CN209911701U - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN209911701U CN209911701U CN201920872979.XU CN201920872979U CN209911701U CN 209911701 U CN209911701 U CN 209911701U CN 201920872979 U CN201920872979 U CN 201920872979U CN 209911701 U CN209911701 U CN 209911701U
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Abstract
The utility model discloses a display panel and display device, wherein, display panel includes relative first base plate and second base plate, a plurality of driver chip and an at least blotter that sets up, driver chip interval locates one side of first base plate, driver chip connects with at least one pin, the pin is connected with first base plate or second base plate electricity; the buffer pad is clamped between the pin and the first substrate or the second substrate. The utility model discloses technical scheme can effectively reduce driver chip's fracture, improves display panel's yield.
Description
Technical Field
The utility model relates to a show technical field, in particular to display panel and display device.
Background
Liquid Crystal Display (LCD) devices have many advantages such as thin body, power saving, and no radiation, and are widely used. A conventional liquid crystal display generally includes a Color Filter (CF) substrate, a Thin Film Transistor (TFT) array substrate, and a liquid crystal layer sandwiched between the Color Filter substrate and the array substrate. The main driving principle of the TFT-LCD is that a system main board connects R/G/B compression signals, control signals and power with a connector on a PCB through wires, and data is processed by a TCON (Timing Controller) IC on the PCB and then connected with a display area through a Source-on-Film Chip S-COF (Source-on-Film) and a Gate-on-Film Chip G-COF (Gate-on-Film), so that the LCD obtains required power and signals.
However, at present, because the source chip and the substrate are only bonded by the colloid, the manufactured display panel jolts in the transportation process, and the source chip is easily disconnected from the substrate due to pulling, even breaks by itself, so that the normal output of the panel is affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a display panel aims at improving display panel's the easy fracture problem of source chip.
In order to achieve the above object, the present invention provides a display panel including a first substrate and a second substrate oppositely disposed;
the driving chips are arranged on one side of the first substrate at intervals and are connected with at least one pin, and the pin is electrically connected with the first substrate or the second substrate; and
at least one buffer pad, the buffer pad is clamped between the pins and the first substrate or the second substrate.
Optionally, the cushion pad is made of conductive silica gel or graphene.
Optionally, the pins are provided in plurality, each of the pins overlaps with the first substrate, and the width of the buffer pad is the same as that of the pin.
Optionally, the area of the leads overlapped with the first substrate occupies half of the total area of the leads, and the area of the buffer pad is equal to the area of the leads overlapped with the first substrate.
Optionally, the thickness of the cushion is equal to the thickness of the pin.
Optionally, the display panel further includes a driving circuit board, and the driving circuit board is electrically connected to the driving chip.
Optionally, the first substrate includes a display region and a fan-out region, and the pins are connected to the first substrate or the second substrate in the fan-out region.
Optionally, the pins are electrically connected to the first substrate, and surfaces of the cushion pads facing the pins and the first substrate are coated with a conductive adhesive film.
The utility model discloses still provide a display panel, display panel includes:
the first substrate and the second substrate are oppositely arranged;
the driving chips are arranged on one side of the first substrate at intervals and are connected with at least one pin, and the pin is electrically connected with the first substrate or the second substrate; and
the buffer pads are clamped between the pins and the first substrate or the second substrate;
the buffer pad is made of conductive silica gel or graphene;
each pin is overlapped with the first substrate or the second substrate, and the overlapping area of the buffer cushion and the pin is smaller than or equal to the overlapping area of the pin and the first substrate.
The utility model also provides a display device, include as above display panel.
