TWM568752U - Machining system - Google Patents

Abstract

The utility model provides a machining system, which includes a workpiece platform, a height measuring unit, a machining head and an axis control unit. An unmachined workpiece is arranged on the workpiece platform. The height measuring unit is used to measure the height of the unmachined workpiece. The machining head is connected to the height measuring unit through a machining mechanism, and the machining head is capable of machining the unmachined workpiece. The axis control unit sets a machining mechanism information of the machining mechanism. The height measuring unit, controlled by the axis control unit, measures the height of the unmachined workpiece on a machining path in the first place. The axis control unit further adjusts machining height and rotation angle of the machining head according to the plane height measured in advance. Thus, the axis control unit controls the machining head to machine the unmachined workpiece along the machining path.

Description

Processing system

The present invention relates to a processing system, in particular to a processing system that can scan a workpiece height along a machining path of a workpiece to be processed before processing the workpiece to reduce the processing time.

In modern industry, processing machines are indispensable equipment in the factory for more precise operations such as dispensing and laser cutting. Since the workpiece or semi-finished product may be inconsistent due to various factors in the manufacturing process during mass production, the surface of the workpiece or semi-finished product may have flatness, so in order to smoothly smooth the surface or semi-finished product For processing, an altimetry device is directly installed next to the processing head of the existing processing machine. This altimetry device can be used to measure the height of the workpiece or semi-finished product on the workpiece platform of the processing machine to prevent the processing machine. The processing head collides with these workpieces or semi-finished products to cause damage. The height measuring device is usually installed on one side of the processing head, for example, fixed to a robot arm together with the processing head, so that one can be used by one The robot arm simultaneously controls the machining head and the height measuring device and reduces the difficulty of the machine design. However, this method causes the height dimension of the height measuring device to be limited, so that the height of the processed object cannot be detected in advance during processing.

When using the existing processing machine for machining operations, the height measuring device is first aligned with the workpiece to be processed on the workpiece or the semi-finished product to measure the height of the plane to obtain the height measurement value, and then the height measurement values are calculated and Compensate to the machining height of the machining head, and then move the machining head to the machining place for processing. For example, when the workpiece to be processed is a plurality of points on the workpiece, the processing machine, for example, first moves the height measuring device to measure the height of the first point to be processed, and then moves the processing head to the first to be processed. The point is processed, and the processing machine then moves the height measuring device to the second point to be processed on the workpiece for height measurement, and then moves the processing head to process the second point to be processed, thereby sequentially processing each to be processed. The height measurement and processing of the point, so the prior art needs to be measured first, after the height measurement and then the glue or laser cutting, the height measurement and the processing can not be carried out at the same time, resulting in an increase in processing time.

In addition, when the type of the workpiece to be processed on the workpiece is a plurality of line segments or needs to be continuously processed, it is first necessary to input the machining path information of the workpiece to the processing machine, for example, the coordinate of the turning point of the machining path, and the processing machine moves again. The height measuring device measures the height of the turning point, and then moves the processing head along the processing path for processing, but this method only measures the height of the turning point on each processing path, if between the turning points When there is a height change in the machining path, it is highly probable that the machining head will hit the workpiece as it moves along the machining path, causing damage to the machining head or workpiece. In order to prevent the above situation, the processing machine can also be designed to first control the height measuring device to measure the height of the overall machining path along the machining path, and then compensate the height measurement result to the machining path information for machining height correction, and finally the machining head. The workpiece or semi-finished product is processed along the corrected machining path. However, the machining path needs to be scanned twice, which will greatly increase the processing time. Therefore, no matter which of the above processing conditions, a new processing system is currently required to reduce the processing time and at the same time reduce the possibility of the processing head hitting the workpiece or the semi-finished product.

The "previous technical" paragraphs are only intended to aid in understanding the content of the present work, and thus the disclosure of the "previous technical" paragraphs may contain some conventional techniques that are not known to those of ordinary skill in the art. The matters disclosed in the "Prior Art" section, which do not represent the subject matter or problems to be solved by one or more embodiments of the present invention, are known or recognized by those of ordinary skill in the art prior to the present application.

