CN116598242A - Chip film pouring equipment - Google Patents
Chip film pouring equipment Download PDFInfo
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- CN116598242A CN116598242A CN202310463481.9A CN202310463481A CN116598242A CN 116598242 A CN116598242 A CN 116598242A CN 202310463481 A CN202310463481 A CN 202310463481A CN 116598242 A CN116598242 A CN 116598242A
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- 230000007246 mechanism Effects 0.000 claims abstract description 81
- 238000003825 pressing Methods 0.000 claims description 130
- 238000004140 cleaning Methods 0.000 claims description 92
- 238000001125 extrusion Methods 0.000 claims description 48
- 239000003292 glue Substances 0.000 claims description 42
- 238000010438 heat treatment Methods 0.000 claims description 26
- 230000006835 compression Effects 0.000 claims description 24
- 238000007906 compression Methods 0.000 claims description 24
- 239000012528 membrane Substances 0.000 claims description 18
- 239000007921 spray Substances 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 12
- 239000011324 bead Substances 0.000 claims description 7
- 230000009467 reduction Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000004512 die casting Methods 0.000 claims 9
- 239000010408 film Substances 0.000 description 245
- 238000000034 method Methods 0.000 description 29
- 230000008569 process Effects 0.000 description 25
- 238000007790 scraping Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000001174 ascending effect Effects 0.000 description 6
- 238000007599 discharging Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 101000623895 Bos taurus Mucin-15 Proteins 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011552 falling film Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The application relates to a chip film pouring device which comprises a bottom plate (1), a rotating mechanism (2), a positioning mechanism (3), a supporting frame (4), a film removing mechanism (5), a supporting plate (6) and a film pasting mechanism (7), wherein the rotating mechanism (2) is arranged in the middle of the bottom plate (1), the positioning mechanism (3) is uniformly arranged around the rotating mechanism (2), the supporting frame (4) is arranged at the left end of the bottom plate (1), the film removing mechanism (5) is arranged on the supporting frame (4), the supporting plate (6) is arranged at the rear end of the bottom plate (1), and the film pasting mechanism (7) is arranged on the supporting plate (6).
Description
Technical Field
The application relates to the technical field of chip film pouring, in particular to chip film pouring equipment.
Background
The chip film pouring is to replace the blue film on the surface of the chip as the name implies, and is one of important procedures in chip processing, after the chip is packaged, the defects of scratch and the like of the blue film on the surface of the chip are unavoidable in the processes of storage, transportation and daily use, and the blue film on the surface of the chip can be replaced through the film pouring procedure, so that the product reaches a qualified state.
In the existing film pouring process, for example, chinese patent with publication number of CN218024148U, an automatic film pouring device for chips is disclosed, and comprises a workbench, a feeding mechanical arm, a feeding table, a film pressing device, a film pressing table, a discharging mechanical arm and a blue film material box, wherein the feeding mechanical arm, the feeding table, the film pressing device, the film pressing table, the discharging mechanical arm and the blue film material box are arranged on the workbench; the tail end of the feeding mechanical arm is provided with a sucker; the tail end of the blanking mechanical arm is provided with a mechanical claw, and a blue film is placed in the blue film material box; the film pressing device is arranged above the film pressing table through a bracket, and the feeding mechanical arm and the discharging mechanical arm are connected with the workbench. According to the utility model, the feeding mechanical arm drives the sucking disc to suck the chip on the feeding table and move the chip to the film pressing table for placement, the blanking mechanical arm drives the mechanical claw to grasp the blue film from the material box and place the blue film above the electrode side of the chip to be film-poured on the film pressing table, and finally the film pressing device presses down to press the new blue film on the chip, so that the film pouring process is completed.
In the prior art, the labor consumption is reduced mainly through the use of the feeding and discharging mechanical arm, the operation efficiency of the film pouring production line is improved by mechanical automation, however, the problem of how to treat the original blue film on the surface of the chip is not considered in the prior art, and the situation that the film is not pasted on the chip is caused by the fact that the blue film is directly gripped by the feeding mechanical arm in a gripping failure mode due to small size and thin thickness of the blue film, the occurrence probability of defective products is improved, the number of the single gripped blue films is one, the film pasting efficiency is low, the application in the production line is not suitable, the phenomenon that the blue film is likely to be wrinkled is easily caused when the blanking mechanical arm is pasted on the chip, meanwhile, the blue film is completely pasted on the surface of the chip by a simple physical extrusion method, the possibility of subsequent falling off exists, and on the basis of the existing film pouring technology, a space is still available for improvement.
Disclosure of Invention
In order to scrape and re-paste a blue film with defects on the surface of a chip, the application provides a chip film pouring device.
The application provides a chip film pouring device which adopts the following technical scheme:
the utility model provides a chip equipment of falling film, includes bottom plate, rotary mechanism, positioning mechanism, support frame, removes membrane mechanism, backup pad, pad pasting mechanism, and rotary mechanism is installed to the mid-mounting of bottom plate, and rotary mechanism evenly is provided with positioning mechanism all around, and the support frame is installed to the left end of bottom plate, is provided with on the support frame and removes membrane mechanism, and the backup pad is installed to the rear end of bottom plate, installs pad pasting mechanism in the backup pad.
The film removing mechanism comprises a U-shaped rail I, a U-shaped rail II, an electric slide block I, a connecting plate I, a film removing knife, a chip cleaning assembly, a lifting plate, a linkage assembly, a knife tip cleaning assembly and a slide block, wherein side plates are symmetrically arranged on the left side and the right side of the support frame, the U-shaped rail I, the U-shaped rail II and the electric slide block I are sequentially arranged on the side plates from top to bottom, the connecting plate I is connected with the connecting plate I, the lifting film removing knife and the chip cleaning assembly are sequentially arranged on the connecting plate I from front to back, the chip cleaning assembly is used for spraying and wiping residual adhesive layers on the surface of a chip after film scraping, the lifting plate is arranged on the support frame in a sliding mode and is matched and connected with the knife tip cleaning assembly arranged on the support frame through the linkage assembly, the slide blocks are symmetrically arranged at the left end and the right end of the film removing knife, the slide blocks temporarily slide in the U-shaped rail II, and the U-shaped rail I and the U-shaped rail II are arranged to play a role in switching the height of the film removing knife.
The film pasting mechanism comprises a shell, a first pressing component, a film pasting component, a power supply component, a frame body, a second pressing component, electric rollers, a limiting component and a glue gun, wherein the shell is arranged on a supporting plate, the first pressing component is arranged at the upper end of the shell, the film pasting component is connected to the lower end of the first pressing component, the film pasting component is electrically connected with the power supply component arranged on the shell, the film pasting component is located inside the frame body, the frame body is arranged on the second pressing component, the second pressing component is arranged on the shell in a sliding mode, the electric rollers are rotatably arranged on the left side and the right side of the second pressing component, a blue film is wound between the electric rollers, the limiting component for controlling the tensioning of the blue film is arranged between the second pressing component and the shell, the glue gun is arranged in the shell, a nozzle of the glue gun is close to the lower surface of the blue film, and glue liquid is mainly smeared on the lower surface of the blue film in a uniform manner, so that the blue film can be attached to the surface of a chip.
According to the application, through fine division of the reverse molding process and improvement of the film removing knife and the film pasting component, the possibility of damaging the chip is greatly reduced, and the reverse molding efficiency is improved.
