CN218918804U - Film pouring machine - Google Patents
Film pouring machine Download PDFInfo
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- CN218918804U CN218918804U CN202223035591.5U CN202223035591U CN218918804U CN 218918804 U CN218918804 U CN 218918804U CN 202223035591 U CN202223035591 U CN 202223035591U CN 218918804 U CN218918804 U CN 218918804U
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- film
- adhesive film
- wafer
- pouring machine
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a film pouring machine, which relates to the technical field of semiconductor production equipment, and comprises: the machine case comprises a machine case body, a carrying platform arranged on the machine case body and a pressing device connected with the machine case body; the carrier is used for bearing a wafer, the two sides of the wafer are respectively attached with the first adhesive film and the second adhesive film, a plurality of through holes are formed in the carrier, the through holes are connected with the negative pressure generating device, and a pressing device is arranged on one side, far away from the chassis body, of the carrier; the pressing device comprises a lifting assembly and a pressing assembly connected with the lifting assembly; the utility model can solve the technical problem that chips with small size cannot be completely transferred to a new blue film in a heating and pressurizing mode in the prior art, so that the chips are damaged.
Description
Technical Field
The utility model relates to the technical field of semiconductor production equipment, in particular to a film pouring machine.
Background
In the manufacturing process of semiconductor integrated circuits, various physical and chemical processes are required to be performed on a semiconductor wafer to form a device structure, the wafer is usually attached to a bottom film, a layer of protective film is covered on the surface of the wafer, the wafer is convenient to process, positioning is convenient, the wafer is prevented from being damaged, the formed device structure is cut into hundreds of thousands of independent chips, and the protective film needs to be torn off when the chips are taken out so as to be transferred to a new blue film.
At present, a more common mode of tearing the protection adhesive film is to heat and pressurize the protection adhesive film, the chip and a new blue film through an inverted film machine, and the protection adhesive film is manually torn off to separate the chip from the protection adhesive film and transfer the chip to the new blue film, but due to the continuous development of the current semiconductor chip, the size of the chip is smaller and smaller, and the small-size chip cannot be completely transferred to the new blue film through the heating and pressurizing mode, so that the chip is damaged, and the yield of the chip is reduced.
Therefore, the existing film pouring machine has the technical problem that chips with small sizes cannot be completely transferred onto a new blue film in a heating and pressurizing mode, so that the chips are damaged.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model aims to provide a film pouring machine and aims to solve the technical problem that chips with small sizes cannot be completely transferred to a new blue film in a heating and pressurizing mode in the prior art, so that the chips are damaged.
An aspect of the present utility model is to provide a film rewinding machine including:
the machine case comprises a machine case body, a carrying platform arranged on the machine case body and a pressing device connected with the machine case body;
the carrying platform is used for carrying a wafer, two sides of the wafer are respectively used for attaching a first adhesive film and a second adhesive film, a plurality of through holes are formed in the carrying platform, the through holes are connected with the negative pressure generating device, and a pressing device is arranged on one side, far away from the chassis body, of the carrying platform;
the pressing device comprises a lifting assembly and a pressing assembly connected with the lifting assembly;
the lifting component moves in a lifting mode, so that the pressing component abuts against the second adhesive film, the pressing component presses the second adhesive film to adhere to the wafer, and the second adhesive film is adsorbed by the through holes in a negative pressure mode so that the first adhesive film can be torn conveniently.
