CN112551878A

CN112551878A - Stage and cutting device

Info

Publication number: CN112551878A
Application number: CN202010886461.9A
Authority: CN
Inventors: 酒井敏行; 上野勉; 西口朋宏
Original assignee: Mitsuboshi Diamond Industrial Co Ltd
Current assignee: Mitsuboshi Diamond Industrial Co Ltd
Priority date: 2019-09-25
Filing date: 2020-08-28
Publication date: 2021-03-26
Also published as: KR20210036255A; JP2021050121A; TW202112686A

Abstract

The invention relates to a stage and a cutting device, which restrain the deflection of a component for loading a substrate. A carrier (3, 3 ') on which a substrate (S) to be cut by three-point bending cutting is placed is provided with a frame (31, 31'), a placement member (33, 33 '), and a fixing member (35, 35'). The frame (31, 31') has an opening (O3). The mounting members (33, 33 ') are flexible and cover the openings (O3) of the frames (31, 31') to form a mounting table on which a substrate is mounted. The fixing members (35, 35 ') fix the ends of the mounting members (33, 33') to the frames (31, 31 ') in a state where the mounting members (33, 33') are stretched by a predetermined tensile force.

Description

Stage and cutting device

Technical Field

The present invention relates to a stage on which a substrate to be cut by three-point bending cutting is placed, and a cutting device provided with the stage.

Background

As a method of cutting a substrate such as glass, there is known "three-point bending cutting", that is: the substrate is supported at two points between which a scribe line formed on the substrate is sandwiched, and the substrate is cut by pressing the vicinity of a portion where the scribe line is formed. As a cutting device that cuts a substrate by three-point bending, there is known a device that cuts the substrate conveyed by a belt conveyor while the substrate is mounted on the belt conveyor (see, for example, patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2015-140289

Disclosure of Invention

Technical problem to be solved

In a device for three-point bending and cutting a substrate while being mounted on a belt conveyor, the belt conveyor may be bent at a portion where three-point bending and cutting are performed, and the three-point bending and cutting of the substrate may not be appropriately performed. For example, it is considered that the substrates after cutting are brought into contact with each other by the deflection of the belt conveyor, and the substrates after cutting are damaged.

The invention aims to restrain the bending of a component for loading a substrate when the substrate is cut by three-point bending cutting.

(II) technical scheme

A plurality of modes are described below as means for solving the above-described technical problems. These means may be combined arbitrarily as required.

A stage according to an aspect of the present invention is a stage on which a substrate to be cut by three-point bending cutting is placed. The stage includes a frame, a mounting member, and a fixing member. The frame has an opening. The mounting member is flexible and covers the opening of the frame to form a mounting table on which the substrate is mounted. The fixing member fixes the end of the mounting member to the frame in a state where the mounting member is stretched by a predetermined tensile force.

In the above-described stage, the mounting member serving as a mounting table on which the substrate is mounted is stretched and fixed to the frame with a predetermined tensile force in a state of covering the opening of the frame. That is, the flexible mounting member is configured to cover a limited space such as an opening provided in the frame. This can suppress the deflection of the mounting member in the region of the mounting table on which the substrate is mounted.

The frame may be circular. This makes it possible to uniformly apply a tensile force to the mounting member.

A cutting device according to another aspect of the present invention includes: a cutting unit and a stage. The cutting unit cuts the substrate by three-point bending cutting. The stage carries the substrate cut by the cutting unit.

A stage provided in a cutting device includes a frame, a mounting member, and a fixing member. The frame has an opening. The mounting member is flexible and covers the opening of the frame to form a mounting table on which the substrate is mounted. The fixing member fixes the end of the mounting member to the frame in a state where the mounting member is stretched by a predetermined tensile force.

In the stage provided in the cutting apparatus, the mounting member serving as the mounting table on which the substrate is mounted is stretched and fixed to the frame with a predetermined stretching force in a state of covering the opening of the frame. Thus, even if the mounting member has flexibility, the mounting member can be prevented from being bent in a limited space provided in the opening of the frame, that is, in a limited region where the substrate is mounted. As a result, the cutting device can cut the substrate appropriately by three-point bending cutting.

