CN112635370A - Point contact quartz boat - Google Patents
Point contact quartz boat Download PDFInfo
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- CN112635370A CN112635370A CN202110258411.0A CN202110258411A CN112635370A CN 112635370 A CN112635370 A CN 112635370A CN 202110258411 A CN202110258411 A CN 202110258411A CN 112635370 A CN112635370 A CN 112635370A
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- material carrying
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- point contact
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a technical field of semiconductor carrier relates to a point contact quartz boat, including the lower plate, be equipped with on the lower plate and place the piece, it carries the flitch including setting up year material stick, a plurality of on the lower plate along carrying material stick length direction interval setting to place the piece, it is used for placing the silicon chip to carry between the flitch, carry the flitch and keep away from the one end of carrying the material stick and keep away from lower plate lopsidedness sets up to form the point contact with the silicon chip, it is no less than three to carry the material stick to be provided with along circumference. The present application has the following effects: through a plurality of material bars settings of carrying, the silicon chip is supported to the at least three strong point of accessible, carries the flitch to shelter from the silicon chip this moment and reduces, reduces the area of contact of carrier and silicon chip, has improved the thermal treatment effect.
Description
Technical Field
The application relates to the technical field of semiconductor carriers, in particular to a point contact quartz boat.
Background
In the semiconductor industry, in order to reduce the true resistivity of a silicon wafer, a resistor disc needs to be subjected to heat treatment, and a special silicon wafer also needs to be subjected to thermal oxidation induced defect inspection. The Czochralski silicon single crystal industry generally needs to carry out heat treatment and thermal oxidation induction on a sample wafer, and the process needs 650 ℃ heat treatment and 1100 ℃ thermal oxidation induction.
In the process, the silicon wafer is required to be placed in a quartz boat for heat treatment and thermal oxidation induction. At present, a commonly used quartz boat is of a frame structure formed by enclosing four horizontal stop rods and four vertical rods, silicon wafer clamping grooves are formed in the four horizontal stop rods, silicon wafers are inserted into the silicon wafer grooves at intervals, and then the quartz boat filled with the silicon wafers is placed on a carbonization paddle and sent into a diffusion furnace for centralized diffusion.
In view of the above-mentioned related technologies, the inventor believes that when the silicon wafer is placed, the silicon wafer contacts with the bottom surface of the clamping groove, and in the diffusion process, the contact surface of the clamping groove always keeps contact with the silicon wafer, so that the heat treatment effect of the part of the silicon wafer is poor, and the quality of a finished product is affected.
Disclosure of Invention
In order to reduce the contact area between the carrier and the silicon wafer, the application provides a point contact quartz boat.
The application provides a point contact quartz boat adopts following technical scheme: the utility model provides a point contact quartz boat, includes the lower plate, be equipped with on the lower plate and place the piece, it carries the flitch including setting up year material stick, a plurality of along carrying material stick length direction interval setting on the lower plate to place the piece, it is used for placing the silicon chip to carry between the flitch, carry the flitch and keep away from a lower plate side slope setting to form the point contact with the silicon chip, it is no less than three to carry the material stick to be provided with along circumference.
Through adopting above-mentioned technical scheme, when laying the silicon chip, can insert the silicon chip to two and carry between the flitch, and because carry the flitch slope and upwards set up, when the silicon chip was placed, will with carry the top contact of flitch, form the point contact, and set up through a plurality of year material stick, the at least three strong point of accessible supports the silicon chip, carries the flitch and shelters from the reduction to the silicon chip this moment, reduces the area of contact of carrier and silicon chip, has improved thermal treatment effect.
Preferably, one end of each material carrying plate is rotatably connected to the material carrying rod, the other end of each material carrying plate is located on the inner side of each material carrying rod, a driving piece used for sequentially driving each material carrying plate to rotate is arranged on each material carrying rod, each material carrying plate rotates one by one along the length direction of each material carrying rod, and the material carrying rods are uniformly distributed along the circumferential direction.