The main purpose of this creation is to provide a machining system that measures the height of the workpiece to be machined by machining along the machining path of the workpiece to be machined, and then processes the workpiece to reduce the time required for machining and reduce the processing head and waiting The possibility of machining a workpiece impact.

Another purpose of this creation is to use the rotating platform of the altimetry unit to change the angle of the machining point in advance, to pre-determine the height of the next machining point, to reduce the distance that the machining head needs to move, and the time of the height detection process. The traditional detection time is the probe scanning plus the glue coating process, twice the processing time, and the pre-determined height can be directly applied while scanning.

A further object of the creation is that the height measuring unit first passes through the machining path, scans the height of the workpiece, and then returns it to the processing head, and predicts the height process to effectively avoid the striker.

Another purpose of this creation is that it can be applied to a machine tool that needs to detect the processing height, such as a dispenser, a welding machine or a laser cutting machine, without limiting the type of the machine tool and the brand, as long as the machining head needs the Z-axis direction. Highly detectable, this soft and hard design is applicable.

To achieve the above objectives, the present disclosure discloses a processing system including a workpiece platform, a height measuring unit, a machining head, and a shaft control unit. The workpiece platform is used to carry the workpiece to be processed. The altimetry unit is used to measure the plane height of the workpiece to be machined. The machining head is used to machine the workpiece to be processed and connected to the altimeter unit through the machining mechanism. The axis control unit is used to set the processing mechanism information of the processing mechanism, whereby the axis control unit is configured to control the height measuring unit to pre-measure the plane height of the workpiece to be processed on a machining path of the workpiece to be processed, and control the machining head according to the measurement. The high unit pre-measures the plane height of the workpiece to be processed on the machining path to adjust the machining height and the rotation angle, and further processes the workpiece to be processed on the machining path.

Based on the above, the embodiment of the present creation has at least one of the following advantages or effects. In the processing system of the present invention, the processing head and the carrying platform are pivotally connected through the link mechanism so that the link mechanism can rotate along the processing head, and the axis control unit controls the altimetry unit to pre-measure the workpiece to be processed on the machining path of the workpiece to be processed. The height of the plane is adjusted according to the height of the plane of the workpiece to be machined on the machining path according to the height measuring unit to adjust the machining height and the rotation angle of the machining head, thereby reducing the processing time and reducing the machining head and the workpiece to be processed. The possibility of impact.

In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings.

The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, for example, up, down, left, right, front or rear, etc., are merely referenced to the direction of the additional drawings or the relative positions of the elements in the drawings. Therefore, the directional terminology used is used to illustrate that it is not intended to limit the creation.

