CN112608687A - Inorganic adhesive for LED packaging and packaging method - Google Patents
Inorganic adhesive for LED packaging and packaging method Download PDFInfo
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- CN112608687A CN112608687A CN202011504459.7A CN202011504459A CN112608687A CN 112608687 A CN112608687 A CN 112608687A CN 202011504459 A CN202011504459 A CN 202011504459A CN 112608687 A CN112608687 A CN 112608687A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 50
- 239000000853 adhesive Substances 0.000 title claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000843 powder Substances 0.000 claims abstract description 89
- 239000011259 mixed solution Substances 0.000 claims abstract description 23
- 239000003085 diluting agent Substances 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 19
- 239000007864 aqueous solution Substances 0.000 claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 19
- 239000010703 silicon Substances 0.000 claims abstract description 19
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 16
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000000243 solution Substances 0.000 claims description 28
- 238000005507 spraying Methods 0.000 claims description 28
- 238000003756 stirring Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 19
- 238000012360 testing method Methods 0.000 claims description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 9
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 claims description 8
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000011068 loading method Methods 0.000 claims description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 4
- 229920002401 polyacrylamide Polymers 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- 229920002319 Poly(methyl acrylate) Polymers 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 239000004111 Potassium silicate Substances 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- 239000004115 Sodium Silicate Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052912 lithium silicate Inorganic materials 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229910052913 potassium silicate Inorganic materials 0.000 claims description 3
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 claims description 3
- 235000019353 potassium silicate Nutrition 0.000 claims description 3
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 150000003505 terpenes Chemical class 0.000 claims description 3
- 235000007586 terpenes Nutrition 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 7
- 239000000741 silica gel Substances 0.000 abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 abstract description 7
- 230000032683 aging Effects 0.000 abstract description 5
- 238000004383 yellowing Methods 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910020489 SiO3 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
- C09J1/02—Adhesives based on inorganic constituents containing water-soluble alkali silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
- C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Luminescent Compositions (AREA)
Abstract
The invention relates to the technical field of LED chip packaging, in particular to inorganic glue for LED packaging and a packaging method. The inorganic adhesive for LED packaging is characterized by comprising the following raw materials in parts by mass: 2-5 of the component A; 1-4 parts of a component B; 3-18 parts of fluorescent powder; 8-80 parts of a diluent; the component A is a mixed solution of silica sol and an auxiliary agent; the mass part ratio of the silica sol to the auxiliary agent is 60-80: 20-40 parts of; the component B is a mixed solution of an acrylic copolymer and an inorganic silicon aqueous solution; the mass part ratio of the acrylic copolymer to the inorganic silicon aqueous solution is 20-50: 5 to 15. According to the invention, the A, B components are matched to prepare the inorganic adhesive with strong bonding force, the inorganic adhesive is applied to LED packaging, the problems of yellowing and aging of an LED product prepared by using silica gel to package fluorescent powder after being lightened at high temperature for a long time, untight sealing of a light source and the like are solved, the performance of an LED chip can be improved, and the service life of the product is prolonged.
Description
Technical Field
The invention relates to the technical field of LED chip packaging, in particular to inorganic glue for LED packaging and a packaging method.
Background
The existing LED products emit light after mixing a blue light chip and fluorescent powder, and in the production and manufacturing process of LED lamp beads, the fluorescent powder or the fluorescent powder and diffusion powder are mixed with silica gel and then subjected to dispensing, powder spraying or powder coating, so that the LED lamp beads are obtained. However, in the using process, since the area of the LED chip is small, a large amount of heat generated in the lighting process is accumulated inside the LED, so that the junction temperature of the chip is increased, which leads to the performance reduction of the LED chip, such as the reduction of the light emitting efficiency and the red shift of the wavelength, on the one hand, and also leads to the vulcanization blackening, lighting blackening, yellowing and the like of the silica gel encapsulating the chip on the other hand.
The phenomena of yellowing, aging, moisture caused by untight light source sealing and the like which occur after the LED product is lightened at high temperature for a long time and are prepared by using silica gel to package the fluorescent powder are the problems to be solved at present.
Disclosure of Invention
The invention aims to overcome at least one defect of the prior art, and provides an inorganic adhesive for LED packaging and a packaging method, which are used for solving the problem of performance reduction of an LED chip caused by preparing an LED product by using silica gel to package fluorescent powder.