Preferably, the rotary mechanism comprises a working motor, a cross rotary arm and an electric rotary shaft, the working motor is arranged in the middle of the bottom plate, the cross rotary arm is arranged at the upper end of the working motor, the cross rotary arm drives the positioning mechanism to rotate in the horizontal direction, the electric rotary shaft is arranged on the outer side of the cross rotary arm, the electric rotary shaft mainly plays a role of longitudinally rotating the positioning mechanism, and the positioning mechanism can rapidly rotate for one hundred eighty degrees after adsorbing a chip to be reversed, so that the film to be scraped on the chip is upwards arranged.
Preferably, the positioning mechanism comprises a rotating arm, a positioning plate, a positioning groove, a through hole, an air pump, a connecting pipe, a flexible wrapping pipe, a telescopic pipe, a cylinder II, a pressing block and an extrusion positioning plate, wherein the rotating arm is arranged on the outer side of the electric rotating shaft, the positioning plate is arranged on the rotating arm, the positioning groove is uniformly formed in the positioning plate, the positioning block is arranged in the positioning groove, a chip is sucked into the positioning groove, the through hole is formed in the positioning block, the air pump is arranged in the rotating arm and connected with the flexible wrapping pipe through the connecting pipe, the telescopic pipe is connected between the flexible wrapping pipe and the positioning block, the sealing connection between the connecting pipe and the telescopic pipe with adjustable caliber is ensured by the arrangement of the flexible wrapping pipe, the pressing block is arranged at the end part of the connecting rod, the pressing block is arranged between the pressing block and the extrusion positioning plate in an extrusion sliding fit mode, the extrusion positioning plate horizontally slides in a movable groove formed in the positioning plate, the periphery of the chip is clamped by the extrusion positioning plate, and the position of the chip after the air suction is further adjusted, and the triangular extrusion block arranged on the outer side of the telescopic pipe is in an extrusion sliding fit mode.
Preferably, the telescopic pipe comprises a U-shaped pipe and flexible edges, the left side and the right side of the lower end of the positioning block symmetrically slide to be provided with the U-shaped pipe, the flexible edges are connected between the U-shaped pipes, the U-shaped pipe and the flexible edges form a pipe body of a return structure, and a reset spring is connected to the inside of the telescopic pipe and plays a role in resetting.
Because flexible edge material is adopted at the middle part of flexible pipe, when ascending pressing block extrudees the triangle extrusion piece, the U type pipe of both sides moves in opposite directions for the space in the flexible pipe reduces, and the through-hole quantity with flexible pipe intercommunication reduces this moment, under equal air suction effect, the through-hole after reducing has increased the suction, and the clamp of extrusion locating plate to the chip periphery is again cooperated, thereby carries out dual fixation to the chip, does benefit to follow-up film scraping, pad pasting processing.
Preferably, the pressing block comprises a lifting sleeve and a pressing piece, the lifting sleeve is connected with the connecting rod, the pressing piece is symmetrically arranged at the upper end of the lifting sleeve, the upper end of the pressing piece is provided with a drag reduction bead in a rolling mode, the drag reduction bead is attached to the inclined surface of the extrusion positioning plate, the drag reduction bead reduces resistance during extrusion, the inclined surface of the extrusion positioning plate is of a gradually upward inclined structure from inside to outside, an internal spring is connected between the extrusion positioning plate and the movable groove, the extrusion positioning plate can be used for positioning a chip according to the setting of the pressing block, the telescopic pipe can be used for adjusting the air suction area, and the extrusion positioning plate can be reset under the driving of the internal spring after the film pouring is completed.
Preferably, the chip cleaning assembly comprises a storage box, a spray head and a cleaning brush, the storage box is arranged at the upper end of the first connecting plate, the spray head is arranged at the lower end of the first connecting plate, the spray head is communicated with the storage box through a communicating pipe, the cleaning brush arranged at the rear of the spray head is arranged at the lower end of the first connecting plate, and the chip surface residual glue layer can be cleaned after the film removal is completed.
Preferably, the linkage assembly comprises a gear, a first rack plate and a second rack plate, a rotating motor is arranged on the outer wall of the supporting frame, a gear is arranged on an output shaft of the rotating motor, the first rack plate is meshed with the outer side of the gear, the second rack plate is meshed with the inner side of the gear, the second rack plate is fixedly connected with the lifting plate, the second rack plate can be driven to descend when the gear rotates, the second rack plate is driven to ascend, the upper end L-shaped structure of the membrane removing knife corresponds to the position between the lifting plate, and the lifting plate can lift a sliding block arranged by the membrane removing knife to the same height as the first U-shaped rail after ascending.
Preferably, the knife tip cleaning component comprises a connecting plate II, a mounting plate, a fixed cleaning plate, a movable cleaning plate, an extruding plate and a connecting plate III, wherein the connecting plate II is arranged on the rack plate I, the mounting plate is arranged at the rear end of the connecting plate II, the fixed cleaning plate is arranged at the upper end of the mounting plate, an inclined chute is formed in the mounting plate, the inclined chute is of a gradually downward inclined structure from front to back, the movable cleaning plate is slidably arranged in the inclined chute, the extruding plate matched with the movable cleaning plate is arranged on the supporting frame through the connecting plate III, when the rack plate I drives the connecting plate II to descend, the movable cleaning plate is obliquely upwards slid under the extrusion of the extruding plate so as to be in the same height position as the fixed cleaning plate, at the moment, the fixed cleaning plate and the movable cleaning plate are respectively clung to the two sides of the film removing knife, the fixed cleaning plate and the movable cleaning plate are driven to synchronously descend along with the second connecting plate, and the film removing knife ascends, so that the lower knife tip part of the film removing knife is scraped by the fixed cleaning plate and the movable cleaning plate.
Preferably, the upper end of the fixed cleaning plate is provided with a first flexible wiping head, and the upper end of the movable cleaning plate is provided with a second flexible wiping head.
Preferably, the first pressing component comprises a U-shaped frame, a first air cylinder, a pressing plate and a connecting rod, the U-shaped frame is arranged at the upper end of the shell, the first air cylinder is connected between the U-shaped frame and the pressing plate, the connecting rod is arranged at the lower end of the pressing plate, and the connecting rod penetrates into the shell to be connected with the film pasting component.
Preferably, the pad pasting subassembly includes the hot plate, cuts the membrane sword, the hot plate slides from top to bottom and sets up the lower extreme at the connecting rod, the setting of hot plate is on the one hand to blue membrane suppression, on the other hand carries out the heating solidification to the glue solution layer of blue membrane lower surface, and be connected with compression spring between hot plate and the connecting rod, compression spring plays the effect that resets, the hot plate is arranged in cutting the membrane sword of returning the structure, cut fixed connection between the upper end of membrane sword and the connecting rod, stop to descend after the hot plate contacts the chip surface, the connecting rod still continues to drive to cut the membrane sword to descend this moment, thereby cut the membrane to the blue membrane after the suppression and handle.
Preferably, the power supply, the start key and the heating plate which are arranged in the power supply assembly are electrically connected, the start key corresponds to the position of the pressing plate, the pressing plate is contacted with the start key after being lowered to the lowest position, and accordingly the start key is triggered, and the power supply assembly supplies power to the heating plate for heating.