Through adopting above-mentioned technical scheme, during the initial position, each year flitch is whole to be in the state that lifts up, when placing the silicon chip, make the year flitch of below open, can place the silicon chip on the flitch of carrying of below earlier, then make the flitch of carrying of last height rotate through the driving piece, place next silicon chip again, the driving piece can make in proper order to carry the flitch and rotate and place, finish up to whole placing, just so can make and carry the flitch more even to the support of silicon chip, reduce the influence of different stresses to the silicon chip when thermal treatment.
Preferably, the material carrying rods comprise combined rods arranged at intervals, one end of the material carrying plate is provided with a rotating shaft rotating between the two combined rods, the driving part comprises a driving plate which is connected between the two combined rods in a positioning and sliding manner, and a driving strip which is arranged on the driving plate and correspondingly matched with the material carrying plate, and the driving strip is only matched with one material carrying plate at a time.
Through adopting above-mentioned technical scheme, when needing to order about year flitch and rotate, through removing the drive plate, the drive strip will be earlier with the pivot cooperation of bottommost for its rotates, along with the drive plate constantly removes, the drive strip will progressively with each pivot cooperation on the length direction, thereby make to carry the flitch and rotate.
Preferably, be equipped with on the circumference lateral wall of pivot and be used for with the first linkage piece of driving strip complex, each the epaxial first linkage piece of pivot is in the vertical direction projection misalignment, and the projection of each first linkage piece in the vertical direction is highly arranging along pivot length direction in proper order according to locating, driving strip parallel length equals the pivot.
Through adopting above-mentioned technical scheme, when the drive plate slided, first linkage piece will contradict on the drive strip to make the pivot rotate, and the drive plate slides, will make drive strip and each first linkage piece contact, the pivot will rotate one by one.
Preferably, elastic clamping joints embedded into the combined rod are arranged in two sides of the driving plate, and a plurality of arc-shaped grooves which correspond to the rotating shafts one to one and are used for embedding the elastic clamping joints are formed in the combined rod along the length direction.
Through adopting above-mentioned technical scheme, every time the drive plate slides a distance, the elasticity joint will be embedded into the arc wall of a height, and the drive strip just rotates the pivot of same height this moment, has placed the silicon chip after, continues next action, and is comparatively convenient.
Preferably, each of the driving plates is interlocked by a link ring.
Through adopting above-mentioned technical scheme, when the drive plate was in the motion, each drive plate linked together for carry the flitch to open simultaneously on a plurality of year material sticks, improve the loading efficiency.
Preferably, a second linkage block matched with the driving strip is further arranged on the circumferential side wall of the rotating shaft, the second linkage block is perpendicular to the first linkage block, one end of the material carrying plate is parallel to the second linkage block, and one end of the material carrying plate, far away from the rotating shaft, is obliquely and upwards arranged.
Through adopting above-mentioned technical scheme, when the drive plate upward movement, open each year flitch back, before loading next time again, the reverse slip drive plate, the second couple piece this moment will cooperate with the drive strip for the pivot rotates.
Preferably, the last rotation groove that supplies the pivot embedding that has of combination bar, the conflict piece of contradicting with rotating the inslot wall is installed at the both ends of pivot, conflict piece is established including inlaying change epaxial connection piece, establish at the connection piece middle part and be used for contradicting the flexion on rotating the inslot wall.
Through adopting above-mentioned technical scheme, when the pivot pivoted, the flexion keeps deformation, will contradict on the inner wall after its deformation, makes then to carry the flitch when rotating, has a little damping force for the pivot rotates more stably, and carries the flitch when placing, can not rock almost.
Preferably, the thickness of the first linkage block and the second linkage block is equal to the diameter of the rotating shaft, one side, away from the driving plate, of the driving strip is abutted to the first linkage block or the second linkage block, the end portions of the first linkage block and the second linkage block are arranged in a round angle mode, and the round angle of one side, away from the driving plate, of the driving strip is arranged in a round angle mode.
