lead screw I, a nut seat I and a lead screw supporting seat I; the motor I3 and the lead screw supporting seat I are fixed on the base, and two guide rails I13 are arranged between the motor I3 and the lead screw supporting seat I;

the screw I is arranged between the two guide rails I13, the nut seat I is sleeved on the screw I, one end of the screw I is connected with the output end of the motor I3, and the other end of the screw I is sleeved on the screw supporting seat I in a threaded manner; the nut seat I is connected with the bottom surface of the fixing plate;

be provided with slider I on the bottom surface of fixed plate I12, slider I sets up in I13 of guide rail. The partial structure of the first sliding mechanism is not shown in the drawings.

Motor I3 drives lead screw I and rotates, and lead screw I drives fixed plate I12 through nut seat I and moves back and forth on guide rail I13, realizes the position control of fixing base I2 and fixing base II 11 on the base, better and glue and get 10 cooperation workings of mechanism.

In the embodiment, the second sliding mechanism comprises a motor II 4, a guide rail II 15, a screw II, a nut seat II and a screw supporting seat II; the motor II 4 and the lead screw supporting seat II are fixed on the side plate, and two guide rails II 15 are arranged between the motor II 4 and the lead screw supporting seat II;

the screw II is arranged between the two guide rails II 15, the nut seat II is sleeved on the screw II, one end of the screw II is connected with the output end of the motor II 4, and the other end of the screw II is sleeved on the screw support seat II in a threaded manner; the nut seat II is connected with the bottom surface of the fixing plate II 5;

and a sliding block II is arranged on the bottom surface of the fixing plate II 5 and is arranged in the guide rail II 15.

The benefit of this design lies in, and II 4 drive lead screw II rotations of motor, and lead screw II drives II 5 side-to-side movement of fixed plate on II 15 of guide rail through nut seat II, realizes gluing the position control of getting mechanism 10 between fixing base I2 and fixing base II 11. The partial structure of the second sliding mechanism is not shown in the drawings.

In the embodiment, the third sliding mechanism comprises a motor III 7, a guide rail III 16, a screw III, a nut seat III and a screw supporting seat III, wherein the motor III 7 and the screw supporting seat III are both fixed on a fixing plate II 5, and two guide rails III 16 are arranged between the motor III 7 and the screw supporting seat III;

The screw III is arranged between the two guide rails III 16, the nut seat III is sleeved on the screw III, one end of the screw III is connected with the output end of the motor III 7, and the other end of the screw III is sleeved on the screw supporting seat III in a threaded manner; the nut seat III is connected with the bottom surface of the fixing plate III 8;

and a sliding block III is arranged on the bottom surface of the fixing plate II 5 and arranged in the guide rail III 16.

The benefit of this design lies in, and motor III 7 drives III rotations of lead screw, and lead screw III drives III 8 of fixed plate and carries out the up-and-down motion on II 15 of guide rail through nut seat III, and then drives and glue the in-process up-and-down motion of getting mechanism 10 at falling the membrane, accomplishes and falls the membrane. The structure of part of the third sliding mechanism is not shown in the drawings.

The working process of the invention is as follows: when the white film fixing device is used, the white film 31 adhered with the COS34 is placed on the positioning convex ring II 30 of the fixing seat II 11, the COS34 is located above the area of the square table II 35, the fixing ring II 32 is matched with the positioning convex ring II 30 through the handle II 33, and the white film 31 adhered with the COS34 is fixed on the fixing seat II 11;

fixing the wafer expanding ring 14 adhered with the blue film I21 to the upper end of the fixed seat I2 through a positioning convex ring I17; lifting the handle I26 upwards, sticking the adhesive surface of the blue film II 27 downwards onto the positioning convex ring III 29, and pressing the handle I26 downwards to fix the blue film II 27, the fixing ring I23 and the positioning sheet 24 together;