Compared with the prior art, the utility model has the beneficial effects that: the film pouring machine provided by the utility model can smoothly transfer a wafer to a new blue film, and specifically comprises a machine box body, a carrying platform arranged on the machine box body and a pressing device connected with the machine box body; the carrier is used for bearing a wafer, the two sides of the wafer are respectively attached with the first adhesive film and the second adhesive film, a plurality of through holes are formed in the carrier, the through holes are connected with the negative pressure generating device, and a pressing device is arranged on one side, far away from the chassis body, of the carrier; the pressing device comprises a lifting assembly and a pressing assembly connected with the lifting assembly; through lifting unit elevating movement to make the pressing assembly support the second glued membrane, and make the second glued membrane adhere on the wafer through pressing assembly pressurization, rethread through-hole negative pressure adsorbs the second glued membrane in order to tear first glued membrane, through increasing the negative pressure absorption of through-hole, with make second glued membrane and wafer be fixed in on the fixed block, first glued membrane just can tear from the wafer smoothly, improve the yield of falling the membrane, reduce the damage rate of chip, avoid first glued membrane to tear and produce the fold, cause the wafer damage, thereby solved the chip of prior art medium and small-size can't be through heating the whole transfer to new blue membrane on of pressurized mode, lead to the technical problem of chip damage.
According to one aspect of the above technical solution, the middle part of the carrier is provided with a first groove, the carrier is provided with a fixed block in the first groove, and the through hole is formed in the fixed block.
According to an aspect of the above technical solution, the through holes are highly dense micro-pitch air holes, and the material of the fixing block is ceramic.
According to an aspect of the above technical solution, the fixing block includes a first fixing portion and a second fixing portion disposed at an edge of the first fixing portion, and a plurality of fasteners penetrate through the second fixing portion to fix the fixing block on the carrier.
According to an aspect of the above technical solution, the carrier is provided with second grooves on two sides of the first groove respectively.
According to an aspect of the above technical solution, the first adhesive film and the second adhesive film are respectively provided with a first connection ring and a second connection ring, the edge portion of the first adhesive film is clamped in the first connection ring, the edge portion of the second adhesive film is clamped in the second connection ring, and the wafer is placed in the first connection ring and the second connection ring through corresponding placement of the first connection ring and the second connection ring, so that the first adhesive film and the second adhesive film are attached to the wafer.
According to an aspect of the above technical solution, the second adhesive film is provided with an adhesive sheet on a side close to the wafer.
According to an aspect of the above technical solution, the carrier is provided with a vacuum control switch and a vacuum detection meter, so as to control the vacuum degree of the wafer attached to the fixed block.
According to an aspect of the above technical solution, the casing body is provided with a temperature controller for controlling the heating temperature of the fixing block.
According to an aspect of the above technical solution, the two ends of the chassis body are respectively provided with a height adjuster, so as to be used for controlling the descending position of the pressing assembly.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of a film rewinding machine according to a first embodiment of the present utility model;
FIG. 2 is a schematic view of a stage according to a first embodiment of the present utility model;
description of the drawings element symbols:
the device comprises a case body 10, a carrying platform 20, a pressing device 30, a height adjuster 11, a temperature controller 12, a first groove body 21, a second groove body 22, a fixed block 23, a first fixed part 24, a second fixed part 25, a through hole 240, a vacuum control switch 26, a vacuum detection meter 27, a lifting assembly 31, a pressing assembly 32 and a pressure adjuster 310.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-2, a film pouring machine according to a first embodiment of the present utility model is shown, and the film pouring machine includes a machine case body 10, a carrier 20 disposed on the machine case body 10, and a pressing device 30 connected to the machine case body 10; the temperature controller 12 on the case body 10 is used for controlling the heating temperature of the fixing block 23, and the two ends of the case are respectively provided with a height adjuster 11 for controlling the descending position of the pressing assembly 32.
The carrier 20 is used for carrying a wafer, a plurality of through holes 240 are formed in the carrier 20, the through holes 240 are high-density micro-pitch air holes, the through holes 240 are connected with a negative pressure generating device, adsorption capacity is high, wrinkles cannot be generated due to film tearing, the through holes 240 are used for adsorbing a second adhesive film through negative pressure, so that the first adhesive film can be torn conveniently, and the yield of chips is improved. The middle part of the carrying platform 20 is provided with a first groove body 21, the carrying platform 20 is provided with a fixed block 23 in the first groove body 21, a through hole 240 is arranged on the fixed block 23, the fixed block 23 is made of ceramic material, the fixed block 23 comprises a first fixed part 24 and a second fixed part 25 arranged at the edge of the first fixed part 24, and a plurality of fasteners penetrate through the second fixed part 25 to fix the fixed block 23 on the carrying platform 20. In addition, the carrier 20 is provided with second grooves 22 at both sides of the first groove 21, respectively, so as to facilitate the assembly and disassembly of the fixing block 23, thereby facilitating the replacement and maintenance.
