CN112566748A - Laser circle cutting method and device - Google Patents

Laser circle cutting method and device Download PDF

Info

Publication number
CN112566748A
CN112566748A CN201980052908.8A CN201980052908A CN112566748A CN 112566748 A CN112566748 A CN 112566748A CN 201980052908 A CN201980052908 A CN 201980052908A CN 112566748 A CN112566748 A CN 112566748A
Authority
CN
China
Prior art keywords
laser
rotating platform
shaft rotating
light
time window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980052908.8A
Other languages
Chinese (zh)
Inventor
祝伍
李子博
刘腊梅
杨硕
杨于武
孙杰
尹建刚
高云峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Han s Laser Technology Industry Group Co Ltd
Original Assignee
Han s Laser Technology Industry Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Han s Laser Technology Industry Group Co Ltd filed Critical Han s Laser Technology Industry Group Co Ltd
Publication of CN112566748A publication Critical patent/CN112566748A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting

Abstract

A laser rounding method, comprising: a single-shaft rotating platform is arranged and used for driving the workpiece to rotate, so that the laser beam forms a circular track to be cut relative to the workpiece; presetting a laser light-emitting time window according to the running speed and the position of the single-shaft rotating platform, wherein the starting point of the laser light-emitting time window is the position of the single-shaft rotating platform when the single-shaft rotating platform is accelerated to a constant speed state, and the end point of the laser light-emitting time window is the position of the single-shaft rotating platform rotating at a constant speed for 360 degrees; and detecting the real-time position of the single-shaft rotating platform, and controlling the laser to be opened when the real-time position is positioned in a light-emitting time window of the laser, or to be closed when the real-time position is not positioned in the light-emitting time window of the laser. The single-shaft rotating platform is adopted to drive the workpiece to rotate, so that the influence of the self performance of the moving platform on the circle cutting precision is avoided; set up laser instrument light-emitting time window, control laser instrument is at the homokinetic operation in-process of unipolar rotary platform and is carried out the circle of contact to the work piece, has both guaranteed the cutting quality, has improved the efficiency that the circle was cut to laser again. Also relates to a laser circle cutting device.