The utility model discloses technical scheme's display panel still includes a plurality of driver chip that are connected with first base plate or second base plate electricity including relative first base plate and the second base plate that sets up, and driver chip passes through the pin and is connected with first base plate or second base plate electricity, if the pin is connected on first base plate, then increases the blotter between first base plate and pin, if the pin is connected on the second base plate, then increases the blotter between second base plate and pin. So, in the display panel transportation, if the striking of jolting takes place, the blotter also can play the absorbing effect of buffering to make driver chip's pin be difficult to with first base plate or second base plate disconnection, and pin self also be difficult for breaking, and then guarantee display panel's normal output, improve display panel's yield.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a top view of an embodiment of a display panel according to the present invention;
fig. 2 is a cross-sectional view of a connection structure between a first substrate and a pin in a display panel according to the present invention;
fig. 3 is a top view of the first substrate and the pin connection structure of the display panel of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
31 | Source electrode driving chip |
| 10 | |
33 | |
| 11 | |
50 | |
| 13 | Fan-out area | 70 | |
| 30 | |
90 | Driving circuit board |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a display panel 100.
Referring to fig. 1 and fig. 2, in an embodiment of the present invention, a display panel 100 includes a first substrate 10 and a second substrate opposite to each other; the plurality of driving chips 30 are arranged on one side of the first substrate 10 at intervals, the driving chips 30 are connected with at least one pin 50, and the pin 50 is electrically connected with the first substrate 10 or the second substrate; and
at least one buffer pad 70, wherein the buffer pad 70 is sandwiched between the pins 50 and the first substrate 10.
In this embodiment, the display panel 100 includes a first substrate 10 and a second substrate, namely, an array substrate (TFT) and a Color substrate (CF), where the first substrate 10 may be the array substrate and the second substrate may be the Color substrate. Generally, the array substrate and the color filter substrate are fabricated, and then assembled together by using a sealant, a liquid crystal molecular layer is filled inside the liquid crystal molecular layer, and then a vertical polarizer is attached to the peripheral surfaces of the two substrates, and finally the driving chip 30 is mounted. The driving chip 30 is an important component of the display panel 100, and is communicated with the first substrate 10 or the second substrate through the driving chip 30, so as to transmit a display signal to the display panel 100 and increase voltage, the first substrate 10 is provided with a common electrode and a color resistance unit, the second substrate is provided with a common electrode and a color resistance layer, the first substrate 10 and the second substrate form a parallel capacitor through the common electrode and a pixel electrode, thereby driving liquid crystal molecules, ensuring light to pass through, and matching the color resistance layer and the color resistance unit to realize the development of color patterns. Thereby realizing the display of the picture.
The pins 50 are pins, also called pin pins, which are led out from the internal circuit of the driving chip 30 to be electrically connected to the substrate, and the plurality of pins 50 form an interface of the driving chip 30. In order to make the pins 50 communicate with the first substrate 10 or the second substrate, the buffer pads 70 are made of a material with high conductivity, and have good flexibility, so that when providing a buffer effect for the pins 50 and the first substrate 10 or the second substrate, the electrical communication between the pins 50 and the first substrate 10 or the second substrate can be efficiently realized. Specifically, the material of the buffer pad 70 may be conductive silica gel or graphene, and has good flexibility and high conductivity. Of course, the material of the buffer pad 70 may be other materials with high conductivity and high toughness.
The utility model discloses technical scheme's display panel 100 includes relative first base plate 10 and the second base plate that sets up, still include a plurality of driver chip 30 of being connected with first base plate 10 or second base plate electricity, driver chip 30 passes through pin 50 and is connected with first base plate 10 or second base plate electricity, if pin 50 connects on first base plate 10, then increase blotter 70 between first base plate 10 and pin 50, if pin 50 connects on the second base plate, then increase blotter 70 between second base plate and pin 50. Thus, in the transportation process of the display panel 100, if bumping and bumping occur, the buffer pad 70 can also play a role of buffering and damping, so that the pins 50 of the driving chip 30 are not easily disconnected from the first substrate 10 or the second substrate, and the pins 50 themselves are not easily broken, thereby ensuring the normal output of the display panel 100 and improving the yield of the display panel 100.
Referring to fig. 3, optionally, a plurality of pins 50 are provided, each pin 50 overlaps the first substrate 10, and the width of the buffer pad 70 is the same as the width of the pin 50.