Please refer to FIG. 1. FIG. 1 is a schematic diagram showing a processing system according to the technology disclosed in the present application. The processing system 10 includes a workpiece platform 11, a height measuring unit 12, a processing head 13, a shaft control unit 14, and a processing mechanism 19. The height measuring unit 12 is connected to the processing head 13 through a processing mechanism 19, and the processing mechanism 19 includes a carrying platform 16, The lever mechanism 17 and the moving mechanism 18. The workpiece to be processed 15 is disposed on the workpiece platform 11, and the altimeter unit 12, the processing head 13 and the processing mechanism 19 are above the workpiece 15 to be processed, and the altimeter unit 12 is disposed on the carrying platform 16 in the processing mechanism 19, and is used for The plane height of the workpiece 15 to be processed is measured. The carrying platform 16 is pivotally connected to the processing head 13 via a link mechanism 17, and the link mechanism 17 is rotatable along the processing head 13. In other words, the altimetry unit 12 is rotatable around the processing head 13 through the carrying platform 16 and the link mechanism 17. That is, the altimeter unit 12 can be rotated by the processing mechanism 13 through the link mechanism 17, and the altimetry unit 12, the processing head 13, the carrying platform 16, and the link mechanism 17 are moved over the workpiece 15 to be processed through the moving mechanism 18. . In this embodiment, the moving mechanism 18 of the processing mechanism 19 is, for example, a carrier that is free to move in a plane parallel to the workpiece platform 11 and above the workpiece 15 to be processed, the processing head 13 being coupled to the carrier, wherein the carrier, for example The relative position of the workpiece 15 to be processed is adjusted by a plurality of slide rails having different sliding directions. However, the moving mechanism 18 can also be implemented by other suitable mechanisms such as a robot arm, and the present invention is not limited thereto. The axis control unit 14 is configured to set a processing mechanism information of the processing mechanism 19 to control the processing mechanism 19 to assist in height measurement and processing, and the processing mechanism information can respectively set at least one of the carrier platform 16, the link mechanism 17 and the moving mechanism 18. The processing parameter, wherein the processing mechanism information may be an operating parameter or message of the carrying platform 16, the link mechanism 17 and the moving mechanism 18, but is not limited thereto, thereby reducing the complexity of the user operating the processing mechanism 19. Therefore, the axis control unit 14 can control at least one of the processing parameters of the carrier platform 16, the link mechanism 17 and the moving mechanism 18 through the processing mechanism information, whereby the axis control unit 14 can be used to control the processing of the workpiece 15 to be processed by the height measuring unit 12. The plane height of the workpiece to be processed is pre-measured on the path 151, and the axis control unit 14 controls the processing head 13 to adjust the processing height and the rotation angle according to the plane height of the workpiece 15 to be processed on the processing path 151, and further treats the processing path 151. The processing workpiece 15 is processed, in other words, the axis control unit 14 can be used to control the height measuring unit 12 to pre-measure the plane height of the workpiece to be processed while controlling the processing head 13 for processing, wherein the processing parameters are, for example, the processing head 13 and the measurement The spacing of the high unit 12 on the workpiece platform 11 is used for the axis control unit 14 to dynamically fine-tune the processing head 13 and the altimeter unit 12, or for example, the processing parameter may also be the distance between the processing head 13 and the altimeter unit 12. Also, the length of the link mechanism 17, but the operator can also input other suitable processing parameters to the axis control unit 14, such as the height measuring device 12, the processing head 13 The movement speed of the processing mechanism 19, the acceleration or deceleration time, or the jerk limitation, etc., are not limited to this creation.

In this embodiment, the altimetry unit 12 is, for example, a Laser Displacement Meter, which emits laser light to illuminate the surface of the workpiece and sense the light reflected by the surface of the workpiece to be processed, when the surface of the workpiece to be processed is When the height is different, the position of the light received by the sensor in the laser displacement meter is different, and the plane height measurement result of the workpiece to be processed can be obtained by triangulation calculation. However, the altimeter unit 12 can also adopt other forms of contact (such as a CMM, Coordinate Measuring Machine) or a non-contact (such as CCD, Charge Coupled Device) height measuring instrument. limit. In addition, the processing head 13 is, for example, a dispensing needle or a dispensing valve of a dispenser, a welding head of a metal welding machine, a laser cutting head of a laser cutting machine or other device capable of directly processing a surface of a workpiece, and an axis control unit 14 For example, a central processing unit (CPU) having a single core or a multi-core, or other programmable general purpose or special purpose microprocessor (Microprocessor), digital signal processor (Digital Signal Processor, The DSP), the programmable controller, the Application Specific Integrated Circuit (ASIC) or other similar components or a combination of the above components are not limited in this creation.