The cutting device may further include a holding portion. The holding unit detachably holds the stage. This makes it possible to carry out the mounting of the substrate on the stage at a position different from the installation position of the cutting device.

The holding unit may be capable of adjusting an installation angle of the stage. This enables the substrate to be cut in any direction.

(III) advantageous effects

The substrate mounted on the mounting member can be cut appropriately by three-point bending cutting while suppressing the flexure of the mounting member on which the substrate cut by three-point bending cutting is mounted.

Drawings

Fig. 1 is a plan view of a cutting device according to a first embodiment.

Fig. 2 is a sectional view taken along line a-a of the cutting apparatus of the first embodiment.

Fig. 3 is a sectional view of the stage of the first embodiment.

Fig. 4A is (a) a diagram schematically showing an example of an operation of three-point bending and cutting the substrate by the cutting apparatus according to the first embodiment.

Fig. 4B is a diagram schematically showing an example of the operation of three-point bending and cutting the substrate by the cutting apparatus according to the first embodiment (second diagram).

Fig. 4C is a view schematically showing an example of the operation of three-point bending and cutting the substrate by the cutting apparatus according to the first embodiment (third step).

Fig. 4D is a diagram schematically showing an example of the operation of three-point bending and cutting the substrate by the cutting apparatus according to the first embodiment (fourth step).

Fig. 4E is a diagram schematically showing an example of the operation of three-point bending and cutting the substrate by the cutting apparatus according to the first embodiment (fifth step).

Fig. 4F is a diagram schematically showing an example of the operation of three-point bending and cutting the substrate by the cutting apparatus according to the first embodiment (sixth embodiment).

Fig. 5 is a sectional view of the stage of the second embodiment.

Description of the reference numerals

100-a cutting device; 1-a cutting part; 11-a support member; 11 a-a support portion; 13-a pressing member; 3. a 3' -stage; 31. 31' -a frame; 31a, 31 a' -flange portion; 31b, 31 b' -fixing moiety; 31 c' -male member; o3-opening; 33. 33' -a mounting member; 35. 35' -a fixing member; 5-a holding section; 51-a recess; 53-a second gear; o1 — first receiving opening; 7-a mobile station; 71-a guide rail; 73-a rotation drive section; 73 a-first gear; 73 b-a drive section; o2-second receiving opening; 9-track; s-a substrate; s1 — a first substrate; SL1 — first scribe; s2-a second substrate; SL 2-second scribe.

Detailed Description

1. First embodiment

(1) Cutting device

The cutting apparatus 100 according to the first embodiment will be described below with reference to fig. 1 and 2. Fig. 1 is a plan view of a cutting device according to a first embodiment. Fig. 2 is a sectional view of the cutting device of the first embodiment taken along line a-a (fig. 1). In fig. 1 and 2, the height direction is set to the Z direction and indicated by an arrow. The horizontal direction perpendicular to the height direction (Z direction) is set as the X direction and indicated by an arrow.

The cutting apparatus 100 of the first embodiment is an apparatus for cutting the substrate S by "three-point bend cutting". Specifically, the cutting apparatus 100 supports the substrate S at two points between the scribe lines SL1 and SL2 (fig. 4) formed on the substrate S, and cuts the substrate S by pressing the vicinity of the portions where the scribe lines SL1 and SL2 are formed from the side opposite to the side where the scribe lines SL1 and SL2 are formed on the substrate S. The cutting apparatus 100 cuts the substrate S in a state where the substrate S to be cut is placed on the flexible placing member 33.

The cutting device 100 includes a cutting unit 1, a stage 3, and a holding unit 5.

As shown in fig. 2, in cutting device 100 of the first embodiment, a pair of cutting units 1 is provided in the Z direction with stage 3 interposed therebetween. On the other hand, the pair of cutting portions 1 are provided to face each other in the X direction.

The cutting unit 1 cuts the substrate S placed on the stage 3 (placing member 33) by three-point bending cutting. Specifically, the cutting section 1 includes a support member 11 and a pressing member 13.

The support members 11 are L-shaped members, for example, and a pair of the support members are provided with a predetermined gap therebetween in the X direction. The support member 11 is moved in the Z direction by a drive mechanism such as a fluid cylinder (not shown). When the support member 11 moves in the Z direction and approaches the substrate S, a portion of the L shape of the support member 11 extending in the X direction (referred to as a support portion 11a) abuts on the substrate S, and the substrate S can be supported by the support portion 11 a.

