CN112563145A - 一种汽车制剂压力应变器陶瓷电路制备方法 - Google Patents

一种汽车制剂压力应变器陶瓷电路制备方法 Download PDF

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CN112563145A
CN112563145A CN202011347380.8A CN202011347380A CN112563145A CN 112563145 A CN112563145 A CN 112563145A CN 202011347380 A CN202011347380 A CN 202011347380A CN 112563145 A CN112563145 A CN 112563145A
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preparation
strain gauge
circuit
automobile
bridge circuit
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康文涛
张迅
彭伟才
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Loudi Antaeus Electronic Ceramics Co ltd
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Loudi Antaeus Electronic Ceramics Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/04Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/8038Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/80399Material
    • H01L2224/80486Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2224/80488Glasses, e.g. amorphous oxides, nitrides or fluorides

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

本发明公开了汽车制剂压力应变器陶瓷电路制备方法,包括以下步骤:S1:将设计好的电桥电路按集成电路生产技术制作成die;S2:将步骤S1中的die使用玻璃微熔技术焊接在陶瓷衬底上;S3:用邦定工艺将电桥电路引线到后级处理电路中。本发明相比传统的汽车制剂压力应变器陶瓷电路制备方法具有生产过程简单、生产效率高、产品合格率高等优点且利用现技术生产的应变片灵敏度和精度都比传统方法生产的要高很多。

Description

一种汽车制剂压力应变器陶瓷电路制备方法
技术领域
本发明涉及汽车传感器技术领域,具体涉及汽车制剂压力应变器陶瓷电路制备方法。
背景技术
现有汽车制冷剂压力应变器是在一个陶瓷衬底上用不同导电率的浆料进行印刷,形成一个厚膜电桥电路,因为在这个厚膜电桥电路里,需要不同压力特性的电阻、导线、绝缘层、保护层、引线焊接层等,所以这个厚模电桥电路需要进行多次且不同浆料的印刷,多次印刷生产过程繁琐复杂,效率非常低;此外,印刷过程中极易产生印刷不良,导致产品的合格率下降或成品的一致性较差,且浆料本身的配置、使用、保存都是复杂多变的,所以浆料也很容易产品的合格率下降或成品的一致性较差;传统的应变片的灵敏度差,精度低。
发明内容
本发明要解决的技术问题是克服现有技术存在的不足,提供一种生产过程简单、生产效率高和产品合格率高的汽车制剂压力应变器陶瓷电路制备方法。
为解决上述技术问题,本发明采用以下技术方案:汽车制剂压力应变器陶瓷电路制备方法,包括以下步骤:
S1:将设计好的电桥电路按集成电路生产技术制作成die;
S2:将步骤S1中的die使用玻璃微熔技术焊接在陶瓷衬底上;
S3:用邦定工艺将电桥电路引线到后级处理电路中。
与现有技术相比,本发明的优点在于:本发明相比传统的汽车制剂压力应变器陶瓷电路制备方法具有生产过程简单、生产效率高、产品合格率高等特点且利用现技术生产的应变片灵敏度和精度都比传统方法生产的要高很多。
附图说明
图1为传统汽车制冷剂压力应变器示意图;
图2为本发明示意图。
图例说明:
1、陶瓷衬底;2、印刷电桥电路;3、半桥电路die。
具体实施方式
以下结合附图和具体实施例对本发明作进一步详细说明,显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例,基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本实施例的汽车制剂压力应变器陶瓷电路制备方法,包括以下步骤:
S1:将设计好的电桥电路按集成电路生产技术制作成die(半桥电路die3);
S2:将步骤S1中的die使用玻璃微熔技术焊接在陶瓷衬底1上;
S3:用邦定工艺将电桥电路引线到后级处理电路中。
本实施例中,不需要印刷电桥电路,解决传统汽车制冷剂压力应变器生产过程繁琐复杂,效率非常低且应变器受浆料性能的影响,使产品合格率下降等问题,本发明将原电桥电路设计成两个半桥电路,并用集成电路生产工艺在wafer上制作出来,经测试合格后再制作成半桥电路die3(wafer生产出来的是整片晶元,将整片晶元生成一个个的die),将此die3用玻璃微熔工艺焊接在陶瓷衬底1上,再用邦定工艺将电桥电路引线到后级处理电路中。电桥电路使用集成电路生产工艺,一致性非常好;产品生产过程中直接使用玻璃微熔和邦定工艺,方便快捷,且合格率高;成品的灵敏度更高、分辨率更精确。集成电路生产工艺与玻璃微熔工艺是目前很成熟的技术,属于现有技术,因此这里不必赘述。
图1为传统汽车制冷剂压力应变器示意图;图2为本发明示意图;图中标号1为陶瓷衬底,标号2为印刷电桥电路,标号3为半桥电路die,箭头方向为制冷剂压力方向。
以上仅是本发明的优选实施方式,本发明的保护范围并不仅局限于上述实施例。对于本技术领域的技术人员来说,在不脱离本发明技术构思前提下所得到的改进和变换也应视为本发明的保护范围。

Claims (1)

1.一种汽车制剂压力应变器陶瓷电路制备方法,其特征在于,包括以下步骤:
S1:将设计好的电桥电路按集成电路生产技术制作成die;
S2:将步骤S1中的die使用玻璃微熔技术焊接在陶瓷衬底上;
S3:用邦定工艺将电桥电路引线到后级处理电路中。
CN202011347380.8A 2020-11-26 2020-11-26 一种汽车制剂压力应变器陶瓷电路制备方法 Pending CN112563145A (zh)

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