CN112585485A - Method for positioning a test substrate, a probe and an inspection unit relative to one another and testing machine for carrying out the method - Google Patents
Method for positioning a test substrate, a probe and an inspection unit relative to one another and testing machine for carrying out the method Download PDFInfo
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- CN112585485A CN112585485A CN201980055304.9A CN201980055304A CN112585485A CN 112585485 A CN112585485 A CN 112585485A CN 201980055304 A CN201980055304 A CN 201980055304A CN 112585485 A CN112585485 A CN 112585485A
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- 238000012360 testing method Methods 0.000 title claims abstract description 102
- 238000007689 inspection Methods 0.000 title claims abstract description 72
- 239000000758 substrate Substances 0.000 title claims abstract description 69
- 239000000523 sample Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000033001 locomotion Effects 0.000 claims description 150
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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Abstract
本发明涉及一种用于使测试基板(5)、探针(6)和检查单元(9)相对彼此定位的方法和试验机(1)，其中，测试基板(5)和探针(6)至少在X‑Y‑平面中以期望的相对位置彼此定向并且检查单元(9)以这种Z‑位置在相对位置之上移动，在该相对位置中将检查单元(9)的焦点设定到测试基板(5)的观察点上。为了简化以及加速检查单元(9)的跟随，测试基板(5)和检查单元(9)从该初始位置开始同步地沿Z‑方向运动，使得保持焦点平面。
The invention relates to a method and a testing machine (1) for positioning a test substrate (5), a probe (6) and an inspection unit (9) relative to each other, wherein the test substrate (5) and the probe (6) At least in the X-Y-plane, the desired relative positions are oriented to each other and the inspection unit (9) is moved in this Z-position over the relative position in which the focus of the inspection unit (9) is set to on the observation point of the test substrate (5). In order to simplify and speed up the following of the inspection unit (9), the test substrate (5) and the inspection unit (9) move synchronously in the Z-direction starting from this initial position, so that the focal plane is maintained.
Description
Technical Field
The invention relates generally to a method for positioning a test substrate, a probe and an inspection unit relative to one another, in which method the test substrate and the probe are oriented relative to one another in a desired relative position at least in an X-Y plane and the inspection unit is advanced by the relative position into a Z position in which the focus of the inspection unit is arranged on the observation point of the test substrate. The invention also relates to a testing machine for carrying out the method.
Background
It is known that electronic components of different properties, generally referred to as test substrates, are examined with respect to various properties or are subjected to special tests. Here, the test substrates are in different stages of manufacture and integration. Semiconductor chips, hybrid components, micromechanical and micro-optical components, etc., which are also present in the form of wafer complexes or are isolated or already integrated into more or less complex circuits, are thus tested.
For testing and inspecting the test substrates, test stations, generally called testers, are used which comprise a chuck having a surface for receiving the test substrate. The chucks are located on the supports of the test substrates, the contacting of the test substrates and the receiving devices of the test conditions are coordinated and can be moved in the X-, Y-and Z-directions, mostly by means of a movement unit.
The testing machine further includes a plurality of probes held by the probe holders. A single probe or a probe card having a plurality of probe tips, a so-called test card, may be used as the probe depending on the test substrate and the test case. The probe holder typically includes a probe holding plate that is arranged horizontally over the chuck and holds individual probes or carries a probe card by a probe head. The probe holding plate and/or the probe head can also have a movement unit by means of which the probes can be moved jointly or individually at least in the Z-direction.
The testing machine also has an inspection unit for graphically presenting the test substrate and the probe tips. The inspection unit comprises a microscope and/or a camera by means of which the surface of the test substrate can be seen in the Z-direction. The inspection unit usually also has a movement unit in order to move the lens in the Z direction close to the test substrate, so that the focus of the inspection unit is set to a defined observation point of the test substrate, i.e. the observation point can be imaged sharp and a sufficient distance can be established again, for example when changing probes.
The movement unit typically allows said parts of the testing machine to be moved independently of each other, for example by means of the examination unit bringing the probe tip or the test substrate or an intermediate position into focus. The movement unit is also usually equipped with a drive mechanism for driving the movement of the chuck and/or the probe holder plate or the individual probes and/or the inspection unit. The drive movement of the component is effected by means of a control unit provided for this purpose.
