CN112562512A

CN112562512A - Display module and display device

Info

Publication number: CN112562512A
Application number: CN202011463015.3A
Authority: CN
Inventors: 叶穗丰; 何晶; 罗锦钊; 胡君文
Original assignee: Truly Huizhou Smart Display Ltd
Current assignee: Truly Huizhou Smart Display Ltd
Priority date: 2020-12-14
Filing date: 2020-12-14
Publication date: 2021-03-26

Abstract

The invention relates to a display module, which comprises a lower substrate, an upper substrate, an IC (integrated circuit) and an FPC (flexible printed circuit), wherein the upper substrate is arranged on the lower substrate, and the FPC is connected with the lower substrate through the IC. The IC comprises a packaging piece, an IC output pin is arranged on the contact end face of the packaging piece and the lower substrate, an IC input pin is arranged on the contact end face of the packaging piece and the FPC, the IC is electrically connected with the lower substrate through the IC output pin, and the IC is electrically connected with the FPC through the IC input pin. The invention also relates to a display device which comprises the display module.

Description

Display module and display device

Technical Field

The invention relates to the technical field of display, in particular to a display module and a display device.

Background

Under the trend of full-face screens, the display device is increasingly pursuing the overall design of frame narrowing, and the narrowing of the upper frame, the left frame and the right frame of the display device is realized at present. An IC (integrated chip) and an FPC (flexible printed circuit) are generally required to be arranged in a lower frame of a display device, and a technical scheme of a cog (chip on glass) packaging technology disclosed in the prior art is to arrange the IC and the FPC on a lower substrate respectively, and the packaging technology has the technical problems that: the wider connecting area needs to be reserved on the lower substrate to arrange the IC and the FPC, so that the effect of narrowing the lower frame is difficult to achieve.

In order to achieve the effect of narrowing the lower frame, a COF (chip on film) packaging technology is also disclosed in the prior art, and the COF packaging technology is different from the COG packaging technology in that: the COF packaging technology is to bind the IC to the Film of the FPC, so that the width of the connection region reserved on the lower substrate can be reduced to achieve the effect of narrowing the lower frame. However, the COF packaging technology has the technical problems that: the mold opening cost is high, and the cost of the product is greatly increased.

Disclosure of Invention

Aiming at the technical problems in the prior art, the invention provides a display module and a display device.

In one aspect, the present application provides a display module including a lower substrate, an upper substrate, an IC (integrated chip) and an FPC (flexible circuit board), wherein the upper substrate is disposed on the lower substrate, a region between the bottom of the lower substrate and the upper substrate is referred to as a "connection region", a width of the connection region corresponds to a width of a lower frame of a display device, and the IC and the FPC are disposed in the connection region. The FPC is connected to the lower substrate through the IC.

The IC comprises an IC input pin and an IC output pin, the IC is electrically connected with the lower substrate through the IC output pin, and the IC is electrically connected with the FPC through the IC input pin. The IC input end pin is used for inputting power supply and control signals, and the IC output end pin is used for outputting signals of the source drain grid electrode and the drain grid electrode of the display panel.

In the present application, the IC needs to be packaged first, and the packaging process of the IC may be implemented by applying the technology disclosed in the prior art to semiconductor packaging (e.g., BGA packaging technology), so as to package the IC in the package, where the contact end surface of the package and the lower substrate is provided with an IC output pin, and the contact end surface of the package and the FPC is provided with an IC input pin. In one embodiment, FPC binding gaskets are arranged on the contact end faces of the packaging part and the FPC, the FPC binding gaskets correspond to the IC input pins one to one, and the FPC is bound and connected with the packaging part through the FPC binding gaskets.

In one embodiment, the partial IC input pins and the partial IC output pins are respectively connected with the contacts on the IC by leads, and the partial IC input pins and the partial IC output pins are directly connected through leads. The arrangement of the IC input terminal pins is matched with the contact part of the FPC, the FPC is electrically connected with the IC through part of the IC input terminal pins, and the FPC is directly electrically connected with the lower substrate through part of the IC input terminal pins.