Meanwhile, the invention also provides an LED packaging method.
The technical scheme adopted by the invention is as follows:
an inorganic adhesive for LED packaging is composed of the following raw materials in parts by mass:
the component A is a mixed solution of silica sol and an auxiliary agent; the mass part ratio of the silica sol to the auxiliary agent is 60-80: 20-40 parts of; the component B is a mixed solution of an acrylic copolymer and an inorganic silicon aqueous solution; the mass part ratio of the acrylic copolymer to the inorganic silicon aqueous solution is 20-50: 5-15;
the inorganic adhesive for LED packaging is prepared by the following steps:
step 1: uniformly dividing the component B into a plurality of parts, adding one part of the component B into the component A at regular intervals, and stirring in a high-speed stirrer until the component A and the component B are completely and uniformly mixed to obtain an AB mixed solution;
step 2: adding fluorescent powder into the AB mixed solution, and stirring for a certain time to obtain a fluorescent powder solution;
and step 3: and adding a diluent into the fluorescent powder solution, and stirring until the diluent is completely and uniformly mixed to obtain the inorganic adhesive.
The inorganic adhesive for LED packaging in the technical scheme is prepared by firstly A, B components of silica sol or SiO in inorganic silicon aqueous solution2Molecular, SiO3 3+The ions are filled among the molecules of the acrylic copolymer, and then the ions and the copolymer molecules form a conjugated system under the action of high temperature to form a system with good viscoelasticity, so that the inorganic adhesive of the technical scheme has strong bonding force, can effectively fix the fluorescent powder and play a role in packaging an LED, solves the problems of yellowing and aging of an LED product prepared by using the silica gel to package the fluorescent powder after long-time lighting at high temperature, prevents tight sealing of a light source and the like, can improve the performance of an LED chip and prolong the service life of the product.
In the technical scheme, inorganic raw materials such as silica sol, inorganic silicon aqueous solution and the like have good high temperature resistance and aging resistance, the acrylic copolymer raw material provides good adhesion and thermal conductivity, and the inorganic adhesive for LED packaging, which is simple in preparation process and good in performance, is obtained by matching multiple raw materials.
Preferably, the auxiliary agent is any one of water-based rosin resin, water-based terpene resin and polyvinyl alcohol fiber.
Preferably, the acrylic copolymer is polyacrylamide or polymethyl acrylate; and/or the inorganic silicon aqueous solution is any one of a sodium silicate solution, a potassium silicate solution and a lithium silicate solution.
Preferably, the phosphor is one or a mixture of more of Yttrium Aluminum Garnet (YAG), terbium-doped yttrium aluminum garnet (TAG), silicate, yellow phosphor of nitride series, green phosphor and red phosphor.
Preferably, the diluent is any one or more of xylene, toluene, n-heptane, n-hexane and diethyl ether.
Preferably, in the step 1, the rotating speed of the stirrer is 2000r/min, and the stirring time is 1-2 h; and/or the component B is added into the component A once every 15-30 min; and/or in the step 2, the stirring time is 30-60 min.
An LED packaging method adopting the inorganic adhesive for LED packaging comprises the following steps:
s1: loading the inorganic glue into a powder sprayer, uniformly stirring and controlling the viscosity to be within a certain range to obtain an inorganic glue dispersion solution;
s2: placing the substrate carrying the LED chip on a clamp of a powder sprayer, and performing powder trial spraying, baking and color temperature testing on the substrate through the powder sprayer;
s3: and adjusting parameters of the powder sprayer, spraying powder to the substrate, baking and testing the color temperature.
The LED packaging method of the technical scheme is simple in process, and an LED packaging product with a good effect is obtained by flexibly adjusting the preparation parameters. After powder spraying is tried, if the substrate reaches a set value, the powder spraying operation is stopped; if the color temperature of the substrate is less than the set value, the substrate needs to be cleaned, and the parameters of the powder sprayer are reset to carry out powder spraying again; if the color temperature of the substrate is higher than the set value, further powder spraying is needed, and the fluorescent powder layer is thickened by increasing the powder spraying frequency, so that the color temperature is reduced. The color temperature in the technical scheme is adjusted by controlling the thickness of the fluorescent powder layer, and under the condition of unchanging the formula, the thicker the fluorescent powder layer is, the lower the color temperature is; conversely, the thinner the phosphor layer, the higher the color temperature.