Description

Laser circle cutting method and device Technical Field
The invention relates to the technical field of laser cutting, in particular to a laser circle cutting method and a laser circle cutting device.
Background
The traditional laser cutting technology adopts a double-shaft cutting system, various cutting patterns such as a circle, a square, an ellipse or other irregular patterns are formed through the matching action of a double-shaft platform, and the laser acts on a target workpiece along the track of the cutting patterns to process products with various patterns. This method is widely used in various fields, but it still has a problem in cutting a circle.
The circular shape is realized by double-axis circular interpolation, namely, the x and y linear motion platforms are matched with each other through an algorithm to form a circular pattern, and meanwhile, a laser beam is impacted on a target workpiece along the circular pattern, so that the purpose of circle cutting is achieved.
However, the circular pattern is actually a pattern that is approximately circular and is composed of a plurality of straight line segments in different directions, as shown in fig. 1. The x and y linear motion platforms simultaneously move to synthesize a straight line segment in a certain direction, the direction of the straight line segment, namely the slope, is equal to the speed ratio of the two shafts, and the straight line segments in different directions can be obtained through speed conversion of the x and y linear motion platforms.
The speed of each point on the circular track is obtained in the mode and is the resultant speed of the x direction and the y direction, the speed of the x direction and the speed of the y direction are continuously changed, and the resultant speed is also continuously changed. Therefore, the laser light falls on the circular trajectory at a fixed frequency, and a difference in dot pitch is formed. When the platform speed is lower, the point spacing is very small, the difference of the point spacing is very small, and the final cutting effect is not greatly influenced; however, when the platform speed is fast, the dot pitch becomes large, and the difference between the dot pitches also becomes large, and the difference is obviously reflected on the cutting edge, so that the smoothness of the cutting edge is affected, and the processing requirement cannot be met. In order to ensure the processing requirement, the speed of the x and y linear motion platform must be matched with the laser frequency in this way, so that the speed of the platform, namely the processing efficiency, is greatly limited.
In addition, the circle of the method is a figure similar to a circle and simulated by the motion of the x and y linear motion platforms, and the roundness of the curve is directly influenced by the performance of the x and y linear motion platforms, so the machining precision of the final product is limited by the performance of the x and y linear motion platforms.
For these reasons, conventional laser cutting methods are difficult to adapt for high efficiency and high precision circular cutting applications.
Disclosure of Invention
The invention provides a method and a device for cutting a circle by laser, which aim to solve the problems of low processing efficiency and low processing precision when the existing laser cutting system cuts the circle.
The laser circle cutting method comprises the following steps:
a single-shaft rotating platform is arranged and used for driving the workpiece to rotate, so that the laser beam forms a circular track to be cut relative to the workpiece;
presetting a laser light-emitting time window according to the running speed and the position of the single-shaft rotating platform;
detecting the real-time position of the single-shaft rotating platform, and controlling the laser to be turned on when the real-time position is positioned in a light-emitting time window of the laser, or to be turned off when the real-time position is not positioned in the light-emitting time window of the laser;
the starting point of the light-emitting time window of the laser is the position of the single-shaft rotating platform when the single-shaft rotating platform accelerates to a uniform speed state, and the end point of the light-emitting time window of the laser is the position of the single-shaft rotating platform rotating at the uniform speed by 360 degrees.
Further, the step of presetting the laser light-emitting time window according to the operation speed and the position of the single-axis rotating platform comprises the following steps:
determining motion parameters of a workpiece according to the machining requirements;
controlling the single-shaft rotating platform to operate according to the motion parameters of the workpiece, and measuring the position of the workpiece accelerated to a uniform speed state as an angle theta;
and presetting a light-emitting time window of the laser to be (theta, theta +360 DEG) according to the angle.
Further, the method further comprises:
an encoder is arranged and used for feeding back the real-time position of the single-shaft rotating platform;
the resolution of the encoder is A, when the feedback value of the encoder falls into
Figure PCTCN2019096477-APPB-000001
And controlling the laser to emit light in the interval.
Further, the method further comprises:
controlling the single-shaft rotating platform to decelerate after the laser is closed;
when the encoder feedback value is
Figure PCTCN2019096477-APPB-000002
The single-axis rotation platform is stopped.
Further, the method is based on an aerotech controller; observing the position of the single-shaft rotating platform accelerated to a constant speed state through an oscilloscope of an aerotech controller; and establishing a light-emitting time window of the laser through windows of the aerotech controller.
The laser circle cutting device comprises a laser and:
the single-shaft rotating platform is used for driving the workpiece to rotate so that the laser beam forms a circular track to be cut relative to the workpiece;