Compared with the prior art, the display panel and the display device provided by the invention at least realize the following beneficial effects:

the COG packaging technology needs to arrange at least two areas in a connecting area to respectively connect an IC and an FPC, wherein the IC is arranged between the FPC and an upper substrate, and the width of the connecting area is at least the sum of the widths of the two areas; the display module provided by the invention has the advantages that the connecting area only needs to be provided with the area capable of being connected with the IC, so that the width of the connecting area is reduced, and the technical effect of narrowing the lower frame is achieved;

the COF packaging technology is used for binding the IC on the Film of the FPC, but the display module provided by the invention still has the advantages that the IC is arranged in the connecting area, the IC realizes the function of a connecting piece through packaging treatment, and compared with the method for binding the IC on the Film of the FPC, the packaging treatment of the IC has remarkable advantages in product yield and cost.

On the other hand, the invention also provides a display device which comprises the display module. The display device described in the present invention may be any electronic product having a display function, including but not limited to the following categories: the mobile terminal comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, a mobile phone, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like.

The following description will be given with reference to specific examples.

Drawings

The figures further illustrate the invention, but the examples in the figures do not constitute any limitation of the invention.

Fig. 1 is a schematic structural diagram of a display module according to comparative embodiment 1 of the present disclosure.

Fig. 2 is a schematic structural diagram of a display module according to comparative embodiment 2 of the present invention.

Fig. 3 is a top view of a display module according to embodiment 1 of the present invention.

Fig. 4 is a right side view of a display module according to embodiment 1 of the present invention.

Fig. 5 is a schematic structural diagram of an IC provided in embodiment 1 of the present invention.

Fig. 6 is a schematic structural diagram of a display module according to embodiment 2 of the present invention.

Fig. 7 is a schematic structural diagram of a display module according to embodiment 3 of the present invention.

Wherein the reference numerals are: 1. a lower substrate; 2. an upper substrate; IC; IC input pin; 32, an IC output pin; 33. a package housing; 4, FPC; FPC connection portion.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be mechanically coupled, directly coupled, or indirectly coupled through intervening agents, both internally and/or in any other manner known to those skilled in the art. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

Comparative example 1

As shown in fig. 1, the present comparative embodiment provides a display module, which includes a lower substrate 1, an upper substrate 2, an IC3 and an FPC4, and the display module adopts a COG packaging technology, the upper substrate 2 is disposed on the lower substrate 1, the range of the upper substrate 2 on the lower substrate 1 is a "display range", and the ratio of the display range to the non-display range is a screen ratio. Both the IC3 and the FPC4 are provided in the connection region, and the IC3 is provided between the upper substrate 2 and the FPC 4.

Comparative example 2

As shown in fig. 2, the present comparative embodiment provides a display module, which includes a lower substrate 1, an upper substrate 2, an IC3 and an FPC4, and the display module adopts COF packaging technology, which is different from that of embodiment 1 in that: the IC3 is bonded to the Film of the FPC4 so that the width of the connection region can be reduced. The width of the connection region in comparative example 1 was larger than that in comparative example 2. By reducing the width of the connection region, the effect of narrowing the lower frame is achieved and the screen duty ratio is increased.

Example 1

As shown in fig. 3 to 4, the present embodiment provides a display module including a lower substrate 1, an upper substrate 2, an IC3 and an FPC4, wherein the FPC4 is connected to the lower substrate 1 through the IC3, and the width of the connection region in the present embodiment is the same as that of the connection region in the comparative embodiment 1. The application provides a be applied to display module's packaging structure can reach the effect of lower frame narrowing and increase the screen and account for the ratio.

As shown in fig. 5, in the present embodiment, the IC3 is packaged in the package housing 33, the top end surface of the package housing 33 is provided with IC input pins 31, the bottom end surface of the package housing 33 is provided with IC output pins 32, the IC3 is electrically connected to the FPC4 through the IC input pins 31, and the IC3 is electrically connected to the lower substrate 1 through the IC output pins 32. While package housing 33 also provides structural strength for the use of IC3 as a connector. An FPC bonding pad (not shown in the drawings) is further provided on the top end surface of the package housing 33, the FPC bonding pad corresponds to the IC input terminal pins 31 one to one, and the FPC4 is bonded to the package housing 33 through the FPC bonding pad. In this embodiment, the specific binding structure of the FPC4 and the package housing 33 adopts a binding structure applied to an FPC as disclosed in the prior art.