The focusing of the observation point is carried out repeatedly a number of times during the inspection process, which includes repeated contacting of one or more points of the test substrate and the feed movements in the X-, Y-and Z-directions required for this. On this basis, the time consumption is increased by each new feed movement.
In order to establish the point contact, in addition to the movability in the X-Y plane, which is always defined as the receiving surface of the chuck, and which is mostly realized by the movement unit of the chuck, a feed movement between the probe and the test substrate in the Z-direction is required.
First, the probe and the test substrate are positioned in the X-Y-plane relative to each other by means of at least one of the movement units such that they are arranged one above the other at a distance. In the following feed movement in the Z-direction (referred to as Z-feed movement below), the contact point is established. This Z-position is referred to as the contact position. After the test is completed, the contact is released in the Z-direction by the method and moved to the next contact position in the X-Y plane.
The Z-feed movement towards the contact position can be effected by means of a movement of the probe or by means of a movement of the test substrate. The feeding of the probe has the advantage that the relative position of the inspection unit and the test substrate is not changed and thus the focus is maintained on the contact surface, so that a minimum deviating movement of the probe tip under observation in the X-Y direction, which is achieved by the placement of the probe tip and which is required to establish a reliable electrical contact which can be continuously observed, can be observed continuously.
It has proven advantageous in various circumstances for the probe tips to travel in the Z-direction to an intermediate position over the test substrate. In which the probe tips are at a sufficiently large distance from the test substrate to enable correction in the X-Y plane, for example, without risk of damage to the probe tips. But the intermediate position enables simultaneous control of the X-Y position and smooth manual feed into the contact position.
Typically feeding in the Z-direction by a chuck is preferred or possible based on the design of the probe holder. However, this results in the necessity of adding an inspection unit in order, for example, to detect the contact surfaces of the test substrate. If it is also necessary to move to an intermediate position, the time required for this purpose is added up by the intermediate calibration required at the two components, chuck and inspection unit, and the total time is no longer acceptable in terms of always pursuing cost-effectiveness and partially or fully automated inspection.
There is therefore a need to simplify and accelerate the feed movement of the inspection unit in the Z-direction.
The accuracy of the feed in the X-Y plane should also be maintained here.
It is also possible to start the final feed at least from the intermediate position to the contact position by means of manual operation.
Disclosure of Invention
The object of the invention is to simulate, by means of a chuck and an inspection unit, the effect which is achieved when a probe holding plate with probes is raised and lowered and there is no movement of the test substrate and the inspection unit in order to establish and achieve contact between the test substrate and the probe tips. This is achieved by moving the test substrate and the inspection unit synchronously in the Z-direction starting from an initial position in which the focus of the inspection unit is set to a point of view of the test substrate, for example a contact surface on the surface of the test substrate, so that a desired end position of the test substrate, for example a contact position, is set with respect to the probe tips.
The synchronous movement is carried out in such a way that the focal plane is maintained at least during the Z-feed movement and, if necessary, also during the contact separation, so that the observation point on the test substrate remains clearly imaged, as is known from the prior art, as a movement of the probe. This process can be considered as a virtual movement of the probe card holder and can also be applied in cases where the probe card holder is not movable or where its movement interferes excessively in the inspection process.
The term "one" of the movements along the Z-direction includes the entire movement process which is carried out in order to cross the desired spacing in the Z-direction, for example up to the spacing of the contacts of the probe tips on the test substrate, as well as the individual sections thereof. Such a section may for example be a feed from or to the above-mentioned intermediate position, which involves or is moved away from the test substrate.
Features for implementing this scheme are described below. The skilled person combines these features differently from each other in different embodiments, as long as the skilled person considers this to be advantageous and suitable for the application situation.
The orientation specification X, Y, Z corresponds to common applications in the art for the horizontal X-and Y-directions and the vertical Z-direction.
The synchronous movement with maintained focal plane includes the length of the movement in the Z-direction and the time portion.
