CN112640073A - Apparatus for transporting first and second carriers, processing system for vertically processing substrates, and method therefor - Google Patents

Apparatus for transporting first and second carriers, processing system for vertically processing substrates, and method therefor Download PDF

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Publication number
CN112640073A
CN112640073A CN201880096957.7A CN201880096957A CN112640073A CN 112640073 A CN112640073 A CN 112640073A CN 201880096957 A CN201880096957 A CN 201880096957A CN 112640073 A CN112640073 A CN 112640073A
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carrier
transport
magnetic bearings
track section
space
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奥利弗·海默尔
克里斯蒂安·沃尔夫冈·埃曼
拉尔夫·林登贝格
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Applied Materials Inc
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Applied Materials Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Abstract

An apparatus (100) for transporting a first carrier (10A) and a second carrier (10B) in a vacuum chamber (210) is described. The apparatus (100) comprises a first transport system (101) comprising a plurality of magnetic bearings (120) for contactlessly holding the first carrier (10A) and a drive unit (130) for moving the first carrier (10A) along a first transport path (T1), the magnetic bearings (120) and the drive unit (130) being arranged above the first carrier transport space (15A). Furthermore, the apparatus (100) comprises a second transport system (102) horizontally offset from the first transport system (101) and comprises a plurality of further magnetic bearings (120B) for contactlessly holding the second carrier (10B) and a further drive unit (130B) for moving the second carrier (10B) along a second transport path (T2), wherein the further magnetic bearings (120B) are arranged adjacent to the magnetic bearings (120). Also, a processing system for vertically processing a substrate and a method therefor are described.

Description

Apparatus for transporting first and second carriers, processing system for vertically processing substrates, and method therefor
Technical Field
Embodiments of the present disclosure relate to apparatus and methods for transporting a plurality of carriers, particularly carriers used during processing of large area substrates. More particularly, embodiments of the present disclosure relate to apparatus and methods for non-contact transport carriers in processing systems applicable for vertical substrate processing, such as material deposition on large area substrates for display manufacturing. In particular, embodiments of the present disclosure relate to an apparatus for transporting a first carrier and a second carrier in a vertical substrate processing system, such as for the fabrication of organic light-emitting diode (OLED) devices.
Background
Techniques for layer deposition on a substrate include, for example, sputter deposition, Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), and thermal evaporation. The coated substrate may be used in various applications and in various technical fields. For example, the coated substrate may be used in the field of display devices. Display devices may be used to create television screens, computer screens, mobile phones, other handheld devices, and the like for displaying information. Generally, displays are manufactured by coating a substrate with a stack of different material layers.
For example, the coated substrate may be used in the field of Organic Light Emitting Diode (OLED) devices. OLEDs can be used to manufacture television screens, computer screens, mobile phones, other handheld devices, and the like, for example, for displaying information. An OLED device, such as an OLED display, may include one or more layers of organic material between two electrodes deposited on a substrate.
During deposition of the coating material on the substrate, the substrate may be held by a substrate carrier and the mask may be held in front of the substrate by a mask carrier. A pattern of material (e.g., a plurality of pixels) corresponding to the pattern of openings of the mask may be deposited on the substrate, for example, by evaporation of the material.
The function of an OLED device generally depends on the accuracy of the coating material and the thickness of the organic material, which should be in a predetermined range. In order to achieve high resolution OLED devices, technical challenges regarding deposition of evaporated materials need to be mastered. In particular, it is challenging to accurately and smoothly transport a substrate carrier carrying a substrate and/or a mask carrier carrying a mask through a vacuum system. Furthermore, precise handling of the substrate carrier relative to the mask carrier under vacuum conditions is important for achieving high quality deposition results, e.g. for manufacturing high resolution OLED devices. .
Accordingly, there is a continuing need for improved apparatus and methods for carrier transport that overcome at least some of the problems of the prior art, and for improved vacuum processing systems.
Disclosure of Invention
In view of the above, an apparatus for transporting a first carrier and a second carrier in a vacuum chamber, a processing system for vertically processing substrates, a method of transporting a first carrier and a second carrier in a vacuum chamber and a method of adjusting a distance between a first carrier and a second carrier in a vacuum chamber according to the independent claims are proposed. Other aspects, advantages, and features are apparent from the dependent claims, the description, and the drawings.
According to one aspect of the present disclosure, an apparatus for transporting a first carrier and a second carrier in a vacuum chamber is presented. The apparatus includes a first transport system disposed along a first transport path and including a first upper track section. The first upper track section comprises one or more magnetic bearings for contactlessly holding the first carrier in the first carrier transport space. The one or more magnetic bearings are arranged centrally above the center of gravity of the first carrier to be transported. Furthermore, the first upper track section comprises a drive unit for moving the first carrier along the first transport path. The one or more magnetic bearings and the drive unit are arranged above the first carrier transport space. Furthermore, the apparatus comprises a second transport system arranged along a second transport path horizontally offset from the first transport path and comprising a second upper track section. The second upper track section comprises one or more further magnetic bearings for contactless holding of the second carrier in the second carrier transportation space. This one or more further magnetic bearings are arranged centrally above the centre of gravity of the second carrier to be transported. Furthermore, the second upper track section comprises a further drive unit for moving the second carrier along the second transport path. The one or more further magnetic bearings and the further drive unit are arranged above the second carrier transporting space. The one or more further magnetic bearings of the second upper track section are arranged adjacent to the one or more magnetic bearings of the first upper track section.
According to other aspects of the present disclosure, a processing system for vertically processing a substrate is presented. The processing system includes at least one vacuum chamber including a processing device. Furthermore, the processing system comprises an apparatus for transporting the first carrier and the second carrier according to any embodiment described herein.
According to another aspect of the present disclosure, a method of transporting a first carrier and a second carrier in a vacuum chamber is presented. The method includes contactlessly holding the first carrier in the first carrier transport space with one or more magnetic bearings. The one or more magnetic bearings are arranged centrally above the center of gravity of the first carrier to be transported. Furthermore, the method comprises holding the second carrier contactlessly in the second carrier transportation space with one or more further magnetic bearings. This one or more further magnetic bearings are arranged centrally above the centre of gravity of the second carrier to be transported. The one or more further magnetic bearings are arranged adjacent to the one or more magnetic bearings. Furthermore, the method comprises transporting the first carrier in a transport direction with a drive unit arranged above the first carrier transport space. Furthermore, the method comprises transporting the second carrier in the transport direction with a further drive unit arranged above the second carrier transport space.
According to another aspect of the present disclosure, a method of adjusting a distance between a first carrier and a second carrier in a vacuum chamber is presented. The method includes providing an apparatus for transporting a first carrier and a second carrier. The apparatus includes a first transport system disposed along a first transport path and including a first upper track section. The first upper track section comprises one or more magnetic bearings for contactlessly holding the first carrier in the first carrier transport space. The one or more magnetic bearings are arranged centrally above the center of gravity of the first carrier to be transported. Furthermore, the first upper track section comprises a drive unit for moving the first carrier along the first transport path. The one or more magnetic bearings and the drive unit are arranged above the first carrier transport space. Furthermore, the apparatus comprises a second transport system arranged along a second transport path horizontally offset from the first transport path and comprising a second upper track section. The second upper track section comprises one or more further magnetic bearings for contactless holding of the second carrier in the second carrier transportation space. This one or more further magnetic bearings are arranged centrally above the centre of gravity of the second carrier to be transported. Furthermore, the second upper track section comprises a further drive unit for moving the second carrier along the second transport path. The one or more further magnetic bearings and the further drive unit are arranged above the second carrier transporting space. The one or more further magnetic bearings of the second upper track section are arranged adjacent to the one or more magnetic bearings of the first upper track section. Furthermore, the apparatus comprises a second carrier transport assembly for moving the second carrier from the second transport path towards the first transport path in a second carrier transport direction. The second carrier transport assembly comprises a second transport actuator which is arranged in the atmospheric space, in particular outside the vacuum chamber or in the atmospheric box. Furthermore, the method of adjusting the distance between the first carrier and the second carrier in the vacuum chamber comprises moving the second carrier in a second carrier transport direction from the second transport path towards the first transport path with a second transport actuator. Alternatively, the method of adjusting the distance between the first carrier and the second carrier in the vacuum chamber comprises moving the second carrier from the second transport path away from the first transport path in a second carrier transport direction with a second transport actuator.
