CN112588689A - 一种硅片清洗堆叠输送一体化系统 - Google Patents
一种硅片清洗堆叠输送一体化系统 Download PDFInfo
- Publication number
- CN112588689A CN112588689A CN202110223794.8A CN202110223794A CN112588689A CN 112588689 A CN112588689 A CN 112588689A CN 202110223794 A CN202110223794 A CN 202110223794A CN 112588689 A CN112588689 A CN 112588689A
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- Prior art keywords
- cleaning
- stacking
- silicon wafer
- conveying
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 78
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 78
- 239000010703 silicon Substances 0.000 title claims abstract description 78
- 238000004140 cleaning Methods 0.000 claims abstract description 112
- 239000012459 cleaning agent Substances 0.000 claims description 19
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 230000010354 integration Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 210000001503 joint Anatomy 0.000 abstract description 2
- 238000012840 feeding operation Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 65
- 239000000463 material Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
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CN202110223794.8A CN112588689B (zh) | 2021-03-01 | 2021-03-01 | 一种硅片清洗堆叠输送一体化系统 |
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CN202110223794.8A CN112588689B (zh) | 2021-03-01 | 2021-03-01 | 一种硅片清洗堆叠输送一体化系统 |
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CN112588689A true CN112588689A (zh) | 2021-04-02 |
CN112588689B CN112588689B (zh) | 2021-05-18 |
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CN202110223794.8A Active CN112588689B (zh) | 2021-03-01 | 2021-03-01 | 一种硅片清洗堆叠输送一体化系统 |
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Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0482663A (ja) * | 1990-07-24 | 1992-03-16 | Mimasu Handotai Kogyo Kk | ウェーハ貼付用プレートの洗浄装置 |
CN1410174A (zh) * | 2001-10-09 | 2003-04-16 | 松下电器产业株式会社 | 基板的洗涤方法,基板洗涤装置以及零件的安装方法 |
CN103801536A (zh) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | 一种晶片清洗装置 |
CN103846245A (zh) * | 2012-11-29 | 2014-06-11 | 盛美半导体设备(上海)有限公司 | 基板清洗装置及清洗方法 |
CN104813438A (zh) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备(上海)有限公司 | 半导体硅片的清洗方法和装置 |
CN107170695A (zh) * | 2016-03-08 | 2017-09-15 | 应用材料公司 | 多个晶片旋转处理 |
CN207698772U (zh) * | 2017-09-30 | 2018-08-07 | 湖南海擎智能科技有限责任公司 | 玻璃板自动清洗系统 |
CN208303457U (zh) * | 2018-04-02 | 2019-01-01 | 南轩(天津)科技有限公司 | 一种具有自动进料的硅片清洗设备 |
CN109261611A (zh) * | 2018-11-30 | 2019-01-25 | 汪涛 | 一种利用矿石清洗装置清洗矿石的方法 |
CN210365596U (zh) * | 2019-07-11 | 2020-04-21 | 江西瑞丰食品有限公司 | 一种雪糕加工用物料传送装置 |
CN211605103U (zh) * | 2019-12-31 | 2020-09-29 | 江苏雷博科学仪器有限公司 | 一种导轨式剥离清洗装置 |
CN111790658A (zh) * | 2020-08-03 | 2020-10-20 | 江苏科沛达半导体科技有限公司 | 陶瓷盘清洗机 |
CN111883468A (zh) * | 2020-08-12 | 2020-11-03 | 赣州市业润自动化设备有限公司 | 一种硅晶片清洗装置 |
CN211852792U (zh) * | 2020-03-25 | 2020-11-03 | 杭州芯研科技有限公司 | 一种旋转密封装置 |
-
2021
- 2021-03-01 CN CN202110223794.8A patent/CN112588689B/zh active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0482663A (ja) * | 1990-07-24 | 1992-03-16 | Mimasu Handotai Kogyo Kk | ウェーハ貼付用プレートの洗浄装置 |
CN1410174A (zh) * | 2001-10-09 | 2003-04-16 | 松下电器产业株式会社 | 基板的洗涤方法,基板洗涤装置以及零件的安装方法 |
CN103801536A (zh) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | 一种晶片清洗装置 |
CN104813438A (zh) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备(上海)有限公司 | 半导体硅片的清洗方法和装置 |
CN103846245A (zh) * | 2012-11-29 | 2014-06-11 | 盛美半导体设备(上海)有限公司 | 基板清洗装置及清洗方法 |
CN107170695A (zh) * | 2016-03-08 | 2017-09-15 | 应用材料公司 | 多个晶片旋转处理 |
CN207698772U (zh) * | 2017-09-30 | 2018-08-07 | 湖南海擎智能科技有限责任公司 | 玻璃板自动清洗系统 |
CN208303457U (zh) * | 2018-04-02 | 2019-01-01 | 南轩(天津)科技有限公司 | 一种具有自动进料的硅片清洗设备 |
CN109261611A (zh) * | 2018-11-30 | 2019-01-25 | 汪涛 | 一种利用矿石清洗装置清洗矿石的方法 |
CN210365596U (zh) * | 2019-07-11 | 2020-04-21 | 江西瑞丰食品有限公司 | 一种雪糕加工用物料传送装置 |
CN211605103U (zh) * | 2019-12-31 | 2020-09-29 | 江苏雷博科学仪器有限公司 | 一种导轨式剥离清洗装置 |
CN211852792U (zh) * | 2020-03-25 | 2020-11-03 | 杭州芯研科技有限公司 | 一种旋转密封装置 |
CN111790658A (zh) * | 2020-08-03 | 2020-10-20 | 江苏科沛达半导体科技有限公司 | 陶瓷盘清洗机 |
CN111883468A (zh) * | 2020-08-12 | 2020-11-03 | 赣州市业润自动化设备有限公司 | 一种硅晶片清洗装置 |
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CN112588689B (zh) | 2021-05-18 |
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Effective date of registration: 20220627 Address after: No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province, 225300 Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 8 / F, block B, Tianrun science and technology building, 801 Changwu Middle Road, Wujin District, Changzhou City, Jiangsu Province, 213000 Patentee before: CHANGZHOU JIANGSU UNIVERSITY ENGINEERING TECHNOLOGY Research Institute Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province, 225300 Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
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