Preferably, the second pressing component comprises a second electric sliding block, a connecting frame and a pressing frame, the second electric sliding block is arranged on the supporting plate, the connecting frame is connected to the second electric sliding block, the pressing frame is connected between the connecting frames, the electric rollers are symmetrically arranged at the left end and the right end of the pressing frame, and the second electric sliding block can drive the pressing frame to descend when descending.
Preferably, the limit component comprises a compression tightening block, a movable tightening block, a limit wheel and a glue solution collecting frame, wherein the movable tightening block attached to the upper surface of the blue film is arranged on a pressing frame, the compression tightening block positioned below the movable tightening block is arranged on a shell, and in the descending process of the movable tightening block, the movable tightening block and the compression tightening block below clamp the blue film and then wholly and synchronously descend, so that the tension adjustment is carried out on the blue film, the surface of the blue film is smooth during film pasting, the upper end of the compression tightening block is uniformly provided with a pressing column, the arrangement of the pressing column ensures that the blue film is in multi-point contact when contacting with the compression tightening block, but does not contact in a large area, the condition that the blue film is continuously stuck on the compression tightening block after the pressing frame drives the movable tightening block to rise is avoided, the limiting wheel located on the inner side of the compression tightening block is rotationally arranged on the fixing frame, the fixing frame is arranged on the pressing frame, the limiting wheel can limit the position of the blue film, the height of the limiting wheel is higher than that of the frame, when the blue film passes through the limiting wheel and the frame, only the blue film part in contact with the lower surface of the frame is located at the lowest position (the part of the blue film is the part to be adhered with the film), the rest blue film part is higher than the position of the part of the blue film, the rest blue film part is prevented from being adhered with the adhesive solution of the locating plate when the film is adhered, the adhesive solution collecting frame is arranged at the lower end of the fixing frame, the adhesive removing shovel arranged inside the adhesive solution collecting frame is tightly attached to the surface of the limiting wheel, and the adhesive solution adhered to the surface of the limiting wheel can be cleaned by the adhesive removing shovel.
In summary, the present application includes at least one of the following beneficial technical effects:
1. according to the chip film pouring equipment, the conveyed chips are subjected to centralized positioning treatment in a dual positioning mode of air suction and mechanical clamping, then the positioned chips are subjected to film scraping treatment through the film removing knife with adjustable height and the chip cleaning assembly, and then the film scraped chips are subjected to blue film tightening type descending, pressing and cutting, so that the surfaces of the blue film-attached chips are subjected to blue film sticking, and meanwhile, the glue solution layer of the blue film is subjected to curing treatment through an added heating function, so that the possibility of film stripping is reduced;
2. the positioning mechanism is arranged, the chip is sucked into the positioning groove in an air suction mode, then the extrusion positioning plate is gradually closed in an extrusion mode, so that the chip is subjected to position adjustment and mechanical clamping, meanwhile, the caliber of the telescopic pipe is reduced under the action of extrusion force, the communication quantity of the through hole is reduced, the air suction force is increased in a necking and air gathering mode, the chip is further subjected to reinforced air suction positioning, and the positioning mechanism can simultaneously position a plurality of chips at a time and is suitable for production line production;
3. the film removing mechanism is arranged, the film removing knife achieves the effect of single film scraping by adopting a height difference mode, the condition that the film removing knife is in direct contact with the upper surface of a chip when retreating is avoided, the knife tip of the film removing knife is processed, and the knife tip is scraped and cleaned by descending the knife tip cleaning component and lifting the film removing knife, so that the cleaning efficiency is improved;
4. The setting of pad pasting mechanism is tightly handled the blue membrane through spacing subassembly for the blue membrane is in the state of tightening before the pad pasting, avoids the condition of fold to appear, and adopts pushing down, cuts the synchronous integration mode of material to carry out the pad pasting processing at pad pasting in-process, thereby the solidification of glue layer has been accelerated to the heating plate after the while is to the pad pasting after cutting, has reduced the possibility of taking off the membrane.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a cross-sectional view A-A of FIG. 2 in accordance with the present invention;
FIG. 4 is a cross-sectional view of the film attachment mechanism of the present invention;
FIG. 5 is a cross-sectional view of the positioning mechanism of the present invention;
FIG. 6 is a partial cross-sectional view of the membrane removal mechanism of the present invention;
FIG. 7 is an enlarged view of the invention at B of FIG. 3;
FIG. 8 is an enlarged view of FIG. 4 at C in accordance with the present invention;
FIG. 9 is an enlarged view of the invention at D of FIG. 4;
FIG. 10 is an enlarged view of FIG. 5 at E in accordance with the present invention;
fig. 11 is a top view of the telescoping tube 38 of the present invention.
Reference numerals illustrate: 1. a bottom plate; 2. a rotation mechanism; 3. a positioning mechanism; 4. a support frame; 5. a film removing mechanism; 6. a support plate; 7. a film pasting mechanism; 21. a working motor; 22. a cross rotating arm; 23. an electric rotating shaft; 31. a rotating arm; 32. a positioning plate; 33. a positioning groove; 34. a through hole; 35. an air pump; 36. a connecting pipe; 37. a flexible wrap tube; 38. a telescopic tube; 39. a second cylinder; 40. pressing the blocks; 41. extruding the positioning plate; 51. u-shaped rail I; 52. u-shaped rails II; 53. an electric sliding block I; 54. a first connecting plate; 55. a film removing knife; 56. a chip cleaning assembly; 57. a lifting plate; 58. a linkage assembly; 59. a nose cleaning assembly; 60. a slide block; 71. a housing; 72. a first pressing component; 73. a film pasting component; 74. a power supply assembly; 75. a frame; 76. a second pressing component; 77. a motorized roller; 78. a limit component; 79. a glue gun; 381. a U-shaped tube; 382. a flexible edge; 401. a lifting sleeve; 402. a pressing member; 561. a storage bin; 562. a spray head; 563. a cleaning brush; 581. a gear; 582. rack plate I; 583. rack plate II; 591. a second connecting plate; 592. a mounting plate; 593. fixing a cleaning plate; 594. moving the cleaning plate; 595. an extrusion plate; 596. a third connecting plate; 721. a U-shaped frame; 722. a first cylinder; 723. pressing the plate; 724. a connecting rod; 731. a heating plate; 732. a film cutting knife; 761. an electric sliding block II; 762. a connecting frame; 763. a pressing frame; 781. compressing the tightening block; 782. moving the tightening block; 783. a limiting wheel; 784. and a glue solution collecting frame.
Detailed Description
The application is described in further detail below with reference to fig. 1-11.
The embodiment of the application discloses a chip film pouring device, which reduces the possibility of damage to a chip in the film pouring process and greatly improves the efficiency and practicability of film pouring by finely dividing the film pouring process and improving a film removing knife 55 and a film pasting component 73.
Referring to fig. 1-2, a chip film pouring device disclosed in this embodiment includes a base plate 1, a rotating mechanism 2, a positioning mechanism 3, a supporting frame 4, a film removing mechanism 5, a supporting plate 6, and a film attaching mechanism 7, wherein the rotating mechanism 2 is installed in the middle of the base plate 1, the positioning mechanism 3 is uniformly arranged around the rotating mechanism 2, the supporting frame 4 is installed at the left end of the base plate 1, the film removing mechanism 5 is provided on the supporting frame 4, the supporting plate 6 is installed at the rear end of the base plate 1, and the film attaching mechanism 7 is installed on the supporting plate 6.