Embodiments are also directed to apparatuses for practicing the disclosed methods and including apparatus components for performing various described method aspects. Such method aspects may be performed by hardware elements, a computer programmed by suitable software, any combination of the two, or any other manner. Furthermore, embodiments according to the present disclosure also relate to methods for operating the described apparatus. Such methods for operating the described apparatus include method aspects for performing the functions of the apparatus.
Drawings
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described below:
fig. 1 shows a schematic view of an apparatus for transporting a first carrier and a second carrier in a vacuum chamber according to embodiments described herein;
fig. 2 and 3A show schematic views of an apparatus for transporting first and second carriers in a vacuum chamber according to other embodiments described herein;
fig. 3B shows a side view of an upper portion of an apparatus for transporting first and second carriers in a vacuum chamber according to embodiments described herein;
fig. 4 shows a schematic view of an upper portion of an apparatus for transporting first and second carriers in a vacuum chamber according to other embodiments described herein;
FIG. 5 depicts a schematic view of a processing system for vertically processing a substrate according to embodiments described herein;
fig. 6 depicts a flow diagram of a method of transporting a first carrier and a second carrier in a vacuum chamber according to embodiments described herein; and
fig. 7 shows a flow chart of a method of adjusting a distance between a first carrier and a second carrier in a vacuum chamber according to embodiments described herein.
Detailed Description
Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. In the following description of the drawings, like reference numerals refer to like elements. Only the differences with respect to the individual embodiments are described. The examples are provided to explain the disclosure and are not meant to be limiting of the disclosure. Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. This description is intended to include such modifications and variations.
Referring exemplarily to fig. 1, an apparatus 100 for transporting a first carrier 10A and a second carrier 10B in a vacuum chamber 210 according to the present disclosure is described. For example, the vacuum chamber 210 can be a vacuum chamber of the processing system 200 described herein for vertical processing of substrates. The apparatus for transporting the first and second carriers may also be referred to herein as a transport apparatus.
According to an embodiment, which can be combined with any other embodiment described herein, the apparatus 100 comprises a first transport system 101, the first transport system 101 being arranged along a first transport path T1 in a transport direction T. The transport direction T is perpendicular to the paper of fig. 1. The first transport system 101 comprises a first upper track section 11U. The first upper track section 11U comprises one or more magnetic bearings 120, the one or more magnetic bearings 120 being used for non-contact holding of the first carrier 10A in the first carrier transport space 15A. The one or more magnetic bearings 120 are arranged centrally above the center of gravity G1 of the first carrier 10A to be transported. Further, the first upper rail section 11U includes a drive unit 130, and the drive unit 130 is used to move the first carrier 10A along the first transport path T1. One or more magnetic bearings 120 and a drive unit 130 are arranged above the first carrier transport space 15A.
Further, the plant 100 comprises a second transport system 102, the second transport system 102 being arranged along a second transport path T2 horizontally offset from the first transport path T1 and comprising a second upper track section 14U. The second upper track section 14U comprises one or more further magnetic bearings 120B for contactless holding of the second carrier 10B in the second carrier transportation space 15B. One or more further magnetic bearings 120B are arranged centrally above the centre of gravity G2 of the second carrier 10B to be transported. Furthermore, the second upper track section 14U comprises a further drive unit 130B, the further drive unit 130B being adapted to move the second carrier 10B along the second transport path T2. One or more further magnetic bearings 120B and a further drive unit 130B are arranged above the second carrier transport space 15B. As exemplarily depicted in fig. 1, one or more additional magnetic bearings 120B are disposed adjacent to the one or more magnetic bearings 120.
Thus, embodiments of the apparatus for transporting a first carrier and a second carrier described herein are improved in particular with respect to compactness (compactness) and with respect to accurate and smooth transport of the carriers in a vacuum chamber, e.g. providing a high temperature vacuum environment in the vacuum chamber, compared to conventional carrier transport apparatuses. Furthermore, embodiments described herein advantageously provide more robust (robust) contactless carrier transport at lower manufacturing costs than conventional carrier transport equipment. In particular, embodiments of the apparatus for transporting carriers described herein are less sensitive to manufacturing tolerances, distortion, and thermal expansion. Furthermore, a simpler integration of the device for transporting the first carrier and the second carrier into the vacuum chamber is advantageously proposed.
Before describing other embodiments of the present disclosure in more detail, some aspects are explained in relation to some terms used herein.
In the present disclosure, "carrier transport space" is understood to be the area along the transport path in which the carriers are arranged in the transport direction during transport of the carriers. In particular, as exemplarily depicted in fig. 1, the carrier transportation space may be a vertical carrier transportation space having a height H extending in a vertical direction and a width W extending in a horizontal direction. For example, the aspect ratio of H/W can be H/W ≧ 5, specifically H/W ≧ 10. The term "carrier transport space" as used herein may refer to the first carrier transport space and/or the second carrier transport space as described herein, unless explicitly stated otherwise.
With exemplary reference to fig. 1, it will be understood that the "upper track section" described herein advantageously provides a magnetic levitation system for non-contact transport of a carrier. As shown in fig. 1, the first carrier 10A is held in the first carrier transporting space 15A between the upper chamber wall 212 and the bottom chamber wall 211 without contact. The second carrier 10B is held in a non-contact manner in the second carrier transporting space 15B between the upper chamber wall 212 and the bottom chamber wall 211. In particular, the upper chamber wall 212 can be a top plate of the vacuum chamber. Thus, the bottom chamber wall 211 can be the bottom wall of the vacuum chamber.
Referring to fig. 1, in the present disclosure, the expression "arranged centrally above the center of gravity of the carrier" may be understood as meaning that a vertical plane 111 extending through the center of gravity G of the carrier also extends through the magnetic bearing. That is, a vertical plane 111 extending through the center of gravity G of a carrier (e.g., the first carrier 10A or the second carrier 10B) may intersect the respective magnetic bearing (e.g., the one or more magnetic bearings 120 or the one or more additional magnetic bearings 120B). In particular, the vertical plane 111 may substantially intersect the center of the respective magnetic bearing. The expression "substantially intersecting the center of the respective magnetic bearing" may be understood as the perpendicular plane 111 intersects the magnetic bearing at a lateral distance from the center of the respective magnetic bearing. In particular, the vertical plane 111 may intersect the magnetic bearings with a lateral offset from the center of the respective magnetic bearing (i.e., at a lateral distance from the center of the respective magnetic bearing). The term "lateral offset" is understood to mean a lateral offset from the center of the respective magnetic bearing in the direction of the lateral edge of the respective magnetic bearing. Therefore, the perpendicular plane 111 that exactly intersects the center of the respective magnetic bearing has a lateral offset of 0% from the center of the respective magnetic bearing. The perpendicular plane 111 that exactly intersects the edge of the respective magnetic bearing has a lateral offset of 100% from the center of the respective magnetic bearing. According to some embodiments, which can be combined with other embodiments described herein, the lateral offset of the perpendicular plane 111 intersecting the center of the respective magnetic bearing can be ± 75%, in particular ± 50%, more in particular ± 25%, more in particular ± 10%. According to an example, the vertical plane 111 may represent a symmetry plane of the respective magnetic bearing. As exemplarily depicted in fig. 1, the drive units described herein may be arranged laterally with respect to the respective magnetic bearings.
In the present disclosure, a "magnetic levitation system" can be understood as a system configured for holding an object (e.g., a carrier) in a non-contact manner by utilizing magnetic forces. In the present disclosure, the term "levitating or levitating" means a state of an object (e.g., a carrier carrying a substrate or a mask) in which the object floats without mechanical contact or support. Also, moving or transporting the object means providing a driving force, e.g. a force in a direction different from the levitation force direction, wherein the object moves from one position to another, different position, e.g. a different position along the transport direction. For example, a carrier carrying a substrate or a mask may be levitated, i.e., levitated by a force against gravity, and may move in a direction different from a direction parallel to the gravity when levitated.
In the present disclosure, the term "non-contact" is to be understood as meaning that a weight (e.g. the weight of a carrier, in particular the weight of a carrier carrying a substrate or a mask) is not held by mechanical contact or force, but by magnetic force. That is, the term "non-contact" as used throughout this specification may be understood as utilizing magnetic force instead of mechanical force (i.e., contact force) to hold the carrier in a suspended or floating state.