the control unit is respectively connected with the single-shaft rotating platform and the laser and used for presetting a light-emitting time window of the laser, detecting the real-time position of the single-shaft rotating platform and controlling the laser to be started when the real-time position is positioned in the light-emitting time window of the laser;
the starting point of the light-emitting time window of the laser is the position of the single-shaft rotating platform when the single-shaft rotating platform accelerates to a uniform speed state, and the end point of the light-emitting time window of the laser is the position of the single-shaft rotating platform rotating at the uniform speed by 360 degrees.
Further, the control unit comprises a driver which controls the single-shaft rotating platform to operate and read the real-time operation speed and position of the single-shaft rotating platform; presetting a laser start-stop time window, comparing the real-time position of the single-shaft rotating platform with the time window, and sending a control signal to the laser according to a comparison result.
Further, the control unit still includes the encoder, the encoder sets up between unipolar rotary platform and driver, reads the real-time position feedback of unipolar rotary platform to the driver.
Further, the driver is an aerotech controller, and the aerotech controller is provided with an oscilloscope for displaying the real-time speed and position of the single-axis rotating platform and windows for establishing a light-emitting time window of the laser.
According to the invention, the single-shaft rotating platform is arranged to replace a double-shaft linear motion platform to drive the target workpiece to rotate, so that the influence of the self performance of the double-shaft linear motion platform on the circle cutting precision can be avoided; through setting up laser instrument light-emitting time window, control laser instrument carries out the circle of contact to the work piece at unipolar rotary platform uniform velocity operation in-process, can guarantee on the one hand that the point interval that laser was beaten on the target work piece is unchangeable to ensure the cutting quality, on the other hand can make unipolar rotary platform operating speed not restricted by laser frequency, thereby improves the efficiency that laser was cut the circle greatly. Therefore, the method and the device are more suitable for circle cutting application occasions with higher requirements on precision and efficiency.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic diagram of a conventional biaxial circular interpolation cyclotomy method;
FIG. 2 is a schematic flow chart of a laser rounding method of the present invention;
fig. 3 is a schematic structural diagram of the laser circle cutting device of the present invention.
Detailed Description
The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 2, the laser circle cutting method of the present invention includes the following steps:
a single-shaft rotating platform is arranged and used for driving the workpiece to rotate, so that the laser beam forms a circular track to be cut relative to the workpiece;
presetting a laser light-emitting time window according to the running speed and the position of the single-shaft rotating platform, wherein the starting point of the laser light-emitting time window is the position of the single-shaft rotating platform when the single-shaft rotating platform is accelerated to a constant speed state, and the end point of the laser light-emitting time window is the position of the single-shaft rotating platform rotating at a constant speed for 360 degrees;
and detecting the real-time position of the single-shaft rotating platform, and controlling the laser to start light emission when the real-time position is positioned in a light emission time window of the laser, or closing the laser and stopping light emission.
The single-shaft rotating platform can drive the workpiece to rotate and can also drive the laser to rotate, and only the workpiece and the laser beam can move relatively to form a circular cutting track. Because the laser light path is comparatively complicated, in order to guarantee the stability of its light-emitting, generally with its standing, but adopt the rotatory mode of unipolar rotary platform drive work piece.
The single-shaft rotating platform drives the workpiece to rotate, the track formed by the laser beam is circular, the roundness of the workpiece is greatly improved compared with a traditional double-shaft circular interpolation mode, and the precision of a product obtained by final cutting can be guaranteed.
The single-shaft rotating platform drives the workpiece to rotate initially and is in an acceleration state. Because the laser instrument frequency of light-emitting is certain, consequently, if light-emitting under the unipolar rotary platform acceleration state, the laser beam hits the spot interval on the work piece and can have the difference, can influence cutting effect finally. In order to ensure the cutting effect, the laser needs to be controlled to emit light to cut the workpiece in the uniform-speed rotation process of the single-shaft rotating platform.
Specifically, a laser light emitting time window is preset according to the running speed and the position of the single-axis rotating platform, the time window is a position interval corresponding to the uniform running state of the single-axis rotating platform, the starting point is the position of the single-axis rotating platform accelerated to the uniform state, and the end point is the position of the single-axis rotating platform rotating at a uniform speed by 360 degrees.
And detecting the real-time position of the single-shaft rotating platform, and controlling the laser to start light emission when the real-time position is positioned in a light emission time window of the laser, or closing the laser and stopping light emission. Namely, the laser is controlled to start light emission when the single-shaft rotating platform rotates to a constant speed state; taking the position as a starting point, continuously rotating the single-axis rotating platform for 360 degrees, and keeping the laser in a light emitting state during the period; and after the single-shaft rotating platform reaches the position of the starting point plus 360 degrees, the laser is closed, and light emission is stopped.
