CN213601593U

CN213601593U - Drive chip and display device

Info

Publication number: CN213601593U
Application number: CN202023314423.0U
Authority: CN
Inventors: 柳发霖; 张东琪; 张松岩; 董欣; 马亮
Original assignee: Truly Renshou High end Display Technology Ltd
Current assignee: Truly Renshou High end Display Technology Ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-07-02
Anticipated expiration: 2030-12-31

Abstract

The utility model discloses a driving chip, which comprises a substrate and connecting terminals positioned on the substrate, wherein at least one group of connecting terminals has an inclined design; the driving chip further includes dummy terminals disposed at respective blank positions beside the inclined design connection terminals. The utility model also discloses a display panel including above-mentioned driver chip. The terminal group of the driving chip of the utility model is designed to be inclined, so that the connecting wiring of the driving chip and the display panel needs to occupy the frame width of the display panel to be reduced on the premise of meeting the requirement of the line distance; meanwhile, a dummy terminal having no electrical characteristics is added to a blank region of the driving chip. The dummy terminals can enable the driving chip to be stressed uniformly in the binding and attaching process, and damage to the driving chip is avoided.

Description

Drive chip and display device

Technical Field

The utility model relates to a show technical field, especially relate to a driver chip and display device.

Background

With the continuous development of display technology, the visual effect requirements of consumers on display devices such as mobile phones and the like are continuously improved, higher requirements are put forward on narrow-frame display devices, and ultra-narrow frames or even no frames are required.

The terminal sets of the conventional driving chip (IC) are generally arranged in a straight line. In some improved schemes, by designing the terminal group of the driving chip to be inclined, as shown in fig. 1, on the premise that the improved connection routing of the driving chip and the display panel meets the requirement of the line distance, the width of the frame of the display panel, which is occupied by the connection routing, is reduced.

In the display device, a Driver Integrated Circuit (Driver IC) is bound to a display Panel (Panel), and the display Panel is driven by the Driver IC. Chip On Glass (COG) technology is a common technology for integrating a driving Chip On a display panel at present, and a Chip On board (COG) process is shown in fig. 2, wherein when the Chip On board (COG) technology is bound, the driving Chip (20) directly corresponds to the position of a connecting terminal of the display panel (10), and the Chip On board (COG) technology is pressed down by a binding pressure head to enable the Chip On board (COG) technology and the display panel to be bound through an anisotropic conductive film (30).

However, in the chip on board (COG) process during the bonding process of the improved driving chip with the display panel, the driving chip is easily stressed unevenly after the bonding pressure head presses down, so that the partial position of the driving chip is pressed down excessively, and the driving chip may be damaged.

SUMMERY OF THE UTILITY MODEL

To prior art's not enough, this application provides a driver chip, and this driver chip can structurally reduce the non-display area width of the display panel chip integrated area one side that occupies to be favorable to display device's narrow frame design.

The application provides a driving chip, which comprises a substrate and connecting terminals positioned on the substrate, wherein at least one group of connecting terminals have an inclined design; the driving chip further includes dummy terminals disposed at respective blank positions beside the inclined design connection terminals.

As a further preferred solution, the driving chip comprises at least one set of input terminals and at least one set of output terminals, and the set of output terminals has a slanted design.

As a further preferable scheme, on the plane of the driving chip, the output terminal group is located above, and the input terminal group is located below; the two ends of the output terminal group are designed to be inclined downwards, and the dummy terminals are arranged at blank positions of the upper left corner and the upper right corner of the driving chip.

More preferably, the plurality of dummy terminals are arranged in a line and parallel to the long side of the substrate.

More preferably, the plurality of dummy terminals are arranged in a line and parallel to the short side of the substrate.

More preferably, the plurality of dummy terminals are arranged in a straight L-shape and are parallel to the long side and the short side of the substrate, respectively.

More preferably, the dummy terminals have the same height.

More preferably, the dummy terminals are arranged in a stepwise manner in a direction along the long side of the substrate from the end portions to the intermediate portions of the substrate.

The application also provides a display panel, which comprises a display area and a non-display area, wherein the non-display area comprises a chip integration area; the chip integrated area is provided with the driving chip.

Compared with the prior art, the utility model discloses following beneficial effect has:

the terminal group of the driving chip of the utility model is designed to be inclined, so that the connecting wiring of the driving chip and the display panel needs to occupy the frame width of the display panel to be reduced on the premise of meeting the requirement of the line distance; meanwhile, a dummy terminal having no electrical characteristics is added to a blank region of the driving chip. The dummy terminals can enable the driving chip to be stressed uniformly in the binding and attaching process, and damage to the driving chip is avoided.

Drawings

Fig. 1 is a schematic structural diagram of a conventional driving chip;

FIG. 2 is a schematic diagram of a conventional bonding process between a driver chip and a display panel;

fig. 3 is a schematic plan view of a driving chip according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a planar structure of another driving chip according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a planar structure of another driving chip according to an embodiment of the present application;

fig. 6 is a schematic plan view of a driving chip according to an embodiment of the present disclosure;

FIG. 7 is a side view of a dummy terminal on the driver chip shown in FIG. 3;

fig. 8 is a side view of another dummy terminal on the driver chip shown in fig. 3.

The attached drawings are marked as follows:

the display device includes a display panel (10), a driving chip (20), an anisotropic conductive film (30), a substrate (21), an input terminal (23), an output terminal (22), and a dummy terminal (24).

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Refer to fig. 3-8, which are views of the present invention.

