CN111987207A - Packaging piece of LED chip - Google Patents

Packaging piece of LED chip Download PDF

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Publication number
CN111987207A
CN111987207A CN202010908509.1A CN202010908509A CN111987207A CN 111987207 A CN111987207 A CN 111987207A CN 202010908509 A CN202010908509 A CN 202010908509A CN 111987207 A CN111987207 A CN 111987207A
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Prior art keywords
weight
parts
led chip
powder
fluorescent
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Pending
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CN202010908509.1A
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Chinese (zh)
Inventor
麦家通
戴轲
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Ansheng Technology Guangdong Co ltd
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Ansheng Technology Guangdong Co ltd
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Priority to CN202010908509.1A priority Critical patent/CN111987207A/en
Publication of CN111987207A publication Critical patent/CN111987207A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides a packaging piece of an LED chip, which comprises the LED chip, wherein fluorescent film layers are coated on the periphery and the top surface of the LED chip, and a toner film layer is coated outside the fluorescent film layers; the fluorescent film layer is obtained by curing fluorescent glue, and the fluorescent glue comprises the following components in parts by weight: silica gel: 85-115 parts by weight; fluorescent powder: 76-83 parts by weight; anti-settling powder: 0.3 to 0.8 part by weight; dispersing powder: 1-3 parts by weight; the color agent film layer is obtained by curing a color agent adhesive, and the color agent adhesive comprises the following components in parts by weight: silica gel: 85-115 parts by weight; color agent: 10-20 parts by weight. The packaging piece of the LED chip is applied to production and manufacturing of color LED chips so as to improve the light emitting efficiency of the LED chips with different colors.

