CN108561700B - Three-degree-of-freedom ultrasonic vibration auxiliary machining precision positioning platform - Google Patents
Three-degree-of-freedom ultrasonic vibration auxiliary machining precision positioning platform Download PDFInfo
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- CN108561700B CN108561700B CN201810588285.3A CN201810588285A CN108561700B CN 108561700 B CN108561700 B CN 108561700B CN 201810588285 A CN201810588285 A CN 201810588285A CN 108561700 B CN108561700 B CN 108561700B
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- 238000003754 machining Methods 0.000 title claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 116
- 239000000919 ceramic Substances 0.000 claims abstract description 76
- 230000003321 amplification Effects 0.000 claims abstract description 66
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 66
- 238000013519 translation Methods 0.000 claims abstract description 28
- 230000005540 biological transmission Effects 0.000 claims abstract description 18
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000008878 coupling Effects 0.000 abstract description 2
- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- 238000009763 wire-cut EDM Methods 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/02—Heads
- F16M11/04—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
- F16M11/043—Allowing translations
- F16M11/045—Allowing translations adapted to left-right translation movement
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/02—Heads
- F16M11/04—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
- F16M11/043—Allowing translations
- F16M11/046—Allowing translations adapted to upward-downward translation movement
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/02—Heads
- F16M11/04—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
- F16M11/043—Allowing translations
- F16M11/048—Allowing translations adapted to forward-backward translation movement
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
The invention discloses a three-degree-of-freedom ultrasonic vibration auxiliary machining precision positioning platform, which is machined by adopting a wire cut electrical discharge machining technology, so that the mechanical assembly is reduced; four symmetrical flexible differential amplifying mechanisms are connected in parallel, so that high-precision translation of the movable platform in an XY plane is realized, and translation in a Z direction is realized by a series bridge type amplifying mechanism; the large platform is connected with a small platform in series, and the high-frequency piezoelectric ceramic piece is used for providing ultrasonic vibration in a plane; the precision positioning platform has a compact structure, and can have higher natural frequency; the coupling error caused by mechanism transmission can be eliminated by adopting a symmetrical flexible mechanism; the differential amplification mechanism and the bridge amplification mechanism have larger displacement amplification ratios, so that the movable platform has larger strokes in X-direction translation, Y-direction translation and Z-direction translation; the four groups of parallel sheet-shaped flexible hinge mechanisms connected with the bridge type mechanism can realize decoupling of the precise positioning platform on X-direction translation and Y-direction translation of the movable platform, and improve the motion precision of the movable platform.
Description
Technical Field
The invention relates to the field of micro-nano manufacturing, in particular to a three-degree-of-freedom ultrasonic vibration auxiliary machining precision positioning platform.
Background
With the development of scientific technology, micro-nano technology is rapidly developed, the requirement of a complex micro-nano structure with nano precision is more and more extensive, in order to obtain higher processing speed and processing precision, ultrasonic vibration is applied to the micro-nano processing process, at present, ultrasonic vibration auxiliary processing platforms are few, and particularly, an ultrasonic vibration micro-motion platform with three-degree-of-freedom motion performance is provided. At present, most ultrasonic vibration auxiliary machining platforms have small strokes and cannot realize three-dimensional machining, and machining requirements cannot be met.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a three-degree-of-freedom ultrasonic vibration auxiliary processing precision positioning platform which has three degrees of freedom of X-direction translation, Y-direction translation and Z-direction translation, is high in precision and has an ultrasonic vibration function.
