CN112563179B - Deflection type piezoelectric micro-nano wafer deflection table - Google Patents
Deflection type piezoelectric micro-nano wafer deflection table Download PDFInfo
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- CN112563179B CN112563179B CN201910916803.4A CN201910916803A CN112563179B CN 112563179 B CN112563179 B CN 112563179B CN 201910916803 A CN201910916803 A CN 201910916803A CN 112563179 B CN112563179 B CN 112563179B
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- 238000006073 displacement reaction Methods 0.000 claims abstract description 55
- 239000000919 ceramic Substances 0.000 claims abstract description 42
- 230000007246 mechanism Effects 0.000 claims abstract description 5
- 230000003321 amplification Effects 0.000 claims description 8
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 31
- 239000004065 semiconductor Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
- H02N2/04—Constructional details
- H02N2/043—Mechanical transmission means, e.g. for stroke amplification
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a deflection type piezoelectric micro-nano wafer deflection table, which comprises a piezoelectric driving type micro-displacement module, a ceramic sucker fixing seat, a ceramic sucker and a wafer, wherein the piezoelectric driving type micro-displacement module comprises a base body and a hinge main body arranged at the top of the base body, a stack type piezoelectric ceramic, a deflection type amplifying structure and a double-parallel hinge structure are arranged in the hinge main body, a displacement end of the stack type piezoelectric ceramic is connected with an input end of the deflection type amplifying structure through a primary displacement input end, the deflection type amplifying structure is connected with the double-parallel hinge structure through a primary displacement output end, a secondary displacement output end is rigidly connected with an output end switching jig through a screw, a plunger end part and a plunger elastic end are fixed at the top of the switching jig, and the ceramic sucker fixing seat is connected with the plunger elastic end through a pin hole; the invention adopts piezoelectric ceramics as power drive, and realizes high-precision adjustment of the wafer through the multistage displacement amplifying mechanism.
Description
Technical Field
The invention relates to micro-driving application in the field of semiconductor back-end packaging, in particular to a deflection type piezoelectric micro-nano wafer deflection table.
Background
The semiconductor field is the field with the highest technological integration content in the 21 st century. Semiconductor post-process equipment includes equipment for packaging semiconductor chips, materials, testing equipment, and the like. Wafers are the basic material for manufacturing semiconductor chips, and therefore, are important. In the packaging process, the wafer puts higher-level positioning accuracy requirements on the deflection platform beyond micrometers.
In the subsequent packaging process of the semiconductor, the positioning requirement of the wafer relative to other workpiece space relative relation reaches the mu m level. Because the wafer is adsorbed on the ceramic sucker by vacuum, the fine adjustment device is not easy to set. Therefore, extremely high precision requirements are put on the wafer bearing device, the traditional solution is to use a high-precision mechanical clamp to ensure the flatness of the wafer, and then design a mechanical fine adjustment device to process the relative spatial relationship with other workpieces, but the defects of poor precision and difficult maintenance at later stages exist.
When the piezoelectric ceramic is used as power drive, the piezoelectric ceramic has small volume, large thrust generation and resolution of nanometer level, and is ideal drive for realizing high-precision micro-displacement. However, the displacement generated by the piezoelectric ceramic is only about one thousandth of the ceramic length, and the primary amplification factor of each amplifying mechanism is often not satisfied
Disclosure of Invention
The invention aims to provide a deflection type piezoelectric micro-nano wafer deflection table for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a wafer beat platform is received to flexure formula piezoelectricity micro-displacement module, pottery sucking disc fixing base, pottery sucking disc and wafer, the wafer passes through vacuum negative pressure absorption on the pottery sucking disc, the piezoelectricity driving micro-displacement module includes the base member and installs the hinge main part at the base member top, and the piezoelectricity driving micro-displacement module embeds has stacked piezoceramics, stacked piezoceramics stiff end flexible ball and flexible mount pad coaxial tangent installation, stacked piezoceramics flexible end and bulb pretension jackscrew are installed in the same center, and the bulb pretension jackscrew passes through fine thread and is connected with the hinge main part, provides pretightening force to piezoceramics simultaneously, the piezoelectricity driving micro-displacement module embeds has flexible amplifying structure and double parallel hinge structure, and the displacement end and the one-level displacement input end of stacked piezoceramics link to each other with flexible amplifying structure input end, and double parallel hinge structure pass through one-level displacement output end and with hinge main part integration processing, second level displacement output end and output end changeover tool pass through the screw and carry out rigid connection, changeover tool top is fixed with plunger tip and plunger spring pin hole and elasticity are connected with the fixing base.