Through adopting above-mentioned technical scheme, during the cooperation, the drive strip is contradicted on first or second linkage piece, and contradicts on another linkage piece, can make the in-process of motion, and the drive strip will enable pivot pivoted angle at every turn to be 90.
Preferably, the number of the material carrying rods is three, a feeding gap for inserting the silicon wafer exists between the three material carrying rods, and an upper end plate is installed at the upper end of each material carrying rod.
Through adopting above-mentioned technical scheme, when laying the silicon chip, place on carrying the flitch through the feeding clearance, can support again can conveniently place the silicon chip through the support mode of not equipartition.
In summary, the present application includes at least one of the following beneficial technical effects:
1. when the silicon wafer is placed, the silicon wafer can be placed on the material carrying plate in an inclined mode, the contact mode of the material carrying plate and the silicon wafer is point contact, the contact area of the material carrying plate and the silicon wafer can be reduced, and the heat treatment effect is improved;
2. through the motion of drive plate, can make and carry the flitch and can open in proper order in the direction of height, just can follow the silicon chip of taking above, also can make and carry the material stick and can evenly set up in circumference, can have the support uniformly to the silicon chip.
Drawings
FIG. 1 is a schematic structural diagram of embodiment 1 of the present application;
FIG. 2 is a partial side view of embodiment 1 of the present application;
FIG. 3 is a schematic structural view of embodiment 2 of the present application, in which the carrier plate is fully opened and the drive plate is located at the uppermost end;
FIG. 4 is a schematic structural view of embodiment 2 of the present application with an upper end plate and a drive plate hidden;
FIG. 5 is a schematic view showing the connection between the rotary shaft and the combination rod in embodiment 2 of the present application;
FIG. 6 is a side view of a material loading plate in embodiment 2 of the present application;
fig. 7 is a bottom view of the material-carrying plate in embodiment 2 of the present application, showing the accommodating groove;
FIG. 8 is a schematic structural view of a driving member in embodiment 2 of the present application;
FIG. 9 is a schematic view showing the connection relationship between the elastic chuck connector and the driving plate in embodiment 2 of the present application;
fig. 10 is a schematic structural view of an elastic chuck connector in embodiment 2 of the present application.
Description of reference numerals: 100. a lower end plate; 111. a loading bar; 112. a material carrying plate; 113. slotting in a ring shape; 120. an upper end plate; 130. a combination rod; 131. a rotating shaft; 132. a rotating groove; 141. connecting sheets; 142. a bending section; 150. a drive member; 151. a drive plate; 152. a drive bar; 153. a first linkage block; 154. a second linkage block; 155. accommodating grooves; 156. a link ring; 160. an elastic snap joint; 161. a pin; 162. an arc-shaped bulge; 163. a slot; 170. an arc-shaped slot; 171. and a limiting block.
Detailed Description
The present application is described in further detail below with reference to figures 1-9.
Example 1:
the embodiment discloses a point contact quartz boat, referring to fig. 1, which comprises a lower end plate 100, wherein a placing piece is arranged on the lower end plate 100, and the placing piece comprises a material loading rod 111 vertically arranged on the lower end plate 100 and a plurality of material loading plates 112 arranged at intervals along the length direction of the material loading rod 111.
The material loading rods 111 are welded to the lower end plate 100, and in this embodiment, three material loading rods 111 are provided, the lower end plate 100 is circular, and the middle of the lower end plate 100 is provided with a ring-shaped slot 113, so that the lower end plate 100 forms a ring shape. The three material carrying rods 111 are arranged along the circumferential direction, the material carrying rods 111 are positioned at the edge of the lower end plate 100, a connecting line of one material carrying rod 111 and the circle center forms a symmetrical line a, the other two material carrying rods 111 are symmetrically arranged on the line, the middle material carrying rod 111 and the circle center form a line b, the included angle formed by the two lines a and b is 100 degrees, and therefore a 160-degree feeding gap for silicon wafer insertion is formed between the two symmetrical material carrying rods 111.