The technical scheme adopted by the invention is as follows: a three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform is of an X-axis and Y-axis axisymmetric structure and comprises a large platform and a small platform, wherein the small platform is connected in series in the center of the large platform, and the bottom of the small platform is connected in series with a bridge type amplification mechanism;
the outer peripheral side of the bridge type amplification mechanism is symmetrically connected with 4 symmetrical differential amplification mechanisms along the X direction and the Y direction, the front end of one of the symmetrical differential amplification mechanisms in 2 symmetrical differential amplification mechanisms arranged along the X direction is provided with a first piezoelectric ceramic driver for driving the bridge type amplification mechanism to drive the small platform to translate in the X direction, and the front end of one of the symmetrical differential amplification mechanisms in 2 symmetrical differential amplification mechanisms arranged along the Y direction is provided with a second piezoelectric ceramic driver for driving the bridge type amplification mechanism to drive the small platform to translate in the Y direction; a third piezoelectric ceramic driver for realizing the Z-direction translation of the small platform is arranged in the bridge type amplification mechanism along the Z direction;
little platform is including moving the platform, move the four week side X of platform to, Y is provided with 4 flexible hinge mechanisms to the symmetry, along X to 2 of arranging flexible hinge mechanism one of them the front end of flexible hinge mechanism is provided with the realization move platform X to high-frequency vibration's first high frequency piezoelectric ceramic piece, along Y to 2 of arranging one of them of flexible hinge mechanism the front end of flexible hinge mechanism is provided with the realization move platform Y to high-frequency vibration's second high frequency piezoelectric ceramic piece.
Furthermore, the symmetrical differential amplification mechanism comprises a first movable beam, a second movable beam, a first force transmission connecting rod, a third movable beam, a parallel sheet-shaped flexible hinge mechanism, a fourth movable beam and a second force transmission connecting rod; the piezoelectric ceramic contact surface of the first movable beam and the first piezoelectric ceramic driver or the second piezoelectric ceramic driver is in a movable semicircular shape, one side of the first piezoelectric ceramic driver or the second piezoelectric ceramic driver is pre-tightened through a pre-tightening bolt and is in contact with the base body of the large platform, and the output end of the first piezoelectric ceramic driver or the second piezoelectric ceramic driver is in contact with the first movable beam; the first movable cross beam is respectively connected with the second movable cross beam and the second force transmission connecting rod; the second movable cross beam is connected with the base body of the large platform, and the output end of the second movable cross beam is connected with the first force transmission connecting rod; the other end of the first force transmission connecting rod is connected with the third movable cross beam; the tail end of the second force transmission connecting rod is connected with the fourth movable cross beam, the fourth movable cross beam is connected with the third movable cross beam, and the output tail end of the third movable cross beam is connected with the bridge type amplification mechanism through the parallel sheet-shaped flexible hinge mechanism.
The parallel flaky flexible hinge mechanism comprises two parallel flaky flexible hinges, one side of each parallel flaky flexible hinge is connected with the bridge type amplification mechanism, and the other side of each parallel flaky flexible hinge is connected with the output tail end of the third movable beam, so that the decoupling of the precise positioning platform on the X-direction translation and the Y-direction translation of the small platform is realized.
Furthermore, the bridge type amplification mechanism comprises 2 vertical beams, 2 cross beams and an output platform; the contact surface of one vertical beam and the third piezoelectric ceramic driver is a movable semicircle, and the other vertical beam is pre-tightened by a pre-tightening bolt and is in contact with the third piezoelectric ceramic driver; the other ends of the 2 vertical beams are respectively connected with the 2 cross beams; and 2, the other ends of the cross beams are connected with the output platform.
Furthermore, four corners at the bottom of the bridge type amplification mechanism are respectively connected with a supporting mechanism, and each supporting mechanism is composed of two hooke hinges which are connected in series.
The invention has the beneficial effects that: the three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform adopts the wire cut electrical discharge machining technology to machine, so that the mechanical assembly is reduced; four symmetrical flexible differential amplifying mechanisms are connected in parallel, so that high-precision translation of the movable platform in an XY plane is realized, and a novel bridge type amplifying mechanism is connected in series to realize translation in a Z direction; the large platform is connected with a small platform in series, and the high-frequency piezoelectric ceramic piece is used for providing ultrasonic vibration in a plane; the X-direction, Y-direction and Z-direction precise positioning platform is compact in structure, and can have higher natural frequency; the coupling error caused by mechanism transmission can be eliminated by adopting a symmetrical flexible mechanism; the differential amplification mechanism and the bridge amplification mechanism have larger displacement amplification ratios, so that the movable platform has larger strokes in X-direction translation, Y-direction translation and Z-direction translation; the contact surface of the piezoelectric ceramic and the flexible amplifying mechanism is designed into a semicircular contact surface so as to prevent the piezoelectric ceramic from bearing bending moment and torque and prevent the piezoelectric ceramic from being damaged; the four groups of parallel sheet-shaped flexible hinge mechanisms connected with the bridge type mechanism can realize decoupling of the precise positioning platform on X-direction translation and Y-direction translation of the movable platform, so that the motion precision of the movable platform is improved; the supporting mechanism is arranged, so that the influence of gravity on the platform can be weakened to a certain extent.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the symmetrical differential amplifier of the present invention;
FIG. 3 is an enlarged schematic view of a bridge amplification mechanism according to the present invention;
FIG. 4 is an enlarged schematic view of a small platform according to the present invention;
fig. 5 is an enlarged schematic view of the supporting mechanism of the present invention.