The pressing member 13 is, for example, a long plate-shaped cutting rod, and is provided between the pair of support members 11. The pressing member 13 is moved in the Z direction by a driving mechanism such as a fluid cylinder (not shown). That is, the pressing member 13 is movable in the Z direction between the pair of support members 11. The pressing member 13 moves in the Z direction while supporting the substrate S by the supporting portion 11a of the cutting portion 1 on the opposite side across the substrate S, and presses the substrate S, thereby cutting the substrate S.

The stage 3 mounts the substrate S cut by the cutting unit 1. In cutting apparatus 100 of the present embodiment, three-point bending cutting of substrate S is performed in a state where substrate S is mounted on stage 3. A specific configuration of stage 3 that enables three-point bending cutting of substrate S will be described in detail later.

The holding unit 5 detachably holds the stage 3. Specifically, holding unit 5 has first accommodation opening O1 capable of accommodating stage 3. As shown in fig. 2, holding unit 5 can hold stage 3 by abutting a flange portion 31a (described later) of stage 3 on its upper surface and housing the lower portion (mounting member 33) of stage 3 in first housing opening O1. On the other hand, by detaching the stage 3 accommodated in the first accommodation opening O1 from the first accommodation opening O1, the stage 3 can be detached from the holding portion 5.

By making the stage 3 detachable from the holding portion 5, the substrate S can be mounted on the stage 3 at a position away from the installation position of the cutting device 100, for example.

As shown in fig. 1 and 2, the cutting apparatus 100 includes a moving stage 7. The mobile station 7 holds the holding unit 5. The moving stage 7 is provided with a second housing opening O2 corresponding to the first housing opening O1 of the holding portion 5, and a guide rail 71 is provided along the second housing opening O2. The guide rail 71 is fitted into a recess 51, and the recess 51 is provided along the first housing opening O1 at the lower portion of the holding portion 5. Thereby, the holding portion 5 is held on the moving stage 7 in a state rotatable around the Z axis.

The moving stage 7 is provided with a rotation driving unit 73. The rotation driving unit 73 is a device for rotating the holding unit 5 about the Z axis, and includes, for example, a first gear 73a and a driving unit 73 b. The first gear 73a meshes with the second gear 53, and the second gear 53 is provided on the lower side surface of the holding portion 5. The driving portion 73b rotates the first gear 73 a. When the rotation driving unit 73 rotates the holding unit 5 about the Z axis, the holding unit 5 rotates the stage 3 accommodated in the first accommodation opening O1 about the Z axis. Thus, the holding unit 5 can adjust the installation angle of the stage 3.

By adjusting the installation angle of the stage 3, the substrate S can be cut in any direction.

The movable stage 7 is movable in the X direction along a pair of rails 9 arranged at a predetermined interval. Thereby, the moving stage 7 can move the substrate S mounted on the stage 3 in the X direction with respect to the cutting unit 1.

(2) Carrying platform

Next, the structure of stage 3 on which substrate S cut by three-point bending cutting is placed will be described with reference to fig. 3. Fig. 3 is a sectional view of the stage of the first embodiment. On the stage 3, the substrate S is placed on a placing member 33, and the placing member 33 is flexible and is in a state of being stretched by a predetermined stretching force.

Specifically, the stage 3 includes a frame 31, a placing member 33, and a fixing member 35. The frame 31 is an annular (circular) member having an opening O3. By forming the frame 31 in an annular shape, a tensile force can be uniformly applied to the mounting member 33 when the mounting member 33 is fixed to the frame 31. The frame 31 is an L-shaped member having a flange portion 31a and a fixing portion 31b, wherein the flange portion 31a abuts on the upper surface of the holding portion 5 when the stage 3 is held by the holding portion 5; the fixing portion 31b fixes the placement member 33.

The mounting member 33 is a sheet-like member made of a flexible material, for example. The mounting member 33 is a sheet made of urethane rubber, for example. The mounting member 33 covers the opening O3 in a state of being stretched by the fixing member 35 with a predetermined stretching force. The portion of the mounting member 33 covering the opening O3 forms a mounting table on which the substrate S is mounted.