2A-2D are schematic diagrams showing the process of measuring the plane height of a workpiece to be processed in an embodiment of the processing system of FIG. 1 according to the technique disclosed in the present application, in which some components are omitted in FIGS. 2A to 2D. The process of measuring the plane height of the workpiece to be processed is shown in the present invention, and the same components are denoted by the same reference numerals and will not be described again. Referring to FIG. 2A to FIG. 2D and FIG. 1 , the processing path 151 has a starting point O and two processing positions, such as a first processing point A and a second processing point B, wherein the starting point O reaches the first processing point. The line connecting the line A and the line connecting the first processing point A to the second processing point B at the first processing point A is greater than or equal to 90 degrees. First, the altimetry unit 12 first performs the measurement of the plane height of the starting point O, and measures the plane height between the starting point O and the first processing point A along the processing path 151, and the processing head 13 then performs the starting point O. Processing. Then, the moving mechanism 18 of the processing mechanism 19 drives the height measuring unit 12 to measure the plane height of the first processing point A, and the processing head 13 also moves along the processing path 151 through the moving mechanism 18. Please refer to FIG. 2A, which is schematically illustrated in FIG. 2A. The condition in which the height measuring unit 12 measures the plane height of the first machining point A is shown. 2B, after the height measuring unit 12 completes the plane height measurement of the first machining point A, the plane height of the first machining point A is transmitted to the axis control unit 14, and the axis control unit 14 is planar by the first machining point A. The machining height of the machining head 13 is adjusted in height, and the linkage mechanism 17 of the machining mechanism 19 is controlled to directly pivot the carrier platform 16 and the altimeter unit 12 to a machining path 151 between the first machining point A and the second machining point B. Referring to FIG. 2C, since the angle θ is greater than or equal to 90 degrees, when the moving mechanism 18 of the processing mechanism 19 moves the processing head 13 to the first processing point A for processing, the height measuring unit 12 is due to the link mechanism 17 The relationship can be directly advanced and the plane height of the machining path 151 between the first machining point A and the second machining point B can be measured. Referring to FIG. 2D, after the processing head 13 completes the processing operation of the first processing point A, the moving mechanism 18 moves the altimetry unit 12 to measure the plane height of the second processing point B, and the altimetry unit 12 completes the plane height of the second processing point B. After the measurement, the plane height of the second machining point B is transmitted to the axis control unit 14 for the axis control unit 14 to control the machining height of the machining head 13.

3A to 3D are schematic diagrams showing the planar height of the workpiece to be processed in another embodiment in accordance with the technique disclosed in the present disclosure, wherein some of the components are omitted in FIGS. 3A to 3D. The process of measuring the plane height of the workpiece to be processed is clearly illustrated in the present invention, and the same components are denoted by the same reference numerals and will not be described again. Referring to FIG. 3A and FIG. 1 together, in the embodiment, the processing path 151 further includes a third processing point C, a connection line from the first processing point A to the second processing point B, and a second processing point B to the third. The angle δ of the line connecting the processing point C to the second processing point B is less than 90 degrees. Referring to FIG. 3B, after the altimetry unit 12 measures the plane height of the second machining point B, the altimetry unit 12 transmits the height measurement result of the second machining point B to the axis control unit 14, and the axis control unit 14 controls the machining. The linkage 17 of the mechanism 19 pivots the acuity unit 12 and the carrier platform 16 to a processing path 151 between the second machining point B and the third machining point C. Please refer to FIG. 3C. FIG. 3C is a top plan view showing the plane height of the workpiece to be processed in the processing system of FIG. 3B. In the prior art, since the link mechanism 17 is rotated by the machining head 13, the height measuring unit 12 only The energy is measured as the plane height of the workpiece 15 directly below, and when the altimetry unit 12 is pivoted to the machining path 151 between the second machining point B and the third machining point C, since the angle δ is less than 90 degrees, the altimeter unit 12 will be limited by the range of rotation of the linkage mechanism 17 and will not directly measure the plane height of the section 152 on the machining path 151. At this time, the axis control unit 14 calculates the height compensation information of the section 152 according to the plane height of the second processing point B, and adjusts the processing height of the processing head 13 by using the height compensation information, wherein the height compensation information is performed, for example, by a function. The operation can be performed by a linear or non-linear function or other suitable function to derive the height information of the segment 152 to adjust and correct the processing height of the processing head 13. Referring to FIG. 3D, the moving mechanism 18 drives the processing head 13 to the second processing point B for processing. The axis control unit 14 controls the linkage mechanism 18 to pivot to cause the altimetry unit 12 to measure the second processing point B to the third processing. The plane height of the processing path 151 between points C. Therefore, the step flow of predicting the height according to the present embodiment can be applied to the process of continuous machining without causing the machining head 13 to strike the workpiece 15 due to the mechanism limitation of the machining mechanism 19. For example, in the process of continuous glue application, the height of the height measuring unit is instantaneously fed back to the dispensing head, and when the height measuring unit scans, the dispensing head can be directly coated, without waiting for testing. After the high unit scans all the processing paths, the glue application is switched, and the height of the glue can be measured and the glue can be applied while the processing time is saved.