The term "synchronous" here also denotes temporally identical movements and includes delays which are determined by the control unit and/or which can be implemented by means of currently customary computing techniques when a movement of the focal point is automatically detected by means of customary algorithms and a corresponding compensating movement is triggered.
It was found that with the current tester technology a waiting time, i.e. a delay time of 300ms, between the actual execution of the trigger, e.g. the start of the movement of the chuck, and the start of the actual movement of the inspection unit following the chuck movement, is sufficient to be able to recognize the movement of the focal plane in time.
By "timely" is meant, for example, that the deflection motion triggered by the placement of the probe tip on the test substrate is sensed at a point in time when the probe tip is still on the contact region and/or another unfavorable relative position has not been compromised or achieved. Preferably, the waiting time should be less than 200ms, preferably less than 100ms, more preferably less than 50ms, more preferably less than 40ms, more preferably less than 30ms, more preferably less than 20ms, more preferably less than 10ms, more preferably less than 5 ms. The permissible offset movements and the achievable waiting times can be further reduced with increasing scaling of the electronic components and efficiency of the computation technology.
The synchronous movement of the test substrate and the inspection unit can be realized, for example, by means of control signals for carrying out the synchronization of the movements of the chuck and the inspection unit, wherein the above-described waiting times can be used for the time intervals of the control signals.
When describing the movement of the chuck in the following, this movement is the same as the movement of the test substrate, since the chuck carries the test substrate on its horizontal receiving surface.
According to one embodiment of the method, the movement of the test substrate and the inspection unit in the Z-direction can be carried out by a robot body which is part of the robot of the testing machine used. The robot body is moved, specifically by the direction of movement and the extent of movement, for example length or angle. The direction and extent of the movement of the robot body are detected in terms of measurement technology by means of suitable movement measurement value sensors, so that the movement needs to be carried out in the Z direction for the chuck and/or the examination unit, from which the orientation of the movement direction of the robot body and the movement length of the movement amount of the robot body can be derived.
On the basis of the measured values and the control signals generated therefrom, the chuck or the inspection unit is moved and, due to the coupling of the two movement units by means of the computing technology of the control unit, the respective other test machine component follows this initial movement synchronously. Other methods for connecting the two movements that allow a synchronous movement are also conceivable depending on the configuration of the checking device. The initial movement may be performed, for example, by a chuck, which the inspection unit follows. Other sequences of the two components or movements of the two components based on the control signals generated from the measured values are also possible.
In order to achieve a synchronous movement of the test substrate and the inspection unit, the robot arm can be coupled to the two movement units such that the robot arm controls the drive mechanisms of the two movement units in a drive movement, wherein a control signal for controlling the movement units is generated on the basis of the measured values of the movement value sensors of the robot arm.
Alternatively, the robot can interact directly with only one of the two movement units. In this embodiment, the second motion unit performs a compensating motion in the Z direction.
According to another embodiment, the robot body is moved manually. Alternatively, movements of the robot body by means of suitable robot controls are also possible.
The movement of the robot body may be a rotation of the robot body about a rotation axis. Here, the clockwise or counterclockwise direction of rotation specifies the direction up or down in the Z-direction and the angle of rotation specifies the value of positive or negative lift, i.e. the length of movement in the Z-direction.
According to a further embodiment of the method, the movement of the robot body can be limited by a stop or stops. The stop limits the extent of movement and may be defined by the contact location. For common applications, advantageous starting, intermediate and end positions, for example minimum spacing positions, can be defined by means of stops.
It has been found that the axes of motion of the chuck and the inspection unit in the Z-direction are not always exactly parallel to each other. According to one embodiment of the method, a Z-movement-based offset is determined and compensated for by means of its movement unit in order to compensate for the resulting change in the X-Y relative position between the observation point of the test substrate and the focal point of the inspection unit. The latency described above for the synchronous motion can also be used for this purpose.
Compensation for X-Y-offset (referred to herein as linear compensation) can be made in the X-Y-direction by additional movement of at least one of the two members, depending on the direction and extent of movement of the offset during or after the movement is performed in the Z-direction. Compensation is preferred during movement and before the probe tips are placed on the test substrate, for example when the test substrate is moved in the X-Y-direction, to avoid damage to the contact surfaces due to subsequent compensation.
