CN106025015A - LED wafer expanding machine with membrane cutting device - Google Patents
LED wafer expanding machine with membrane cutting device Download PDFInfo
- Publication number
- CN106025015A CN106025015A CN201610633139.9A CN201610633139A CN106025015A CN 106025015 A CN106025015 A CN 106025015A CN 201610633139 A CN201610633139 A CN 201610633139A CN 106025015 A CN106025015 A CN 106025015A
- Authority
- CN
- China
- Prior art keywords
- circular
- gland
- led
- expands
- cutting apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 18
- 239000012528 membrane Substances 0.000 title abstract 4
- 210000004907 gland Anatomy 0.000 claims abstract description 21
- 239000000126 substance Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses an LED wafer expanding machine with a membrane cutting device. The machine comprises a base, the base is provided with four support columns, a lower pressing mold board is horizontally arranged on the four support columns, a circular wafer expanding disc is arranged at the center of the lower pressing mold board, and heating tubes are arranged in the wafer expanding disc; one side of the lower pressing mold board is provided with an upper pressing mold board, the lower surface of the upper pressing mold board is provided with a circular groove corresponding to the circular wafer expanding disc, the two sides of the lower pressing mold board are provided with supporting rods, the bottoms of the supporting rods are fixed to the base, the tops of the supporting rods are each vertically provided with a spring, the springs are connected with a gland installing plate, the upper surface of the gland installing plate is provided with an air cylinder, the lower surface of the gland installing plate is provided with a gland, and the lower surface of the gland is provided with an annular blade. According to the LED wafer expanding machine with the membrane cutting device, redundant wafer membranes can be conveniently, quickly and accurately cut off, and meanwhile the condition that operating personnel are injured can be avoided.
Description
Technical field
The present invention relates to a kind of LED and expand brilliant machine, particularly to a kind of LED having film cutting apparatus
Expand brilliant machine.
Background technology
At present, in the encapsulation process of LED manufacturing enterprise, LED expands brilliant machine can be the completeest
Become to heat, stretch, expand crystalline substance, solid film Four processes, but solid film needs manually by unnecessary after completing
Wafer film blade slice off, prior art not plant equipment can realize machinery and cut film,
Manually cut film not only efficiency low, and due to artificial uncertainty, the quality cutting film is not the most protected
Card, operator manually use blade to carry out cutting film the danger hurt by hands, endangers operator
The personal safety of member.To this end, it is proposed that a kind of LED having film cutting apparatus expands brilliant machine.
Summary of the invention
Present invention is primarily targeted at and provide a kind of LED having film cutting apparatus to expand brilliant machine, energy
Convenient, fast and accurate unnecessary wafer film is cut away, operator also can be avoided to be subject to simultaneously
Wound, can effectively solve the problem in background technology.
For achieving the above object, the technical scheme that the present invention takes is:
A kind of LED having film cutting apparatus expands brilliant machine, and including base, described base is provided with four
Individual support column, on described four support columns, level is provided with dip mold plate, described lower bolster center
Being provided with the brilliant dish of circular expansion, be provided with and add heat pipe in described expansion crystalline substance dish, described dip mold plate side is provided with
Top die plate, described top die plate lower surface is provided with recessed with the circular circle expanding brilliant dish corresponding
Groove, described dip mold plate both sides are provided with support bar, fix with base bottom described support bar, top
Portion is vertically provided with spring, and described spring connects has gland installing plate, described gland upper surface to be provided with
Cylinder, lower surface is provided with gland, and described gland lower surface is provided with circular blade.
Further, described dip mold plate and top die plate are hinged by hinge.
Further, the described circular crystalline substance panel surface that expands is provided with circle shape groove.
Further, described support bar is expansion link.
Further, the thickness of described circular blade is less than the width of circle shape groove.
Further, described circular blade is detachable.