In the present disclosure, a "carrier" may be understood as a carrier configured for holding a substrate, also referred to as a substrate carrier. For example, the carrier may be a substrate carrier for carrying large area substrates. It will be appreciated that embodiments of the apparatus for carrier transport may also be used with other carrier forms, such as mask carriers. Thus, additionally or alternatively, the carrier may be a carrier configured for carrying a mask. In particular, the first carrier 10A described herein may be, for example, a substrate carrier carrying the substrate 1, and the second carrier 10B described herein may be, for example, a mask carrier carrying the mask 2. The dimensions of the substrate carrier may be different from the dimensions of the mask carrier. For example, the height and/or width of the substrate carrier may be greater than the height and/or width of the mask carrier. Alternatively, the height and/or width of the substrate carrier may be less than the height and/or width of the mask carrier. Further, it will be understood that, unless explicitly stated in the present disclosure, the term "vector" as used herein may mean the first vector and/or the second vector described herein.
In the present disclosure, the term "substrate" may particularly comprise a substantially inflexible substrate, such as a wafer, a transparent quartz plate such as sapphire or the like, or a glass plate. However, the present disclosure is not so limited, and the term "substrate" may also include flexible substrates, such as a web or foil. The term "substantially inflexible" is understood to be distinguished from "flexible". In particular, the substantially inflexible substrate may have a degree of flexibility, such as a glass sheet having a thickness of 0.5mm or less, where the substantially inflexible substrate is less flexible than the flexible substrate. According to embodiments described herein, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of a material selected from the group consisting of: glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound material, carbon fiber material, or any other material or combination of materials that can be coated by a deposition process.
In the present disclosure, the term "large area substrate" is meant to have a thickness of 0.5m2Or more, in particular 1m2Or a larger area of the substrate of the main surface. In some embodiments, the large area substrate or carrier may be a generation 4.5, generation 5, generation 7.5, generation 8.5, or even generation 10. Generation 4.5 corresponds to about 0.67m2Substrate (0.73m x 0.92.92 m), generation 5 corresponds to about 1.4m2Substrate (1.1m x 1.3.3 m), generation 7.5 corresponds to about 4.29m2Substrate (1.95m x 2.2.2 m), generation 8.5 corresponds to about 5.7m2Substrate (2.2m x 2.5.5 m), generation 10 corresponds to about 8.7m2The substrate (2.85 m.times.3.05 m). Even higher generations, such as 11 th and 12 th generations, and corresponding substrate areas may be similarly applied. Furthermore, the substrate thickness may be from 0.1 to 1.8mm, in particular about 0.9mm or less, for example 0.7mm or 0.5 mm.
In the present disclosure, a "transport system" may be understood as a system configured for transporting a carrier in a transport direction along a transport path. The term "transport direction" is understood to mean the direction in which the carrier is transported along the transport path. In general, the transport direction may be an essentially horizontal direction.
In the present disclosure, "upper track section" may be understood as the upper part of the transport system described herein, comprising one or more magnetic bearings and a drive unit.
In the present disclosure, a "magnetic bearing" may be understood as a bearing configured for holding or supporting an object (such as a carrier described herein) in a non-contact manner (i.e., without physical contact). Accordingly, one or more magnetic bearings described herein may be configured to generate a magnetic force acting on the carrier such that the carrier is held contactlessly at a predetermined distance from a base structure (e.g., the upper chamber wall 212 shown in fig. 1). In particular, the one or more magnetic bearings 120 may be configured to generate a magnetic force acting in a substantially vertical direction V such that the vertical width of the gap 122 between the upper chamber wall 212 and the carrier described herein may remain substantially fixed.
In the present disclosure, a "drive unit" may be understood as a unit configured for moving an object (such as a carrier described herein) in a non-contact manner in a transport direction. In particular, the drive unit described herein may be configured to generate a magnetic force acting on the carrier in the transport direction. Thus, the drive unit may be a linear motor. For example, the linear motor may be a core type linear motor. Alternatively, the linear motor may be a ironless linear motor. The ironless linear motor advantageously avoids torque on the carrier due to vertical forces resulting from possible interaction of the passive magnetic elements of the carrier and the iron core of the linear motor.
Some embodiments described herein include the concept of "vertical orientation". The vertical direction is considered to be a direction substantially parallel to the direction along which gravity extends. The vertical direction may deviate from exactly vertical (the latter being defined by gravity), for example by an angle of up to 15 degrees. Moreover, some embodiments described herein may include the concept of a "lateral direction". The lateral direction is understood to be distinguished from the vertical direction. The lateral direction may be vertical or substantially perpendicular to the exact vertical direction defined by gravity.
With exemplary reference to fig. 1, according to some embodiments, which may be combined with other embodiments described herein, the one or more magnetic bearings 120 and the one or more further magnetic bearings 120B are arranged mirror-symmetrically with respect to the symmetry plane 105. The symmetry plane 105 is located between the first carrier transport space 15A and the second carrier transport space 15B. In particular, the plane of symmetry 105 is a vertical plane.
With exemplary reference to fig. 1, according to some embodiments, which can be combined with other embodiments described herein, the drive unit 130 and the further drive unit 130B are arranged mirror-symmetrically with respect to the symmetry plane 105. Generally, the lateral distance of the drive unit 130 to the symmetry plane 105 is larger than the lateral distance of the one or more magnetic bearings 120 to the symmetry plane 105. Furthermore, the lateral distance of the further drive unit 130B to the symmetry plane 105 is typically larger than the lateral distance of the one or more further magnetic bearings 120B to the symmetry plane 105.
With exemplary reference to fig. 1, it will be understood that the lateral distance of the drive unit 130 to the symmetry plane 105 generally substantially corresponds to (in particular is equal to) the lateral distance of the further drive unit 130B to the symmetry plane 105. Thus, the lateral distance of the one or more magnetic bearings 120 to the symmetry plane 105 generally substantially corresponds to (in particular is equal to) the lateral distance of the one or more further magnetic bearings 120B to the symmetry plane 105.
Referring exemplarily to fig. 1, according to some embodiments, which may be combined with other embodiments described herein, the one or more magnetic bearings 120 comprise one or more first actuators 121 for non-contact holding. The drive unit 130 may comprise one or more second actuators 132, the one or more second actuators 132 for moving the first carrier 10A along the first transport path T1. Furthermore, the one or more further magnetic bearings 120B may comprise one or more third actuators 121B for contactlessly holding the second carrier 10B. The further drive unit 130B may comprise one or more fourth actuators 132B for moving the second carrier 10B along the second transport path T2.
In the present disclosure, a "first actuator" of one or more magnetic bearings may be understood as an active and controllable element of the magnetic bearing. Thus, the "third actuator" of the one or more further magnetic bearings may be understood as an active and controllable element of the magnetic bearing. In particular, the one or more first actuators and/or the one or more third actuators may comprise controllable magnets, such as electromagnets. The magnetic field of the one or more first actuators and/or the one or more third actuators may be actively controllable for maintaining and/or adjusting the distance between the upper chamber wall 212 and the carrier (e.g., the first carrier and/or the second carrier), respectively. That is, a "first actuator" of one or more magnetic bearings and/or a "third actuator" of one or more further magnetic bearings may be understood as an element having a controllable and adjustable magnetic field to provide a magnetic levitation force acting on the respective carrier (e.g. the first carrier and/or the second carrier).
The one or more second actuators 132 and/or the one or more fourth actuators 132B may be one or more controllable magnets, such as electromagnets. Thus, the one or more second actuators 132 and/or the one or more fourth actuators 132B may be actively controllable for exerting a moving force on the carrier in the transport direction. As exemplarily depicted in fig. 1, one or more second magnetic counterparts 182 may be arranged at the first carrier 10A and/or the second carrier 10B, in particular at an upper portion of the first carrier 10A and/or the second carrier 10B. The one or more second magnetic counterparts 182 of the carrier (e.g. the first carrier 10A and/or the second carrier 10B) may magnetically interact with the one or more second actuators 132 of the drive unit 130 and/or the one or more fourth actuators 132B of the further drive unit 130B, respectively. In particular, the one or more second magnetic counterparts 182 may be passive magnetic elements. For example, the one or more second magnetic counterparts 182 may be made of a magnetic material, such as a ferromagnetic material, a permanent magnet, or may have permanent magnet properties.