Alternatively, the compensation may be made next to the Z-motion. In this respect, the inspection unit is moved, while the relative position between the test substrate and the probe holder is unaffected.
The offset is determined on the basis of the distance between the two contact partners, which is produced during the Z-movement and which, in the event of a non-parallel extension of the Z-movement, moves the image field relative to the test substrate. This offset can be seen in the top view. The offset can be derived, like the offset in the synchronized Z-motion, by known methods, for example model recognition methods or in situ monitoring of the spatial position of the two components or other suitable measures.
Alternatively, the Z-axis orientation may be known, for example, from prior feed motions or analysis of the testing machine. In all cases linear compensation can be equalized during or after Z-motion by motion controlled in the reverse direction.
The testing machine which can be used for carrying out the method has, in addition to components of this type, namely the chuck, the probe and its corresponding holder and the inspection unit, a positioning device which comprises movement units, at least one of which is used for the chuck and one of which is used for the inspection unit in order to move the chuck and the inspection unit at least in the Z-direction. Furthermore, at least one control unit for controlling the two movement units is configured such that the movements of the chuck and the examination unit can be carried out synchronously according to the above description. Alternatively, each of the movement units may have its own control unit, which are connected to each other in communication for the purpose of carrying out a synchronous movement.
The synchronized movement is performed in such a way that the focal plane is maintained, so that the observation point remains clearly imaged on the test substrate.
According to one embodiment, the positioning device of the testing machine comprises a robot for moving the chuck and the inspection unit.
The robot includes a robot main body, an operation member for moving the robot main body and the motion value sensor. The object which can be moved such that the direction of movement and the degree of movement can be unambiguously obtained from its movement by measurement techniques is considered as a robot body.
Depending on the design of the manipulator, a defined direction of movement is ensured when the movement of the manipulator has exactly one degree of freedom.
According to a further embodiment of the robot, the robot body can be a rotary body, which is arranged so as to be rotatable about its axis of rotation.
The manipulator is operated by means of suitable operating elements which are adjusted in a manual or motorized manner of operation and in a movement, for example in a rotary or mobile manner, of the manipulator body.
The direction and extent of the movement are determined by means of a movement value sensor of the robot arm, for which purpose the movement value sensor is correspondingly provided. The motion value sensor is arranged relative to the robot body as a function of the type of motion value sensor and the motion that can be derived therefrom. In the example of the rotating body, the motion value sensor is a rotation value sensor that detects a rotation direction and a rotation angle and is arranged axially with respect to the rotating body, for example. Alternatively, more than one motion value sensor can be used in order to derive the required measured values. The measured values are optionally preprocessed and passed to at least one control unit.
Based on the measured values, control signals are generated, which are used to control the movement of the chuck or the examination unit or both in the Z-direction according to the above description. For this purpose, the motion value sensor is connected in communication with the control unit.
According to a further embodiment of the testing machine, the robot has at least one stop for limiting the movement of the robot body. Advantageously, the stop is variable in the Z-direction and/or adjustable for a defined distance. By moving the stop, it is also possible to move the stop manually to different end or intermediate positions in a precise manner. The at least one stop can be implemented on the robot arm on the hardware side or on the software side, for example by means of a control unit.
According to the method description, it may be necessary to linearly compensate the relative position of the chuck and the examination unit in the X-Y-direction in order to always provide the desired image part. To this end, the testing machine provided for the linear compensation comprises at least one such movement unit which can be brought into contact with the chuck or the inspection unit and which is configured to perform a movement of the component in the X-, Y-direction in addition to the Z-movement. Alternatively, two components can also be connected to such a movement unit. Furthermore, the control unit can be configured on the hardware side and on the software side to control at least one respective movement unit in the X-, Y-and Z-directions.
Drawings
The present invention will be described in detail below based on examples. The figures show:
fig. 1 shows a testing machine with components that are essential for the invention;
FIGS. 2A and 2B show perspective and cross-sectional views of details of one embodiment of a robot; and
figure 3 shows a robot body with adjustable stops.