Referring to fig. 1, fig. 3, and fig. 6-7, in the film removing process of the chip surface, part of glue solution adheres to the tip part of the film removing knife 55 in the film scraping process and may scratch the exposed chip surface in the film removing knife 55 moving back process, after the situation is considered, the film removing knife 55 and related structures are adjusted according to the application, specifically, the film removing mechanism 5 comprises a first U-shaped rail 51, a second U-shaped rail 52, an electric slide block 53, a connecting plate 54, the film removing knife 55, a chip cleaning component 56, a lifting plate 57, a linkage component 58, a knife tip cleaning component 59 and a slide block 60, side plates are symmetrically arranged on the left side and the right side of the support frame 4, the first U-shaped rail 51, the second U-shaped rail 52 and the electric slide block 53 are sequentially arranged from top to bottom, the connecting plate 54 is sequentially provided with a lifting film removing knife 55 and a chip cleaning component 56, the chip cleaning component 56 is used for spraying and wiping the residual glue layer on the chip surface after the film scraping, the lifting plate 57 is arranged on the support frame 55, the lifting plate 57 matched with the film removing knife is arranged on the first U-shaped rail 55, the sliding plate is arranged on the support frame 55 and is in a sliding manner and is connected with the two U-shaped rail 52 by the two side plates through the two side rails 52, and the sliding component 60, and the side plate is arranged on the side of the support frame 52 is in a sliding mode and is connected with the two side rail 52 and has a certain sliding mode, and a certain sliding mode is arranged on the side between the side plate 55 and a side is provided.
Referring to fig. 1, fig. 4, and fig. 8-9, in order to re-paste the surface of a chip, the application is provided with a film pasting mechanism 7 with adjustable tightness of a blue film and heating and solidifying glue solution in the film pasting process, specifically, the film pasting mechanism 7 comprises a shell 71, a first pressing component 72, a film pasting component 73, a power supply component 74, a frame 75, a second pressing component 76, an electric roller 77, a limiting component 78 and a glue gun 79, wherein the shell 71 is arranged on a supporting plate 6, the upper end of the shell 71 is provided with the first pressing component 72, the lower end of the first pressing component 72 is connected with the film pasting component 73, the film pasting component 73 is electrically connected with the power supply component 74 arranged on the shell 71, the film pasting component 73 is positioned in the frame 75, the frame 75 is arranged on the second pressing component 76, the second pressing component 76 is slidably arranged on the shell 71, the left side and the right side of the second pressing component 76 are rotatably provided with electric rollers 77, a blue film is wound between the electric rollers 77, a limiting component 78 for controlling the tensioning of the blue film is arranged between the second pressing component 76 and the shell 71, the glue gun 79 is arranged in the shell 71, the glue gun 79 is coated on the spout of the blue film, and the glue gun 79 is coated on the surface of the chip, which is adhered to the surface of the blue film is uniform.
By adopting the technical scheme, in the actual working process, the chip to be reverse molded is placed in the positioning mechanism 3, then the chip is positioned and fixed through the positioning mechanism 3, at the moment, the positioning mechanism 3 is driven by the rotating mechanism 2 to rotate clockwise to the position right below the film removing mechanism 5, then the film removing knife 55 moves forwards under the drive of the electric sliding block I53 (because the sliding blocks 60 arranged on the left side and the right side of the film removing knife 55 slide in the U-shaped rail II 52 temporarily, the knife tip of the film removing knife 55 is fixed at the lowest point and is level with the height of the upper surface of the fixed chip at the moment), the blue film on the surface of the chip is cleaned through the film removing knife 55, at the moment, the residual adhesive layer after the chip is scraped by the chip cleaning component 56 which moves synchronously at the moment, when the connecting plate I54 moves to the forefront end, at the moment, the knife tip part of the film removing knife 55 is positioned in the knife tip cleaning component 59, the upper end of the film removing knife 55 is clamped with the lifting plate 57 (at the moment, the sliding block 60 of the film removing knife 55 is separated from the U-shaped rail II 52), then the lifting plate 57 and the knife tip cleaning component 59 are driven to move up and down reversely through the linkage component 58, the film removing knife 55 is driven to lift through the lifting plate 57 (the position between the lifted sliding block 60 and the U-shaped rail I51 corresponds to the current clamping sliding state), the film removing knife 55 is wiped by the knife tip cleaning component 59 in the descending state, the connecting plate I54 is driven to move backwards through the electric sliding block I53, the sliding block 60 is clamped into the U-shaped rail I51 at the moment, so that high-position movement is carried out (the lifted film removing knife 55 is not contacted with the upper surface of a chip, scratch condition caused by direct contact between the film removing knife 55 and the surface of the chip is avoided), after the connecting plate I54 is reset, the positioning mechanism 3 continues to rotate clockwise by ninety degrees, when the position corresponding to the film pasting mechanism 7 is reached, the glue layer is smeared on the lower surface of the blue film to be pasted through the glue coating gun 79, the electric roller 77 and the limiting component 78 are driven to descend through the pressing component II 76, so that the blue film is tightened, the film pasting component 73 is driven to descend through the pressing component I72, the upper end of a chip is pasted again and cut, meanwhile, the pressing component I72 touches the power supply component 74, the electrified power supply component 74 heats the cut film, so that the solidification of a glue layer is accelerated (the heating temperature does not influence the blue film performance), and at the moment, the chip reverse is completed.
Referring to fig. 1-2, in order to drive the positioning mechanism 3 to perform the subsequent process, the application is provided with a rotating mechanism 2, specifically, the rotating mechanism 2 comprises a working motor 21, a cross rotating arm 22 and an electric rotating shaft 23, the working motor 21 is installed in the middle of the bottom plate 1, the cross rotating arm 22 is installed at the upper end of the working motor 21, the cross rotating arm 22 drives the positioning mechanism 3 to rotate in the horizontal direction, the electric rotating shaft 23 is arranged at the outer side of the cross rotating arm 22, the electric rotating shaft 23 mainly plays a role of longitudinally rotating the positioning mechanism 3, and the positioning mechanism 3 can rapidly rotate for one hundred eighty degrees after adsorbing a chip to be film-poured, so that the film to be scraped on the chip is upwards arranged.
In the actual rotation process, after the chip to be subjected to mold pouring is placed into the positioning mechanism 3, the positioning mechanism 3 is driven by the electric rotating shaft 23 to turn over one hundred and eighty degrees, so that the part of the chip to be scraped is upward, and then the cross rotating arm 22 and the positioned chip are driven by the working motor 21 to rotate to a proper position.