Referring to fig. 1 and 2, the material loading plate 112 is integrally formed on the material loading rod 111, and the material loading plate 112 is inclined upward toward a side away from the lower end plate 100. One end of the material carrying plate 112 far away from the material carrying rods 111 is positioned in each material carrying rod 111, namely, towards the center of the lower end plate 100. The silicon wafer is placed between the material loading plates 112, and when the silicon wafer is inserted through the feeding gap, the silicon wafer will abut against the three material loading plates 112 with the same height, and the silicon wafer is supported through the three supporting points. Meanwhile, the end of the material loading rod 111 far away from the lower end plate 100 is welded with an upper end plate 120, and the shape of the upper end plate 120 is the same as that of the lower end plate 100.
The principle is implemented to this application embodiment 1 point contact quartz boat: when the silicon wafer carrying device is placed, the silicon wafer is inserted into the material carrying plate 112 through the feeding gap, the end portions of the three material carrying plates 112 can support the silicon wafer, the supporting mode is point contact, and the heat treatment effect can be improved.
Example 2:
the difference from embodiment 1 is that, referring to fig. 3, the material carrying rod 111 includes two spaced combination rods 130, the lower ends of the two combination rods 130 are welded to the lower end plate 100, one end of the material carrying plate 112 is rotatably connected to the material carrying rod 111, that is, the two combination rods 130, the upper end plate 120 is inserted into the combination rods 130, that is, the lower side of the upper end plate 120 has insertion grooves for inserting the ends of the combination rods 130, the upper end plate 120 is detachably connected to the combination rods 130, and in other embodiments, the upper end plate can be fixed by bolts.
Referring to fig. 4 and 5, a rotation shaft 131 is integrally formed at one end of the material loading plate 112, a rotation groove 132 into which the rotation shaft 131 is inserted is formed in the combination rod 130, and the rotation grooves 132 are spaced apart in a longitudinal direction of the combination rod 130. The both ends of pivot 131 are installed and are rotated the conflict piece of groove 132 inner wall conflict, conflict piece including inlaying connection piece 141 of establishing on pivot 131, establish at connection piece 141 middle part and be used for conflicting the flexion 142 on rotating the groove 132 inner wall, the both ends of connection piece 141 insert on the circumference lateral wall of pivot 131, the middle part bending of connection piece 141 forms flexion 142, the top of flexion 142 is used for conflicting on the inner wall that rotates groove 132, make pivot 131 when rotating, have certain damping force. One end of the material carrying plate 112 is integrally provided on the rotating shaft 131, and the end extends in the radial direction of the lower end plate 100, and the end of the material carrying plate 112 is inclined upward and has a rounded end (refer to fig. 6).
Referring to fig. 3 and 7, the material carrying rods 111 are provided with driving members 150 for sequentially driving the material carrying plates 112 to rotate, the material carrying plates 112 rotate one by one in an arrangement order along the length direction of the material carrying rods 111, and the material carrying rods 111 are uniformly distributed along the circumferential direction. The driving member 150 includes a driving plate 151 slidably connected between the two combined rods 130, and a driving bar 152 disposed on the driving plate 151 and correspondingly engaged with the rotating shaft 131, wherein the driving bar 152 is engaged with only one rotating shaft 131 at a time, and the driving bar 152 is parallel to the rotating shaft 131.