As shown in fig. 3, a driving chip provided in the present embodiment includes a substrate (21), and a connection terminal (bump pad) located on the substrate (21). The drive chip of this application embodiment has at least a set of connecting terminal to have the slope design to make drive chip and display panel's the line of being connected walk under the prerequisite that satisfies the line distance requirement, connect the frame width that the line needs occupy display panel that walks and reduce.

The drive chip of this application embodiment still is provided with a plurality of dummy terminals (dummy pad) (24), dummy terminal (24) set up in the other corresponding blank position of slope design connecting terminal. Because the dummy terminals (24) (dummy pads) without electrical characteristics are added in the blank area of the driving chip, the dummy terminals (24) can enable the driving chip to be stressed uniformly in the binding and attaching process, and damage to the driving chip is avoided.

The connection terminals of the driving chip include at least one set of input terminals (23) and at least one set of output terminals (22). Wherein, the input terminal (23) is used for transmitting external signals and is usually connected with the FPC. The output terminal (22) is used for connecting with the display panel. In a particular embodiment of the application, the set of output terminals (22) has a slanted design.

In the plan view of the driver chip according to the embodiment of the present invention, as shown in fig. 3, the long side of the driver chip is horizontally disposed, the group of output terminals (22) is located above, and the group of input terminals (23) is located below. The two ends of the output terminal (22) group are designed to be inclined downwards, blank positions are arranged at the upper left corner and the upper right corner of the driving chip, and the dummy terminal (24) of the specific embodiment of the application is arranged at the blank positions of the upper left corner and the upper right corner of the driving chip.

As a specific embodiment, as shown in fig. 3, a plurality of dummy terminals (24) are arranged in a straight line and parallel to the long side of the substrate (21).

As shown in fig. 3, the middle portion of the group of output terminals (22) is disposed horizontally, and both ends of the group of output terminals (22) are designed to be inclined. However, it is understood that the connection terminals are not limited to the inclined design shown in fig. 3, and the group of output terminals (22) may be directly composed of the inclined design without a horizontally disposed portion in the middle.

The set of output terminals (22) may be a set, as shown in fig. 3. The group of output terminals (22) may be a plurality of groups, as shown in fig. 4.

The sets of input terminals (23) shown in fig. 3-6 are arranged in a straight line.

As another specific embodiment, as shown in fig. 5, a plurality of dummy terminals (24) may be arranged in a straight line and parallel to the short side of the substrate (21).

As another specific embodiment, as shown in fig. 6, a plurality of dummy terminals (24) are arranged in a straight L shape and are parallel to the long side and the short side of the substrate (21), respectively.

When the length of the driver chip is small, as shown in fig. 7, it is preferable that the heights of the plurality of dummy terminals (24) are the same. The height of the dummy terminal (24) is not greater than the height of the connection terminal and may be the same as the height of the connection terminal.

However, when the length of the driver chip is large, as shown in fig. 8, the heights of the plurality of dummy terminals (24) are preferably different. Specifically, the heights of the dummy terminals (24) are gradually reduced from the end portion to the middle portion of the substrate (21) along the long side of the substrate (21). The length of the driving chip is larger, the stress of the driving chip is more complex, and the stress difference can be avoided when the driving chip is bound by adopting a step-by-step decreasing mode. The height of the dummy terminal (24) is not greater than the height of the connection terminal, and the height of the dummy terminal (24) having the highest height may be the same as the height of the connection terminal.

The specific embodiment of the present application further provides a display panel, which includes a display area and a non-display area, wherein the non-display area includes a chip integration area. The driving chip is disposed on the chip integration region.

the terminal group of the driving chip of the utility model is designed to be inclined, so that the connecting wiring of the driving chip and the display panel needs to occupy the frame width of the display panel to be reduced on the premise of meeting the requirement of the line distance; meanwhile, dummy terminals (dummy pads) having no electrical characteristics are added to the blank regions of the driving chip. The dummy terminals (dummy pads) can enable the driving chip to be stressed uniformly in the binding and attaching process, and damage to the driving chip is avoided.

It will be understood that modifications and variations can be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the appended claims.

Claims

1. A driving chip comprises a substrate and connecting terminals positioned on the substrate, wherein at least one group of the connecting terminals has an inclined design; the driving chip is characterized by further comprising dummy terminals, wherein the dummy terminals are arranged at corresponding blank positions beside the inclined design connecting terminals.

2. The driver chip according to claim 1, wherein the driver chip comprises at least one set of input terminals and at least one set of output terminals, wherein the set of output terminals has a slanted design.

3. The driver chip according to claim 2, wherein the set of output terminals is located above and the set of input terminals is located below in a plane of the driver chip; the two ends of the output terminal group are designed to be inclined downwards, and the dummy terminals are arranged at the blank positions of the upper left corner and the upper right corner of the driving chip.

4. The driver chip of claim 3, wherein the plurality of dummy terminals are arranged in a line and parallel to a long side of the substrate.

5. The driver chip of claim 3, wherein the plurality of dummy terminals are arranged in a line and parallel to a short side of the substrate.

6. The driver chip according to claim 3, wherein the plurality of dummy terminals are arranged in a straight L-shape and are parallel to the long side and the short side of the substrate, respectively.

7. The driver chip of claim 1, wherein the heights of the plurality of dummy terminals are the same.

8. The driver chip according to claim 1, wherein the plurality of dummy terminals have a height that decreases in steps from an end portion to an intermediate position of the substrate in a direction along the long side of the substrate.

9. A display panel comprises a display area and a non-display area, wherein the non-display area comprises a chip integration area; wherein the chip integrated area is provided with the driving chip according to any one of claims 1 to 8.