The attached drawings are marked as follows: 1. a substrate; 2. a first piezoelectric ceramic driver; 3. pre-tightening the bolts; 4. a symmetrical differential amplification mechanism; 41. a first movable cross member; 42. a second movable cross member; 43. a first force transfer link; 44. a third movable beam; 45. a parallel sheet-like flexible hinge mechanism; 46. a fourth movable beam; 47. a second force transfer link; 5. a bridge amplification mechanism; 51. erecting a beam; 52. a cross beam; 53. an output stage; 6. a third piezoelectric ceramic driver; 7. a second high-frequency piezoelectric ceramic sheet; 8. a first high-frequency piezoelectric ceramic sheet; 9. a small platform; 91. a small platform substrate; 92. a flexible hinge mechanism; 93. a movable platform; 10. a second piezoelectric ceramic driver; 11. a support mechanism;
Detailed Description
In order to further understand the contents, features and effects of the present invention, the following embodiments are illustrated and described in detail with reference to the accompanying drawings:
as shown in fig. 1 to 5, the three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform is of an X-axis and Y-axis axisymmetric structure, and comprises a large platform and a small platform 9 which are integrally formed by plate linear cutting, wherein the small platform 9 is connected in series in the center of the large platform, and the bottom of the small platform 9 is connected in series with a bridge type amplification mechanism 5.
The outer periphery of the bridge type amplifying mechanism 5 is symmetrically connected with 4 symmetrical differential amplifying mechanisms 4 along the X direction and the Y direction through 4 groups of parallel flaky flexible hinges which are connected in parallel. The front end of one 4 of the 2 symmetrical differential amplification mechanisms 4 arranged in the X direction is provided with a piezoelectric ceramic driver (i.e., the first piezoelectric ceramic driver 2), the front end of the other 4 is not provided with a piezoelectric ceramic driver, and the symmetrical differential amplification mechanisms 4 arranged in the X direction are driven by the first piezoelectric ceramic driver 2; the first piezoelectric ceramic driver 2 drives the bridge type amplification mechanism 5 to translate along the X direction through the symmetrical differential amplification mechanism 4 which is connected with the first piezoelectric ceramic driver and arranged along the X direction, and then drives the small platform 9 connected with the bridge type amplification mechanism 5 to translate along the X direction. The front end of one of the symmetrical differential amplification mechanisms 4 of the 2 symmetrical differential amplification mechanisms 4 arranged in the Y direction is provided with a piezoelectric ceramic driver (i.e., a second piezoelectric ceramic driver 10), the front end of the other symmetrical differential amplification mechanism 4 is not provided with a piezoelectric ceramic driver, and the symmetrical differential amplification mechanisms 4 arranged in the Y direction are driven by the second piezoelectric ceramic driver 10; the second piezoceramic driver 10 drives the bridge type amplification mechanism 5 to translate along the Y direction through the symmetrical differential amplification mechanism 4 which is connected with the second piezoceramic driver and arranged along the Y direction, and then drives the small platform 9 connected with the bridge type amplification mechanism 5 to translate along the Y direction. The top of the bridge type amplification mechanism 5 is connected with the small platform 9 in series along the Z direction, and a piezoelectric ceramic driver (namely, a third piezoelectric ceramic driver 6) is arranged inside the bridge type amplification mechanism 5 along the Z direction; the bridge type amplification mechanism 5 is driven by a third piezoelectric ceramic driver 6; the third piezoelectric ceramic driver 6 drives the small platform 9 to translate along the Z direction through the bridge type amplification mechanism 5 which is connected with the third piezoelectric ceramic driver and arranged along the Z direction.