According to some embodiments, which can be combined with other embodiments described herein, one or more first actuators 121, one or more second actuators 132, one or more third actuators 121B, and one or more fourth actuators 132B can be arranged in the air space. The expression "atmospheric space" is understood to mean a space having atmospheric pressure conditions, that is to say approximately 1.0 bar. For example, the atmospheric space may be a space provided outside the vacuum chamber. Alternatively, the atmospheric space may be provided by an atmospheric box or an atmospheric container (not explicitly shown) disposed inside the vacuum chamber.
Referring exemplarily to fig. 1, according to some embodiments, which can be combined with other embodiments described herein, one or more first actuators 121, one or more second actuators 132, one or more third actuators 121B, and one or more fourth actuators 132B can be attached to an outer side surface of an upper chamber wall 212, in particular, an outer side surface of an upper chamber wall 212 of a vacuum chamber 210. Thus, active elements benefiting from one or more magnetic bearings are arranged in easily accessible positions for installation and/or maintenance, which leads to a cost reduction. According to one example, an outer side surface of the upper chamber wall 212 may include receptacles for receiving one or more first actuators 121, one or more second actuators 132, one or more third actuators 121B, and one or more fourth actuators 132B, as exemplarily depicted in fig. 1.
It will be understood that the one or more first actuators 121 are configured for holding the first carrier 10A contactlessly, and the one or more third actuators 121B are configured for holding the second carrier 10B contactlessly. As exemplarily depicted in fig. 1, one or more first magnetic counterparts 181 may be arranged at the first carrier 10A and/or the second carrier 10B, in particular on top of the first carrier 10A and/or the second carrier 10B. The one or more first magnetic counterparts 181 of the first carrier 10A may magnetically interact with the one or more first actuators 121 of the one or more magnetic bearings 120. The one or more first magnetic counterparts 181 of the second carrier 10B may magnetically interact with the one or more third actuators 121B of the one or more further magnetic bearings 120B. In particular, the one or more first magnetic counterparts 181 may be passive magnetic elements. For example, the one or more first magnetic counterparts 181 may be made of a magnetic material, such as a ferromagnetic material, a permanent magnet, or may have permanent magnetic properties.
For example, the output parameters (e.g., the current applied to the one or more first actuators) may be controlled according to the input parameters (e.g., the distance between the upper chamber wall 212 and the first carrier 10A). For example, the distance between the upper chamber wall 212 and the first carrier 10A (e.g., the gap 122 shown in fig. 1) may be measured by a distance sensor, and the magnetic field strength of the one or more first actuators may be set according to the measured distance. In particular, in case of distances above a predetermined threshold value, the magnetic field strength may increase, and in case of distances below the threshold value, the magnetic field strength may decrease. The one or more first actuators may be controlled by closed loop or feedback control.
Similarly, an output parameter (e.g., current applied to one or more third actuators) may be controlled based on an input parameter (e.g., distance between the upper chamber wall 212 and the second carrier 10B). For example, the distance between the upper chamber wall 212 and the second carrier 10B (e.g., the gap 122 shown in fig. 1) may be measured by a distance sensor, and the magnetic field strength of the one or more third actuators may be set according to the measured distance. In particular, in case of distances above a predetermined threshold value, the magnetic field strength may increase, and in case of distances below the threshold value, the magnetic field strength may decrease. The one or more third actuators may be controlled by closed loop or feedback control.
Referring exemplarily to fig. 1, according to some embodiments, which can be combined with other embodiments described herein, the apparatus 100 further comprises a first lower track section 11L and a second lower track section 14L. The first lower track section 11L comprises a first non-contact guiding arrangement 140A, the first non-contact guiding arrangement 140A for guiding the first carrier 10A along the first transport path T1. The second lower track section 14L comprises a second non-contact guiding arrangement 140B for guiding the second carrier 10B along a second transport path T2.
In the present disclosure, a "lower track section" may be understood as the lower portion of the transport system described herein. Generally, the lower track section is arranged at a vertical distance from the upper track section. In particular, the lower track section may comprise the non-contact guiding arrangement described herein for guiding the first carrier 10A and/or the second carrier 10B in the transport direction T.
Referring exemplarily to fig. 1, according to some embodiments, which can be combined with other embodiments described herein, the first lower track section 11L and the second lower track section 14L are movable in the vertical direction V. In particular, the apparatus may include an actuator 124. The actuator 124 is coupled to the first lower track section 11L and the second lower track section 14L for adjusting a distance between the first lower track section 11L and the first upper track section 11U, and for adjusting a distance between the second lower track section 14L and the second upper track section 14U.
As exemplarily depicted in fig. 1, according to some embodiments, which can be combined with other embodiments described herein, the first non-contact guiding arrangement 140A and/or the second non-contact guiding arrangement 140B may comprise one or more passive magnetic bearings 125. In particular, as exemplarily depicted in fig. 1, the one or more passive magnetic bearings 125 may be arranged vertically. Thus, the one or more passive magnetic bearings 125 are configured for providing a magnetic force acting on the respective carrier (in particular the first carrier 10A and/or the second carrier 10B) in a horizontal direction, in particular the transverse direction L, as exemplarily depicted in fig. 1.
For example, as exemplarily depicted in fig. 1, the one or more passive magnetic bearings 125 may be provided by vertical passive magnetic elements arranged in parallel. Generally, at least two passive magnetic elements are arranged to provide a housing for the third magnetic counterpart 183 of the respective carrier (in particular the first carrier 10A and/or the second carrier 10B). Thus, the third magnetic counterpart 183 is arranged between oppositely arranged passive magnetic elements of the one or more passive magnetic bearings 125 in the presence of the carrier. Generally, the third magnetic counterpart 183 includes a passive magnetic element. In fig. 1, the north pole N of the passive magnetic element is represented by a hatched pattern. The south pole portion of the passive magnetic element is represented by a blank element adjacent to the north pole N portion.
As exemplarily depicted in fig. 1, the passive magnetic elements of the one or more passive magnetic bearings 125 and the third magnetic counterpart 183 are generally arranged such that the south pole portion of the passive magnetic element of the third magnetic counterpart 183 faces the south pole portion of the passive magnetic element of the one or more passive magnetic bearings 125 (depicted on the right side of the first non-contact guiding arrangement 140A and the left side of the second non-contact guiding arrangement 140B in fig. 1). Thus, the north pole portion of the passive magnetic element of the third magnetic counterpart 183 may face the north pole portion of the passive magnetic element of the one or more passive magnetic bearings 125 (shown on the left side of the first non-contact guiding arrangement 140A and the right side of the second non-contact guiding arrangement 140B in fig. 1). Thus, the one or more passive magnetic bearings 125 and the passive magnetic elements of the third magnetic counterpart 183 may be arranged such that a repulsive magnetic force acts between the passive magnetic elements of the third magnetic counterpart 183 and the passive magnetic elements of the one or more passive magnetic bearings 125. Although not explicitly depicted, it will be understood that alternatively the passive magnetic elements of the one or more passive magnetic bearings 125 and the third magnetic counterpart 183 may be arranged such that an attractive magnetic force acts between the passive magnetic elements of the third magnetic counterpart 183 and the passive magnetic elements of the one or more passive magnetic bearings 125.
As shown in fig. 1-3, the first and second non-contact guiding arrangements 140A, 140B may be connected to a common support structure 145. The common support structure 145 may be coupled to the actuator 124 for adjusting the distance between the lower track section and the upper track section. Further, a protective bellows 174 may be provided for ensuring a vacuum seal between the movable element of the actuator 124 and the vacuum chamber, as shown in fig. 3A.
According to an alternative configuration of the non-contact guiding arrangement as exemplarily depicted in fig. 2, one or more passive magnetic bearings 125 may be provided in the accommodation for the first and second non-contact guiding arrangements 140A, 140B of the common support structure 145. In particular, according to an alternative configuration, one or more passive magnetic bearings 125 are arranged below the third magnetic counterpart 183 of the respective carrier.
Thus, a non-contact lateral guidance of the carrier can advantageously be provided. Furthermore, it is noted that the provision of a passive guiding arrangement is particularly suitable for providing robust carrier transport in a high temperature vacuum environment at low cost.
In the present disclosure, a "passive magnetic bearing" is understood to be a bearing having a passive magnetic element that is not actively controlled or adjusted, at least during operation of the apparatus. In particular, the passive magnetic bearing may be adapted to generate a magnetic field, such as a static magnetic field. That is, the passive magnetic bearing may not be configured to produce an adjustable magnetic field. For example, the magnetic elements of the one or more passive magnetic bearings may be made of a magnetic material, such as a ferromagnetic material, a permanent magnet, or may have permanent magnetic properties.