The equipment is started by pressing a starting button 6 on a fixing plate II 5, a motor I3 in a first sliding mechanism and a motor II 4 in a second sliding mechanism rotate to be matched together to drive a fixing plate I12 to move back and forth on a base, the fixing plate II 5 moves left and right on a side plate to rapidly move a sticking mechanism 10 to the upper end of a fixing seat II 11, a motor III 7 in a third sliding mechanism rotates to drive the sticking mechanism 10 to move downwards, a positioning sheet 24 is in contact fit with the fixing seat II 11, and a square table II 35 arranged on the fixing seat II 11 is inserted into a square hole 28 of the positioning sheet 24 in the sticking mechanism 10; the motor IV 9 is started, the pressing plate 22 is driven to move downwards through the first connecting shaft, the pressing plate 22 downwards extrudes the blue film II 27, the blue film II 27 is fully contacted with COS34 on the white film 31, the pressing plate 22 is driven to move upwards by the motor IV 9, meanwhile, the sticking mechanism 10 is driven to move upwards by the motor III 7 in the third sliding mechanism, and COS34 is stuck by the blue film II 27 on the white film 31;

similarly, under the coordination of the first sliding mechanism and the second sliding mechanism, the adhering mechanism 10 is rapidly moved to the upper side of the fixing seat I2, the motor III 7 moves downwards, the positioning plate 24 is in contact with the crystal expansion ring 14 at the upper end of the fixing seat I2, the motor IV 9 drives the pressing plate 22 to move downwards, the pressing plate 22 downwards extrudes the blue film II 27 adhered with the COS34, after the COS34 is fully contacted with the blue film I21 on the crystal expansion ring 14, the motor IV 9 drives the pressing plate 22 to move upwards, and meanwhile, the motor III 7 drives the adhering mechanism 10 to move upwards, so that the COS34 on the blue film II 27 is adhered to the blue film I21 on the crystal expansion ring 14 as shown in FIG. 9; the distribution of COS34 on blue film i 21 is shown in fig. 10.

And resetting the equipment, and taking the crystal expansion ring 14 adhered with the COS34 down from the fixed seat I2 to finish the COS34 film-reversing work.

The device has good arrangement uniformity after the COS34 film is poured to the crystal expansion ring 14. By adopting the device to pour the film of the COS34, an operator is effectively prevented from being in direct contact with a COS34 product, so that the pollution of the product caused by human factors and the impact of static electricity on the COS34 are reduced, and the damage of the COS34 film pouring process is reduced; compared with the manual membrane turning efficiency, the COS34 membrane turning qualification rate is improved to more than 95% from the original 85%, and only 20-30 seconds are needed for one-time membrane turning, so that the working efficiency is greatly improved, and the labor cost is saved.

Example 2

The method for semiconductor laser COS34 film-falling by using the semiconductor laser COS34 film-falling device provided by the embodiment 1 comprises the following steps:

(1) the white film 31 adhered with the COS34 is fixed on a fixed seat II 11 through a fixed ring II 32;

(2) placing the crystal expansion ring 14 fixed with the blue film I21 on the fixed seat I2;

(3) the blue film II 27 is fixed at the upper end of the positioning sheet 24 through the fixing ring I23;

(4) pressing a starting button 6, and starting and operating the equipment;

(5) the first sliding mechanism and the second sliding mechanism drive the sticking mechanism 10 to move to the upper side of the fixed seat II 11, the third sliding mechanism drives the sticking mechanism 10 to move downwards, and the blue film II 27 of the sticking mechanism 10 sticks up the COS34 from the white film 31;

(6) The first sliding mechanism and the second sliding mechanism drive the sticking mechanism 10 to move to the upper part of the fixed seat I2, and the blue film I21 on the wafer expanding ring 14 sticks the COS34 down from the blue film II 27 of the sticking mechanism 10;

(7) the equipment automatically resets, and the wafer expanding ring 14 after the film is poured is taken down from the fixing seat I2, so that the COS34 film pouring work is completed.