The small platform 9 comprises a movable platform 93, and 4 flexible hinge mechanisms 92 are symmetrically arranged on the four sides of the movable platform 93 in the X direction and the Y direction. The front end of one of the flexible hinge mechanisms 92 of 2 flexible hinge mechanisms 92 arranged along the X direction is provided with a high-frequency piezoelectric ceramic piece (namely, a first high-frequency piezoelectric ceramic piece 8), the other end of the high-frequency piezoelectric ceramic piece is connected with the small platform substrate 91, and the front end of the other flexible hinge mechanism 92 is not provided with the high-frequency piezoelectric ceramic piece; the moving platform 93 realizes high-frequency vibration along the X direction through the first high-frequency piezoelectric ceramic piece 8. The front end of one of the flexible hinge mechanisms 92 of 2 flexible hinge mechanisms 92 arranged along the Y direction is provided with a high-frequency piezoelectric ceramic piece (namely, a second high-frequency piezoelectric ceramic piece 7), the other end of the high-frequency piezoelectric ceramic piece is connected with the small platform substrate 91, and the front end of the other flexible hinge mechanism 92 is not provided with the high-frequency piezoelectric ceramic piece; the moving platform 93 realizes high-frequency vibration along the Y direction through the second high-frequency piezoelectric ceramic plate 7.
Wherein the symmetric differential amplification mechanism 4 comprises a first movable beam 41, a second movable beam 42, a first force transmission link 43, a third movable beam 44, a parallel sheet-like flexible hinge mechanism 45, a fourth movable beam 46 and a second force transmission link 47; the piezoelectric ceramic contact surface of the first movable beam 41 and the first piezoelectric ceramic driver 2 or the second piezoelectric ceramic driver 10 is a movable semicircular shape, one side of the first piezoelectric ceramic driver 2 or the second piezoelectric ceramic driver 10 is pre-tightened by a pre-tightening bolt 3 and is contacted with the substrate 1 of the large platform, and the output end of the first piezoelectric ceramic driver 2 or the second piezoelectric ceramic driver 10 is contacted with the first movable beam 41; the first movable beam 41 is connected to the second movable beam 42 and the second force-transmission link 47, respectively; the second movable cross beam 42 is connected with the base body 1 of the large platform, and the output end of the second movable cross beam 42 is connected with the first force transmission connecting rod 43; the other end of the first force transmission link 43 is connected to the third movable beam 44; the end of the second force-transmission link 47 is connected to the fourth movable beam 46, the fourth movable beam 46 is connected to the third movable beam 44, and the output end of the third movable beam 44 is connected to the bridge amplification mechanism 5 via the parallel-plate-like flexible hinge mechanism 45.
The parallel flaky flexible hinge mechanism 45 comprises two parallel flaky flexible hinges, one side of each parallel flaky flexible hinge is connected with the bridge type amplification mechanism 5, and the other side of each parallel flaky flexible hinge is connected with the output tail end of the third movable beam 44, so that the decoupling of the precise positioning platform on the X-direction translation and the Y-direction translation of the small platform 9 is realized.
The bridge type amplification mechanism 5 comprises 2 vertical beams 51, 2 cross beams 52 and an output platform 53; the contact surface of one vertical beam 51 and the third piezoelectric ceramic driver 6 is a movable semicircle, and the other vertical beam 51 is pre-tightened by a pre-tightening bolt 3 and is in contact with the third piezoelectric ceramic driver 6; the other ends of the 2 vertical beams 51 are respectively connected with the 2 cross beams 52; the other ends of the 2 beams 52 are connected with the output platform 53.
Four corners at the bottom of the bridge type amplification mechanism 5 are connected with supporting mechanisms 11, and each supporting mechanism 11 is composed of two hooke hinges connected in series.
The working principle of the invention is as follows:
by changing the voltage on the first piezoceramic driver 2, the first piezoceramic driver 2 drives the bridge type amplification mechanism 5 and the small platform 9 thereon to translate along the X direction through the symmetrical differential amplification mechanism 4 which is connected with the first piezoceramic driver and is arranged along the X direction.