Along with the rotation of the single-shaft rotating platform, the laser beam forms a circular cutting track on the workpiece, and when the laser is closed, a complete circle is just finished, so that circular cutting is realized. Because the workpiece rotates at a constant speed along with the single-shaft rotating platform in the process of cutting the workpiece by the light emitted by the laser, the distance between points of a laser beam on the workpiece is inevitably equal on the premise of a certain light emitting frequency of the laser, and the quality of product cutting is ensured.
Further analysis shows that every time the single-axis rotary platform rotates by a certain angle, a laser beam is shot on a workpiece to form a certain arc length, and the laser beam can be seen to emit light every time, namely, every time a point interval is increased in a cutting track, the single-axis rotary platform needs to rotate by a corresponding angle. The ratio of the angle of rotation of the single-axis rotating platform in one rotation of the single-axis rotating platform should be equal to the ratio of one dot pitch in one complete circular cutting track, namely the rotation angle ratio is equal to the arc length ratio. From the above analysis, the formula can be derived:
Figure PCTCN2019096477-APPB-000003
wherein v represents the angular velocity of the single-shaft rotating platform, unit (°/s), f represents the laser light frequency, unit (Hz), L represents the dot pitch formed by the laser beam on the product, unit (mum), D represents the diameter of the circular track to be cut on the workpiece, unit (mm).
Obviously, v/f represents the angle of rotation of the single-axis rotating platform every time the laser emits light;
Figure PCTCN2019096477-APPB-000004
it means the ratio of v to the angle by which the uniaxial rotary stage rotates per light output of the laser in one revolution of the uniaxial rotary stage.
Figure PCTCN2019096477-APPB-000005
It represents the proportion of one dot pitch increased by the cutting track in a complete circular cutting track every time the laser emits light.
When the laser light-emitting frequency is certain, the circular track to be cut of the workpiece is also certain, f and D are fixed values, and then:
L=Kv
wherein the content of the first and second substances,
Figure PCTCN2019096477-APPB-000006
is a constant.
According to the relation between L and v, when the single-shaft rotating platform drives the workpiece to rotate at a constant speed, namely v is a fixed value, the distance between points of the laser beam on the workpiece is unchanged. The faster the uniform rotation speed of the single-shaft rotating platform is, the larger the overall dot spacing is, but the dot spacing is still consistent.
Compared with the traditional mode, the distance between the points, which are irradiated by the laser beam, on the workpiece cannot be different due to the acceleration of the platform speed, so that the processing efficiency can be improved by accelerating the rotating speed of the single-shaft rotating platform, and the laser frequency is not limited any more. Of course, this does not mean that the rotation speed of the single-axis rotating platform can be increased without limit, the laser dot pitch is increased as the rotation speed is increased, and the phenomenon of cutting-tight may be caused due to the excessively large dot pitch.
As mentioned above, the rotation speed of the workpiece directly affects the distance between the points where the laser beam strikes the workpiece, and thus the final cutting effect. Therefore, in order to meet the processing requirements of the workpiece, the motion parameters of the workpiece, including the speed and the acceleration of the rotation of the workpiece, that is, the speed and the acceleration of the uniform rotation of the single-axis rotating platform, need to be determined in advance. According to the motion parameters, the position of the single-shaft rotating platform in the uniform speed state can be calculated, and the time when the laser is controlled to start light emitting can be determined. However, in consideration of the inevitable error of the calculated data, the present invention records the position of the single-axis rotating platform rotating to a uniform speed state, i.e. the required rotating angle, according to the actual test result.
Therefore, the step of presetting the laser light-emitting time window according to the running speed and the position of the single-axis rotating platform specifically comprises the following steps:
determining motion parameters of a workpiece according to the machining requirements;
controlling the single-shaft rotating platform to operate according to the motion parameters of the workpiece, and measuring the position of the workpiece accelerated to a uniform speed state as an angle theta;
and presetting a light-emitting time window of the laser to be (theta, theta +360 DEG) according to the angle.
In order to facilitate practical industrial application, the invention is also provided with an encoder for feeding back the real-time position of the single-shaft rotating platform. The encoder is connected with a motor of the single-shaft rotating platform, and the reading of the encoder represents the real-time rotating angle of the motor. Assuming an encoder resolution of a, the encoder reading will increase by a/360 ° for every 1 degree of motor rotation. The time window of starting and stopping the laser is represented by the reading of the encoder
Figure PCTCN2019096477-APPB-000007
Figure PCTCN2019096477-APPB-000008
Therefore, the laser circle cutting method of the present invention further comprises:
an encoder is arranged and used for feeding back the real-time position of the single-shaft rotating platform;