Thus, a "passive magnetic element" or "passive magnet" as used herein may be understood as a magnet that is not actively controlled via feedback control, for example. For example, there is no output parameter such as the magnetic field strength of the passive magnet that is controlled according to an input parameter such as distance. The "passive magnetic element" or "passive magnet" may instead provide lateral stabilization of the carrier without any feedback control. For example, a "passive magnetic element" or "passive magnet" described herein may include one or more permanent magnets. The "passive magnetic element" or "passive magnet" may alternatively or additionally comprise one or more electromagnets that may not be actively controlled.
Thus, it will be understood that the first transport system 101 may be a magnetic levitation system, comprising a first upper track section 11U and a first lower track section 11L. The first upper track section 11U is fixed and the first lower track section 11L is movable in the vertical direction V. Thus, second transport system 102 may be a magnetic levitation system, including second upper track section 14U and second lower track section 14L. The second upper track section 14U is fixed and the second lower track section 14L is movable in the vertical direction V.
Referring exemplarily to fig. 3A, according to some embodiments, which may be combined with other embodiments described herein, the apparatus 100 may further comprise a first carrier transport assembly 150A for moving the first carrier 10A out of the first transport path T1 in a first carrier transport direction S1. The first carrier transport assembly 150A generally includes a first transport actuator 154A. The first transport actuator 154A is disposed in the atmospheric space, particularly outside the vacuum chamber or in an atmospheric box.
In the present disclosure, a "first carrier transport assembly" may be understood as an assembly configured to move a first carrier, in particular a substrate carrier, between different transport paths laterally offset from each other. In particular, the first carrier transport assembly is generally configured for moving the first carrier laterally in a first carrier transport direction S1, e.g., for switching a path of the first carrier. With exemplary reference to fig. 3A, it will be understood that the term "first carrier transport direction S1" may be understood as a horizontal direction, in particular perpendicular to the transport direction T.
Referring exemplarily to fig. 3A, according to some embodiments, which can be combined with other embodiments described herein, a first carrier transport assembly 150A includes one or more carrier transport elements 152. For example, the one or more carrier transport elements 152 may be elongated elements extending in the first carrier transport direction S1. As exemplarily indicated by the double arrow, the one or more carrier transport elements 152 are movable in a first carrier transport direction S1 for transporting the first carrier 10A (in particular for switching paths), for example from the first transport path T1 to the second transport path T2 or vice versa. In particular, one or more carrier transport elements 152 may be connected to a first transport actuator 154A. For example, the first transport actuator 154A may be disposed outside of the vacuum chamber 210. Further, a protective bellows 156 may be provided for ensuring a vacuum seal between the one or more carrier transport elements 152 and the vacuum chamber.
For example, fig. 3A shows two carrier transport elements, each connected to a separate transport actuator, in which a respective bellows is provided. However, it will be understood that more than two carrier transport elements may alternatively be provided. Still further, it will be understood that the carrier transport elements may be connected or coupled to a common transport actuator according to alternative configurations.
Referring exemplarily to fig. 3A, according to some embodiments, which may be combined with other embodiments described herein, the apparatus 100 may further comprise a second carrier transport assembly 150B for moving the second carrier 10B from the second transport path T2 towards the first transport path T1 in the second carrier transport direction S2, or for moving the second carrier 10B from the second transport path T2 away from the first transport path T1 in the second carrier transport direction S2. The second carrier transport assembly 150B generally includes a second transport actuator 154B disposed in the atmospheric space, particularly outside of the vacuum chamber or in an atmospheric box. For example, the second transport actuator 154B may be arranged on the same side of the vacuum chamber 210 as the first transport actuator 154A, as exemplarily depicted in fig. 3A.
In the present disclosure, a "second carrier transport assembly" may be understood as being configured to move a second carrier, in particular a mask carrier, towards a first carrier for adjusting a distance between the second carrier and the first carrier. In particular, the second carrier transport assembly is generally configured for moving the second carrier laterally in a second carrier transport direction S2. Referring to fig. 3A by way of example, it will be understood that the term "second carrier transport direction S2" may be understood as a horizontal direction, in particular perpendicular to the transport direction T.
It will be understood that the second carrier transport assembly 150B may include one or more carrier transport elements 152, which may be configured similarly to the one or more carrier transport elements of the second carrier transport assembly 150B. According to one example, as exemplarily depicted in fig. 3A, the one or more carrier transport elements 152 of the second carrier transport assembly 150B may be configured to extend around the first carrier transport space 15A and the second carrier transport space 15B. In particular, as exemplarily depicted in fig. 3A, an upper carrier transport element of the one or more carrier transport elements 152 is disposed above the first carrier 10A and the second carrier 10B. For example, the upper carrier transport element may be arranged in a space or gap provided between the magnetic bearing and the adjacent actuator of the drive unit described herein. For simplicity of illustration, the magnetic bearings and actuators of the drive unit described herein are denoted by reference numeral 190 in fig. 3B.
It will be understood that the space 191 or gap between the above-mentioned adjacent actuators is configured such that the upper carrier transport element is arranged between the above-mentioned adjacent actuators, as exemplarily depicted in fig. 3B. Again, it will be understood that the carrier transport elements described herein generally extend in the transverse direction L.
As exemplarily depicted in fig. 3A, the upper chamber wall 212 may be configured to extend into the vacuum chamber 210. In particular, the upper chamber wall 212, which is equipped with the magnetic bearings and drive units described herein, may extend 50mm to 100mm into the vacuum chamber in the vertical direction. For example, as shown in fig. 3A by way of example, the upper chamber wall 212 may be applied as a barrel-shaped sheet element. Again, it will be understood that the upper chamber wall may have a recess 192 for the upper carrier transport element. In particular, from fig. 3B, it will be understood that the upper carrier transport element is disposed inside the vacuum chamber, and the magnetic bearings and drive units described herein are disposed outside the atmospheric box or vacuum chamber.
As shown in fig. 3A, according to some embodiments, which can be combined with other embodiments described herein, the one or more carrier transport elements 152 comprise a carrier holder 153, the carrier holder 153 for holding a carrier described herein. In particular, the carrier holder 153 may be adapted to be coupled to a respective coupling element provided at the first carrier. For example, in fig. 3A, the coupling element of the first carrier is depicted as a recess. It will be understood that the carrier holder 153 and the coupling elements of the carrier may have other configurations configured for coupling the carrier holder of the carrier transport element to the first carrier.
Referring exemplarily to fig. 4, according to some embodiments, which can be combined with other embodiments described herein, the apparatus 100 further comprises at least one lateral stabilization device 160. The at least one lateral stabilizing device 160 has at least one stabilizing magnet 161 configured to provide a restoring force F on the carrier described herein in a transverse direction L transverse to the transport direction T. For example, the at least one stabilizing magnet 161 may be arranged above the first carrier transport space 15A and/or the second carrier transport space 15B, in particular in the atmospheric space. In particular, at least one stabilizing magnet 161 may be attached to an outer side surface of the upper chamber wall 212. In general, the at least one stabilizing magnet 161 may be arranged at a lateral distance with respect to the drive unit (e.g. the drive unit 130 and the further drive unit 130B).
Thus, in the event of a lateral shift of the carrier, the at least one lateral stabilization device 160 may advantageously stabilize the carrier at a predetermined lateral position by providing a restoring force on the carrier as described herein. The restoring force F pushes or pulls the carrier back to the predetermined lateral position. Thus, the at least one lateral stabilization device 160 may advantageously generate a stabilizing force. The stabilizing force is configured to counteract a deflection of the carrier from the carrier transportation space (e.g. the first carrier transportation space 15A and/or the second carrier transportation space 15B) in the transverse direction L. That is, when the carriers are offset in the transverse direction L from the predetermined transverse position or equilibrium position exemplarily depicted in fig. 4, the at least one lateral stabilizing device 160 may be configured to generate a restoring force F that pushes and/or pulls the respective carrier back into the respective carrier transport space.
As exemplarily depicted in fig. 4, the at least one stabilizing magnet 161 may be a passive magnet having a north pole N and a south pole S. In some embodiments, the at least one stabilizing magnet may comprise a plurality of passive magnets, which may be arranged one after the other in the transport direction. In general, the direction of the magnetic field lines inside the at least one stabilizing magnet (from south to north inside the magnet) may essentially correspond to the transverse direction L.