By changing the voltage on the second piezoceramic driver 10, the second piezoceramic driver 10 drives the bridge type amplification mechanism 5 and the small platform 9 thereon to translate along the Y direction through the symmetrical differential amplification mechanism 4 which is connected with the second piezoceramic driver and is arranged along the Y direction.
The voltage of the third piezoceramic driver 6 is changed, so that the third piezoceramic driver 6 drives the small platform 9 thereon to translate along the Z direction through the bridge type amplification mechanism 5 which is connected with the third piezoceramic driver and arranged along the Z direction.
By changing the voltage on the first high-frequency piezoelectric ceramic piece 8, the first high-frequency piezoelectric ceramic piece 8 drives the movable platform 93 of the small platform 9 to vibrate along the X direction at high frequency.
By changing the voltage on the second high-frequency piezoelectric ceramic plate 7, the second high-frequency piezoelectric ceramic plate 7 drives the movable platform 93 of the small platform 9 to vibrate along the Y direction at high frequency.
In summary, the movable platform 93 of the present invention not only can realize the translation in the X direction, the translation in the Y direction, and the translation in the Z direction, but also can realize the ultrasonic high-frequency vibration in the X direction and the Y direction.
Although the preferred embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and those skilled in the art can make many modifications without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (4)
1. A three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform is characterized by being of an X-axis and Y-axis axisymmetric structure and comprising a large platform and a small platform, wherein the small platform is connected in series in the center of the large platform, and the bottom of the small platform is connected in series with a bridge type amplification mechanism;
the outer peripheral side of the bridge type amplification mechanism is symmetrically connected with 4 symmetrical differential amplification mechanisms along the X direction and the Y direction, the front end of one of the symmetrical differential amplification mechanisms in 2 symmetrical differential amplification mechanisms arranged along the X direction is provided with a first piezoelectric ceramic driver for driving the bridge type amplification mechanism to drive the small platform to translate in the X direction, and the front end of one of the symmetrical differential amplification mechanisms in 2 symmetrical differential amplification mechanisms arranged along the Y direction is provided with a second piezoelectric ceramic driver for driving the bridge type amplification mechanism to drive the small platform to translate in the Y direction; a third piezoelectric ceramic driver for realizing the Z-direction translation of the small platform is arranged in the bridge type amplification mechanism along the Z direction; the symmetrical differential amplification mechanism comprises a first movable beam, a second movable beam, a first force transmission connecting rod, a third movable beam, a parallel sheet-shaped flexible hinge mechanism, a fourth movable beam and a second force transmission connecting rod; the piezoelectric ceramic contact surface of the first movable beam and the first piezoelectric ceramic driver or the second piezoelectric ceramic driver is in a movable semicircular shape, one side of the first piezoelectric ceramic driver or the second piezoelectric ceramic driver is pre-tightened through a pre-tightening bolt and is in contact with the base body of the large platform, and the output end of the first piezoelectric ceramic driver or the second piezoelectric ceramic driver is in contact with the first movable beam; the first movable cross beam is respectively connected with the second movable cross beam and the second force transmission connecting rod; the second movable cross beam is connected with the base body of the large platform, and the output end of the second movable cross beam is connected with the first force transmission connecting rod; the other end of the first force transmission connecting rod is connected with the third movable cross beam; the tail end of the second force transmission connecting rod is connected with the fourth movable cross beam, the fourth movable cross beam is connected with the third movable cross beam, and the output tail end of the third movable cross beam is connected with the bridge type amplification mechanism through the parallel sheet-shaped flexible hinge mechanism;
little platform is including moving the platform, move the four week side X of platform to, Y is provided with 4 flexible hinge mechanisms to the symmetry, along X to 2 of arranging flexible hinge mechanism one of them the front end of flexible hinge mechanism is provided with the realization move platform X to high-frequency vibration's first high frequency piezoelectric ceramic piece, along Y to 2 of arranging one of them of flexible hinge mechanism the front end of flexible hinge mechanism is provided with the realization move platform Y to high-frequency vibration's second high frequency piezoelectric ceramic piece.