Preferably, in the step S1, the viscosity of the inorganic gum dispersion solution is in the range of 50 to 2500 cP.
Preferably, the parameters of the powder blower in the step S3 include the powder blowing frequency and/or the powder blowing pressure;
preferably, the spraying pressure range is 0.5-10 MPa.
The inorganic glue of the technical scheme forms a thin layer with smooth surface and high hardness after being cured, has the characteristics of good heat resistance, high strength and good stability, and can keep high bonding force after the diluent in the inorganic glue is volatilized, so that the fluorescent powder after being sprayed is fixed on a chip, and the diluent used for spraying can reduce the viscosity of AB mixed liquid and is beneficial to improving the capacity of fully and uniformly atomizing. The AB mixed liquid and the diluent are added to form an isolation layer on the surface of the chip, so that the chip is prevented from being in direct contact with the fluorescent powder, the flowability of the fluorescent powder is improved, the fluorescent powder is prevented from being adhered to the chip, the light emitting consistency of the chip is improved, and the isolation layer formed in addition can prevent the fluorescent powder from being aged and blackened in the lighting process. The high-speed stirring in the powder sprayer can ensure that the fluorescent powder, the AB mixed solution and the diluent keep higher circulation speed and mixing effect in the powder sprayer, and can ensure that the sprayed inorganic glue dispersion solution is liquid drops taking fluorescent powder particles as cores under the spraying pressure of 0.5-10 MPa, so that the volatilization of the diluent is facilitated while the atomization is fully carried out.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the A, B components are matched to prepare the inorganic adhesive with strong bonding force, the inorganic adhesive is applied to LED packaging, the problems of yellowing and aging of an LED product prepared by using silica gel to package fluorescent powder after being lightened at high temperature for a long time, untight sealing of a light source and the like are solved, the performance of an LED chip can be improved, and the service life of the product is prolonged. The invention also provides an LED packaging method with simple process and good effect.
Drawings
Fig. 1 is a schematic flow chart of the LED packaging method of this embodiment 4.
The drawings are only for purposes of illustration and are not to be construed as limiting the invention. For a better understanding of the following embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example 1
The embodiment 1 is an inorganic adhesive for LED packaging, which is composed of the following raw materials in parts by mass:
the component A is a mixed solution of silica sol and an auxiliary agent, wherein the weight ratio of the silica sol to the auxiliary agent is 60: 40; the component B is a mixed solution of acrylic copolymer and inorganic silicon aqueous solution; the mass part ratio of the acrylic copolymer to the inorganic silicon aqueous solution is 20: 15. the auxiliary agent is water-based rosin resin. The acrylic copolymer is polyacrylamide. The inorganic silicon aqueous solution is sodium silicate solution. The diluent is xylene.
The inorganic adhesive for LED packaging is prepared by the following steps:
step 1: uniformly dividing the component B into 4 parts, adding one part of the component B into the component A every 15min, and stirring in a high-speed stirrer at the rotating speed of 2000r/min until the component A and the component B are completely and uniformly mixed to obtain an AB mixed solution;
step 2: adding yellow YAG fluorescent powder into the AB mixed solution, and stirring for 30min to obtain a fluorescent powder solution;
and step 3: and adding a diluent into the fluorescent powder solution, and stirring until the diluent is completely and uniformly mixed to obtain the inorganic adhesive.
Example 2
The embodiment 2 is an inorganic adhesive for LED packaging, which is composed of the following raw materials in parts by mass:
the component A is a mixed solution of silica sol and an auxiliary agent, wherein the weight ratio of the silica sol to the auxiliary agent is 70: 30, of a nitrogen-containing gas; the component B is a mixed solution of acrylic copolymer and inorganic silicon aqueous solution; the mass part ratio of the acrylic copolymer to the inorganic silicon aqueous solution is 35: 10. the auxiliary agent is water-based terpene resin. The acrylic copolymer is polymethyl acrylate. The inorganic silicon aqueous solution is a potassium silicate solution. The diluent is toluene.
The inorganic adhesive for LED packaging is prepared by the following steps:
step 1: uniformly dividing the component B into 3 parts, adding one part of the component B into the component A every 20min, and stirring in a high-speed stirrer at the rotating speed of 2000r/min until the component A and the component B are completely and uniformly mixed to obtain an AB mixed solution;
step 2: adding yellow YAG fluorescent powder into the AB mixed solution, and stirring for 45min to obtain a fluorescent powder solution;
and step 3: and adding a diluent into the fluorescent powder solution, and stirring until the diluent is completely and uniformly mixed to obtain the inorganic adhesive.