Description

Packaging piece of LED chip
Technical Field
The present invention relates to a package of an LED chip.
Background
In the manufacturing process of the LED lamp, the LED chip needs to be packaged. The light emitted by the fluorescent powder in the packaging adhesive layer is excited by the light of the LED diode to be white light, and the fluorescent powder, the color agent and the glue are mixed to be prepared into a proper color in the preparation process of the packaging adhesive for the LED chip to emit light with other colors, and then the mixture is coated on the LED chip to be dried and cured. This kind of mode, phosphor powder and the uneven condition of colour agent maldistribution appear easily in mixing or curing process, lead to final light-emitting effect poor, and the colour agent can appear the deviation with the colour ratio of colour agent itself with the light-emitting colour after phosphor powder mixes, and the allotment revises the process and is complicated, influences production efficiency.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a packaging piece of an LED chip, which is applied to the production and the manufacture of colored LED chips so as to improve the light emitting efficiency of the LED chips with different colors.
The invention provides a packaging piece of an LED chip, which comprises the LED chip, wherein fluorescent film layers are coated on the periphery and the top surface of the LED chip, and a toner film layer is coated outside the fluorescent film layers;
the fluorescent film layer is obtained by curing fluorescent glue, and the fluorescent glue comprises the following components in parts by weight:
silica gel: 85-115 parts by weight;
fluorescent powder: 76-83 parts by weight;
anti-settling powder: 0.3 to 0.8 part by weight;
dispersing powder: 1-3 parts by weight;
the color agent film layer is obtained by curing a color agent adhesive, and the color agent adhesive comprises the following components in parts by weight:
silica gel: 85-115 parts by weight;
color agent: 10-20 parts by weight.
As a further scheme of the invention, the anti-settling powder comprises nano aluminum silicate, superfine calcium silicate and fumed silica, wherein the mass ratio of the nano aluminum silicate to the superfine calcium silicate to the fumed silica is (1-1.5): (2-2.3): (3.8-4.2).
As a further scheme of the invention, the mass ratio of the nano aluminum silicate to the superfine calcium silicate to the fumed silica is 1: 2: 4.
as a further aspect of the present invention, the diffusion powder is a mixture of two silicone diffusion agents having particle diameters of 1.0 μm and 2.0 μm in a ratio of 1: 1 in the ratio of the total weight of the powder.
As a further scheme of the invention, the silica gel is prepared by mixing the following components in a mass ratio of 1: 5, glue A and glue B; relative to the silica gel with the mass percentage of 100 wt%, the A gel consists of 16 wt% -17 wt% of vinyl-terminated methyl phenyl polysiloxane and 0.03 wt% -0.05 wt% of platinum divinyl tetramethyl disiloxane solution, and the B gel consists of 63 wt% -64 wt% of phenyl silicone resin, 19 wt% -20 wt% of phenyl hydrogen polysiloxane and 0.05 wt% -0.07 wt% of ethynyl cyclohexanol.
As a further scheme of the invention, the LED chip is a blue LED chip, and the fluorescent powder is YAG yellow fluorescent powder.
In a further embodiment of the present invention, the toner is an epoxy toner.
The invention excites the fluorescent powder of the fluorescent film layer to generate white light through the blue LED, and then the white light penetrates through the toner film layer to generate light with color corresponding to the toner.
The fluorescent glue comprises 0.3-0.8 part by weight of anti-settling powder, wherein the anti-settling powder comprises nano aluminum silicate, superfine calcium silicate and fumed silica, and the mass ratio of the nano aluminum silicate to the superfine calcium silicate to the fumed silica is 1: 2: 4. the anti-settling agent is matched in a coarse-fine grading manner, the adding proportion of each component is adjusted to be optimal, the stable anti-settling effect can be achieved, the using amount of the fluorescent powder can be increased, and the light effect is improved. And the coating can be applied to the vertical luminous surface of the LED chip to prevent the fluorescent powder from sinking in the curing process, and the lower edge of the LED chip has a yellow edge during the luminescence process, so that the color of the emitted colored light is inconsistent.
The fluorescent glue comprises diffusion powder: 1-3 parts by weight of diffusion powder, wherein the diffusion powder is prepared from two organic silicon diffusion agents with the particle sizes of 1.0 mu m and 2.0 mu m according to the weight ratio of 1: 1 in the ratio of the total weight of the powder. The diffusion powder is used together with the anti-settling powder, so that the anti-settling performance and the light emitting uniformity are further improved, and in addition, the effect of improving the light efficiency is also achieved.
Drawings
Fig. 1 is a schematic flow chart illustrating a packaging process of a package of an LED chip according to the present invention.
Fig. 2 is a schematic structural diagram of a package of an LED chip according to the present invention.
Detailed Description
The application scheme is further described below with reference to the accompanying drawings:
a packaging piece of an LED chip comprises the LED chip, wherein fluorescent film layers are coated on the peripheral side and the top surface of the LED chip, and a color agent film layer is coated outside the fluorescent film layers;
the fluorescent film layer is obtained by curing fluorescent glue, and the fluorescent glue comprises the following components in parts by weight:
silica gel: 85-115 parts by weight;
fluorescent powder: 76-83 parts by weight;
anti-settling powder: 0.3 to 0.8 part by weight;
dispersing powder: 1-3 parts by weight;
the color agent film layer is obtained by curing a color agent adhesive, and the color agent adhesive comprises the following components in parts by weight:
silica gel: 85-115 parts by weight;
color agent: 10-20 parts by weight.
The mass ratio of the nano aluminum silicate to the superfine calcium silicate to the fumed silica is 1: 2: 4.
the diffusion powder is prepared by mixing two organic silicon diffusion agents with the particle sizes of 1.0 mu m and 2.0 mu m according to the weight ratio of 1: 1 in the ratio of the total weight of the powder.
The LED chip is a blue LED chip, namely a sapphire substrate. The fluorescent powder is YAG yellow fluorescent powder; the toner is an epoxy toner.
The silica gel consists of a gel A and a gel B; relative to the silica gel by mass percentage of 100 wt%, the A gel consists of 16.63 wt% of vinyl-terminated methylphenyl polysiloxane and 0.04 wt% of platinum divinyl tetramethyl disiloxane solution, and the B gel consists of 63.5 wt% of phenyl silicone resin, 19.77 wt% of phenyl hydrogen polysiloxane and 0.06 wt% of ethynyl cyclohexanol.
The packaging part of the LED chip is packaged according to the following steps:
s1, as shown in fig. 1 (a), providing a carrier 1, and a matrix array of LED chips 2 arranged on the carrier 1, with a first gap between adjacent LED chips 2; the LED chip is a blue LED chip.
S2, as shown in fig. 1 (b), coating a fluorescent glue on the matrix array of the LED chips 2, filling the first gap 21 with the fluorescent glue, and covering the top surfaces of the LED chips 2;
s3, drying and curing the fluorescent glue to obtain a fluorescent film layer 3;
s4, as shown in fig. 1 (c), cutting the matrix array of the LED chips 2 to generate the second gaps 31 between the LED chips 2, and covering the fluorescent film layer 3 on four sides and the top side of the cut LED chips 2;
s5, as shown in fig. 1 (d), applying a toner paste on the matrix array of LED chips 2, covering the fluorescent film layer 3 with the toner paste and filling the second gap 31;
s6, drying and curing the toner glue to obtain a toner film layer 4;
s7, as shown in fig. 1 (e), the matrix array of LED chips 2 is diced to obtain LED chip packages.
The drying and curing operation is carried out in a heating mould, and the heating mould comprises an upper heating mould and a lower heating mould; the carrier 1 is arranged in the lower heating die, and when the carrier is dried and cured, the bottom surface of the upper heating die is pressed on the matrix array of the LED chip 2. The bottom surface of the upper heating mould is stuck with a pyrolytic film. The drying and curing conditions of the steps S3 and S6 are as follows: the temperature of the upper heating die is 145-155 ℃; the temperature of the lower heating film is 95-120 ℃.
The above encapsulation process was carried out in accordance with the component ratios of examples 1 to 3 of table 1 below; preparing fluorescent glue according to the component proportion of comparative example 1 in the table 2, directly coating the fluorescent glue on the four side surfaces and the top surface of the LED chip, and drying and curing. The LED chip packages prepared in examples 1 to 3 were subjected to a performance comparison test with the LED chip package prepared in comparative example 1, and the results are shown in table 3.
TABLE 1
Figure BDA0002662395060000051
Figure BDA0002662395060000061
TABLE 2
Comparative example 1 fluorescent glue composition Parts by weight
AB glue 100
Fluorescent powder 80
Toner 10
Silicon dioxide 0.7
Dispersing powder 2
TABLE 3
Figure BDA0002662395060000062
As can be seen from the test results in table 3, in examples 1 to 3, the blue LED excites the phosphor of the phosphor layer to generate white light, and then the white light passes through the toner layer to generate light of a color corresponding to the toner, so that the color of the light emitted is uniform, the color uniformity is within 0.01 of the deviation between the Y axis and the X axis, and the light efficiency is high. In contrast, in comparative example 1, the LED chip packaged by the prior art had uneven color of emitted light, and the deviation between the Y axis and the X axis exceeded 0.03.
The above preferred embodiments should be considered as examples of the embodiments of the present application, and technical deductions, substitutions, improvements and the like similar to, similar to or based on the embodiments of the present application should be considered as the protection scope of the present patent.