In this embodiment, the number of the pins 50 is different according to the driving chip 30. Specifically, the driving chips 30 include an active electrode driving chip 31 and a gate driving chip 33, which are respectively located at two adjacent sides of the first substrate 10, and the number of the driving chips 30 may also be set according to the size of the display panel 100. In order to make the connection between the leads 50 and the first substrate 10 more stable, each of the leads 50 is disposed to overlap the first substrate 10, i.e., to have a portion overlapping each other, so as to increase the connection area between the two. Because the pins 50 are substantially in a strip shape, one end of each pin is connected to the periphery of the driving chip 30, and the other end of each pin is connected to the first substrate 10, in order to further improve the buffering effect, the width of the buffering pad 70 is set to be the same as the width of the pin 50, so that the buffering pad 70 can be further ensured to have the buffering effect on the width direction of the pin 50, the occurrence of partial fracture is further prevented, and the yield of the display panel 100 is improved.
Referring to fig. 3 again, optionally, the overlapping area of the leads 50 and the first substrate 10 occupies half of the total area of the leads 50, and the area of the buffer pad 70 is equal to the overlapping area of the leads 50 and the first substrate 10.
In this embodiment, because the pins 50 are arranged in a long strip shape, the length direction of the pins 50 is generally perpendicular to the edge of the first substrate 10, and in order to further improve the connection stability of the driving chip 30, the overlapping area of the pins 50 and the first substrate 10 is set to account for half of the total area of the pins 50, that is, the overlapping length of the pins 50 and the first substrate 10 accounts for half of the length of the pins 50, so that the connection stability of the pins 50 can be effectively ensured, and the pins are not easily broken. Of course, the pin 50 can also be bent in a direction perpendicular to its surface, so that when bumping or pulling occurs, it can be further extended to improve the cushioning effect.
In other embodiments, the overlapping area of the buffer pad 70 and the pin 50 may be smaller than the overlapping area of the pin 50 and the first substrate 10.
Referring to fig. 2, in an alternative embodiment, the thickness of the buffer pad 70 is equal to the thickness of the leads 50.
In this embodiment, the thickness of the buffer pad 70 may be set according to the size of the first substrate 10 and the driving chip 30, but the thickness of the buffer pad 70 is not too small, otherwise, the buffer pad cannot play a significant role in buffering and damping; certainly, the thickness of the cushion pad 70 should not be too large, otherwise, the material is wasted, and the driving chip 30 is relatively shaken due to the flexibility, so that the pulling force of the driving chip 30 is increased. Therefore, the thickness of the buffer pad 70 is equal to the thickness of the pin 50, so that a good buffer function can be ensured, and the stability of the driving chip 30 can be ensured.
Specifically, the pins 50 are electrically connected to the first substrate 10, and the surfaces of the buffer pads 70 facing the pins 50 and the first substrate 10 are coated with a conductive adhesive film.
In this embodiment, in order to effectively connect the pin 50 and the first substrate 10, i.e., the buffer pad 70, the conductive film is used to perform the high-temperature and high-pressure crimping after the conductive film is coated, so that a stable connection structure can be realized without affecting the electrical connection between the pin 50 and the first substrate 10. Optionally, the conductive film is an anisotropic conductive film, and is a solvent formed by uniformly mixing liquid resin and conductive particles, so that the conductive film is convenient to process and manufacture.
It is understood that the display panel 100 further includes a driving circuit board 70, and the driving circuit board 70 is electrically connected to the driving chip 30. Specifically, the first substrate 10 includes a display region 11 and a fan-out region 13, and the pins 50 are connected to the first substrate 10 in the fan-out region 13.