Referring to fig. 1-3, fig. 5, and fig. 10, in order to further improve positioning accuracy in a chip positioning process, the application is provided with a clamping and air suction integrated double clamping structure, specifically, the positioning mechanism 3 comprises a rotating arm 31, a positioning plate 32, a positioning groove 33, a through hole 34, an air pump 35, a connecting pipe 36, a flexible wrapping pipe 37, a telescopic pipe 38, a cylinder two 39, a pressing block 40 and an extrusion positioning plate 41, wherein the rotating arm 31 is installed at the outer side of the electric rotating shaft 23, the positioning plate 32 is arranged on the rotating arm 31, the positioning plate 32 is uniformly provided with the positioning groove 33, a positioning block is arranged in the positioning groove 33, a chip is sucked into the positioning groove 33, the positioning block is provided with the through hole 34, the air pump 35 is arranged in the positioning block, the air pump 35 is connected with the flexible wrapping pipe 37 through the connecting pipe 36, the telescopic pipe 38 is connected with the positioning block, the sealing connection between the connecting pipe 36 and the telescopic pipe 38 with an adjustable caliber, the positioning plate 32 is provided with the cylinder two 39, the extending end of the cylinder two 39 is connected with the connecting rod, the pressing block 40 is installed at the end of the connecting rod, the pressing block 40 is matched with the extrusion positioning block 40 in a sliding mode, and the middle part of the pressing block 41 is further arranged at the periphery of the die 41, and is matched with the positioning block to be arranged at the periphery of the sliding position of the positioning block, and the sliding block is matched with the positioning block to be pressed to the positioning block 41.
Referring to fig. 5 and fig. 10-11, after the positioning of the chip is completed, in order to apply a larger suction force to the chip and make the clamping of the chip more stable, the application is provided with the telescopic tube 38 with an adjustable caliber, specifically, the telescopic tube 38 comprises a U-shaped tube 381 and a flexible edge 382, the left side and the right side of the lower end of the positioning block are symmetrically and slidingly provided with the U-shaped tube 381, the flexible edge 382 is connected between the U-shaped tube 381, the U-shaped tube 381 and the flexible edge 382 form a tube body with a return spring, the return spring plays a role in resetting, and because the middle part of the telescopic tube 38 adopts a flexible edge material, when the ascending pressing block 40 presses the triangular pressing block, the U-shaped tubes 381 on two sides move oppositely, so that the space in the telescopic tube 38 is reduced, at the moment, the number of through holes 34 communicated with the telescopic tube 38 is reduced, under the same air suction effect, the reduced through holes 34 are increased in suction force, and then the telescopic positioning plate 41 is matched for clamping the periphery of the chip, thereby performing double fixation on the chip, and facilitating the subsequent film scraping and film pasting treatment.
Referring to fig. 5 and fig. 10-11, the chip is not firmly clamped after being sucked into the positioning groove 33, so that the application is provided with a pressing block 40 for adjusting the position of the extrusion positioning plate 41 and the suction area of the telescopic tube 38 so as to achieve the double clamping effect, specifically, the pressing block 40 comprises a lifting sleeve 401 and a pressing piece 402, the lifting sleeve 401 is connected with a connecting rod, the pressing piece 402 is symmetrically arranged at the upper end of the lifting sleeve 401, the upper end of the pressing piece 402 is provided with a drag reduction bead in a rolling way, the drag reduction bead is attached to the inclined surface of the extrusion positioning plate 41, the drag reduction bead reduces the resistance during extrusion, the inclined surface of the extrusion positioning plate 41 is of a structure of gradually inclining upwards from inside to outside, an internal spring is connected between the extrusion positioning plate 41 and the movable groove, the arrangement of the pressing block 40 ensures that the extrusion positioning plate 41 can position the chip, and the 38 can adjust the suction area, and the extrusion positioning plate 41 can reset under the driving of the internal spring after the film pouring.
In the actual positioning process of the chip, the air pump 35 attracts the chip under negative pressure through the through hole 34 connected with the connecting pipe 36, the chip enters the positioning groove 33 under the action of the suction force, the air cylinder II 39 drives the lifting sleeve 401 to ascend through the connecting rod, the synchronously ascending pressing piece 402 extrudes the inclined surface of the extrusion positioning plate 41, the extrusion positioning plate 41 extrudes inwards through the movable groove arranged on the positioning plate 32, the position of the chip after the air suction is adjusted, the accurate positioning and clamping of the chip are realized, meanwhile, the middle part of the ascending pressing piece 402 extrudes the triangular extrusion piece outside the U-shaped pipe 381 (the flexible edge 382 is connected between the U-shaped pipes 381, and the U-shaped pipe 381 and the flexible edge 382 form a pipe body with a loop structure, so the caliber adjustment of the telescopic pipe 38 can be realized), at the moment, the air suction area of the telescopic pipe 38 is reduced, the number of the through holes 34 communicated with the air pump 35 is reduced, the suction force of the through holes 34 corresponding to the positioned chip position is increased, and the positioning and double fixing effect of the chip is realized.
Referring to fig. 6-7, in order to clean the surface of the chip after removing the film, the application is provided with a chip cleaning assembly 56, specifically, the chip cleaning assembly 56 includes a storage tank 561, a spray head 562, and a cleaning brush 563, the storage tank 561 is installed at the upper end of the first connecting plate 54, the spray head 562 is installed at the lower end of the first connecting plate 54, the spray head 562 is communicated with the storage tank 561 through a communicating pipe, the cleaning brush 563 located behind the spray head 562 is installed at the lower end of the first connecting plate 54, and after the film removal is completed, the residual glue layer on the surface of the chip can be cleaned.
In the actual cleaning process, the first electric slider 53 drives the first connecting plate 54 to move forwards, after the film removing knife 55 scrapes the blue film on the surface of the chip, the storage tank 561 behind the film removing knife 55 sprays the adhesive on the surface of the chip through the spray heads 562, and then the cleaning brush 563 behind the spray heads 562 wipes and cleans residues on the surface of the chip.
Referring to fig. 1, 3 and 6-7, in order to ensure that the film removing knife 55 moves at a high position and cleans the knife tip of the film removing knife 55 during retraction, the application controls the height of the film removing knife 55 and the cleaning of the knife tip through the cooperation of the linkage assembly 58 and the knife tip cleaning assembly 59, specifically, the linkage assembly 58 comprises a gear 581, a first rack plate 582 and a second rack plate 583, a rotating motor is arranged on the outer wall of the supporting frame 4, a gear 581 is arranged on an output shaft of the rotating motor, the first rack plate 582 is meshed with the outer side of the gear 581, the second rack plate 583 is fixedly connected with the lifting plate 57, the first rack plate 582 can be driven to descend when the gear 581 rotates, the second rack plate 583 is driven to ascend, the upper end L-shaped structure of the film removing knife 55 corresponds to the position between the lifting plate 57, and the sliding block 60 arranged on the film removing knife 55 can be lifted to the height equal to the first U-shaped rail 51 after the lifting plate 57 ascends.
Referring to fig. 1, 3 and 7, the blade tip cleaning assembly 59 includes a second connecting plate 591, a mounting plate 592, a fixed cleaning plate 593, a movable cleaning plate 594, a pressing plate 595 and a third connecting plate 596, the second connecting plate 591 is mounted on the first rack plate 582, the rear end of the second connecting plate 591 is provided with the mounting plate 592, the upper end of the mounting plate 592 is provided with the fixed cleaning plate 593, the mounting plate 592 is provided with an inclined chute, the inclined chute is of a structure of gradually inclining downwards from front to back, the movable cleaning plate 594 is slidingly disposed in the inclined chute, the pressing plate 595 in press fit with the movable cleaning plate 594 is mounted on the supporting frame 4 through the third connecting plate 596, when the first rack plate 582 drives the second connecting plate 591 to descend, the movable cleaning plate 594 slides upwards under the pressing of the pressing plate 595 to be in an equal height position with the fixed cleaning plate 593, the fixed cleaning plate 593 and the movable cleaning plate 594 are respectively clung to two sides of the film removal blade 55 at this moment, and the second connecting plate 591 continues to drive the fixed cleaning plate 593, the movable cleaning plate 594 to descend synchronously, and the film removal blade 55 is removed by the upper end of the movable cleaning plate 594 and the movable blade 5955 moves down through the fixed blade 55.