In this embodiment, the distance between two adjacent IC input end pins 31 is not less than 0.04mm, the length of the IC input end pin 31 is not less than 0.5mm, and the width of the IC input end pin 31 is not less than 0.08 mm. The number of the IC output pins 32 is larger than that of the IC input pins 31, and the width of the IC output pins 32 is not more than 0.04 mm.

In this embodiment, the IC output pin 32 is bound to the lower substrate 1.

Example 2

As shown in fig. 6, the present embodiment provides a display module including a lower substrate 1, an upper substrate 2, an IC3 and an FPC4, wherein the upper substrate 2 is disposed on the lower substrate 1. In this embodiment, the upper substrate 2 has a special structure, two connection areas are respectively formed between two corners of the bottom of the upper substrate 2 and the bottom of the lower substrate 1, and the IC3 is disposed in both connection areas. In this embodiment, the IC3 is packaged in the package housing 33, the top end surface of the package housing 33 is provided with an IC input pin 31, the bottom end surface of the package housing 33 is provided with an IC output pin 32, the IC3 is electrically connected to the FPC4 through the IC input pin 31, and the IC3 is electrically connected to the lower substrate 1 through the IC output pin 32. The width of the connection area matches the width of the package housing 33. An FPC bonding pad (not shown in the drawings) is further provided on the top end surface of the package housing 33, two FPC connecting portions 41 of the FPC4 are respectively bonded and connected to the package housing 33, and the bonding and connecting structure of the FPC connecting portions 41 and the package housing 33 is the same as the bonding structure of the FPC4 and the package housing 33 in embodiment 1. The application provides a be applied to display module's packaging structure is applicable to heterotypic structure's display module.

Example 3

As shown in fig. 7, the present embodiment provides a display module, which includes a lower substrate 1, an upper substrate 2, an IC3 and an FPC4, wherein the upper substrate 2 is disposed on the lower substrate 1, a connection region is formed between a side of the lower substrate 1 and the upper substrate 2 in the present embodiment, an IC3 is packaged in a package housing 33, an IC input pin 31 is disposed on a top end surface of the package housing 33, an IC output pin 32 is disposed on a bottom end surface of the package housing 33, the IC3 is electrically connected to the FPC4 through the IC input pin 31, and the IC3 is electrically connected to the lower substrate 1 through the IC output pin 32. The specific structure of the package housing 33 matches the connection area. An FPC bonding pad (not shown in the drawings) is further provided on the top end surface of the package housing 33, the FPC connection portion 41 of the FPC4 is bonded to the package housing 33, and the bonding structure of the FPC connection portion 41 to the package housing 33 is the same as the bonding structure of the FPC4 to the package housing 33 in embodiment 1. The application provides a be applied to display module's packaging structure also is applicable to the side of narrowing display module.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a display module assembly, includes infrabasal plate, upper substrate, IC and FPC, the upper substrate sets up on the infrabasal plate, its characterized in that: the FPC is connected with the lower substrate through the IC.

2. The display module according to claim 1, wherein: the IC comprises a packaging piece, the packaging piece and the contact end face of the lower substrate are provided with an IC output end pin, the packaging piece and the contact end face of the FPC are provided with an IC input end pin, the IC passes through the IC output end pin and the lower substrate electrically connected, and the IC passes through the IC input end pin and the FPC electrically connected.

3. The display module according to claim 2, wherein: the packaging part and the contact end face of the FPC are also provided with FPC binding gaskets, the FPC binding gaskets correspond to the pins of the IC input end one to one, and the FPC is bound and connected with the packaging part through the FPC binding gaskets.

4. The display module according to claim 3, wherein: and the IC output terminal pin is bound and connected with the lower substrate.

5. The display module according to claim 4, wherein: the IC is disposed between the bottom of the lower substrate and the upper substrate.

6. The display module according to claim 4, wherein: the IC is disposed between a side of the lower substrate and the upper substrate.

7. A display device, comprising the display module set claimed in any one of claims 1 to 6.