Referring to fig. 5 and 7, in order to enable the driving bar 152 to be matched with the rotating shaft 131, in this embodiment, first linkage blocks 153 for matching with the driving bar 152 are disposed on a circumferential side wall of the rotating shaft 131, the first linkage blocks 153 are perpendicular to a connection end of the material loading plate 112, projections of the first linkage blocks 153 on the rotating shaft 131 in the vertical direction do not overlap, and projections of the first linkage blocks 153 in the vertical direction are sequentially arranged according to heights, the arrangement sequence is from bottom to top along a length direction of the rotating shaft 131, that is, the lowermost first linkage block 153 is located at an end of the rotating shaft 131 in the vertical projection, and the length of the driving bar 152 is equal to that of the rotating shaft 131. The circumferential side wall of the rotating shaft 131 is further provided with a second linkage block 154 matched with the driving strip 152, the second linkage block 154 is perpendicular to the first linkage block 153, the second linkage block 154 is parallel to the material carrying plate 112, when the first linkage block 153 is parallel, the material carrying plate 112 faces upwards, and the second linkage block 154 faces downwards. When the material-carrying plates 112 are all upward, the lower ends thereof have receiving grooves 155 (as shown in fig. 8) into which the material-carrying plates 112 therebelow are fitted, and the respective drive plates 151 are interlocked by a link ring 156, and both ends of the link ring 156 are welded to the adjacent drive plates 151, respectively.
Referring to fig. 5, in order to enable the driving bar 152 to keep rotating the rotating shaft 131 by 90 ° each time, the thickness of the first linkage block 153 and the second linkage block 154 is equal to the diameter of the rotating shaft 131, the side of the driving bar 152 away from the driving plate 151 abuts against the first linkage block 153 or the second linkage block 154, the ends of the first linkage block 153 and the second linkage block 154 are rounded, and the side of the driving bar 152 away from the driving plate 151 is rounded, that is, when the driving bar 152 drives the first linkage block 153 to rotate, the side of the driving bar 152 abuts against the second linkage block 154, so that the first linkage block 153 changes from a horizontal state to a vertical state.
In use, the initial position is that the first linkage block 153 is horizontal, the second linkage block 154 is downward, and the loading plate 112 is upward. By the movement of the driving plate 151, the driving bar 152 will abut against the first linkage block 153, and at this time, the lowest material carrying plate 112 will be driven to rotate and become horizontal, and the second linkage block 154 will also become horizontal. As the driving plate 151 continuously moves upward, the rotating shafts 131 rotate one by one, and finally the second linkage block 154 is horizontal, and when the driving plate 151 moves reversely, the driving strip 152 abuts against the second linkage block 154, so that the material carrying plates 112 are unfolded one by one from top to bottom. In order to increase the stability of the material loading plate 112 for bearing the silicon wafer, a limiting block 171 is integrally disposed on the opposite side of the two combination rods 130, the limiting block 171 is used for abutting against the lower side of the material loading plate 112 to improve the supporting force, and the thickness of the limiting block 171 does not interfere with the first linkage block 153 and the second linkage block 154.
Referring to fig. 9 and 10, in order to realize the sliding of the positioning of the driving plate 151, elastic joints 160 embedded into the combination rod 130 are disposed in both sides of the driving plate 151, a plurality of arc-shaped grooves 170 (as shown in fig. 5) are disposed on the combination rod 130 along the length direction, and the plurality of arc-shaped grooves 170 are in one-to-one correspondence with the rotation shafts 131 and the elastic joints 160 are embedded therein. In this embodiment, the elastic clip 160 includes two pins 161 and an arc protrusion 162 integrally disposed between the two pins 161, the elastic clip 160 is made of metal, the driving plate 151 has a slot 163 for the pin 161 to insert, the two pins 161 are inserted into the slot 163, and after the pin 161 is inserted, the elastic clip can slide a distance continuously, that is, a distance is provided between an end of the pin 161 and a bottom of the slot 163, the arc protrusion 162 is arc-shaped, when the driving plate 151 slides, the arc protrusion 162 will abut against the combination rod 130, when the driving plate moves to the rotating shaft 131, the arc protrusion 162 will be embedded into the arc groove 170 to form a position, and at this time, the driving bar 152 will abut against the first coupling block 153 or the second coupling block 154.