Example 3
The embodiment 3 is an inorganic adhesive for LED packaging, which is composed of the following raw materials in parts by mass:
the component A is a mixed solution of silica sol and an auxiliary agent, wherein the mass part ratio of the silica sol to the auxiliary agent is 80: 20; the component B is a mixed solution of acrylic copolymer and inorganic silicon aqueous solution; the mass part ratio of the acrylic copolymer to the inorganic silicon aqueous solution is 50: 5. the auxiliary agent is polyvinyl alcohol fiber. The acrylic copolymer is polyacrylamide. The inorganic silicon aqueous solution is a lithium silicate solution. The diluent is diethyl ether.
The inorganic adhesive for LED packaging is prepared by the following steps:
step 1: uniformly dividing the component B into 2 parts, adding one part of the component B into the component A every 30min, and stirring in a high-speed stirrer at the rotating speed of 2000r/min until the component A and the component B are completely and uniformly mixed to obtain an AB mixed solution;
step 2: adding yellow YAG fluorescent powder into the AB mixed solution, and stirring for 60min to obtain a fluorescent powder solution;
and step 3: and adding a diluent into the fluorescent powder solution, and stirring until the diluent is completely and uniformly mixed to obtain the inorganic adhesive.
Example 4
This embodiment 4 is a method for packaging an LED, using the inorganic paste for packaging an LED of embodiment 1, and includes the following steps:
s1: loading inorganic glue into a powder sprayer, uniformly stirring and controlling the viscosity to be 2500cP to obtain an inorganic glue dispersion solution;
s2: placing the substrate carrying the LED chip on a clamp of a powder sprayer, and performing powder trial spraying, baking and color temperature testing on the substrate through the powder sprayer;
s3: and (3) adjusting the powder spraying frequency of the powder sprayer to be 3 times, and adjusting the powder spraying pressure to be 5MPa, and performing powder spraying and baking on the substrate, wherein the test color temperature is 4100 k.
Example 5
This embodiment 5 is a method for packaging an LED, using the inorganic paste for packaging an LED of embodiment 2, and includes the following steps:
s1: loading the inorganic glue into a powder sprayer, uniformly stirring and controlling the viscosity to be 1000cP to obtain an inorganic glue dispersion solution;
s2: placing the substrate carrying the LED chip on a clamp of a powder sprayer, and performing powder trial spraying, baking and color temperature testing on the substrate through the powder sprayer;
s3: and adjusting the powder spraying frequency of the powder sprayer to be 3 times, and adjusting the powder spraying pressure to be 10MPa, and performing powder spraying and baking on the substrate, wherein the test color temperature is 6500 k.
Example 6
This embodiment 6 is a method for packaging an LED, using the inorganic paste for packaging an LED of embodiment 3, and includes the following steps:
s1: loading the inorganic glue into a powder sprayer, uniformly stirring and controlling the viscosity to be 50cP to obtain an inorganic glue dispersion solution;
s2: placing the substrate carrying the LED chip on a clamp of a powder sprayer, and performing powder trial spraying, baking and color temperature testing on the substrate through the powder sprayer;
s3: and (3) adjusting the powder spraying frequency of the powder sprayer to be 3 times, and adjusting the powder spraying pressure to be 0.5MPa, and performing powder spraying and baking on the substrate, wherein the test color temperature is 9000 k.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention claims should be included in the protection scope of the present invention claims.
Claims (10)
1. The inorganic adhesive for LED packaging is characterized by comprising the following raw materials in parts by mass:
the component A is a mixed solution of silica sol and an auxiliary agent; the mass part ratio of the silica sol to the auxiliary agent is 60-80: 20-40 parts of; the component B is a mixed solution of an acrylic copolymer and an inorganic silicon aqueous solution; the mass part ratio of the acrylic copolymer to the inorganic silicon aqueous solution is 20-50: 5-15;
the inorganic adhesive for LED packaging is prepared by the following steps:
step 1: uniformly dividing the component B into a plurality of parts, adding one part of the component B into the component A at regular intervals, and stirring in a high-speed stirrer until the component A and the component B are completely and uniformly mixed to obtain an AB mixed solution;
step 2: adding fluorescent powder into the AB mixed solution, and stirring for a certain time to obtain a fluorescent powder solution;
and step 3: and adding a diluent into the fluorescent powder solution, and stirring until the diluent is completely and uniformly mixed to obtain the inorganic adhesive.