2. The three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform according to claim 1, wherein the parallel sheet-shaped flexible hinge mechanism comprises two parallel sheet-shaped flexible hinges, one side of each parallel sheet-shaped flexible hinge is connected with the bridge type amplification mechanism, and the other side of each parallel sheet-shaped flexible hinge is connected with the output tail end of the third movable beam, so that decoupling of the precision positioning platform on X-direction translation and Y-direction translation of the small platform is realized.
3. The three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform according to claim 1, wherein the bridge type amplification mechanism comprises 2 vertical beams, 2 cross beams and an output table; the contact surface of one vertical beam and the third piezoelectric ceramic driver is a movable semicircle, and the other vertical beam is pre-tightened by a pre-tightening bolt and is in contact with the third piezoelectric ceramic driver; the other ends of the 2 vertical beams are respectively connected with the 2 cross beams; and 2, the other ends of the cross beams are connected with the output platform.
4. The three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform according to claim 1, wherein four corners of the bottom of the bridge amplification mechanism are connected with support mechanisms, and each support mechanism is composed of two hooke hinges connected in series.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810588285.3A CN108561700B (en) | 2018-06-08 | 2018-06-08 | Three-degree-of-freedom ultrasonic vibration auxiliary machining precision positioning platform |
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| CN201810588285.3A CN108561700B (en) | 2018-06-08 | 2018-06-08 | Three-degree-of-freedom ultrasonic vibration auxiliary machining precision positioning platform |
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| CN108561700A CN108561700A (en) | 2018-09-21 |
| CN108561700B true CN108561700B (en) | 2020-03-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109584947B (en) * | 2018-09-28 | 2020-11-24 | 天津大学 | Three-degree-of-freedom large-stroke high-precision micro-positioning platform based on bridge type amplification mechanism |
| CN109531546B (en) * | 2018-12-25 | 2024-05-31 | 西交利物浦大学 | Micro-motion platform with normal two degrees of freedom |
| CN109622349B (en) * | 2019-01-31 | 2020-08-14 | 天津大学 | Two-dimensional ultrasonic vibration platform for micro-nano machining |
| CN109622348B (en) * | 2019-01-31 | 2020-07-24 | 天津大学 | Three-dimensional decoupling ultrasonic nano vibration table |
| CN110310695B (en) * | 2019-06-11 | 2021-07-06 | 天津大学 | Variable-friction series-parallel two-degree-of-freedom stick-slip driving precision positioning platform |
| CN110310696B (en) * | 2019-06-12 | 2021-04-27 | 天津大学 | Three-stage displacement amplification two-degree-of-freedom flexible precision positioning platform |
| CN110315205B (en) * | 2019-07-05 | 2024-06-25 | 佛山科学技术学院 | Novel laser welding device and welding method thereof |
| CN110369248B (en) * | 2019-07-16 | 2020-05-05 | 东北大学 | Variable-angle two-dimensional ultrasonic vibration auxiliary machining platform based on flexible hinge |
| CN112447262B (en) * | 2019-08-27 | 2021-12-24 | 天津大学 | Three-translation decoupling micro positioner based on rotary lever half-bridge amplifier |
| CN114337364B (en) * | 2021-01-11 | 2024-04-12 | 西安交通大学 | Differential flexible displacement shrinking mechanism with non-same direction input and output |
| CN114198481B (en) * | 2021-12-16 | 2023-11-10 | 北京航空航天大学 | Parallel two-degree-of-freedom precise motion executing mechanism based on flexible hinge |
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| JP3434709B2 (en) * | 1998-08-31 | 2003-08-11 | オリンパス光学工業株式会社 | Table mechanism |
| CN104595642B (en) * | 2015-01-06 | 2016-05-04 | 山东大学 | A kind of two degrees of freedom Piezoelectric Driving nanopositioning stage |
| CN104624463B (en) * | 2015-01-09 | 2017-01-25 | 天津大学 | Two-dimensional ultrasound vibration platform |
| CN105931675B (en) * | 2016-04-13 | 2018-04-03 | 天津大学 | A kind of parallel xyz Three Degree Of Freedoms mini positioning platform |
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