The principle is implemented to this application embodiment 2 point contact quartz boat: when the silicon wafer is placed on the material carrying plate 112, the driving plate 151 moves upwards and is abutted to the first linkage block 153, the material carrying plate 112 is overturned to a material carrying state and abutted to the limiting block 171, the silicon wafer is placed on the material carrying plate 112 at the moment, the material carrying plate 112 is opened one by one, the driving plate 151 is positioned at the upper end of the combination rod 130 through the elastic clamping joint 160 and is sequentially placed, the effect of uniform distribution of supporting points can be realized, after all the material carrying plates are placed, the upper end plate 120 is installed, and the silicon wafer can be not installed according to actual conditions.
After the heat treatment is completed, the uppermost silicon wafer is taken down, the driving plate 151 moves downwards to abut against the second linkage block 154, the material carrying plate 112 is turned upwards, the next silicon wafer can be taken out, all the silicon wafers can be taken out in sequence, and finally the driving plate 151 moves to the lowest position to facilitate the next treatment.
The embodiments of the present invention are preferred embodiments of the present application, and the scope of protection of the present application is not limited by the embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. A point contact quartz boat, includes lower end plate (100), its characterized in that: the silicon wafer placing device is characterized in that a placing piece is arranged on the lower end plate (100), the placing piece comprises material carrying rods (111) arranged on the lower end plate (100) and a plurality of material carrying plates (112) arranged at intervals along the length direction of the material carrying rods (111), silicon wafers are placed between the material carrying plates (112), one ends, far away from the material carrying rods (111), of the material carrying plates (112) are obliquely arranged towards one side, far away from the lower end plate (100), so that point contact is formed between the material carrying plates and the silicon wafers, and at least three material carrying rods (111) are arranged along the circumferential direction; one end of each material carrying plate (112) is rotatably connected to the material carrying rod (111), the other end of each material carrying plate (112) is located on the inner side of each material carrying rod (111), a driving piece (150) used for sequentially driving each material carrying plate (112) to rotate is arranged on each material carrying rod (111), each material carrying plate (112) rotates one by one in the sequence of the length direction of the material carrying rods (111), and the material carrying rods (111) are uniformly distributed along the circumferential direction.
2. The point contact quartz boat of claim 1, wherein: the material carrying rod (111) comprises combined rods (130) arranged at intervals, one end of the material carrying plate (112) is provided with a rotating shaft (131) rotating between the two combined rods (130), the driving part (150) comprises a driving plate (151) connected between the two combined rods (130) in a positioning sliding mode and a driving strip (152) arranged on the driving plate (151) and correspondingly matched with the rotating shaft (131), and the driving strip (152) is matched with one rotating shaft (131) at a time.
3. The point contact quartz boat of claim 2, wherein: be equipped with on the circumference lateral wall of pivot (131) and be used for with first linkage piece (153) of drive strip (152) complex, each first linkage piece (153) on pivot (131) are at vertical direction projection misalignment, and each first linkage piece (153) is arranged along pivot (131) length direction according to the height of locating in proper order in the projection of vertical direction, drive strip (152) are on a parallel with lower end plate (100) and length equals pivot (131).
4. The point contact quartz boat of claim 3, wherein: elastic clamping joints (160) embedded into the combined rod (130) are arranged on two sides of the driving plate (151), and a plurality of arc-shaped grooves (170) which correspond to the rotating shafts (131) one by one and are used for embedding the elastic clamping joints (160) are formed in the combined rod (130) along the length direction.
5. The point contact quartz boat of claim 4, wherein: the drive plates (151) are interlocked with each other by a link ring (156).