2. The inorganic adhesive for LED encapsulation according to claim 1, wherein the auxiliary agent is any one of an aqueous rosin resin, an aqueous terpene resin and a polyvinyl alcohol fiber.
3. The inorganic adhesive for packaging the LED according to claim 1, wherein the acrylic copolymer is polyacrylamide or polymethyl acrylate; and/or the inorganic silicon aqueous solution is any one of a sodium silicate solution, a potassium silicate solution and a lithium silicate solution.
4. The inorganic paste for LED packaging according to claim 1, wherein the phosphor is a mixture of one or more of Yttrium Aluminum Garnet (YAG), terbium-doped yttrium aluminum garnet (TAG), silicate, nitride series yellow phosphor, green phosphor, and red phosphor.
5. The inorganic adhesive for LED packaging according to claim 1, wherein the diluent is any one or more of xylene, toluene, n-heptane, n-hexane and diethyl ether.
6. The inorganic adhesive for LED packaging according to claim 1, wherein in the step 1, the rotation speed of the stirrer is 2000r/min, and the stirring time is 1-2 h; and/or the component B is added into the component A once every 15-30 min; and/or in the step 2, the stirring time is 30-60 min.
7. An LED packaging method, wherein the inorganic adhesive for LED packaging according to any one of claims 1 to 6 is used, comprising the steps of:
s1: loading the inorganic glue into a powder sprayer, uniformly stirring and controlling the viscosity to be within a certain range to obtain an inorganic glue dispersion solution;
s2: placing the substrate carrying the LED chip on a clamp of a powder sprayer, and performing powder trial spraying, baking and color temperature testing on the substrate through the powder sprayer;
s3: and adjusting parameters of the powder sprayer, spraying powder to the substrate, baking and testing the color temperature.
8. The method for packaging LED as claimed in claim 7, wherein the viscosity of the inorganic glue dispersion solution in step S1 is in the range of 50-2500 cP.
9. The LED packaging method according to claim 7, wherein the parameters of the powder sprayer in the step S3 comprise the powder spraying frequency and/or the powder spraying pressure.
10. The LED packaging method according to claim 9, wherein the powder spraying pressure is in a range of 0.5-10 MPa.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011504459.7A CN112608687A (en) | 2020-12-18 | 2020-12-18 | Inorganic adhesive for LED packaging and packaging method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011504459.7A CN112608687A (en) | 2020-12-18 | 2020-12-18 | Inorganic adhesive for LED packaging and packaging method |
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| CN112608687A true CN112608687A (en) | 2021-04-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114941812A (en) * | 2022-05-30 | 2022-08-26 | 佛山市锐安特光电科技有限公司 | Light bar glue spraying method, glue spraying light bar production method and glue spraying light bar |
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| CN101948692A (en) * | 2010-09-29 | 2011-01-19 | 彩虹集团公司 | Mixed fluorescent powder matched with blue-light chip and preparation method thereof |
| CN102694110A (en) * | 2012-06-08 | 2012-09-26 | 北京理工大学 | Non-rare earth nanocrystalline fluorescent powder-containing packaging material, preparation method and application |
| CN104004407A (en) * | 2013-02-27 | 2014-08-27 | 上海祥羚光电科技发展有限公司 | Coating printed by using yellow fluorescent powder composite ink specialized for white LED remote excitation |
| CN107342355A (en) * | 2016-04-28 | 2017-11-10 | 晶晖光学材料有限公司 | A kind of inorganic fluorescent material and its manufacture method and the product of application |
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| CN101948692A (en) * | 2010-09-29 | 2011-01-19 | 彩虹集团公司 | Mixed fluorescent powder matched with blue-light chip and preparation method thereof |
| CN102694110A (en) * | 2012-06-08 | 2012-09-26 | 北京理工大学 | Non-rare earth nanocrystalline fluorescent powder-containing packaging material, preparation method and application |
| CN104004407A (en) * | 2013-02-27 | 2014-08-27 | 上海祥羚光电科技发展有限公司 | Coating printed by using yellow fluorescent powder composite ink specialized for white LED remote excitation |
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