When expanding brilliant, unload circular blade, wafer film is placed on the brilliant dish of circular expansion, circular
Wafer film is heated by the heat pipe that adds expanded in brilliant dish, and close pressuring diaphragm, and gland is under the driving of cylinder
Pressing up template surface and apply pressure, the expansion completing wafer film is brilliant.When cutting film, load onto circular
Blade, opens top die plate, and gland expands brilliant dish to circle under the driving of cylinder and applies pressure,
Unnecessary wafer film is cut away by circular blade.Present invention energy is convenient, fast and accurate will be many
Remaining wafer film is cut away, and operator also can be avoided injured simultaneously.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the present invention；
Fig. 2 is the circular internal structure schematic diagram expanding brilliant dish.
In figure: 1, base；2, dip mold plate；3, circle shape groove；4, support bar；5、
Spring；6, circular blade；7, gland；8, cylinder；9, gland installing plate；10, on
Pressuring template；11, circular groove；12, hinge；13, support column；14, the brilliant dish of circular expansion；
15, heat pipe is added.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be prone to bright with effect
White understanding, below in conjunction with detailed description of the invention, is expanded on further the present invention.
As illustrated in fig. 1 and 2, a kind of LED having film cutting apparatus expands brilliant machine, including base,
Described base is provided with four support columns, and on described four support columns, level is provided with dip mold plate,
Described lower bolster center is provided with the brilliant dish of circular expansion, is provided with and adds heat pipe in described expansion crystalline substance dish, described
Dip mold plate side is provided with top die plate, and described top die plate lower surface is provided with and expands brilliant dish with circular
Corresponding circular groove, described dip mold plate both sides are provided with support bar, bottom described support bar
Fixing with base, top vertical is provided with spring, and described spring connects gland installing plate, described
Gland upper surface is provided with cylinder, and lower surface is provided with gland, and described gland lower surface is provided with circular
Blade.
Preferably, described dip mold plate and top die plate are hinged by hinge, and top die plate can
To overturn around hinge.
Preferably, the described circular crystalline substance panel surface that expands is provided with circle shape groove, facilitates circular cutter
Sheet cut crystal film.
Preferably, described support bar is expansion link, can regulate the height of support bar.
Preferably, the thickness of described circular blade is less than the width of circle shape groove, convenient
Circular blade cut crystal film.
Preferably, described circular blade is detachable, can avoid when expanding brilliant top die plate and
Circular blade is damaged.
By the way of explanation, only describe some one exemplary embodiment of the present invention above, undoubtedly,
For those of ordinary skill in the art, in the case of without departing from the spirit and scope of the present invention, Ke Yiyong
Described embodiment is modified by various different modes.Therefore, above-mentioned accompanying drawing and being described in substantially
It is illustrative, should not be construed as the restriction to the claims in the present invention protection domain.
Claims (6)
1. the LED having film cutting apparatus expands a brilliant machine, including base, it is characterised in that: described
Base is provided with four support columns, and on described four support columns, level is provided with dip mold plate, described
Lower bolster center is provided with circular expands brilliant dish, is provided with and adds heat pipe in described expansion crystalline substance dish, described under press
Template side is provided with top die plate, and it is relative that described top die plate lower surface is provided with dish brilliant with circular expansion
The circular groove answered, described dip mold plate both sides are provided with support bar, bottom described support bar and the end
Seat is fixing, and top vertical is provided with spring, and described spring connects gland installing plate, described gland
Upper surface is provided with cylinder, and lower surface is provided with gland, and described gland lower surface is provided with circular blade.
A kind of LED having film cutting apparatus the most according to claim 1 expands brilliant machine, its feature
It is: described dip mold plate and top die plate are hinged by hinge.
A kind of LED having film cutting apparatus the most according to claim 1 expands brilliant machine, its feature
It is: the described circular crystalline substance panel surface that expands is provided with circle shape groove.
A kind of LED having film cutting apparatus the most according to claim 1 expands brilliant machine, its feature
It is: described support bar is expansion link.
5. expand brilliant machine according to a kind of LED having film cutting apparatus described in claim 1 and 3, its
It is characterised by: the thickness of described circular blade is less than the width of circle shape groove.