In this embodiment, the display panel 100 includes a plurality of data lines and gate lines, thereby forming a display area 11 composed of a plurality of pixel units, the fan-out area 13 is located at a side edge of the display panel 100, there are more fan-out wires in the fan-out area 13, one end of the fan-out wire is connected to the driving chip 30, and the other end is connected to a signal line, so that the source driving chip 31 located in the fan-out area 13 is electrically connected to the driving circuit board 70, meanwhile, the fan-out area 13 further includes a connecting wire, the connecting wire is connected to the adjacent source driving chip 31, and the space of the fan-out area 13 can be reasonably. After obtaining the R/G/B signal, the control signal, the power, and the like on the main board, the driving circuit board 70 transmits the R/G/B signal, the control signal, the power, and the like to the source driving chip 31 and the gate driving chip 33 through the processing of the driving circuit board 70, and the driving circuit board 70 transmits the signal to the gate driving chip 33 in a line-by-line transmission manner, and enables the display panel 100 to be opened line-by-line through digital-to-analog conversion and high-low voltage. The pins 50 and the first substrate 10 are connected in the fan-out region 13, and the electrical connection between the pins 50 and the first substrate 10 can be effectively realized because the circuit arrangement of the fan-out region 13 is more and regular.
The present invention also provides a display device (not shown), comprising the display panel 100 as described above. The specific structure of the display panel 100 refers to the above embodiments, and since the display device adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A display panel, comprising:
the first substrate and the second substrate are oppositely arranged;
the driving chips are arranged on one side of the first substrate at intervals and are connected with at least one pin, and the pin is electrically connected with the first substrate or the second substrate; and
at least one buffer pad, the buffer pad is clamped between the pins and the first substrate or the second substrate.
2. The display panel of claim 1, wherein the buffer pads are made of conductive silicone or graphene.
3. The display panel of claim 1, wherein the plurality of pins are provided, each of the pins overlaps the first substrate, and the buffer pad has a width identical to that of the pin.
4. The display panel of claim 3, wherein an area of the pins overlapping the first substrate is half of a total area of the pins, and an area of the buffer is equal to an area of the pins overlapping the first substrate.
5. The display panel of claim 1, wherein the buffer pads have a thickness equal to a thickness of the pins.
6. The display panel according to any one of claims 1 to 5, further comprising a driving circuit board electrically connected to the driving chip.
7. The display panel of claim 6, wherein the first substrate includes a display area and a fan-out area, the pins being connected with the first substrate at the fan-out area.
8. The display panel according to any one of claims 1 to 5, wherein the pins are electrically connected to the first substrate, and surfaces of the buffer pads facing the pins and the first substrate are coated with a conductive adhesive film.
9. A display panel, comprising:
the first substrate and the second substrate are oppositely arranged;
the driving chips are arranged on one side of the first substrate at intervals and are connected with at least one pin, and the pin is electrically connected with the first substrate or the second substrate; and
the buffer pads are clamped between the pins and the first substrate or the second substrate;
the buffer pad is made of conductive silica gel or graphene;
each pin is overlapped with the first substrate, and the overlapping area of the buffer cushion and the pin is smaller than or equal to the overlapping area of the pin and the first substrate.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920872979.XU CN209911701U (en) | 2019-06-11 | 2019-06-11 | Display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920872979.XU CN209911701U (en) | 2019-06-11 | 2019-06-11 | Display panel and display device |
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|---|---|
| CN209911701U true CN209911701U (en) | 2020-01-07 |
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| CN201920872979.XU Active CN209911701U (en) | 2019-06-11 | 2019-06-11 | Display panel and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111627342A (en) * | 2020-06-18 | 2020-09-04 | 上海天马微电子有限公司 | Light-emitting panel, spliced panel assembly, backlight module and display device |
| WO2021184889A1 (en) * | 2020-03-18 | 2021-09-23 | 京东方科技集团股份有限公司 | Display panel, manufacturing method, and display device |
-
2019
- 2019-06-11 CN CN201920872979.XU patent/CN209911701U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021184889A1 (en) * | 2020-03-18 | 2021-09-23 | 京东方科技集团股份有限公司 | Display panel, manufacturing method, and display device |
| CN111627342A (en) * | 2020-06-18 | 2020-09-04 | 上海天马微电子有限公司 | Light-emitting panel, spliced panel assembly, backlight module and display device |
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