In addition, the carrier 20 is provided with a vacuum control switch 26 and a vacuum gauge 27 for controlling the vacuum degree of the wafer attached to the fixed block 23.
Further, the wafer is placed on the fixing block 23, two sides of the wafer are respectively used for attaching the first adhesive film and the second adhesive film, it is to be noted that a layer of protection film, namely the first adhesive film, is covered on the surface of the wafer in order to process the wafer, so as to prevent the wafer from being damaged, but when the chip needs to be taken, the first adhesive film needs to be torn off to be transferred to the first adhesive film, the first adhesive film and the second adhesive film are respectively provided with a first connecting ring and a second connecting ring, the edge part of the first adhesive film is clamped in the first connecting ring, the edge part of the second adhesive film is clamped in the second connecting ring, and the wafer is placed in the first connecting ring and the second connecting ring through the corresponding placement of the first connecting ring and the second connecting ring, so that the first adhesive film and the second adhesive film are attached to the wafer, and the first connecting ring or the second connecting ring is placed on the second fixing portion 25. In addition, the second adhesive film is provided with an adhesive sheet at one side close to the wafer, so that the second adhesive film is adhered to the wafer.
The pressing device 30 is connected to the chassis body 10, and the pressing device 30 is used for pressing the second adhesive film, so that the second adhesive film is adhered to the wafer. The pressing device 30 includes a lifting assembly 31 and a pressing assembly 32 connected to the lifting assembly 31, wherein the lifting assembly 31 is connected to the chassis body 10, and the pressing assembly 32 is pressed against the second adhesive film by the lifting assembly 31, and the second adhesive film is adhered to the wafer by the pressing assembly 32, and in addition, a pressure regulator 310 is disposed on the lifting assembly 31 for controlling the pressure value of the pressing device 30.
It should be noted that, the first adhesive film is attached to the wafer, the first adhesive film attached to the wafer is contacted with the fixing block 23 and placed on the fixing block 23, the adhesive sheet is attached to the wafer, the second adhesive film is placed on the adhesive sheet, the lifting component 31 descends to drive the pressing component 32 to abut against the second adhesive film, and applies pressure to the adhesive film, meanwhile, the fixing block 23 is heated to a preset temperature, the heating and the pressing are maintained for a preset time, so that the second adhesive film is attached to the wafer, the wafer is turned over, the second adhesive film is contacted with the fixing block 23 and placed on the fixing block 23, the second adhesive film is adsorbed by the through hole 240 under negative pressure, and the first adhesive film is quickly torn off from the wafer, so as to finish the film pouring action. Further, negative pressure adsorption through the through holes 240 is increased, so that chips with small sizes can be smoothly transferred onto the second adhesive film, the damage rate of the chips is reduced, and the first adhesive film is prevented from being wrinkled due to tearing strength, so that the chips are damaged.