In the actual movement process of the film removing knife 55, after the film removing knife 55 moves to the forefront end, the upper end L-shaped structure of the film removing knife 55 is clamped with the lifting plate 57, the rotating motor drives the gear 581 to rotate, at the moment, the rack I582 descends, the rack II 583 ascends, the descending rack I582 drives the mounting plate 592 to descend, the movable cleaning plate 594 moves upwards obliquely under the extrusion of the extrusion plate 595 so as to be arranged at the same height as the fixed cleaning plate 593, at the moment, the mounting plate 592 continues to descend, the fixed cleaning plate 593 and the movable cleaning plate 594 arranged at the same height scrape and clean the lower end knife tip part of the film removing knife 55, at the same time, the ascending rack II 583 drives the lifting plate 57 to ascend, thereby driving the film removing knife 55 to ascend synchronously, at the moment, the sliding block 60 arranged on the film removing knife 55 is ascended to the same height position as the U-shaped rail I51, at the moment, the connecting plate I54 is then driven by the electric sliding block I53, the film removing knife 55 moves to the rearmost side, and when the film removing knife 55 moves to the rearmost side, the film removing knife 55 is separated from the U-shaped rail I51 at the initial position (at the lowest position).
Referring to fig. 3 and 7, in the process of cleaning the lower end knife edge of the film removing knife 55 by the fixed cleaning plate 593 and the movable cleaning plate 594, in order to further improve the scraping efficiency, the flexible wiping head one is arranged at the upper end of the fixed cleaning plate 593, the flexible wiping head two is arranged at the upper end of the movable cleaning plate 594, and the flexible wiping head one and the flexible wiping head two are arranged so as to be more attached to the knife surface of the film removing knife 55, thereby improving the scraping purity.
Referring to fig. 1, 4 and 8, in order to enable the blue film to be further attached to the surface of the chip and accelerate the curing of the glue solution in the film attaching process, the application is provided with a pressing component 72, a film attaching component 73 and a power supply component 74 which are matched, specifically, the pressing component 72 comprises a U-shaped frame 721, a first cylinder 722, a pressing plate 723 and a connecting rod 724, the upper end of the shell 71 is provided with the U-shaped frame 721, the first cylinder 722 is connected between the U-shaped frame 721 and the pressing plate 723, the lower end of the pressing plate 723 is provided with the connecting rod 724, and the connecting rod 724 extends into the shell 71 to be connected with the film attaching component 73.
Referring to fig. 1, 4 and 8, the film pasting component 73 includes a heating plate 731 and a film cutting knife 732, the heating plate 731 is arranged at the lower end of the connecting rod 724 in a vertically sliding manner, the heating plate 731 is arranged to press the blue film on one side and heat and solidify the glue solution layer on the lower surface of the blue film on the other side, a compression spring is connected between the heating plate 731 and the connecting rod 724, the compression spring plays a role in resetting, the heating plate 731 is located in the film cutting knife 732 with a return structure, the upper end of the film cutting knife 732 is fixedly connected with the connecting rod 724, and when the heating plate 731 contacts the surface of a chip, the connecting rod 724 still continues to drive the film cutting knife 732 to descend, so that the pressed blue film is cut.
Referring to fig. 1, 4 and 8, the power supply, the start key and the heating plate 731 are electrically connected, the start key corresponds to the position of the pressing plate 723, the pressing plate 723 descends to the lowest position and contacts with the start key, so as to trigger the start key, and at this time, the power supply assembly 74 supplies power to and heats the heating plate 731.
In the actual film pasting process, after the chip reaches the designated position, the first cylinder 722 drives the connecting rod 724 to be pressed downwards through the pressing plate 723, the heating plate 731 arranged at the lower end of the connecting rod 724 in a sliding manner presses the blue film to be attached to the surface of the chip (the heating plate 731 is elastically connected with the connecting rod 724, the height of the heating plate 731 does not continuously descend any more at the moment), the connecting rod 724 continuously descends by a small margin, thereby driving the film cutting knife 732 to cut off the blue film, simultaneously, the pressing plate 723 descends to the lowest position and is contacted with the starting key of the power supply assembly 74, thereby triggering the starting key, at the moment, the power supply assembly 74 supplies power to the heating plate 731 to heat and solidify the glue solution layer on the lower surface of the blue film, and film pasting is completed.
Referring to fig. 1-2, fig. 4-5 and fig. 9, in order to avoid the occurrence of the conditions of sticking the positioning plate 32 or wrinkling of the blue film in the film sticking process, the application is provided with a second pressing assembly 76 and a limiting assembly 78, specifically, the second pressing assembly 76 comprises a second electric slide block 761, a connecting frame 762 and a pressing frame 763, the second electric slide block 761 is mounted on the supporting plate 6, the connecting frame 762 is connected to the second electric slide block 761, the pressing frame 763 is connected between the connecting frames 762, electric rollers 77 are symmetrically arranged at the left end and the right end of the pressing frame 763, and the second electric slide block 761 can be driven to descend when descending.
Referring to fig. 4-5 and 8-9, the limiting component 78 includes a compression tightening block 781, a movable tightening block 782, a limiting wheel 783, and a glue collecting frame 784, the movable tightening block 782 attached to the upper surface of the blue film is mounted on a pressing frame 763, the compression tightening block 781 located below the movable tightening block 782 is mounted on the housing 71, during the descending process of the movable tightening block 782, the movable tightening block 782 and the compression tightening block 781 below clamp the blue film and then descend integrally and synchronously, so as to tension and adjust the blue film, ensure the surface of the blue film to be flat during film pasting, ensure that the upper end of the compression tightening block 781 is uniformly provided with a pressing column, ensure that the blue film is in multi-point contact with the compression tightening block 781, but does not contact in a large area, so that the situation that the pressing frame 763 drives the movable tightening block 782 to lift and then the blue film is continuously adhered to the compression tightening block 781 is avoided, the limiting wheel 783 positioned on the inner side of the compression tightening block 781 is rotatably arranged on the fixing frame, the fixing frame is arranged on the pressing frame 763, the limiting wheel 783 can limit the position of a blue film, the height of the limiting wheel 783 is higher than that of the frame body 75, when the blue film passes through the limiting wheel 783 and the frame body 75, only the blue film part contacted with the lower surface of the frame body 75 is positioned at the lowest position (the blue film part is a film part to be pasted), the rest blue film part is higher than the position of the blue film part, the rest blue film part is ensured not to be glued with the positioning plate 32 glue solution when the film is pasted, the glue solution collecting frame 784 is arranged at the lower end of the fixing frame, the glue removing shovel arranged inside the glue solution collecting frame 784 is tightly attached to the surface of the limiting wheel 783, and the glue solution attached to the surface of the limiting wheel 783 can be cleaned by the glue removing shovel.