Detailed Description
The figures only schematically show the device within the scope necessary for elucidating the invention. The figures do not require completeness or correctness of scale.
The testing machine 1 according to fig. 1 comprises a chuck 2 and a chuck movement unit 3. The chuck 2 is movable in the X-, Y-and Z-directions. These directions are shown by a coordinate system. A test substrate 5, for example a wafer, is arranged on the upper, horizontal receiving surface 4. The wafer is contacted by probes 6 held by a probe head 7. The probe head is arranged on a probe holding plate 8.
The inspection unit 9, for example a camera, sees the test substrate 5 from above, specifically the contact points, in the Z-direction, so that the contact points can be imaged clearly. The examination unit 9 also has a movement unit 10, by means of which the examination unit 9 can be moved, for example, also in the X-, Y-and Z-direction, but at least in the Z-direction.
In order to clarify the certainty of the movement of the movable components and the associated movement units or holders, the chuck 2 and the inspection unit 9 and their movement units 3, 10 and the probe head 7 and its probe holder plate 8 are shown here as being fixed on a base and statically defined as a common reference system (horizontal line in the form of a shadow).
The two movement units 3, 10 are connected in communication with a common control unit 11 during their operation, which is configured for this purpose, for example but without limitation, on the hardware side and on the software side.
In the schematic representation, the chuck 2 is moved into the contact position K of the chuckCIn (5), the probe 6 is in contact with the test substrate 5. The checking unit 9 is also in its contact position K of the checking unitIIn (1). In this contact position, the focal point of the inspection unit 9 is set on the surface of the wafer 5 and on the tip of the probe 6 on the wafer.
If contact needs to be released, the chuck 2 will travel downwards (shown by the arrow). At the same time, the inspection unit 9 is also moved downwards at equal intervals in the Z-direction (indicated by the same arrow length). These movements can be carried out up to the intermediate position Z of the chuck, respectivelyCMiddle position Z of the inspection unitI(the lower edges of the receiving surface 4 and of the inspection unit 9 for the chuck 2 are each shown by a dashed line) or respectively up to the chuckTerminal position ECChecking the terminal position E of the unitI(the lower edges of the receiving surface 4 for the chuck 2 and of the inspection unit 9 are shown by dot-dash lines, respectively). Due to the synchronized movement of the chuck 2 and the inspection unit 9, a set observation point 12 remains on the test substrate 5, one of the contact surfaces of the wafer contacted by the probe tips in this embodiment being clearly visible at all times during the movement of the chuck 2 towards one of the deeper positions.
At an intermediate position Z of the chuckCOr end position E of the chuckCThe chuck 2 can be moved in the X-and/or Y-direction, thereby being moved towards another electronic structural element of the wafer and then contacted by means of the probes 6.
For contacting the next electronic component, the wafer 5 is lifted, for example, by means of the chuck 2 into the chuck's intermediate position ZCIn (1). Intermediate position Z of the chuckCIntermediate position Z in its Z coordinate with the previous chuckCAnd an intermediate position Z of the chuck of any other electronic structural element of the wafer 5CAnd (5) the consistency is achieved. The chuck 2 is then moved into the chuck contact position KCIn (1).
In the control unit 11, a control signal for moving the chuck 2 is generated synchronously with the movement of the inspection unit 10 to a similar intermediate position Z for the inspection unit firstIAnd the contact position K of the subsequent inspection unitIThe control signal of (1).
Fig. 2A and 2B show an embodiment of the robot 13 by way of example and without limitation. The same reference numerals used in the two drawings respectively denote the same components of the robot arm.
The robot arm 13 itself is manually operated and controls the driving movement of the chuck 2.
The robot 13 includes a robot main body 20 configured as a cylindrical rotary body. The robot main body 20 is rotatably supported in a housing 21.
An operating element 23, which in this exemplary embodiment is embodied as a lever 23, is mounted on the robot body 20 by means of a suitable connector 22 (fig. 2B) such that the robot body 20 can be rotated manually clockwise and counterclockwise by means of the operating element. Such a lever 23 can also be used for other movements of alternative embodiments of the robot body. The lever 23 is guided in the frame 25, wherein the contour of the lever corresponds to the contour of the frame 25.