The at least one carrier stabilizing magnet 162 may be attached to a carrier (e.g., a first carrier and/or a second carrier) described herein such that a displacement of the respective carrier from the respective carrier transport space in the transverse direction L causes a repulsive magnetic force between the at least one stabilizing magnet 161 and the at least one carrier stabilizing magnet 162 of the at least one lateral stabilizing device 160 to offset the displacement. Thus, during holding and during transport of the carriers along the transport path, the carriers, e.g. the first carrier and/or the second carrier, are advantageously maintained in the equilibrium position shown in fig. 4.
As exemplarily depicted in fig. 4, the at least one carrier stabilizing magnet 162 may be a passive magnet having a north pole N and a south pole S, which is arranged such that the direction of the magnetic field lines inside the at least one carrier stabilizing magnet 162 essentially corresponds to the transverse direction L.
In particular, the at least one carrier stabilizing magnet 162 may be arranged in an opposite direction compared to the at least one stabilizing magnet 161 of the at least one lateral stabilizing device 160. Thus, when the carrier (e.g., first carrier and/or second carrier) is disposed in the equilibrium position, the north pole N of the at least one carrier stabilizing magnet 162 is proximate to and attracted by the south pole S of the at least one stabilizing magnet 161, and the south pole S of the at least one carrier stabilizing magnet 162 is proximate to and attracted by the north pole N of the at least one stabilizing magnet 161. For example, when the second carrier is offset from the equilibrium position in the first lateral direction (e.g., toward the left side of fig. 4), the north pole N of the at least one carrier stabilizing magnet 162 is proximate to the north pole N of the at least one stabilizing magnet 161 of the at least one lateral stabilizing device 160, thereby creating a restoring force that forces the carrier back to the equilibrium position. When the second carrier is offset from the equilibrium position in a second (opposite) transverse direction (e.g., toward the right in fig. 4), the south pole S of the at least one carrier stabilizing magnet 162 approaches the south pole S of the at least one stabilizing magnet 161 of the at least one lateral stabilizing device 160, creating a restoring force that forces the carrier back to the equilibrium position. Thus, the at least one lateral stabilizing device 160 stabilizes the second carrier at a predetermined lateral position such that lateral movement of the carrier may be reduced or avoided. The above description of the second carrier and the at least one lateral stabilizing device 160 corresponding to the second carrier applies mutatis mutandis to the first carrier and the at least one lateral stabilizing device 160 corresponding to the first carrier.
Referring exemplarily to fig. 4, according to some embodiments, which can be combined with other embodiments described herein, the device 100 may further comprise a security arrangement 170. Generally, the safety arrangement 170 comprises a lateral shielding guide element 171, which is disposed between the first carrier transportation space 15A and the second carrier transportation space 15B. In particular, as exemplarily depicted in fig. 4, the lateral shielding guide element 171 may be disposed in the symmetry plane 105, as described herein. The lateral shielding guide element 171 may be applied as a guide track or as a row of a plurality of guide pins.
As exemplarily depicted in fig. 4, additionally or alternatively, the safety arrangement 170 may comprise a safety roller 172 for providing a vertical support, in particular a vertical safety support, for the carrier (e.g. the first carrier and/or the second carrier), in particular in case the one or more first actuators 121 and/or the one or more third actuators 121B are deactivated. Generally, the safety roller 172 is connected to a holder 173, and the holder 173 is attached to the inner side surface of the upper chamber wall 212. The holder holding the safety roller may also act as a lateral shielding guide element.
Referring exemplarily to fig. 4, according to some embodiments, which may be combined with other embodiments described herein, a protective element 163 (e.g., a protective strip) may be attached to the at least one carrier stabilizing magnet 162. In particular, the protective element 163 may be attached to a side of the at least one carrier stabilizing magnet 162 facing the retainer 173.
Referring exemplarily to fig. 4, according to some embodiments, which can be combined with other embodiments described herein, the apparatus 100 may further comprise an adjusting device 155. The adjusting means 155 is configured to adjust one or more of the group consisting of: the position, in particular the vertical position, of the at least one stabilizing magnet 161 of the at least one lateral stabilizing device 160 relative to the carrier transport space described herein; the orientation or angular position of the at least one stabilizing magnet 161; the position, in particular the vertical position, of the transverse shielding guide element 171; and the orientation or angular position of the lateral shielding guide member 171. In particular, the adjustment device may be configured to move the at least one stabilizing magnet 161 in a vertical direction and/or configured to move the transversal shielding guide element 171 in a vertical direction, as exemplarily depicted by the arrow shown in fig. 4.
Thus, the adjusting device 155 can change the state of the at least one stabilizing magnet 161 such that the restoring force F exerted by the lateral stabilizing device on the carrier (e.g. the first carrier and/or the second carrier) is changed, in particular reduced or completely switched off. After the restoring force F acting on the carrier by the lateral stabilizing device is reduced or deactivated, the carrier can be moved away from the lateral stabilizing device in the transverse direction.
Thus, by realizing the adjustment of the restoring force F via the adjusting device 155, the carrier can be reliably held and guided along the transport path in the transport state of the lateral stabilizing device. In the deactivated switching state of the lateral stabilizing device, the carrier can be moved in the transverse direction L. Furthermore, in the case of a displacement of the carrier in the transverse direction L, the restoring force F acting on the carrier can be adjusted.
Again, with exemplary reference to fig. 4, it will be understood that the adjustment device 155 may be configured to move the lateral shield guide element 171 such that the carrier described herein may be moved in a lateral direction. For example, the lateral shielding guide element 171 may be moved vertically upwards to allow lateral movement of the first carrier and/or the second carrier. Further, as shown in fig. 4, a protection bellows 174 may be provided for ensuring a vacuum seal between the movable lateral shielding guide member 171 and the vacuum chamber. Alternatively, the lateral guard guide element 171 may be rotatable (not explicitly shown in fig. 3A), e.g. about an axis extending in the lateral direction or about an axis extending in the transport direction, to allow lateral movement of the carrier.
Referring exemplarily to fig. 3A, it will be understood that the carrier according to the present disclosure comprises a body 13 for carrying an object, such as the substrate 1 or the mask 2. For example, the body 13 may be applied as a carrier plate, configured for holding a substrate or a mask. Alternatively, the body 13 may be applied as a carrier frame configured for holding a substrate or a mask. As exemplarily shown in fig. 3A, the body has a first end 11 and a second end 12. The second end 12 is opposite the first end 11. The first end 11 of the body 13 includes one or more first magnetic counterparts 181 (shown in fig. 1 and 2) for interacting with one or more magnetic bearings as described herein. The first end 11 further includes one or more second magnetic counterparts 182 (shown in fig. 1 and 2) for interacting with the drive unit described herein. Furthermore, the second end 12 of the body 13 comprises a third magnetic counterpart 183 (depicted in fig. 1 and 2) for interacting with one or more passive magnetic bearings 125 of the non-contact guiding arrangement described herein.
With exemplary reference to fig. 1-3, it will be understood that the first carrier 10A and/or the second carrier 10B may be asymmetric carriers, i.e., the carriers are asymmetric with respect to a vertical plane 111 extending through the center of gravity (G1/G2 shown in fig. 1 and 2) when the respective carriers are in a vertical orientation.
From fig. 1 to 3, it will be understood that the dimensions of the carriers described herein (i.e., the first carrier and the second carrier) generally correspond to the dimensions of the respective carrier transport spaces (i.e., the first carrier transport space and the second carrier transport space). Thus, the carrier may have a height Hc, corresponding to the height H of the carrier transport space. Further, the carrier may have a width Wc corresponding to the width W of the carrier transporting space. Thus, the aspect ratio of Hc/Wc can be Hc/Wc ≧ 5, particularly Hc/Wc ≧ 10.
According to some embodiments, which can be combined with any other embodiments described herein, the upper chamber wall can be realized as a separate sheet element, in particular a barrel-shaped sheet element as exemplarily depicted in fig. 3A. Thus, the actuator of the magnetic bearing and the actuator of the drive unit may advantageously be pre-fixed to the upper chamber wall before the upper chamber wall is fixed to the side wall of the chamber. Providing an upper chamber wall with a pre-fixed one or more first actuators and a pre-fixed one or more second actuators can facilitate the assembly process and can reduce costs. Thus, a simpler integration of the transport device (in particular with a magnetic levitation system) into the chamber is proposed compared to the prior art.