the resolution of the encoder is A, when the feedback value of the encoder falls into
Figure PCTCN2019096477-APPB-000009
And controlling the laser to emit light in the interval.
After the laser circle cutting is finished, the single-shaft rotating platform can drive the workpiece to decelerate and stop so as to replace the next workpiece to be processed. The deceleration to stop of the single-shaft rotating platform from the constant speed can be the reverse process from the acceleration to the constant speed, and the required rotating angle is equal to the required rotating angle from the acceleration to the constant speed and is theta. Correspondingly, when the single-shaft rotary platform stops, the degree of the encoder should be
Figure PCTCN2019096477-APPB-000010
Therefore, the laser circle cutting method of the present invention further comprises the steps of:
controlling the single-shaft rotating platform to decelerate after the laser is closed;
when the encoder feedback value is
Figure PCTCN2019096477-APPB-000011
The single-axis rotation platform is stopped.
The above method is based on an aerotech controller. The aerotech controller has an oscilloscope function and can display the real-time speed and position of the motor controlled by the aerotech controller. Before the same workpiece is machined, an oscilloscope of an aerotech controller can observe the rotation angle required by the acceleration of the single-shaft rotating platform to a uniform speed state, and the rotation angle is recorded and can be used for subsequently establishing a light emitting time window of the laser. The aerotech controller also has a windows function, and the invention establishes a laser light-emitting time window by utilizing the function and associates the position of the single-shaft rotating platform with the laser start-stop time, thereby achieving the purpose of controlling the laser to emit light in the process of rotating the single-shaft rotating platform at a constant speed for one circle. Of course, the functions can be realized by adopting a conventional motor driver and matching with software, but the control mode of the aerotech controller is simpler and more intuitive, and the control precision is better.
In order to implement the laser circle cutting method, the invention also provides a laser circle cutting device.
As shown in fig. 2, the laser circle cutting apparatus of the present invention includes a laser, a single-axis rotating table, and a control unit. The laser is arranged at the upper part of the single-shaft rotating platform, the workpiece is arranged on the surface of the single-shaft rotating platform, and the height of the laser is adjusted to enable the workpiece to be positioned on a laser focal plane; the single-shaft rotating platform drives the workpiece to rotate, so that the laser beam forms a circular track to be cut relative to the workpiece; and the control unit is respectively connected with the single-shaft rotating platform and the laser and is used for controlling the laser to be started when the single-shaft rotating platform rotates to a constant speed state, cutting the workpiece, and then being closed after the single-shaft rotating platform rotates at the constant speed for 360 degrees, and stopping cutting.
The control unit comprises a driver, and the driver consists of a control card and matched control software. The control card is respectively connected with the single-shaft rotating platform motor and the laser, and the software controls the single-shaft rotating platform to run and read the running state of the single-shaft rotating platform through the control card, comprises the real-time position and speed of the single-shaft rotating platform and is displayed on a software interface. The method comprises the steps of presetting a starting point in software as a position when a single-shaft rotating platform accelerates to a constant speed state, presetting a terminal point as a laser light emitting time window when the single-shaft rotating platform rotates 360 degrees at the constant speed, comparing the read real-time position of the single-shaft rotating platform with the time window, and sending a control signal to the laser according to a comparison result. When the real-time position of the single-shaft rotating platform reaches the starting point of the time window, sending a laser starting signal to control the laser to emit light; and when the real-time position of the single-axis rotating platform reaches the end point of the time window, sending a laser closing signal to control the laser to stop emitting light.
As mentioned above, for the convenience of practical industrial application, the control unit further includes an encoder disposed between the single-axis rotary platform and the driver, and reads the real-time position of the single-axis rotary platform and feeds the position back to the driver.
In order to achieve simpler control and higher control accuracy, the driver of the invention adopts an aerotech controller which is provided with an oscilloscope used for displaying the real-time speed and position of a single-shaft rotating platform and windows used for establishing a light-emitting time window of the laser.
The above is a specific embodiment of the present invention. The laser circle cutting method and the laser circle cutting device can greatly improve the processing efficiency of products, and the efficiency can reach more than 10 times of that of the existing double-shaft system through actual measurement. By taking glass cutting within 100mm in diameter as an example, when the processing speed of the conventional biaxial system reaches 150 degrees/s, the phenomenon of uneven spacing begins to appear, and by adopting the scheme of the invention, equal-spacing light emission can be realized when the processing speed reaches more than 2000 degrees/s, and the processing requirement of laser cutting can be met.
It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations are intended to fall within the scope of the appended claims.