4A to 4D are schematic diagrams showing the planar height of the workpiece to be processed in the processing system of FIG. 1 according to the technique disclosed in the present disclosure, wherein some components are omitted in FIGS. 4A to 4D. The process of measuring the plane height of the workpiece to be processed is shown in the present invention, and the same components are denoted by the same reference numerals and will not be described again. Referring to FIG. 4A and FIG. 1 together, in the embodiment, the processing path 151 further includes a third processing point C, a connection line between the first processing point A and the second processing point B, and a second processing point B to the third. The angle δ of the line connecting the processing point C to the second processing point B is less than 90 degrees. Next, referring to FIG. 4B, after the altimetry unit 12 measures the plane height of the second machining point B, the altimetry unit 12 transmits the height measurement result of the second machining point B to the axis control unit 14, and the axis control unit 14 controls the movement. The mechanism 18 moves the height measuring unit 12 and the machining head 13 away from the machining path 151. In other words, after the moving mechanism 18 drives the height measuring unit 12 and the machining head 13 to be displaced away from the machining path 151, the moving mechanism 18 Driving the altimeter unit 12 and the machining head 13 further forward, causing the altimetry unit 12 to start the altimetry and the machining head 13 to process to ensure that all the machining paths can be measured, for example, in FIG. 4B toward the second machining point. B moves the upper right side of the distance, but not limited to this. With continued reference to FIG. 4C, the axis control unit 14 controls the linkage mechanism 17 to pivot the altimeter unit 12 and the carrier platform 16 to a machining path 151 between the second machining point B and the third machining point C. Referring to FIG. 4D, in the process in which the moving mechanism 18 moves the machining head 13 to the second machining point B for the machining operation, the height measuring unit 12 simultaneously measures the plane of the machining path 181 between the second machining point B and the third machining point C. height. Therefore, the step flow of predicting height according to the present embodiment can be applied to the process of continuous machining without causing the machining head 13 to strike the workpiece 15 due to the mechanism limitation of the machining mechanism 19. In addition, the advantages of the present embodiment are substantially the same as those of the embodiment described in FIGS. 3A to 3D, but the embodiment described in FIGS. 3A to 3D causes the height measurement due to the emphasis on the direct rotation of the link mechanism 17. The unit 12 has a section 152 which cannot measure its height, so that the operation of the height compensation information needs to be performed through a function. The embodiment described in FIGS. 3A to 3D is more suitable when the height difference of the section 152 is not large. If the moving mechanism 18 is unable to drive the height measuring unit 12 and the processing head 13 to move away from the processing path 151, if it is afraid to hit other processed objects, it is more suitable to use the embodiment described in FIGS. 3A to 3D, and therefore, The use of the embodiments is not completely the same.

However, the above descriptions are only preferred embodiments of the present invention, and the scope of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made by the applicant according to the scope of the patent application and the content of the creation description, They are still covered by this creation. In addition, any embodiment or application of the present invention is not required to achieve all of the objects or advantages or features disclosed in the present disclosure. In addition, the abstract sections and headings are only used to assist in the search for patent documents and are not intended to limit the scope of the invention. Furthermore, the first, second, etc. mentioned in the specification are only used to indicate the names of the components, and are not intended to limit the upper or lower limits of the number of components.