Referring exemplarily to fig. 5, a processing system 200 for vertically processing a substrate according to the present disclosure is illustrated. According to an embodiment, which can be combined with any other embodiment described herein, the processing system 200 comprises at least one vacuum chamber 210 (in particular a vacuum processing chamber), the at least one vacuum chamber 210 comprising the processing device 205. Furthermore, the processing system 200 comprises an apparatus 100 for transporting a first carrier 10A and a second carrier 10B according to any embodiment described herein. In particular, the processing device 205 is generally disposed in a vacuum processing chamber, and the processing device 205 may be selected from the group consisting of a deposition source, an evaporation source (e.g., an evaporation source for depositing one or more organic materials for OLED fabrication), and a sputtering source.
In the present disclosure, the term "vacuum" is understood to mean a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. In general, the pressure in the vacuum chamber described herein can be 10-5mbar and about 10-8mbar, more typically 10-5mbar and 10-7Between mbar, and even more typically about 10-6mbar and about 10-7mbar. According to some embodiments, the pressure in the vacuum chamber may be considered as the partial or total pressure of evaporated material in the vacuum chamber (the partial or total pressure may be substantially the same when only evaporated material is present as the component to be deposited in the vacuum chamber). In some embodiments, the total pressure in the vacuum chamber may be from about 10-4mbar to about 10-7Between mbar, especially in case a second component (e.g. a gas or the like) other than the evaporated material is present in the vacuum chamber. Thus, the vacuum chamber may be a "vacuum deposition chamber," that is, a vacuum chamber configured for vacuum deposition.
Referring exemplarily to the flowchart shown in fig. 6, a method 300 of transporting a first carrier 10A and a second carrier 10B in a vacuum chamber 210 according to the present disclosure is illustrated. According to an embodiment, which can be combined with any other embodiment described herein, the method 300 comprises non-contact holding the first carrier 10A in the first carrier transportation space 15A using one or more magnetic bearings 120 (represented by block 310 in fig. 6). One or more magnetic bearings are arranged centrally above the centre of gravity of the first carrier 10A to be transported.
Furthermore, the method 300 comprises contactlessly holding the second carrier 10B in the second carrier transportation space 15B with one or more further magnetic bearings 120B (represented by block 320 in fig. 6). One or more further magnetic bearings 120B are arranged centrally above the centre of gravity of the second carrier 10B to be transported. One or more additional magnetic bearings 120B are disposed adjacent to the one or more magnetic bearings 120. In particular, the one or more magnetic bearings 120 and the one or more further magnetic bearings 120B are arranged mirror-symmetrically with respect to the symmetry plane 105. The symmetry plane 105 is located between the first carrier transport space 15A and the second carrier transport space 15B. In particular, the plane of symmetry 105 is a vertical plane.
Furthermore, the method 300 comprises transporting the first carrier 10A in a transport direction T along a first transport path T1 with a drive unit 130 arranged above the first carrier transport space 15A (represented by block 330 in fig. 6). Furthermore, the method 300 comprises transporting the second carrier 10B in the transport direction T along a second transport path T2 with a further drive unit 130B arranged above the second carrier transport space 15B (represented by block 340 in fig. 6).
It will be understood that the method 300 of transporting the first carrier 10A and the second carrier 10B may be performed by utilizing the apparatus 100 for transporting the first carrier 10A and the second carrier 10B according to any embodiment described herein.
Referring exemplarily to the flowchart shown in fig. 7, a method 400 of adjusting a distance between a first carrier 10A and a second carrier 10B in a vacuum chamber 210 according to the present disclosure is illustrated. According to an embodiment, which may be combined with any other embodiment described herein, the method 400 comprises providing an apparatus 100 (represented by block 410 in fig. 7) for transporting a first carrier 10A and a second carrier 10B according to any embodiment described herein, the apparatus 100 comprising a second carrier transport assembly 150B for moving the second carrier 10B from the second transport path T2 towards the first transport path T1 in a second carrier transport direction S2. The second carrier transport assembly 150B includes a second transport actuator 154B disposed in the atmospheric space, particularly outside of the vacuum chamber or in an atmospheric box. Further, the method 400 includes moving the second carrier 10B from the second transport path T2 toward the first transport path T1 in a second carrier transport direction S2 with the second transport actuator 154B (represented by block 420 in fig. 7).
According to an embodiment, which may be combined with any other embodiment described herein, the method 400 may comprise suspending the second carrier 10B by using one or more further magnetic bearings 120B, the one or more further magnetic bearings 120B having one or more third actuators 121B for contactlessly holding the second carrier 10B in the second carrier transportation space 15B of the second transportation path T2. Further, the method 400 may include attracting the second carrier 10B by using one or more third actuators 121B (of the second transport system described herein in particular) to reduce the distance between the one or more third actuators 121B and the second carrier 10B. In particular, the step of attracting the second carrier 10B may include reducing the gap between the upper chamber wall 212 and the second carrier 10B by 2/3 the original vertical width of the gap between the upper chamber wall 212 and the second carrier 10B. For example, reducing the gap may include reducing the vertical gap width from 3mm to 1 mm. Thus, the width of the vertical gap provided between the safety roller 172 and the second carrier 10B may be increased 2/3, for example from 3mm to 5 mm.
Further, the method 400 may include moving one or more carrier transport elements 152 of the second carrier transport assembly 150B toward the second carrier 10B to a holding position. In particular, the holding position may be a position in which the carrier holding portion 153 of the one or more carrier transport elements 152 may hold the carrier when the carrier is lowered in the vertical direction to contact the coupling elements of the second carrier. For example, the coupling element of the second carrier may be a recess, as exemplarily depicted in fig. 3A. Thus, the holding position may be a position where the carrier holding portions 153 of the one or more carrier transport elements 152 enter the respective recesses of the second carrier 10B.
Furthermore, the method 400 may comprise lowering the second carrier 10B by using the one or more third actuators 121B (in particular of the second transport system described herein) to establish contact between the one or more carrier transport elements 152 and the second carrier 10B (in particular the coupling elements of the second carrier). For example, when contact between the one or more carrier transport elements 152 and the second carrier 10B is established, as exemplarily depicted in fig. 3A, the gap between the safety roller 172 and the second carrier 10B may have a vertical gap width of about 1 mm. Thus, during the lateral movement of the carrier, the vertical distance between the second carrier and the upper chamber wall 212 may be about 5 mm.
Further, the method 400 includes adjusting the distance between the first carrier 10A and the second carrier 10B by moving the second carrier 10B from the second transport path T2 toward the first transport path T1 in the second carrier transport direction S2 with the second transport actuator 154B. Alternatively, adjusting the distance between the first carrier 10A and the second carrier 10B may include moving the second carrier 10B away from the first transport path T1 from the second transport path T2 in the second carrier transport direction S2 by using the second transport actuator 154B.
According to some embodiments, which can be combined with other embodiments described herein, the method 400 comprises vertically moving at least one element selected from the group consisting of: the first lower track section 11L of the first transport system, the second lower track section 14L of the second transport system, the at least one lateral transverse shielding guide element provided in the second carrier transport space 15B, and the at least one lateral stabilizing device 160 are described herein.
In particular, the first and second lower track sections 11L, 14L may be moved vertically downward by utilizing the actuator 124 for adjusting the distance between the lower and upper track sections, as described herein. Furthermore, as exemplarily explained with reference to fig. 4, the at least one stabilizing magnet 161 of the at least one lateral stabilizing device 160 may be moved vertically upwards to allow the second carrier to be moved laterally. Again, as exemplarily described with reference to fig. 4, the lateral shielding guide element 171 may be moved vertically upwards to allow lateral movement of the second carrier. Alternatively, the lateral guard guide element 171 may be rotatable, e.g. about an axis extending in the lateral direction or about an axis extending in the transport direction, to allow lateral movement of the second carrier. Thus, it will be understood that prior to moving the second carrier in the lateral direction, elements of the transport system (e.g. the at least one stabilizing magnet 161 and/or the lateral shielding guide element 171 and/or the non-contact guiding arrangement) that hinder the lateral movement of the second carrier are moved apart to release the second carrier in the lateral direction.
