CN112659671A - Bending-resistant flexible aluminum substrate process - Google Patents
Bending-resistant flexible aluminum substrate process Download PDFInfo
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- CN112659671A CN112659671A CN202011525934.9A CN202011525934A CN112659671A CN 112659671 A CN112659671 A CN 112659671A CN 202011525934 A CN202011525934 A CN 202011525934A CN 112659671 A CN112659671 A CN 112659671A
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- aluminum substrate
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Abstract
The invention discloses a bending-resistant flexible aluminum substrate process, which comprises the following steps: step A, pressing an aluminum substrate to press the aluminum substrate into a soft aluminum plate; and step B, coating a glue layer on the soft aluminum plate, wherein the glue layer comprises the following components in percentage by mass: 15-30% of straight chain epoxy resin, 20-60% of modified rubber, 1-5% of curing agent and 0.1-5% of auxiliary agent; and step C, attaching the copper foil layer to the top surface of the adhesive layer and performing press molding through a press machine. The aluminum base plate is pressed into the soft aluminum plate, and the soft aluminum plate is matched with the corresponding adhesive layer, so that the aluminum base plate has good softness, good elasticity and toughness, is not easy to crack or damage during bending, has strong practicability, and solves the technical defect that the aluminum base plate cannot be bent in the prior art.
Description
Technical Field
The invention belongs to the technical field of aluminum substrates, and particularly relates to a process for a bending-resistant flexible aluminum substrate.
Background
The aluminum substrate is a common structure in the LED lamp, the aluminum substrate in the prior art is a hard aluminum plate with the thickness of 0.8-3.0 mm, the middle of the aluminum substrate is made of heat-conducting glue and is matched with the copper foil layer, and although the aluminum substrate can meet the market demand, the aluminum substrate cannot be bent due to the influence of the heat-conducting glue and the influence of the hard aluminum plate, and is easy to crack or damage when bent, so that the applicability and the practicability are limited.
Disclosure of Invention
The invention aims to provide a process for bending-resistant flexible aluminum substrate, aiming at solving the technical defect that the aluminum substrate can not be bent in the prior art.
The technical scheme for achieving the purpose of the invention is a bending-resistant flexible aluminum substrate process, which comprises the following steps:
step A, pressing an aluminum substrate to press the aluminum substrate into a soft aluminum plate;
and step B, coating a glue layer on the soft aluminum plate, wherein the glue layer comprises the following components in percentage by mass: 15-30% of straight chain epoxy resin, 20-60% of modified rubber, 1-5% of curing agent and 0.1-5% of auxiliary agent;
and step C, attaching the copper foil layer to the top surface of the adhesive layer and performing press molding through a press machine.
In step A, the soft aluminum plate has a thickness of 0.2-0.5 mm.
In step B, the thickness of the glue layer is 0.025 mm.
In step C, the thickness of the copper foil layer is 0.018-0.07 mm.
The invention has the positive effects that: the aluminum base plate is pressed into the soft aluminum plate, and the soft aluminum plate is matched with the corresponding adhesive layer, so that the aluminum base plate has good softness, good elasticity and toughness, is not easy to crack or damage during bending, has strong practicability, and solves the technical defect that the aluminum base plate cannot be bent in the prior art.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference is now made to the following detailed description of the present disclosure taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic representation of the results of the testing of samples according to the present invention.
Detailed Description
(example 1)
Fig. 1 shows an embodiment of the present invention, wherein fig. 1 is a schematic diagram of the test results of a sample of the present invention.
Referring to fig. 1, a process for manufacturing a bending-resistant flexible aluminum substrate includes the following steps:
step A, pressing an aluminum substrate to press the aluminum substrate into a soft aluminum plate;
and step B, coating a glue layer on the soft aluminum plate, wherein the glue layer comprises the following components in percentage by mass: 15-30% of straight chain epoxy resin, 20-60% of modified rubber, 1-5% of curing agent and 0.1-5% of auxiliary agent;
and step C, attaching the copper foil layer to the top surface of the adhesive layer and performing press molding through a press machine.
In step A, the soft aluminum plate has a thickness of 0.2-0.5 mm.
In step B, the thickness of the glue layer is 0.025 mm.
In step C, the thickness of the copper foil layer is 0.018-0.07 mm.
The aluminum base plate is pressed into the soft aluminum plate, and the soft aluminum plate is matched with the corresponding adhesive layer, so that the aluminum base plate has good softness, good elasticity and toughness, is not easy to crack or damage during bending, has strong practicability, and solves the technical defect that the aluminum base plate cannot be bent in the prior art.
The standard parts used in the present embodiment may be purchased directly from the market, and the non-standard structural components described in the specification and drawings may be obtained by processing without any doubt according to the common general knowledge in the art, and the connection manner of the respective parts is by the conventional means developed in the art, and the machines, parts and equipment are of the conventional type in the art, so that the detailed description thereof is omitted.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And such obvious changes and modifications which fall within the spirit of the invention are deemed to be covered by the present invention.
Claims (4)
1. A bending-resistant flexible aluminum substrate process is characterized in that: the method comprises the following steps:
step A, pressing an aluminum substrate to press the aluminum substrate into a soft aluminum plate;
and step B, coating a glue layer on the soft aluminum plate, wherein the glue layer comprises the following components in percentage by mass: 15-30% of straight chain epoxy resin, 20-60% of modified rubber, 1-5% of curing agent and 0.1-5% of auxiliary agent;
and step C, attaching the copper foil layer to the top surface of the adhesive layer and performing press molding through a press machine.
2. The process of claim 1, wherein the aluminum substrate is made of a flexible aluminum substrate with bending resistance: in step A, the soft aluminum plate has a thickness of 0.2-0.5 mm.
3. The process of claim 2, wherein the aluminum substrate is a flexible aluminum substrate with bending resistance: in step B, the thickness of the glue layer is 0.025 mm.
4. The process of claim 3, wherein the aluminum substrate is made of a flexible aluminum substrate with bending resistance: in step C, the thickness of the copper foil layer is 0.018-0.07 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011525934.9A CN112659671A (en) | 2020-12-22 | 2020-12-22 | Bending-resistant flexible aluminum substrate process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011525934.9A CN112659671A (en) | 2020-12-22 | 2020-12-22 | Bending-resistant flexible aluminum substrate process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112659671A true CN112659671A (en) | 2021-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011525934.9A Pending CN112659671A (en) | 2020-12-22 | 2020-12-22 | Bending-resistant flexible aluminum substrate process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112659671A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4511757A (en) * | 1983-07-13 | 1985-04-16 | At&T Technologies, Inc. | Circuit board fabrication leading to increased capacity |
| CN105835467A (en) * | 2016-03-26 | 2016-08-10 | 林俊宝 | Aluminum substrate material being bendable randomly and production method thereof |
-
2020
- 2020-12-22 CN CN202011525934.9A patent/CN112659671A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4511757A (en) * | 1983-07-13 | 1985-04-16 | At&T Technologies, Inc. | Circuit board fabrication leading to increased capacity |
| CN105835467A (en) * | 2016-03-26 | 2016-08-10 | 林俊宝 | Aluminum substrate material being bendable randomly and production method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210416 |