A kind of LED having film cutting apparatus the most according to claim 1 expands brilliant machine, its feature
It is: described circular blade is detachable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610633139.9A CN106025015A (en) | 2016-08-04 | 2016-08-04 | LED wafer expanding machine with membrane cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610633139.9A CN106025015A (en) | 2016-08-04 | 2016-08-04 | LED wafer expanding machine with membrane cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106025015A true CN106025015A (en) | 2016-10-12 |
Family
ID=57133890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610633139.9A Withdrawn CN106025015A (en) | 2016-08-04 | 2016-08-04 | LED wafer expanding machine with membrane cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106025015A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106738059A (en) * | 2016-12-12 | 2017-05-31 | 厦门南洋职业学院 | A kind of self-service cutter of face paper and cutting method |
| CN106738060A (en) * | 2016-12-12 | 2017-05-31 | 厦门南洋职业学院 | A kind of self-service cutter sweep of face paper and cutting method |
| CN108550542A (en) * | 2018-05-28 | 2018-09-18 | 嘉兴市正大照明有限公司 | A kind of brilliant machine of full-automatic LED expansion |
| CN109860078A (en) * | 2018-12-22 | 2019-06-07 | 杭州小橙工业设计有限公司 | LED light automatic blanking expands brilliant machine |
| CN112670818A (en) * | 2019-09-29 | 2021-04-16 | 潍坊华光光电子有限公司 | Film reversing device and method for COS of semiconductor laser |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202640449U (en) * | 2012-06-08 | 2013-01-02 | 珠海格力电器股份有限公司 | Film cutting mechanism |
| CN203895484U (en) * | 2014-06-04 | 2014-10-22 | 深圳市晶台股份有限公司 | Film cutting device of LED chip expanding machine |
| CN204792745U (en) * | 2015-07-06 | 2015-11-18 | 扬州虹扬科技发展有限公司 | Wafer expands membrane clamping device |
| CN205376555U (en) * | 2016-01-29 | 2016-07-06 | 江门市亮美电子有限公司 | LED expands brilliant machine |
-
2016
- 2016-08-04 CN CN201610633139.9A patent/CN106025015A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202640449U (en) * | 2012-06-08 | 2013-01-02 | 珠海格力电器股份有限公司 | Film cutting mechanism |
| CN203895484U (en) * | 2014-06-04 | 2014-10-22 | 深圳市晶台股份有限公司 | Film cutting device of LED chip expanding machine |
| CN204792745U (en) * | 2015-07-06 | 2015-11-18 | 扬州虹扬科技发展有限公司 | Wafer expands membrane clamping device |
| CN205376555U (en) * | 2016-01-29 | 2016-07-06 | 江门市亮美电子有限公司 | LED expands brilliant machine |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106738059A (en) * | 2016-12-12 | 2017-05-31 | 厦门南洋职业学院 | A kind of self-service cutter of face paper and cutting method |
| CN106738060A (en) * | 2016-12-12 | 2017-05-31 | 厦门南洋职业学院 | A kind of self-service cutter sweep of face paper and cutting method |
| CN106738060B (en) * | 2016-12-12 | 2018-11-06 | 厦门南洋职业学院 | A kind of self-service cutter device of face paper and cutting method |
| CN106738059B (en) * | 2016-12-12 | 2018-11-06 | 厦门南洋职业学院 | A kind of self-service cutter of face paper and cutting method |
| CN108550542A (en) * | 2018-05-28 | 2018-09-18 | 嘉兴市正大照明有限公司 | A kind of brilliant machine of full-automatic LED expansion |
| CN108550542B (en) * | 2018-05-28 | 2024-06-25 | 嘉兴市正大照明有限公司 | Full-automatic LED expands brilliant machine |
| CN109860078A (en) * | 2018-12-22 | 2019-06-07 | 杭州小橙工业设计有限公司 | LED light automatic blanking expands brilliant machine |
| CN112670818A (en) * | 2019-09-29 | 2021-04-16 | 潍坊华光光电子有限公司 | Film reversing device and method for COS of semiconductor laser |
| CN112670818B (en) * | 2019-09-29 | 2022-06-10 | 潍坊华光光电子有限公司 | Film reversing device and method for COS of semiconductor laser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161012 |