CN103794683A - Novel inverted film technology - Google Patents
Novel inverted film technology Download PDFInfo
- Publication number
- CN103794683A CN103794683A CN201210441225.1A CN201210441225A CN103794683A CN 103794683 A CN103794683 A CN 103794683A CN 201210441225 A CN201210441225 A CN 201210441225A CN 103794683 A CN103794683 A CN 103794683A
- Authority
- CN
- China
- Prior art keywords
- chip
- ring
- film
- inverted
- pour mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
The invention relates to a novel inverted film technology. The technology comprises the following steps that a chip with cracks after being diced by a dicing saw and a collapsing ring are flatly placed on an inverted film machine according to a back side of the chip; an inverted film ring uniformly covers the collapsing ring and the chip is ensured to be at a center position of an inner ring of the inverted film ring; a blue film covers the collapsing ring and a super clean cloth is used to wipe the chip lightly from the center of the chip to two sides of the chip till that the blue film and the chip are completely pasted together and there is no bubble; a circumference knife on the inverted film machine is used to cut off the redundant blue film; the collapsing ring is overturned for 180 degrees and then is flatly placed on a bench surface of the inverted film machine; one corner of a white film is rived and the white film is lightly off the inverted film ring; the inverted film ring is in an annular shape and an inner ring diameter is 0.5cm-1.5cm greater than a diameter of the chip. By using the technology of the invention, operation is simple; time is saved and unnecessary wastes are reduced.
Description
Technical field
The present invention relates to a kind of new pour mask technique, belong to LED production field.
Background technology
In pour mask technique in the past, for complete LED chip, can carry out faster pour mask work.But in scribing processes, due to the defect of chip itself or operating personnel's error, easily on chip, crack, now adopt traditional pour mask technique, chip need to be separated along crackle, not only troublesome poeration, and to sop up multi coil core in cracks, can produce unnecessary waste.
Summary of the invention
The present invention is directed to deficiency, a kind of new pour mask technique is provided.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of new pour mask technique, it is characterized in that, and described method step comprises:
The chip that has crackle from scribing machine has been drawn is lain on pour mask machine by chip back together with collapsing ring;
Described in reversed-membrane ring is covered on uniformly, collapse ring upper, and guarantee that described chip encircles middle position in described reversed-membrane ring;
Blue film is covered to collapse ring upper, with ultra-clean cloth from chip centre to chip both sides gently wiping come, until blue film and chip are pasted together completely and guarantee without bubble;
Unnecessary blue film is cut down with the circumference cutter on pour mask machine;
Described in inciting somebody to action, collapse 180 ° of ring upsets, lie on pour mask machine table top;
Tear tunica albuginea one jiao, gently tunica albuginea is peeled from described reversed-membrane ring.
Further, described reversed-membrane ring is annular, and interior ring diameter is than the large 0.5cm-1.5cm of chip diameter.
The invention has the beneficial effects as follows: the present invention is simple to operate, save time, and reduced unnecessary waste.
Embodiment
Below principle of the present invention and feature are described, example, only for explaining the present invention, is not intended to limit scope of the present invention.
A new pour mask technique, is characterized in that, described method step comprises:
The chip that has crackle from scribing machine has been drawn is lain on described pour mask machine by chip back together with collapsing ring;
Described in reversed-membrane ring is covered on uniformly, collapse ring upper, and guarantee that described chip encircles middle position in described reversed-membrane ring;
Blue film is covered to collapse ring upper, with ultra-clean cloth from chip centre to chip both sides gently wiping come, until blue film and chip are pasted together completely and guarantee without bubble;
Unnecessary blue film is cut down with the circumference cutter on pour mask machine;
Described in inciting somebody to action, collapse 180 ° of ring upsets, lie on pour mask machine table top;
Tear tunica albuginea one jiao, gently tunica albuginea is peeled from described reversed-membrane ring.
Described reversed-membrane ring is annular, and in described reversed-membrane ring, ring diameter is than the large 0.5cm-1.5cm of chip diameter.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., all should be included in the present invention.
Claims (2)
1. a new pour mask technique, is characterized in that, described method step comprises:
The chip that has crackle from scribing machine has been drawn is lain on pour mask machine by chip back together with collapsing ring;
Described in reversed-membrane ring is covered on uniformly, collapse ring upper, and guarantee that described chip encircles middle position in described reversed-membrane ring;
Blue film is covered to collapse ring upper, with ultra-clean cloth from chip centre to chip both sides gently wiping come, until blue film and chip are pasted together completely and guarantee without bubble;
Unnecessary blue film is cut down with the circumference cutter on pour mask machine;
Described in inciting somebody to action, collapse 180 ° of ring upsets, lie on pour mask machine table top;
Tear tunica albuginea one jiao, gently tunica albuginea is peeled from described reversed-membrane ring.
2. new pour mask technique according to claim 1, is characterized in that, described reversed-membrane ring is annular, and interior ring diameter is than the large 0.5cm-1.5cm of chip diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210441225.1A CN103794683A (en) | 2012-10-29 | 2012-10-29 | Novel inverted film technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210441225.1A CN103794683A (en) | 2012-10-29 | 2012-10-29 | Novel inverted film technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103794683A true CN103794683A (en) | 2014-05-14 |
Family
ID=50670173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210441225.1A Pending CN103794683A (en) | 2012-10-29 | 2012-10-29 | Novel inverted film technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103794683A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653956A (en) * | 2015-11-04 | 2017-05-10 | 无锡华润华晶微电子有限公司 | Wafer membrane overturning method and locating device |
| CN106914705A (en) * | 2017-01-23 | 2017-07-04 | 苏州五方光电材料有限公司 | A kind of blue film cutting technique |
| CN111509107A (en) * | 2020-04-24 | 2020-08-07 | 湘能华磊光电股份有限公司 | Method for separating L ED wafer into N pieces of reverse films |
| CN112670818A (en) * | 2019-09-29 | 2021-04-16 | 潍坊华光光电子有限公司 | Film reversing device and method for COS of semiconductor laser |
-
2012
- 2012-10-29 CN CN201210441225.1A patent/CN103794683A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653956A (en) * | 2015-11-04 | 2017-05-10 | 无锡华润华晶微电子有限公司 | Wafer membrane overturning method and locating device |
| CN106653956B (en) * | 2015-11-04 | 2019-07-05 | 无锡华润华晶微电子有限公司 | Wafer turns over film method, positioning device |
| CN106914705A (en) * | 2017-01-23 | 2017-07-04 | 苏州五方光电材料有限公司 | A kind of blue film cutting technique |
| CN106914705B (en) * | 2017-01-23 | 2019-12-31 | 苏州五方光电材料有限公司 | Blue film cutting process |
| CN112670818A (en) * | 2019-09-29 | 2021-04-16 | 潍坊华光光电子有限公司 | Film reversing device and method for COS of semiconductor laser |
| CN112670818B (en) * | 2019-09-29 | 2022-06-10 | 潍坊华光光电子有限公司 | Film reversing device and method for COS of semiconductor laser |
| CN111509107A (en) * | 2020-04-24 | 2020-08-07 | 湘能华磊光电股份有限公司 | Method for separating L ED wafer into N pieces of reverse films |
| CN111509107B (en) * | 2020-04-24 | 2021-06-04 | 湘能华磊光电股份有限公司 | Method for separating N parts of reverse films from LED wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140514 |