In the actual film pasting process, the cut blue film is wound on the left electric roller 77 through the rotation of the electric roller 77, at the moment, the blue film above the film pasting position is a complete blue film part, the limiting wheel 783 is used for carrying out turning conveying on the blue film in the winding process, glue solution attached to the surface of the limiting wheel 783 is cleaned through the glue removing shovel, after the electric roller 77 stops rotating, the pressing frame 763 is driven to descend through the second electric slider 761, the electric roller 77, the movable tightening block 782, the limiting wheel 783 and the glue solution collecting frame 784 arranged on the pressing frame 763 descend simultaneously, and the tightness of the blue film is adjusted through the cooperation of the descending movable tightening block 782 and the compression tightening block 781, so that the blue film is ensured to be in a tightening state.
The implementation principle of the embodiment is as follows:
step one, positioning and fixing; the chip is subjected to air suction positioning through the positioning mechanism 3, then the position of the chip is adjusted through clamping all around, the chip is mechanically clamped, and meanwhile, the caliber of the telescopic pipe 38 is contracted, so that the air suction force is increased, and the chip is subjected to air suction positioning;
step two, rotating: the positioned chip is turned over for one hundred eighty degrees through the electric rotating shaft 23, so that the surface of the chip to be scraped is upwards arranged;
Step three, removing the film: the positioning mechanism 3 and the chip after the turnover are driven by the working motor 22 to rotate into the film removing mechanism 5, and the first connecting plate 54, the film removing knife 55 and the chip cleaning component 56 are driven by the first electric sliding block 53 to move forwards, so that blue films on the surface of the chip are scraped, and the method specifically comprises the following steps of:
a. the upper end face of the chip is subjected to film scraping treatment by a film removing knife 55 arranged at a low position;
b. spraying a photoresist remover on the upper surface of the chip after film scraping through a synchronously moving nozzle 562, and cleaning the surface of the chip through a cleaning brush 563;
c. when the first connecting plate 54 moves to the forefront end, the upper end L-shaped structure of the film removing knife 55 is clamped with the lifting plate 57, the lower end of the film removing knife 55 reaches between the fixed cleaning plate 593 and the movable cleaning plate 594, at the moment, the lifting plate 57 and the knife tip cleaning assembly 59 are driven to move up and down reversely through the linkage assembly 58, the film removing knife 55 is driven to ascend through the lifting plate 57, and the knife tip cleaning assembly 59 in a descending state wipes the film removing knife 55;
d. the first connecting plate 54 is driven to move backwards through the first electric sliding block 53, at the moment, the sliding block 60 is clamped into the first U-shaped rail 51 to perform high-position movement, the first electric sliding block is separated from the first U-shaped rail 51 when the film removing knife 55 moves to the rearmost side, and the film removing knife 55 descends to an initial position under the action of gravity;
And step four, film sticking: the chip after film scraping is driven by the working motor 22 to rotate into the film pasting mechanism 7, the electric roller 77 and the limiting component 78 are driven to descend by the pressing component II 76, so that the blue film is tightened, the film pasting component 73 is driven to descend by the pressing component I72, the upper end of the chip is pasted again and cut, meanwhile, the power supply component 74 is triggered by the pressing component I72, the cut film is heated by the power supply component 74 after being electrified, the solidification of a glue layer is accelerated, and film pouring is completed.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the invention, which is defined by the appended claims.
Claims (10)
1. The chip film pouring device comprises a bottom plate (1), a rotating mechanism (2), a positioning mechanism (3), a supporting frame (4), a film removing mechanism (5), a supporting plate (6) and a film pasting mechanism (7), and is characterized in that; the mid-mounting of bottom plate (1) has rotary mechanism (2), and rotary mechanism (2) evenly is provided with positioning mechanism (3) all around, and support frame (4) are installed to the left end of bottom plate (1), are provided with on support frame (4) except that membrane mechanism (5), and backup pad (6) are installed to the rear end of bottom plate (1), install pad pasting mechanism (7) on backup pad (6), wherein:
The film removing mechanism (5) comprises a U-shaped rail I (51), a U-shaped rail II (52), an electric sliding block I (53), a connecting plate I (54), a film removing knife (55), a chip cleaning component (56), a lifting plate (57), a linkage component (58), a knife tip cleaning component (59) and sliding blocks (60), wherein side plates are symmetrically arranged on the left side and the right side of the supporting frame (4), the U-shaped rail I (51), the U-shaped rail II (52) and the electric sliding block I (53) are sequentially arranged from top to bottom, the connecting plate I (54) is connected between the electric sliding blocks I (53), a lifting film removing knife (55) and a chip cleaning component (56) which are sequentially arranged from front to back are in a lifting mode, the lifting plate (57) matched with the film removing knife (55) is arranged on the supporting frame (4) in a sliding mode, the lifting plate (57) is matched with the knife tip cleaning component (59) arranged on the supporting frame (4) through the linkage component (58), the sliding blocks (60) are symmetrically arranged on the left side and the right side of the two ends of the film removing knife (55) in a temporary sliding mode in the U-shaped rail II (52);
the film pasting mechanism (7) comprises a shell (71), a first pressing component (72), a film pasting component (73), a power supply component (74), a frame body (75), a second pressing component (76), an electric roller (77), a limiting component (78) and a glue coating gun (79), wherein the shell (71) is installed on a supporting plate (6), the first pressing component (72) is arranged at the upper end of the shell (71), the film pasting component (73) is connected with the lower end of the first pressing component (72), the film pasting component (73) is electrically connected with the power supply component (74) installed on the shell (71), the film pasting component (73) is located in the frame body (75), the frame body (75) is installed on the second pressing component (76), the second pressing component (76) is arranged on the shell (71) in a sliding mode, the electric roller (77) is arranged on the left side and the right side of the second pressing component (76) in a rotating mode, a blue film is wound between the electric roller (77), the limiting component (78) for controlling the tensioning of the blue film is installed between the second pressing component (76) and the shell (71), and a spout of the blue film (79) is arranged in the shell (71) and is close to the surface of the glue coating gun.
2. The die-casting apparatus according to claim 1, wherein: the rotating mechanism (2) comprises a working motor (21), a cross rotating arm (22) and an electric rotating shaft (23), wherein the working motor (21) is installed in the middle of the bottom plate (1), the cross rotating arm (22) is installed at the upper end of the working motor (21), and the electric rotating shaft (23) is arranged on the outer side of the cross rotating arm (22).