The surface of the mounting member 33 has a concave-convex shape. Since the uneven shape on the surface of the mounting member 33 can reduce the contact area between the mounting member 33 and the substrate S, the substrate S can be easily moved on the mounting member 33 when three-point bending cutting is performed.

In the case where the mounting member 33 is made of a material having a small friction coefficient with respect to the contact with the substrate S, the surface of the mounting member 33 may not have a concave-convex shape.

The fixing member 35 fixes the end of the mounting member 33 to the frame 31 in a state where the mounting member 33 is stretched by a predetermined tensile force. The fixing member 35 is, for example, a tack such as a rivet, a bolt nut, a draw stud, or the like. When the fixing member 35 is a wire stud, the state of deflection of the mounting member 33 of the mounting table can be adjusted by adjusting the tensile force of the mounting member 33.

In stage 3 having the above-described configuration, mounting member 33 covers a limited space (a short distance) such as opening O3 provided in frame 31. Thus, even if the mounting member 33 has flexibility, the mounting member 33 can be prevented from flexing in the region of the mounting table on which the substrate S is mounted.

(3) Three-point bending cutting action of substrate

Hereinafter, the operation of performing three-point bending cutting of the substrate S mounted on the stage 3 by the cutting apparatus 100 of the first embodiment will be described with reference to fig. 4A to 4F. Fig. 4A to 4F are diagrams schematically showing an example of an operation of three-point bending and cutting the substrate by the cutting device according to the first embodiment. In fig. 4A to 4F, with the mounting member 33 as a reference, a side where the substrate S exists in the Z direction is defined as an upward direction, and a side where the opening O3 exists is defined as a downward direction.

In the following description, the substrate S is a substrate obtained by bonding the first substrate S1 and the second substrate S2. In the following description, an operation of cutting the substrate S along the first scribe line SL1 provided on the first substrate S1 and the second scribe line SL2 provided on the second substrate S2 by the cutting apparatus 100 will be described.

First, a first scribe line SL1 is formed on the first substrate S1 of the substrate S to be cut, a second scribe line SL2 is formed on the second substrate S2, and the substrate S is placed on the placing member 33 of the stage 3. Here, as shown in fig. 4A, the substrate S is placed such that the second substrate S2 faces downward.

Next, as shown in fig. 4A, the pair of supporting members 11 provided on the second substrate S2 side, that is, below, are brought close to the mounting member 33, and the substrate S is supported from the second substrate S2 side (lower side) by the pair of supporting members 11. At this time, the second scribe line SL2 exists between the pair of support members 11.

Thereafter, as shown in fig. 4B, in a state where the substrate S is supported from the lower side by the lower supporting member 11, the upper pressing member 13 is brought close to the substrate S, and the upper pressing member 13 is brought into contact with the first substrate S1. The pressing member 13 is further moved downward from the state of being in contact with the first substrate S1, and the second substrate S2 is cut along the second scribe line SL2 as shown in fig. 4C.

After the second substrate S2 is cut, as shown in fig. 4D, the pair of supporting members 11 provided on the first substrate S1 side, i.e., above, are brought close to the first substrate S1, and the substrate S is supported from the first substrate S1 side (upper side) by the pair of supporting members 11. At this time, the first scribe line SL1 exists between the pair of support members 11.

Thereafter, as shown in fig. 4E, in a state where the substrate S is supported from above by the upper support member 11, the lower pressing member 13 is brought close to the substrate S, and the lower pressing member 13 is brought into contact with the mounting member 33. The pressing member 13 is further moved upward from the state of being in contact with the placing member 33, and the first substrate S1 is cut along the first scribe line SL1 as shown in fig. 4F.

As described above, since the carrier member 33 is restrained from flexing at the stage 3, the carrier member 33 does not flex significantly when the substrate S is pressed by the pressing member 13 in order to cut the substrate S.

As a result, the problem of the cut substrate moving due to the deflection of the mounting member 33 can be suppressed, and the problem of the collision and damage of the two cut substrates can be suppressed.