Claims (7)

1. A packaging piece of an LED chip comprises the LED chip and is characterized in that the periphery and the top surface of the LED chip are coated with fluorescent film layers, and the fluorescent film layers are coated with color agent film layers;
the fluorescent film layer is obtained by curing fluorescent glue, and the fluorescent glue comprises the following components in parts by weight:
silica gel: 85-115 parts by weight;
fluorescent powder: 76-83 parts by weight;
anti-settling powder: 0.3 to 0.8 part by weight;
dispersing powder: 1-3 parts by weight;
the color agent film layer is obtained by curing a color agent adhesive, and the color agent adhesive comprises the following components in parts by weight:
silica gel: 85-115 parts by weight;
color agent: 10-20 parts by weight.
2. The package of the LED chip of claim 1, wherein the anti-settling powder comprises nano aluminum silicate, ultra-fine calcium silicate, and fumed silica, and the mass ratio of the nano aluminum silicate, the ultra-fine calcium silicate, and the fumed silica is (1-1.5): (2-2.3): (3.8-4.2).
3. The package of LED chips as claimed in claim 2, wherein the mass ratio of nano-aluminosilicate, ultra-fine calcium silicate and fumed silica is 1: 2: 4.
4. the package of LED chips of claim 1, wherein the diffusion powder is a mixture of two silicone diffusers with particle sizes of 1.0 μ ι η and 2.0 μ ι η in a ratio of 1: 1 in the ratio of the total weight of the powder.
5. The package of LED chips of claim 1, wherein said silicone gel is prepared from the following components in a mass ratio of 1: 5, glue A and glue B; relative to the silica gel with the mass percentage of 100 wt%, the A gel consists of 16 wt% -17 wt% of vinyl-terminated methyl phenyl polysiloxane and 0.03 wt% -0.05 wt% of platinum divinyl tetramethyl disiloxane solution, and the B gel consists of 63 wt% -64 wt% of phenyl silicone resin, 19 wt% -20 wt% of phenyl hydrogen polysiloxane and 0.05 wt% -0.07 wt% of ethynyl cyclohexanol.
6. The package of LED chips of claim 1, wherein said LED chip is a blue LED chip and said phosphor is a YAG yellow phosphor.
7. The package of LED chips of claim 1, wherein said toner is an epoxy toner.
CN202010908509.1A 2020-09-02 2020-09-02 Packaging piece of LED chip Pending CN111987207A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113717712A (en) * 2021-09-02 2021-11-30 广州光联电子科技有限公司 Anti-aging anti-settling fluorescent material and preparation method and application thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102074623A (en) * 2010-11-23 2011-05-25 惠州雷曼光电科技有限公司 Colored LED (Light-Emitting Diode) and manufacturing method thereof
CN103400923A (en) * 2013-07-31 2013-11-20 深圳市天电光电科技有限公司 LED (light emitting diode) packaging structure and LED packaging method
CN105845812A (en) * 2016-05-09 2016-08-10 深圳市聚飞光电股份有限公司 LED fluorescent glue and packaging method for improving luminescence uniformity, and LED
CN207938651U (en) * 2018-03-30 2018-10-02 新月光电（深圳）股份有限公司 Fluorescent effect more preferably LED light

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102074623A (en) * 2010-11-23 2011-05-25 惠州雷曼光电科技有限公司 Colored LED (Light-Emitting Diode) and manufacturing method thereof
CN103400923A (en) * 2013-07-31 2013-11-20 深圳市天电光电科技有限公司 LED (light emitting diode) packaging structure and LED packaging method
CN105845812A (en) * 2016-05-09 2016-08-10 深圳市聚飞光电股份有限公司 LED fluorescent glue and packaging method for improving luminescence uniformity, and LED
CN207938651U (en) * 2018-03-30 2018-10-02 新月光电（深圳）股份有限公司 Fluorescent effect more preferably LED light

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113717712A (en) * 2021-09-02 2021-11-30 广州光联电子科技有限公司 Anti-aging anti-settling fluorescent material and preparation method and application thereof
CN113717712B (en) * 2021-09-02 2024-01-16 广州光联电子科技有限公司 Aging-resistant and sedimentation-resistant fluorescent material and preparation method and application thereof

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Application publication date: 20201124