In view of the above, it will be appreciated that embodiments of the present disclosure advantageously provide an apparatus for transporting first and second carriers in a vacuum chamber, a processing system for vertically processing a substrate, a method of transporting first and second carriers in a vacuum chamber, and a method of adjusting a distance between first and second carriers in a vacuum chamber, which are improved in terms of accurately and smoothly transporting the carriers in a high temperature vacuum environment, particularly for high quality display manufacturing, such as for OLED displays, compared to the prior art. Furthermore, embodiments described herein advantageously provide more robust non-contact carrier transport at lower manufacturing costs and are less sensitive to manufacturing tolerances, distortion, and thermal expansion than the prior art.
In conclusion, while the foregoing is directed to embodiments, other and further embodiments of the invention may be devised without departing from the spirit and scope of the present disclosure, and the scope thereof is determined by the claims that follow.

Claims (15)

1. An apparatus (100) for transporting a first carrier (10A) and a second carrier (10B) in a vacuum chamber (210), comprising:
a first transport system (101), the first transport system (101) being disposed along a first transport path (T1) and comprising a first upper track section (11U), the first upper track section (11U) comprising:
one or more magnetic bearings (120) for contactlessly holding the first carrier (10A) in a first carrier transport space (15A), the one or more magnetic bearings (120) being arranged centrally above the center of gravity of the first carrier (10A) to be transported; and
a drive unit (130) for moving the first carrier (10A) along the first transport path (T1), the one or more magnetic bearings (120) and the drive unit (130) being arranged above the first carrier transport space (15A); and
a second transport system (102), the second transport system (102) disposed along a second transport path (T2) horizontally offset from the first transport path (T1) and including a second upper track section (14U), the second upper track section (14U) comprising:
one or more further magnetic bearings (120B) for contactlessly holding the second carrier (10B) in a second carrier transport space (15B), the one or more further magnetic bearings (120B) being arranged centrally above the center of gravity of the second carrier (10B) to be transported; and
a further drive unit (130B) for moving the second carrier (10B) along the second transport path (T2), the one or more further magnetic bearings (120B) and the further drive unit (130B) being arranged above the second carrier transport space (15B);
wherein the one or more further magnetic bearings (120B) are arranged adjacent to the one or more magnetic bearings (120).
2. The apparatus (100) according to claim 1, wherein the one or more magnetic bearings (120) and the one or more further magnetic bearings (120B) are arranged mirror-symmetrically with respect to a symmetry plane (105), the symmetry plane (105) being located between the first carrier transport space (15A) and the second carrier transport space (15B).
3. The apparatus (100) according to claim 2, wherein the drive unit (130) and the further drive unit (130B) are arranged mirror-symmetrically with respect to the symmetry plane (105), wherein a lateral distance of the drive unit (130) to the symmetry plane (105) is larger than a lateral distance of the one or more magnetic bearings (120) to the symmetry plane (105), and a lateral distance of the further drive unit (130B) to the symmetry plane (105) is larger than a lateral distance of the one or more further magnetic bearings (120B) to the symmetry plane (105).
4. The apparatus (100) according to any one of claims 1 to 3, further comprising a first lower track section (11L) and a second lower track section (14L), the first lower track section (11L) comprising a first non-contact guiding arrangement (140A), the first non-contact guiding arrangement (140A) for guiding the first carrier (10A) along the first transport path (T1), and the second lower track section (14L) comprising a second non-contact guiding arrangement (140B), the second non-contact guiding arrangement (140B) for guiding the second carrier (10B) along the second transport path (T2).
5. The apparatus (100) according to claim 4, the first lower track section (11L) and the second lower track section (14L) being movable in a vertical direction (V).
6. The apparatus (100) of claim 4 or 5, further comprising an actuator (124), the actuator (124) being coupled to the first lower track section (11L) and the second lower track section (14L) for adjusting a distance between the first lower track section (11L) and the first upper track section (11U) and for adjusting a distance between the second lower track section (14L) and the second upper track section (14U).
7. The apparatus (100) according to any one of claims 1 to 6, the one or more magnetic bearings (120) comprising one or more first actuators (121) for holding the first carrier (10A) in a non-contact manner, the one or more further magnetic bearings (120B) comprising one or more third actuators (121B) for holding the second carrier (10B) in a non-contact manner, the drive unit (130) comprising one or more second actuators (132) for moving the first carrier (10A) along the first transport path (T1), the further drive unit (130B) comprising one or more fourth actuators (132B) for moving the second carrier (10B) along the second transport path (T2), wherein the one or more first actuators (121), the one or more second actuators (132) and, The one or more third actuators (121B) and the one or more fourth actuators (132B) are disposed in an air space.
8. The apparatus (100) according to any one of claims 1 to 7, further comprising a first carrier transport assembly (150A) for moving the first carrier (10A) in a first carrier transport direction (S1) away from the first transport path (T1), the first carrier transport assembly (150A) comprising a first transport actuator (154A), the first transport actuator (154A) being disposed in an atmospheric space, in particular outside the vacuum chamber or in an atmospheric box.
9. The apparatus (100) according to any one of claims 1 to 8, further comprising a second carrier transport assembly (150B) for moving the second carrier (10B) in a second carrier transport direction (S2) from the second transport path (T2) towards the first transport path (T1), the second carrier transport assembly (150B) comprising a second transport actuator (154B), the second transport actuator (154B) being disposed in an atmospheric space, in particular outside the vacuum chamber or in an atmospheric box.
10. The apparatus (100) according to any one of claims 1 to 9, further comprising at least one lateral stabilizing device (160) having at least one stabilizing magnet (161) configured to exert a restoring force (F) on the first carrier (10A) and/or the second carrier (10B) in a transverse direction (L) transverse to a transport direction (T) of the first carrier (10A) and/or the second carrier (10B).
11. The apparatus (100) according to any one of claims 1 to 10, further comprising a security arrangement (170) comprising at least one element of the group consisting of: a lateral guard guide element (171) arranged between the first carrier transport space (15A) and the second carrier transport space (15B), and a safety roller (172) for providing vertical support for the first carrier (10A) and/or the second carrier (10B).
12. The apparatus (100) of any of claims 1 to 11, further comprising an adjustment device (155) configured to adjust one or more of the group consisting of: a vertical position of at least one stabilizing magnet (161) of a stabilizing device (160) relative to the first carrier transport space (15A) and/or the second carrier transport space (15B), an orientation or an angular position of the at least one stabilizing magnet (161), a vertical position of a lateral shielding guide element (171), and an orientation or an angular position of the lateral shielding guide element (171).
13. A processing system (200) for vertically processing substrates, comprising at least one vacuum chamber (210) and an apparatus (100) according to any of claims 1 to 12 for transporting a first carrier (10A) and a second carrier (10B), the at least one vacuum chamber (210) comprising a processing device (205).
14. A method of transporting a first carrier (10A) and a second carrier (10B) in a vacuum chamber (210), comprising the steps of:
-contactlessly holding the first carrier (10A) in a first carrier transport space (15A) with one or more magnetic bearings (120), the one or more magnetic bearings (120) being arranged centrally above the centre of gravity of the first carrier (10A) to be transported;
-contactlessly holding the second carrier (10B) in a second carrier transport space (15B) with one or more further magnetic bearings (120B), which one or more further magnetic bearings (120B) are arranged centrally above the centre of gravity of the second carrier (10B) to be transported and which one or more further magnetic bearings (120B) are arranged adjacent to the one or more magnetic bearings (120);
transporting the first carrier (10A) in a transport direction (T) with a drive unit (130) arranged above the first carrier transport space (15A); and
the second carrier (10B) is transported in a transport direction (T) by means of a further drive unit (130B) arranged above the second carrier transport space (15B).
15. A method of adjusting a distance between a first carrier (10A) and a second carrier (10B) in a vacuum chamber (210), comprising:
-providing an apparatus (100) for transporting a first carrier (10A) and a second carrier (10B) according to claims 1 and 9; and
-moving the second carrier (10B) from the second transport path (T2) towards the first transport path (T1) in a second carrier transport direction (S2) by means of the second transport actuator (154B), or-moving the second carrier (10B) from the second transport path (T2) away from the first transport path (T1) in the second carrier transport direction (S2).
CN201880096957.7A 2018-08-29 2018-08-29 Apparatus for transporting first and second carriers, processing system for vertically processing substrates, and method therefor Pending CN112640073A (en)

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