3. The die-casting apparatus according to claim 2, wherein: the positioning mechanism (3) comprises a rotating arm (31), a positioning plate (32), a positioning groove (33), a through hole (34), an air pump (35), a connecting pipe (36), a flexible wrapping pipe (37), a telescopic pipe (38), a second cylinder (39), a pressing block (40) and an extrusion positioning plate (41), wherein the rotating arm (31) is arranged on the outer side of the electric rotating shaft (23), the positioning plate (32) is arranged on the rotating arm (31), the positioning groove (33) is uniformly arranged on the positioning plate (32), a positioning block is arranged in the positioning groove (33), the through hole (34) is arranged on the positioning block, the air pump (35) is arranged in the rotating arm (31) and connected with the flexible wrapping pipe (37) through the connecting pipe (36), the telescopic pipe (38) is connected between the flexible wrapping pipe (37) and the positioning block, the positioning plate (32) is connected with the second cylinder (39) on which the pressing block is arranged, the connecting rod is connected with the extending end of the second cylinder (39), the pressing block (40) is arranged at the end part of the connecting rod, the pressing block (40) is in extrusion sliding fit with the extrusion positioning plate (41), the horizontal sliding of the extrusion positioning plate (41) is arranged in the movable groove (32), the middle part of the pressing block (40) is in extrusion sliding fit with a triangular extrusion block arranged on the outer side of the telescopic pipe (38);
The telescopic pipe (38) comprises a U-shaped pipe (381) and flexible edges (382), the U-shaped pipe (381) is symmetrically arranged on the left side and the right side of the lower end of the positioning block in a sliding mode, the flexible edges (382) are connected between the U-shaped pipes (381), the U-shaped pipe (381) and the flexible edges (382) form a pipe body with a return structure, and a return spring is connected inside the telescopic pipe (38);
the pressing block (40) comprises a lifting sleeve (401) and a pressing piece (402), the lifting sleeve (401) is connected with the connecting rod, the pressing piece (402) is symmetrically arranged at the upper end of the lifting sleeve (401), drag reduction beads are arranged at the upper end of the pressing piece (402) in a rolling mode and are attached to the inclined surface of the extrusion positioning plate (41), the inclined surface of the extrusion positioning plate (41) is gradually inclined upwards from inside to outside, and an internal spring is connected between the extrusion positioning plate (41) and the movable groove.
4. The die-casting apparatus according to claim 1, wherein: the chip cleaning assembly (56) comprises a storage box (561), a spray head (562) and a cleaning brush (563), the storage box (561) is arranged at the upper end of the first connecting plate (54), the spray head (562) is arranged at the lower end of the first connecting plate (54), the spray head (562) is communicated with the storage box (561) through a communicating pipe, and the cleaning brush (563) positioned behind the spray head (562) is arranged at the lower end of the first connecting plate (54).
5. The die-casting apparatus according to claim 1, wherein: the linkage assembly (58) comprises a gear (581), a first rack plate (582) and a second rack plate (583), a rotating motor is arranged on the outer wall of the support frame (4), the gear (581) is installed on an output shaft of the rotating motor, the first rack plate (582) is meshed with the outer side of the gear (581), the second rack plate (583) is meshed with the inner side of the gear (581), the second rack plate (583) is fixedly connected with the lifting plate (57), and the upper end L-shaped structure of the membrane removing knife (55) corresponds to the position between the lifting plate (57).
6. The die-casting apparatus according to claim 5, wherein: the knife tip cleaning assembly (59) comprises a second connecting plate (591), a mounting plate (592), a fixed cleaning plate (593), a movable cleaning plate (594), an extrusion plate (595) and a third connecting plate (596), wherein the second connecting plate (591) is arranged on the first rack plate (582), the rear end of the second connecting plate (591) is provided with the mounting plate (592), the upper end of the mounting plate (592) is provided with the fixed cleaning plate (593), the mounting plate (592) is provided with an inclined chute, the inclined chute is of a gradually downward inclined structure from front to back, the movable cleaning plate (594) is slidably arranged in the inclined chute, and the extrusion plate (595) in extrusion fit with the movable cleaning plate (594) is arranged on the support frame (4) through the third connecting plate (596);
The upper end of the fixed cleaning plate (593) is provided with a first flexible wiping head, and the upper end of the movable cleaning plate (594) is provided with a second flexible wiping head.
7. The die-casting apparatus according to claim 1, wherein: the first pressing component (72) comprises a U-shaped frame (721), a first air cylinder (722), a pressing plate (723) and a connecting rod (724), the U-shaped frame (721) is arranged at the upper end of the shell (71), the first air cylinder (722) is connected between the U-shaped frame (721) and the pressing plate (723), the connecting rod (724) is arranged at the lower end of the pressing plate (723), and the connecting rod (724) penetrates into the shell (71) to be connected with the film pasting component (73).
8. The die-casting apparatus as claimed in claim 7, wherein: the film pasting component (73) comprises a heating plate (731) and a film cutting knife (732), the heating plate (731) is arranged at the lower end of the connecting rod (724) in a sliding mode, a compression spring is connected between the heating plate (731) and the connecting rod (724), the heating plate (731) is located in the film cutting knife (732) with a return structure, and the upper end of the film cutting knife (732) is fixedly connected with the connecting rod (724);
the power supply, the start key and the heating plate (731) which are arranged in the power supply assembly (74) are electrically connected, and the start key corresponds to the position of the pressing plate (723).
9. The die-casting apparatus according to claim 1, wherein: the second pressing assembly (76) comprises a second electric sliding block (761), a connecting frame (762) and a pressing frame (763), wherein the second electric sliding block (761) is installed on the supporting plate (6), the connecting frame (762) is connected to the second electric sliding block (761), the pressing frame (763) is connected between the connecting frames (762), and electric rollers (77) are symmetrically arranged at the left end and the right end of the pressing frame (763).
10. The die-casting apparatus as claimed in claim 9, wherein: the limiting component (78) comprises a compression tightening block (781), a movable tightening block (782), limiting wheels (783) and a glue solution collecting frame (784), the movable tightening block (782) attached to the upper surface of the blue film is installed on the pressing frame (763), the compression tightening block (781) located below the movable tightening block (782) is installed on the shell (71), extrusion columns are uniformly arranged at the upper end of the compression tightening block (781), the limiting wheels (783) located on the inner side of the compression tightening block (781) are rotatably arranged on a fixing frame, the fixing frame is installed on the pressing frame (763), the glue solution collecting frame (784) is installed at the lower end of the fixing frame, and a glue removing shovel arranged inside the glue solution collecting frame (784) is tightly attached to the surface of the limiting wheels (783).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310463481.9A CN116598242A (en) | 2023-04-26 | 2023-04-26 | Chip film pouring equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310463481.9A CN116598242A (en) | 2023-04-26 | 2023-04-26 | Chip film pouring equipment |
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| Publication Number | Publication Date |
|---|---|
| CN116598242A true CN116598242A (en) | 2023-08-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310463481.9A Pending CN116598242A (en) | 2023-04-26 | 2023-04-26 | Chip film pouring equipment |
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| Country | Link |
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| CN (1) | CN116598242A (en) |
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| JP2021070319A (en) * | 2019-11-03 | 2021-05-06 | 邵倩倩 | One-sided film sticking device |
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| US20220044942A1 (en) * | 2018-09-20 | 2022-02-10 | Jiangsu Chiangjiang Electronics Technology Co., Ltd | Packaging method and packaging device for selectively encapsulating packaging structure |
| CN218024148U (en) * | 2022-07-04 | 2022-12-13 | 福建兆元光电有限公司 | Automatic film pouring device for chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011129647A (en) * | 2009-12-16 | 2011-06-30 | Shinapex Co Ltd | Reworking device for chip component, and set pin used for the same |
| CN108735665A (en) * | 2017-04-18 | 2018-11-02 | 扬州晶新微电子有限公司 | A kind of semiconductor chip turns over film method |
| KR20190102745A (en) * | 2018-02-27 | 2019-09-04 | 문영엽 | Molding apparatus and method for flip chip pakaging |
| US20220044942A1 (en) * | 2018-09-20 | 2022-02-10 | Jiangsu Chiangjiang Electronics Technology Co., Ltd | Packaging method and packaging device for selectively encapsulating packaging structure |
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