Claims

1. A film reversing device of a semiconductor laser COS is characterized by comprising a main body, a fixing plate I, a fixing plate II, a fixing plate III, a sticking mechanism, a starting button, a fixing seat I and a fixing seat II;

a fixing plate II is arranged on a side plate of the main body, a second sliding mechanism is arranged between the side plate and the fixing plate II, a fixing plate III is arranged on the fixing plate II, a third sliding mechanism is arranged between the fixing plate II and the fixing plate III, a starting button is arranged on the fixing plate III, and the lower end of the fixing plate III is provided with the sticking mechanism;

The sticking mechanism comprises a motor IV, a positioning piece, a blue film II, a pressing plate and a fixing ring I, wherein the motor IV is fixed at the lower end of the fixing plate III, and the positioning piece, the blue film II and the fixing ring I are sequentially arranged below the motor IV from bottom to top;

2 handles I are arranged on the fixing ring I;

the viscosity of the blue film I is greater than that of the blue film II, and the viscosity of the blue film II is greater than that of the white film.

2. The device for inverting the COS of a semiconductor laser as claimed in claim 1, wherein a positioning protrusion ring I is disposed at the upper end of the fixing base I, a square platform I is disposed in the middle of the positioning protrusion ring I, and the size of the square platform I is matched with that of the square hole.

3. The device as claimed in claim 2, wherein the die expanding ring is arranged at the upper end of the fixing base i and located at the outer side of the positioning protrusion ring i, the size of the inner ring of the die expanding ring is matched with that of the positioning protrusion ring i, a blue die i is arranged in the middle of the die expanding ring, and the adhesion surface of the blue die i faces upward.

4. The device for inverting the COS of the semiconductor laser as claimed in claim 2, wherein the second fixing seat is arranged at one side of the first fixing seat, a positioning convex ring II is arranged at the upper end of the second fixing seat, a square platform II is arranged in the middle of the positioning convex ring II, and the size of the second fixing seat is the same as that of the first fixing seat; a white film is arranged on the positioning convex ring II, and the sticking surface of the white film faces upwards; the height of the square platform II is higher than that of the positioning convex ring II.

5. The device for inverting the COS of a semiconductor laser as claimed in claim 4, wherein the fixing ring II is arranged at the upper end of the fixing seat II, the inner diameter of the fixing ring II is matched with the outer diameter of the positioning convex ring II, the outer diameter of the fixing ring II is matched with the size of the fixing seat II, and 2 handles II are arranged on the fixing ring II.

6. The film backing device of the semiconductor laser COS (chip scale package) as claimed in claim 1, wherein the first sliding mechanism comprises a motor I, a guide rail I, a lead screw I, a nut seat I and a lead screw support seat I; the motor I and the lead screw supporting seat I are fixed on the base, and two guide rails I are arranged between the motor I and the lead screw supporting seat I;

be provided with slider I on the bottom surface of fixed plate I, slider I sets up in guide rail I.

7. The film backing device of the semiconductor laser COS (chip on chip) as claimed in claim 1, wherein the second sliding mechanism comprises a motor II, a guide rail II, a lead screw II, a nut seat II and a lead screw support seat II; the motor II and the lead screw supporting seat II are fixed on the side plate, and two guide rails II are arranged between the motor II and the lead screw supporting seat II;

8. The film backing device for the COS of the semiconductor laser device as claimed in claim 1, wherein the third sliding mechanism comprises a motor III, a guide rail III, a lead screw III, a nut seat III and a lead screw support seat III, the motor III and the lead screw support seat III are both fixed on the fixing plate II, and two guide rails III are arranged between the motor III and the lead screw support seat III;

9. The method for inverting the film of the inverting device of the semiconductor laser COS as claimed in any of claims 2 to 8, comprising the steps of:

(1) fixing the white film on the fixing seat II through a fixing ring II;

(4) pressing a starting button to start the equipment;