6. The point contact quartz boat of claim 4, wherein: the circumference lateral wall of pivot (131) still is provided with on with drive strip (152) complex second linkage block (154), second linkage block (154) perpendicular to first linkage block (153), the one end perpendicular to that year flitch (112) are close to pivot (131) first linkage block (153), the one end that year flitch (112) are close to pivot (131) is on a parallel with second linkage block (154), just it upwards sets up to carry the one end slope that flitch (112) are kept away from pivot (131).
7. The point contact quartz boat of claim 6, wherein: have on combination bar (130) and supply rotation groove (132) of pivot (131) embedding, the conflict piece of contradicting with rotation groove (132) inner wall is installed at the both ends of pivot (131), conflict piece is including inlaying connection piece (141) of establishing on pivot (131), establish at connection piece (141) middle part and be used for contradicting flexion (142) on rotating groove (132) inner wall.
8. The point contact quartz boat of claim 7, wherein: the thickness of first linkage piece (153) with second linkage piece (154) equals the diameter of pivot (131), drive strip (152) keep away from one side of drive plate (151) and contradict on first linkage piece (153) or second linkage piece (154), first linkage piece (153) the equal fillet of tip of second linkage piece (154) sets up, drive strip (152) keep away from one side fillet setting of drive plate (151).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110258411.0A CN112635370B (en) | 2021-03-10 | 2021-03-10 | Point contact quartz boat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110258411.0A CN112635370B (en) | 2021-03-10 | 2021-03-10 | Point contact quartz boat |
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| Publication Number | Publication Date |
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| CN112635370A true CN112635370A (en) | 2021-04-09 |
| CN112635370B CN112635370B (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110258411.0A Active CN112635370B (en) | 2021-03-10 | 2021-03-10 | Point contact quartz boat |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113322450A (en) * | 2021-08-02 | 2021-08-31 | 杭州盾源聚芯半导体科技有限公司 | Silicon boat for high-temperature vapor deposition |
| CN115116910A (en) * | 2022-07-19 | 2022-09-27 | 宁夏中欣晶圆半导体科技有限公司 | Universal horizontal quartz boat and oxidation heat treatment method for silicon wafers of different specifications simultaneously |
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| JPH07326580A (en) * | 1994-05-30 | 1995-12-12 | Sony Corp | Semiconductor wafer-mounting boat in vertical low pressure cvd device |
| JPH10321543A (en) * | 1997-05-20 | 1998-12-04 | Sumitomo Metal Ind Ltd | Wafer support and vertical boat |
| JP2005005379A (en) * | 2003-06-10 | 2005-01-06 | Shin Etsu Handotai Co Ltd | Method and vertical boat for heat-treating semiconductor wafer |
| CN102412175A (en) * | 2011-12-05 | 2012-04-11 | 湖州奥博石英科技有限公司 | Quartz boat |
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2021
- 2021-03-10 CN CN202110258411.0A patent/CN112635370B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07326580A (en) * | 1994-05-30 | 1995-12-12 | Sony Corp | Semiconductor wafer-mounting boat in vertical low pressure cvd device |
| JPH10321543A (en) * | 1997-05-20 | 1998-12-04 | Sumitomo Metal Ind Ltd | Wafer support and vertical boat |
| JP2005005379A (en) * | 2003-06-10 | 2005-01-06 | Shin Etsu Handotai Co Ltd | Method and vertical boat for heat-treating semiconductor wafer |
| CN102412175A (en) * | 2011-12-05 | 2012-04-11 | 湖州奥博石英科技有限公司 | Quartz boat |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113322450A (en) * | 2021-08-02 | 2021-08-31 | 杭州盾源聚芯半导体科技有限公司 | Silicon boat for high-temperature vapor deposition |
| CN115116910A (en) * | 2022-07-19 | 2022-09-27 | 宁夏中欣晶圆半导体科技有限公司 | Universal horizontal quartz boat and oxidation heat treatment method for silicon wafers of different specifications simultaneously |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112635370B (en) | 2021-06-15 |
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