Claims (9)

  1. A laser rounding method, comprising:
    a single-shaft rotating platform is arranged and used for driving the workpiece to rotate, so that the laser beam forms a circular track to be cut relative to the workpiece;
    presetting a laser light-emitting time window according to the running speed and the position of the single-shaft rotating platform;
    detecting the real-time position of the single-shaft rotating platform, and controlling the laser to be turned on when the real-time position is positioned in a light-emitting time window of the laser, or to be turned off when the real-time position is not positioned in the light-emitting time window of the laser;
    the starting point of the light-emitting time window of the laser is the position of the single-shaft rotating platform when the single-shaft rotating platform accelerates to a uniform speed state, and the end point of the light-emitting time window of the laser is the position of the single-shaft rotating platform rotating at the uniform speed by 360 degrees.
  2. The method of claim 1, wherein the step of presetting the laser light-emitting time window according to the operation speed and position of the single-axis rotating platform comprises:
    determining motion parameters of a workpiece according to the machining requirements;
    controlling the single-shaft rotating platform to operate according to the motion parameters of the workpiece, and measuring the position of the workpiece accelerated to a uniform speed state as an angle theta;
    and presetting a light-emitting time window of the laser to be (theta, theta +360 DEG) according to the angle.
  3. The laser rounding method of claim 2, further comprising:
    an encoder is arranged and used for feeding back the real-time position of the single-shaft rotating platform;
    the resolution of the encoder is A, when the feedback value of the encoder falls into
    Figure PCTCN2019096477-APPB-100001
    And controlling the laser to emit light in the interval.
  4. The laser rounding method of claim 3, further comprising:
    controlling the single-shaft rotating platform to decelerate after the laser is closed;
    when the encoder feedback value is
    Figure PCTCN2019096477-APPB-100002
    While the single shaft rotates flatThe table is stopped.
  5. The laser rounding method according to any one of claims 1 to 4,
    the method is based on an aerotech controller;
    observing the position of the single-shaft rotating platform accelerated to a constant speed state through an oscilloscope of an aerotech controller;
    and establishing a light-emitting time window of the laser through windows of the aerotech controller.
  6. The utility model provides a laser circle cutting device, includes the laser instrument, its characterized in that still includes:
    the single-shaft rotating platform is used for driving the workpiece to rotate so that the laser beam forms a circular track to be cut relative to the workpiece;
    the control unit is respectively connected with the single-shaft rotating platform and the laser and used for presetting a light-emitting time window of the laser, detecting the real-time position of the single-shaft rotating platform and controlling the laser to be started when the real-time position is positioned in the light-emitting time window of the laser;
    the starting point of the light-emitting time window of the laser is the position of the single-shaft rotating platform when the single-shaft rotating platform accelerates to a uniform speed state, and the end point of the light-emitting time window of the laser is the position of the single-shaft rotating platform rotating at the uniform speed by 360 degrees.
  7. The laser circle cutting device of claim 6, wherein the control unit comprises a driver for controlling the single-shaft rotating platform to run and reading the real-time running speed and position of the single-shaft rotating platform; presetting a laser start-stop time window, comparing the real-time position of the single-shaft rotating platform with the time window, and sending a control signal to the laser according to a comparison result.
  8. The laser rounding device of claim 7, wherein the control unit further comprises an encoder disposed between the single-axis rotary stage and the driver, for reading real-time position feedback of the single-axis rotary stage to the driver.
  9. The laser circle cutting device of any one of claims 7-8, wherein the driver is an aerotech controller having an oscilloscope for displaying real-time speed and position of the single-axis rotating platform and windows for establishing a time window for the laser to emit light.
CN201980052908.8A 2019-07-18 2019-07-18 Laser circle cutting method and device Pending CN112566748A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/096477 WO2021007831A1 (en) 2019-07-18 2019-07-18 Laser circle cutting method and device