Still further aspects are as follows: the piezoelectric driving type micro-displacement modules are distributed symmetrically around the vent holes at the bottom of the matrix in a right angle.
Still further aspects are as follows: the flexible amplifying structure adopts an amplifying mechanism, and the amplifying coefficient is less than fifteen times.
Still further aspects are as follows: the double-parallel hinge structure is formed by adopting the overlapped hinge as a flexible part, compared with a common flexible hinge (such as a rounded flexible hinge and an arc-shaped hinge), the double-parallel hinge structure can greatly reduce the maximum stress at key positions of the hinge and provide high system rigidity, and meanwhile, the using resonant frequency of the displacement platform can be effectively improved.
Still further aspects are as follows: the elastic end of the plunger is internally provided with a spring, and the elastic end of the plunger is elastically connected with the ceramic sucker fixing seat.
Compared with the prior art, the invention has the beneficial effects that:
1. the piezoelectric ceramic driver is matched with the flexible hinge structure to serve as a wafer deflection table driven by micro-displacement, the multistage displacement amplifying mechanism is adopted, the amplification factor is larger, compared with the traditional method of controlling by mechanical precision, the method has the advantages that the cost is low, the control is simple, the real-time adjustment can be realized, the disassembly and assembly of a machine are not needed during subsequent maintenance, and the later maintenance is hardly needed;
2. the hinge main body is integrally processed, so that the whole system is convenient to control, has a tiny structure and is suitable for high-precision application places;
3. the invention is particularly directed to high-precision adjustment of wafer space runout in the semiconductor field, and is applicable to all wafer packaging equipment in the semiconductor back-end packaging process, including, but not limited to, wafer thinning machines, wafer cutting machines, wafer probe stations and wafer wire bonding machines.
Drawings
Fig. 1 is a schematic structural diagram of a deflection stage of a flexural piezoelectric micro-nano wafer.
Fig. 2 is an isometric view of a hinge body in a flexural piezoelectric micro-nano wafer deflection stage.
FIG. 3 is a cross-sectional view of a hinge body in a flexural piezoelectric micro-nano wafer deflection stage.
Fig. 4 is an enlarged view of a portion of a rounded flexible hinge in a flexural piezoelectric micro-nano wafer deflection stage.
Fig. 5 is an enlarged view of a portion of a superimposed hinge in a flexural piezoelectric micro-nano wafer deflection stage.
Fig. 6 is a schematic structural diagram of a deflection type piezoelectric micro-nano wafer deflection table.
In the figure: the device comprises a hinge main body 1, an output end switching jig 2, a plunger end 3, a plunger elastic end 4, a ball head pre-tightening jackscrew 5, a flexible ball 6, a stacked piezoelectric ceramic 7, a flexible mounting seat 8, a base body 9, a ceramic chuck fixing seat 10, a ceramic chuck 11, a rounded flexible hinge 12, a superposition hinge 13, a hinge main body side mounting hole 14, a double parallel hinge structure 15, a flexible hinge structure 16, a primary displacement output end 17, a primary displacement input end 18, a secondary displacement output end 19, an output end fixing hole 20, a piezoelectric driving type micro-displacement module 21 and a bottom ventilation hole 23.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-6, in the embodiment of the present invention, a deflection type piezoelectric micro-nano wafer deflection table includes a piezoelectric driving micro-displacement module 21, a ceramic chuck fixing seat 10, a ceramic chuck 11 and a wafer, the wafer is adsorbed on the ceramic chuck 11 by vacuum negative pressure, the piezoelectric driving micro-displacement module 21 includes a base 9 and a hinge main body 1 installed on top of the base 9, a stack type piezoelectric ceramic 7 is built in the piezoelectric driving micro-displacement module 21, a fixed end flexible ball 6 of the stack type piezoelectric ceramic 7 is coaxially and tangentially installed with a flexible installation seat 8, a telescopic end of the stack type piezoelectric ceramic 7 is concentrically installed with a ball head pre-tightening jackscrew 5, the ball head pre-tightening jackscrew 5 is simultaneously connected with the hinge main body 1 by fine threads and provides a pre-tightening force for the piezoelectric ceramic 7, a deflection type amplifying structure 16 and a double parallel hinge structure 15 are built in the piezoelectric driving micro-displacement module 21, a displacement end of the stack type piezoelectric ceramic 7 is connected with a first stage displacement input end 18, the first stage displacement input end 18 is connected with an input end of the deflection type amplifying structure 16, the deflection type amplifying structure 16 is connected with a double parallel hinge main body 17 through a first stage output end 17 and a displacement fixture 2 through a hinge end 1 and a pin hole, and a plunger piston 2 is fixedly connected with a plunger piston 2 through a plunger piston end.