10‧‧‧Processing system

11‧‧‧Workpiece platform

12‧‧‧ altimetry unit

13‧‧‧Processing head

14‧‧‧Axis control unit

15‧‧‧Workpieces to be machined

151‧‧‧Processing path

Section 152‧‧‧

16‧‧‧Loading platform

17‧‧‧ linkage mechanism

18‧‧‧Mobile agencies

19‧‧‧Processing institutions

A‧‧‧First processing point

B‧‧‧Second processing point

C‧‧‧ third processing point

O‧‧‧ starting point

θ, δ‧‧‧ angle

1 is a schematic diagram showing a processing system according to the technology disclosed in the present application; FIGS. 2A to 2D are diagrams showing the plane height of a workpiece to be processed in an embodiment of the processing system of FIG. 1 according to the technique disclosed in the present application. 3A to 3D are schematic views showing the plane height of the workpiece to be processed in another embodiment of the processing system of FIG. 1 according to the technique disclosed in the present invention; and FIGS. 4A to 4D are based on the present creation The disclosed technology represents a schematic diagram of the processing system of FIG. 1 measuring the planar height of the workpiece to be machined in yet another embodiment.

Claims (10)

A processing system comprising: a workpiece platform for carrying a workpiece to be processed; a height measuring unit for measuring a plane height of the workpiece to be processed; and a processing head for processing the workpiece to be processed and transmitting a processing mechanism is connected to the altimetry unit; and a shaft control unit is configured to set a processing mechanism information of the processing mechanism to control the altimetry unit to pre-measure the workpiece to be processed on a machining path of the workpiece to be processed Level of the plane, and controlling the processing head to pre-measure the plane height of the workpiece to be processed on the machining path according to the height measuring unit to adjust the machining height and the rotation angle, and further processing the workpiece on the machining path The workpiece is machined. The processing system of claim 1, wherein the processing mechanism comprises a carrying platform, a connecting rod mechanism and a moving mechanism, wherein the altimetry unit is disposed on the carrying platform, and the carrying platform passes through the connecting rod mechanism The pivoting mechanism is coupled to the machining head, and the linkage mechanism rotates the altimetry unit along the machining head. The processing system of claim 2, wherein the axis control unit controls the at least one processing parameter of the carrying platform, the link mechanism and the moving mechanism through the processing mechanism information. The processing system of claim 3, wherein the processing parameter is a distance between the processing head and the height measuring unit on the workpiece platform, a length of the link mechanism, or the height measuring device, the processing The moving speed, acceleration or deceleration time or jerk of the head or the machining mechanism. The processing system of claim 2, wherein the processing path further includes a first processing point and a second processing point, and after the altimetry unit measures the plane height of the first processing point, The axis control unit controls the linkage mechanism to rotate the carrier platform and the height measuring unit to the machining path between the first machining point and the second machining point. The processing system of claim 5, wherein the processing path further includes a starting point, and the connecting point of the starting point to the first processing point and the first processing point to the second processing point The angle of the connection to the first processing point is greater than or equal to 90 degrees. The processing system of claim 6, wherein when the processing head performs the processing operation to the first processing point, the height measuring unit can directly advance and measure the relationship due to the relationship of the link mechanism. The plane height of the machining path between a machining point and the second machining point. The processing system of claim 5, wherein the processing path further includes a third processing point, and the line connecting the first processing point to the second processing point and the second processing point to the third The angle of the line connecting the processing points to the second processing point is less than 90 degrees. The processing system of claim 8, wherein when the height measuring unit measures the plane height of the second processing point, the axis control unit calculates a function according to the plane height of the second processing point. A height compensation information is used to adjust the machining height of the machining head by the height compensation information, wherein the function can be a linear function or a nonlinear function. The processing system of claim 8, wherein the axis control unit controls the height measuring unit and the processing head to deviate from the processing path after the height measuring unit measures the plane height of the second processing point After the direction is moved, the axis control unit further controls the link mechanism to rotate the carrying platform and the altimetry unit to the machining path toward the second machining point and the third machining point.