Further, the operation force and the operation torque of the robot main body 20 and the sensitivity thereof can be changed by the actuator 24. In this embodiment two detents 24 are arranged, which press with a settable force onto the outer surface of the cylindrical robot body 20.
Adjacent to and axially with respect to the robot body 20 there is arranged a motion value sensor 26, in this embodiment a rotation value sensor 26, which measures the direction of rotation and the angle of rotation. Optionally after a preliminary processing, the measured values are transmitted to the control unit 11 (fig. 1) via a signal conductor 28.
The robot main body 20 and the rotation value sensor 26 are protected from external influences by an inner liner 27 and can be mounted on a testing machine (fig. 1).
Fig. 3 shows an alternative embodiment of a robot body 30, wherein the robot body 30 is designed as a rotary knob 31 and can be locked in a defined angular position. The knob 31 is rotatable about its axis 32. Three radial recesses 34 are arranged on the partial circumference in the outer surface 33 thereof, into which recesses pins 35 can be inserted. The pin 35 is introduced into one of the recesses 34 by means of a guide groove 37 of a guide plate 36 arranged centrally with respect to the knob 31 and in this way limits the implementable rotational movement of the knob 31 over the length of the guide groove 37. If a further recess 34 is used, a further rotational movement can be carried out, thereby enabling the length of the movement that can be carried out by means of the movement unit 3, 10 to be varied.
Alternative embodiments of the robot or the stop are possible. This design supports tactile differentiation if the tester has a plurality of manipulators with different functions.
Reference numerals
1 testing machine
2 chuck
3 direction of movement of the chuck
4 receiving surface
5 test substrate and wafer
6 Probe
7 Probe head
8 Probe holding plate
9 inspection unit
10 direction of movement of the inspection unit
11 control unit
12 observation points
13 mechanical arm
20 robot body
21 casing
22 connector
23 operating element, lever
24 brake
25 frame
26 motion value sensor, rotation value sensor
27 inner liner
28 signal conductor
30 robot body
31 knob
32 axes
33 outer surface
34 recess
35 Pin
36 guide plate
37 guide groove
KCContact position of chuck
ZCIntermediate position of chuck
ECEnd position of chuck
KIChecking contact position of unit
ZIIntermediate position of the inspection unit
EIChecking the terminal position of the unit
Claims (13)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018121911.3A DE102018121911A1 (en) | 2018-09-07 | 2018-09-07 | Method for positioning the test substrate, probes and inspection unit relative to each other and Prober for its execution |
| DE102018121911.3 | 2018-09-07 | ||
| PCT/DE2019/100794 WO2020048567A1 (en) | 2018-09-07 | 2019-09-04 | Method for positioning test substrate, probes and inspection unit relative to one another, and tester for carrying out the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112585485A true CN112585485A (en) | 2021-03-30 |
| CN112585485B CN112585485B (en) | 2024-09-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980055304.9A Active CN112585485B (en) | 2018-09-07 | 2019-09-04 | Method for positioning a test substrate, a probe and an inspection unit relative to each other and a testing machine for implementing the method |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3847466A1 (en) |
| KR (1) | KR102738943B1 (en) |
| CN (1) | CN112585485B (en) |
| DE (1) | DE102018121911A1 (en) |
| TW (1) | TWI856024B (en) |
| WO (1) | WO2020048567A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI835495B (en) * | 2022-01-31 | 2024-03-11 | 日商山葉汎提克股份有限公司 | Electrical inspection equipment and electrical inspection method |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN112585485B (en) | 2024-09-06 |
| KR20210055708A (en) | 2021-05-17 |
| DE102018121911A1 (en) | 2020-03-12 |
| EP3847466A1 (en) | 2021-07-14 |
| TW202027227A (en) | 2020-07-16 |
| TWI856024B (en) | 2024-09-21 |
| WO2020048567A1 (en) | 2020-03-12 |
| KR102738943B1 (en) | 2024-12-04 |
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