The piezoelectric driving type micro-displacement module 21 is distributed symmetrically at right angles around the vent hole 23 at the bottom of the base body 9.
Compared with differential lever amplification, the flexible hinge amplification structure adopted by the invention amplifies the displacement of piezoelectric ceramic output, has large stroke and small radial deviation, and the amplification coefficient of the flexible hinge amplification structure is generally below 15 times in order to ensure the response capability of the system.
The double parallel hinge structure 15 is formed by adopting the overlapped hinge 13 as a flexible part, compared with a common flexible hinge (such as a rounded flexible hinge 12 and an arc hinge), the maximum stress at key positions of the hinge can be greatly reduced, high system rigidity is provided, and meanwhile, the use resonant frequency of the displacement platform can be effectively improved.
The hinge main body 1 is connected with the stacked piezoelectric ceramics 7 and the ceramic sucker and is in arc tangent line contact with the flexible ball 6, so that the piezoelectric ceramics can be effectively prevented from being subjected to transverse shear stress and stress concentration is reduced, and the piezoelectric ceramics can be ensured to be used effectively for a long time.
The plunger elastic end 4 is internally provided with a spring, and the plunger elastic end 4 is elastically connected with the ceramic sucker fixing seat 10.
The working principle of the invention is as follows: the stacked piezoelectric ceramics 7 generate transverse micro-displacement through inverse piezoelectric effect, based on the deflection type amplifying structure 16, the piezoelectric ceramics 7 are amplified into longitudinal output displacement by utilizing the lever amplifying principle, the displacement output end of the deflection type amplifying structure 16 is the displacement input end of the double parallel hinge structure 15, the amplified displacement is transmitted to the secondary displacement output end through the superposition hinge 13, the secondary displacement output end 19 is rigidly connected with the output end switching jig 2 through screws, the output end switching jig 2 is rigidly connected with the plunger end 3 through a pin hole, the plunger elastic end 4 is elastically connected with the ceramic sucker fixing seat 10 under the action of an internal spring, the wafer is adsorbed at the center of the ceramic sucker 11 under the action of vacuum negative pressure of the ceramic sucker 11, the output displacement of the stacked piezoelectric ceramics 7 is amplified and transmitted to the wafer finally, when the voltage is applied to the stacked piezoelectric ceramics 7, the electric driving micro-displacement modules 21 are mutually in groups, and are distributed symmetrically around the circumference, so that the longitudinal height difference of the wafer is commonly controlled, and the vertical deflection of the high precision of two directions X/Y axes is realized under the action of mutual coupling.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (2)
1. The utility model provides a deflection type piezoelectric micro-nano wafer deflection table, including piezoelectric driving micro-displacement module (21), ceramic chuck fixing base (10), ceramic chuck (11) and wafer, the wafer adsorbs on ceramic chuck (11) through vacuum negative pressure, characterized in that, piezoelectric driving micro-displacement module (21) include base member (9) and install hinge main part (1) at base member (9) top, piezoelectric driving micro-displacement module (21) embeds has stack type piezoceramics (7), stack type piezoceramics (7) stiff end flexible ball (6) and flexible mount pad (8) coaxial tangent installation, stack type piezoceramics (7) flexible end and bulb pretension jackscrew (5) concentric installation, bulb pretension jackscrew (5) are connected with hinge main part (1) through the fine thread, simultaneously