CN112640587A - 电子装置、显示装置、基底与导电层 - Google Patents

电子装置、显示装置、基底与导电层 Download PDF

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Publication number
CN112640587A
CN112640587A CN201880094168.XA CN201880094168A CN112640587A CN 112640587 A CN112640587 A CN 112640587A CN 201880094168 A CN201880094168 A CN 201880094168A CN 112640587 A CN112640587 A CN 112640587A
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China
Prior art keywords
conductive
pads
substrate
conductive connection
electronic device
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Pending
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CN201880094168.XA
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English (en)
Inventor
熊鹏宇
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Publication of CN112640587A publication Critical patent/CN112640587A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明公开一种电子装置，包括基底与导电层。所述基底以及所述导电层均设置有绑定区，在所述绑定区内，所述导电层的第二表面与所述基底的第一表面粘贴设置，所述基底的第一表面包括多个第一导电连接垫，所述导电层的第二表面包括多个第二导电连接垫。至少一个所述第一导电连接垫在第一表面呈内凹形状，至少一个所述第二导电连接垫在第二表面呈外凸形状，所述凸出形状的所述第二导电连接垫至少部分容置于所述内凹的第一导电连接垫内并且相互电性连接。进一步，还公开一种前述的基底、导电层以及一种显示装置。

Description

PCT国内申请，说明书已公开。

Claims (16)

  1. PCT国内申请，权利要求书已公开。
CN201880094168.XA 2018-08-01 2018-08-01 电子装置、显示装置、基底与导电层 Pending CN112640587A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/098137 WO2020024191A1 (zh) 2018-08-01 2018-08-01 电子装置、显示装置、基底与导电层

Publications (1)

Publication Number Publication Date
CN112640587A true CN112640587A (zh) 2021-04-09

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CN201880094168.XA Pending CN112640587A (zh) 2018-08-01 2018-08-01 电子装置、显示装置、基底与导电层

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CN (1) CN112640587A (zh)
WO (1) WO2020024191A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5984164A (en) * 1997-10-31 1999-11-16 Micron Technology, Inc. Method of using an electrically conductive elevation shaping tool
US6179625B1 (en) * 1999-03-25 2001-01-30 International Business Machines Corporation Removable interlockable first and second connectors having engaging flexible members and process of making same
CN1829933A (zh) * 2003-07-29 2006-09-06 皇家飞利浦电子股份有限公司 具有接线端子的电子装置
JP2014067769A (ja) * 2012-09-25 2014-04-17 Nec Saitama Ltd プリント基板
CN107329335A (zh) * 2017-06-21 2017-11-07 武汉华星光电技术有限公司 阵列基板与显示面板
US20180175278A1 (en) * 2016-12-20 2018-06-21 General Electric Company Ultrasound transducer and method for wafer level back face attachment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7710739B2 (en) * 2005-04-28 2010-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
WO2007055027A1 (ja) * 2005-11-14 2007-05-18 Matsushita Electric Industrial Co., Ltd. 回路基板の接続構造

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5984164A (en) * 1997-10-31 1999-11-16 Micron Technology, Inc. Method of using an electrically conductive elevation shaping tool
US6179625B1 (en) * 1999-03-25 2001-01-30 International Business Machines Corporation Removable interlockable first and second connectors having engaging flexible members and process of making same
CN1829933A (zh) * 2003-07-29 2006-09-06 皇家飞利浦电子股份有限公司 具有接线端子的电子装置
JP2014067769A (ja) * 2012-09-25 2014-04-17 Nec Saitama Ltd プリント基板
US20180175278A1 (en) * 2016-12-20 2018-06-21 General Electric Company Ultrasound transducer and method for wafer level back face attachment
CN107329335A (zh) * 2017-06-21 2017-11-07 武汉华星光电技术有限公司 阵列基板与显示面板

Also Published As

Publication number Publication date
WO2020024191A1 (zh) 2020-02-06

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Application publication date: 20210409