Publications (1)

Publication Number Publication Date
CN112566748A true CN112566748A (en) 2021-03-26

Family

ID=74210168

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980052908.8A Pending CN112566748A (en) 2019-07-18 2019-07-18 Laser circle cutting method and device

Country Status (2)

Country Link
CN (1) CN112566748A (en)
WO (1) WO2021007831A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114799518B (en) * 2022-05-20 2022-09-30 武汉逸飞激光股份有限公司 Laser welding control method and device for cylindrical battery cell seal

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751436A (en) * 1996-12-23 1998-05-12 Rocky Mountain Instrument Company Method and apparatus for cylindrical coordinate laser engraving
CN203526716U (en) * 2013-09-18 2014-04-09 宝钢集团新疆八一钢铁有限公司 Disc cutting machine
CN204135543U (en) * 2014-10-22 2015-02-04 湖北追日电气股份有限公司 A kind of mechanism of quick manual cutting arc shape work piece
CN107598394A (en) * 2017-10-20 2018-01-19 范梦瑶 A kind of laser circle-cutting machine

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636611A (en) * 1985-04-15 1987-01-13 General Electric Company Quiescent circle and arc generator
CN105537781B (en) * 2016-03-15 2017-04-12 深圳市创鑫激光股份有限公司 Method and device for achieving quick cutting of laser cutting device
CN107511593A (en) * 2017-08-24 2017-12-26 湖州吴兴华隆机械有限公司 A kind of rail mounted laser circle-cutting machine
CN112975149A (en) * 2017-12-18 2021-06-18 徐晨 Automatic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751436A (en) * 1996-12-23 1998-05-12 Rocky Mountain Instrument Company Method and apparatus for cylindrical coordinate laser engraving
CN203526716U (en) * 2013-09-18 2014-04-09 宝钢集团新疆八一钢铁有限公司 Disc cutting machine
CN204135543U (en) * 2014-10-22 2015-02-04 湖北追日电气股份有限公司 A kind of mechanism of quick manual cutting arc shape work piece
CN107598394A (en) * 2017-10-20 2018-01-19 范梦瑶 A kind of laser circle-cutting machine

Also Published As

Publication number Publication date
WO2021007831A1 (en) 2021-01-21

Similar Documents

Publication Publication Date Title
JP5350216B2 (en) Processed product measuring apparatus and measuring method
EP3023736A1 (en) Shape measurement device, structural object production system, shape measurement method, structural object production method, shape measurement program, and recording medium
CN204195057U (en) A kind of precise laser scanning machining system
CN110455246A (en) A kind of surface shape measurement device and method for conformal optical element
CN112013787B (en) Blade three-dimensional contour reconstruction method based on blade self-characteristics
CN106444645A (en) Multi-axis linkage motion control method based on embedded cutting bed controller
CN112566748A (en) Laser circle cutting method and device
CN109719386A (en) Laser-processing system
JPH0587922A (en) Detecting apparatus of obstacle
WO2021192890A1 (en) Machine tool, machine tool control method, and machine tool control program
TWM568752U (en) Machining system
JPH09159418A (en) Method and equipment for measuring shape of three-dimensional curved surface molding
CN111505602A (en) Electronic device and three-dimensional scanning method
JP3207458U (en) Pitch measurement structure
CN214109226U (en) Laser marking system
JP2000263495A (en) Cutting method and cutting device of plate
CN208810888U (en) A kind of punching machine with fast positioning function
CN114739290A (en) Path planning method and system for line laser scanning chemical milling of rubber reticle
JP4670911B2 (en) Laser processing equipment
JP4202305B2 (en) 3D laser processing machine
CN207139431U (en) A kind of coarse-fine processing integrated device for gravure printing roller
JP2019095205A (en) Laser tracker and method for adjusting gain of laser tracker
CN220593325U (en) Cutting mechanism
JP2019086362A (en) Laser device and method for adjusting gain of laser device
CN116140833A (en) Method, device, processor and readable storage medium for realizing laser inclined perforation processing in numerical control laser processing system

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20210326

RJ01 Rejection of invention patent application after publication