provide pretension to piezoceramics (7), piezoelectric driving micro-displacement module (21) embeds has deflection type amplification structure (16) and double parallel hinge structure (15), and stack type piezoceramics (7) displacement end and one-level displacement input end (18) meet one-level displacement input end (16) and deflection type amplification structure (16) and are connected with one-level (16) input structure (16) and are processed integral type input structure (16) and deflection type displacement end (16) and are connected with one-level input structure (1), the secondary displacement output end (19) is rigidly connected with the output end switching jig (2) through a screw, a plunger end (3) and a plunger elastic end (4) are fixed at the top of the switching jig (2), and the ceramic sucker fixing seat (10) is connected with the plunger elastic end (4) through a pin hole;
the piezoelectric driving type micro-displacement module (21) is symmetrically distributed around the vent hole (23) at the bottom of the matrix (9) at right angles;
the double parallel hinge structure (15) is formed by adopting a superposition hinge (13) as a flexible part;
the plunger elastic end (4) is internally provided with a spring, and the plunger elastic end (4) is elastically connected with the ceramic sucker fixing seat (10).
2. The flexure piezoelectric micro-nano wafer deflection stage of claim 1, wherein the magnification factor of the flexure amplifying mechanism (16) is less than fifteen times.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910916803.4A CN112563179B (en) | 2019-09-26 | 2019-09-26 | Deflection type piezoelectric micro-nano wafer deflection table |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910916803.4A CN112563179B (en) | 2019-09-26 | 2019-09-26 | Deflection type piezoelectric micro-nano wafer deflection table |
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| CN112563179A CN112563179A (en) | 2021-03-26 |
| CN112563179B true CN112563179B (en) | 2023-10-24 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05212647A (en) * | 1992-01-31 | 1993-08-24 | Onoda Cement Co Ltd | Positioning device with displacement enlarging mechanism |
| JP2014082930A (en) * | 2012-10-16 | 2014-05-08 | Massachusetts Institute Of Technology | Buckling type actuator |
| CN106224713A (en) * | 2016-09-09 | 2016-12-14 | 西安交通大学 | A kind of five freedom degree precision positioning platform based on bridge shape compliant mechanism |
| CN109909996A (en) * | 2019-04-15 | 2019-06-21 | 华侨大学 | A kind of flexible hinge multistage displacement equations structure of stacked composite material |
| CN110058404A (en) * | 2019-04-26 | 2019-07-26 | 广东工业大学 | A kind of big stroke micro-nano beat platform of piezoelectric driven integral type |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7348709B2 (en) * | 2004-04-16 | 2008-03-25 | Npoint, Inc. | Heavy-load nanopositioner with dual-parallel flexure design |
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2019
- 2019-09-26 CN CN201910916803.4A patent/CN112563179B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05212647A (en) * | 1992-01-31 | 1993-08-24 | Onoda Cement Co Ltd | Positioning device with displacement enlarging mechanism |
| JP2014082930A (en) * | 2012-10-16 | 2014-05-08 | Massachusetts Institute Of Technology | Buckling type actuator |
| CN106224713A (en) * | 2016-09-09 | 2016-12-14 | 西安交通大学 | A kind of five freedom degree precision positioning platform based on bridge shape compliant mechanism |
| CN109909996A (en) * | 2019-04-15 | 2019-06-21 | 华侨大学 | A kind of flexible hinge multistage displacement equations structure of stacked composite material |
| CN110058404A (en) * | 2019-04-26 | 2019-07-26 | 广东工业大学 | A kind of big stroke micro-nano beat platform of piezoelectric driven integral type |
Non-Patent Citations (2)
| Title |
|---|
| 一种低成本微定位平台的设计与仿真;卢清华;吴志伟;范彦斌;张宪民;;中国机械工程(第05期);全文 * |
| 一种垂直运动精密微定位平台的设计与分析;徐骁;任佳琦;朱晓博;刘品宽;;机械设计与研究(第04期);全文 * |
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