2. Second embodiment

In the first embodiment described above, frame 31 of stage 3 is one member of an L-shape, but is not limited thereto. As shown in fig. 5, in stage 3 ' of the second embodiment, frame 31 ' is composed of flange 31a ', fixing portion 31b ', and convex member 31c '. Fig. 5 is a sectional view of the stage of the second embodiment. As shown in fig. 5, the flange portion 31a 'and the fixing portion 31 b' are formed as an L-shaped integral member as in the first embodiment. Like the flange 31a of the first embodiment, the flange 31a 'abuts against the upper surface of the holding portion 5 when the stage 3' is held by the holding portion 5. The center portion of the lower surface of the fixing portion 31 b' has a groove.

The male member 31c ' is, for example, a ring-shaped member corresponding to the concave groove of the fixing portion 31b ' (having the same diameter as the diameter of the concave groove), and has a male portion fitted into the concave groove of the fixing portion 31b '.

The mounting member 33 ' and the fixing member 35 ' of the stage 3 ' have the same configurations and functions as those of the mounting member 33 and the fixing member 35 of the first embodiment, respectively, and therefore, description thereof is omitted here.

In the stage 3 'of the second embodiment, the mounting member 33' is fixed to the frame 31 'by the fixing member 35' in a state of being sandwiched between the concave groove of the fixing portion 31b 'and the convex portion of the convex member 31 c'. More specifically, the placement member 33 ' is fixed to the frame 31 ' by the fixing member 35 ' in a state where the end portion thereof is pressed into the concave groove of the fixing portion 31b ' by the convex portion of the convex member 31c '.

By pressing the end of the mounting member 33 'into the concave groove of the fixing portion 31 b' by the convex member 31c ', the tensile force can be applied to the portion of the mounting member 33' constituting the mounting table more reliably.

3. Common matters of the embodiments

The first and second embodiments described above have the following configurations and functions in the same manner.

The stage (for example, stages 3 and 3') is a stage on which a substrate (for example, substrate S) cut by three-point bending cutting is placed. The stage is provided with: a frame (e.g., frames 31, 31 '), a mounting member (e.g., mounting members 33, 33 '), and a fixing member (e.g., fixing

members

35, 35 '). The frame has an opening (e.g., opening O3). The mounting member is flexible and covers the opening of the frame to form a mounting table on which the substrate is mounted. The fixing member fixes the end of the mounting member to the frame in a state where the mounting member is stretched by a predetermined tensile force.

4. Other embodiments

While the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. In particular, the plurality of embodiments and modifications described in the present specification can be combined as desired.

(A) In the first and second embodiments described above, the first gear 73a and the second gear 53 are gears having a plurality of teeth. However, the present invention is not limited to this, and the first gear 73a and the second gear 53 may be sprockets. In this case, the first gear 73a and the second gear 53 are coupled via a chain.

(B) In the first and second embodiments, the frames 31 and 31 ' are circular, and the frames 31 and 31 ' may have any shape as long as the tensile force can be appropriately applied to the mounting members 33 and 33 '.

(C) In the first and second embodiments described above, the second gear 53 of the holding portion 5 is provided along the entire circumference of the holding portion 5, but the present invention is not limited thereto, and the second gear 53 may be provided only in a part of the circumference of the holding portion 5. For example, the second gear 53 may be provided only at 1/4 cycles (center angle: 90 degrees) of the holding portion 5.

Industrial applicability

The present invention can be widely applied to a device for cutting a substrate by three-point bending cutting.

Claims

1. A stage on which a substrate cut by three-point bending cutting is placed,

the stage includes:

a frame having an opening;

a flexible mounting member that covers the opening and forms a mounting table on which the substrate is mounted; and

and a fixing member that fixes an end of the mounting member to the frame in a state where the mounting member is stretched by a predetermined tensile force.

2. The carrier as recited in claim 1,

the frame is circular.

3. A cutting device is provided with:

a cutting unit that cuts the substrate by three-point bending cutting; and

a stage on which the substrate cut by the cutting unit is placed,

the stage includes:

a frame having an opening;

4. The cutoff device according to claim 3,

the stage is further provided with a holding unit that detachably holds the stage.

5. The cutoff device according to claim 4,

the holding portion can adjust an installation angle of the stage.