Compared with the prior art, the film pouring machine that this embodiment provided, beneficial effect lies in: the film pouring machine provided by the utility model can smoothly transfer a wafer to a new blue film, and specifically comprises a machine box body, a carrying platform arranged on the machine box body and a pressing device connected with the machine box body; the carrier is used for bearing a wafer, the two sides of the wafer are respectively attached with the first adhesive film and the second adhesive film, a plurality of through holes are formed in the carrier, the through holes are connected with the negative pressure generating device, and a pressing device is arranged on one side, far away from the chassis body, of the carrier; the pressing device comprises a lifting assembly and a pressing assembly connected with the lifting assembly; through lifting unit elevating movement to make the pressing assembly support the second glued membrane, and make the second glued membrane adhere on the wafer through pressing assembly pressurization, rethread through-hole negative pressure adsorbs the second glued membrane in order to tear first glued membrane, through increasing the negative pressure absorption of through-hole, with make second glued membrane and wafer be fixed in on the fixed block, first glued membrane just can tear from the wafer smoothly, improve the yield of falling the membrane, reduce the damage rate of chip, avoid first glued membrane to tear and produce the fold, cause the wafer damage, thereby solved the chip of prior art medium and small-size can't be through heating the whole transfer to new blue membrane on of pressurized mode, lead to the technical problem of chip damage.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. The utility model provides a film pouring machine which characterized in that, film pouring machine includes:
the machine case comprises a machine case body, a carrying platform arranged on the machine case body and a pressing device connected with the machine case body;
the carrying platform is used for carrying a wafer, two sides of the wafer are respectively used for attaching a first adhesive film and a second adhesive film, a plurality of through holes are formed in the carrying platform, the through holes are connected with the negative pressure generating device, and a pressing device is arranged on one side, far away from the chassis body, of the carrying platform;
the pressing device comprises a lifting assembly and a pressing assembly connected with the lifting assembly;
the lifting component moves in a lifting mode, so that the pressing component abuts against the second adhesive film, the pressing component presses the second adhesive film to adhere to the wafer, and the second adhesive film is adsorbed by the through holes in a negative pressure mode so that the first adhesive film can be torn conveniently.
2. The film pouring machine according to claim 1, wherein a first groove body is formed in the middle of the carrying platform, a fixed block is arranged in the first groove body of the carrying platform, and the through hole is formed in the fixed block.
3. The film pouring machine according to claim 2, wherein the through holes are highly dense micro-pitch air holes, and the fixing block is made of ceramic material.
4. A film pouring machine as recited in claim 3, wherein the fixed block includes a first fixed portion and a second fixed portion provided at an edge of the first fixed portion, the second fixed portion being penetrated by a plurality of fasteners to fix the fixed block to the carrier.
5. The film pouring machine according to claim 2, wherein the carrier is provided with second groove bodies on two sides of the first groove body respectively.
6. The film pouring machine according to claim 4, wherein a first connecting ring and a second connecting ring are respectively arranged on the first adhesive film and the second adhesive film, the edge part of the first adhesive film is clamped in the first connecting ring, the edge part of the second adhesive film is clamped in the second connecting ring, and the wafer is placed in the first connecting ring and the second connecting ring through corresponding placement of the first connecting ring and the second connecting ring, so that the first adhesive film and the second adhesive film are attached to the wafer.
7. The film pouring machine according to claim 1, wherein the second adhesive film is provided with an adhesive sheet on a side close to the wafer.
8. The film pouring machine according to claim 1, wherein a vacuum control switch and a vacuum detection meter are arranged on the carrying platform for controlling the vacuum degree of the wafer attached to the fixed block.
9. The film pouring machine according to claim 1, wherein a temperature controller is provided on the machine case body for controlling a heating temperature of the fixing block.
10. The film pouring machine according to claim 6, wherein the two ends of the machine case body are respectively provided with a height adjuster for controlling the descending position of the pressing assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223035591.5U CN218918804U (en) | 2022-11-15 | 2022-11-15 | Film pouring machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223035591.5U CN218918804U (en) | 2022-11-15 | 2022-11-15 | Film pouring machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218918804U true CN218918804U (en) | 2023-04-25 |
Family
ID=86041948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223035591.5U Active CN218918804U (en) | 2022-11-15 | 2022-11-15 | Film pouring machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218918804U (en) |
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2022
- 2022-11-15 CN CN202223035591.5U patent/CN218918804U/en active Active
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