CN112541319A - Low-temperature expansion design method for ten-gigabit wavelength division module - Google Patents
Low-temperature expansion design method for ten-gigabit wavelength division module Download PDFInfo
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- CN112541319A CN112541319A CN202011435489.7A CN202011435489A CN112541319A CN 112541319 A CN112541319 A CN 112541319A CN 202011435489 A CN202011435489 A CN 202011435489A CN 112541319 A CN112541319 A CN 112541319A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
Abstract
The invention discloses a low-temperature expansion design method of a ten-gigabit wavelength division module, which comprises the following steps: s1, firstly, a control circuit is designed on an optical module hard board and consists of a bias resistor, a thermistor and a switch triode, wherein the resistance value of the thermistor changes along with the working temperature of the optical module, the resistance value of the thermistor is increased at low temperature, the control voltage of the switch triode is increased along with the increase of the resistance value of the thermistor, the control voltage reaches a set threshold value TO control the conduction of the triode, a power heating resistor is electrified and heated, the heat generated by the power heating resistor is conducted TO a close-contact TO base through a soft board, the temperature of a laser working at low temperature is compensated through the TO base, the working temperature of the laser working at low temperature is improved, and the photoelectric index of the; s2, welding and connecting the common laser component without TEC control through one end of a high-speed soft board with a heating compensation resistor, ensuring the shortest connection of the TO pins and reducing the high-frequency inductance of the lead.
Description
Technical Field
The invention relates to the technical field of 4G LTE and 5G fronthaul system application and industrial automation control, in particular to a low-temperature expansion design method for a gigabit wavelength division module.
Background
In recent years, networks and service applications such as cloud computing, internet of things, mobile internet and the like have emerged, high bandwidth and bearing requirements are provided for a transmission network at the bottom layer, particularly higher requirements are provided for the bandwidth, service fast providing, network flexibility and the like of the network, a gigabit color light module (CWDM wavelength division) is required for 4G LTE and 5G fronthaul to support large-bandwidth services, the working wavelength is expanded from an O band to a C band, the optical power and sensitivity index requirements of the optical module are high, the optical fiber passing distance is long, the temperature requirement of a common application working environment meets 0-70 ℃, and the temperature requirement of a special application working environment meets industrial-40-85 ℃.
At present, the commercial grade is taken as the main part of the multi-color light module for mass shipment, the temperature of the working environment is required to be 0-70 ℃, the transmission distance is 10-15 KM, and the requirement of conventional market application can be completely met, but the environment temperature is required to be expanded to the industrial grade of-40-85 ℃ in industrial control, military application and other special applications. The existing batch commercial-grade products can be expanded to 85 ℃ by improving the high temperature of a heat dissipation structure to meet index requirements, but the long wavelength of the C wave band is influenced by chirp of a laser at a low temperature, the index of a photoelectric eye diagram before fiber passing is qualified in a working environment of-40 ℃, the chromatic dispersion after fiber passing is serious, and the index cannot meet the transmission application of 10KM, the problem of fiber passing chromatic dispersion of a long-wavelength optical module of the C wave band at the ambient temperature of-40 ℃ is solved, the transmission distance and the engineering application are ensured, the conventional method is that TEC control is added to the laser, the real-time working temperature of the optical module is monitored and fed back to a TEC control circuit, the working environment of the laser of the optical module is subjected to constant temperature control, the stable working of the laser at the optimal temperature point is ensured, the TEC is also added to be required to be driven by the TEC, the working power consumption of, the overall operating power consumption of the optical mode will also increase.
Disclosure of Invention
The invention aims to provide a low-temperature expansion design method of a ten-gigabit wavelength division module, which aims to solve the problem of fiber dispersion of a long-wavelength optical module in a C-band at-40 ℃ environmental temperature and ensure transmission distance and engineering application in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a low-temperature expansion design method of a ten-gigabit wavelength division module comprises the following steps:
s1, firstly, a control circuit is designed on an optical module hard board and comprises a bias resistor, a thermistor and a switch triode, wherein the resistance value of the thermistor changes along with the working temperature of the optical module, the resistance value of the thermistor increases at low temperature, the control voltage of the switch triode rises along with the increase of the resistance value of the thermistor, the control voltage reaches a set threshold value TO control the conduction of the triode, a power heating resistor is electrified and heated, the heat generated by the power heating resistor is conducted TO a close-contact TO base through the soft board, the temperature of a laser working at low temperature is compensated through the TO base, the working temperature of the laser working at low temperature is improved, and the photoelectric index of the optical module working.
S2, welding and connecting the common laser component without TEC control through one end of a high-speed soft board with a heating compensation resistor, ensuring the shortest connection of the pins of TO, reducing the high-frequency inductance of a lead wire, ensuring the integrity of high-speed signals, meanwhile, welding a heating resistor on a coupling ground plane of a microstrip circuit, not influencing the integrity of the high-speed signals, designing a green oil window at the position corresponding TO the resistor, coating heat-conducting glue after welding and assembling, ensuring the reliable heat conduction, realizing the switch state control of the switch tube Q1 by dividing the voltage of the resistor R1 and the thermistor R2, wherein R2 is a negative temperature coefficient thermistor, the resistance value of the resistor is increased along with the reduction of the temperature, and the control voltage corresponding TO the control pin Q1 is gradually increased along with the increase of the.
And S3, finally, when the temperature is reduced to the set temperature point, the Q1 switching tube is conducted to supply power to the heating resistor. The heating resistor works to generate heat, the temperature of the laser working in the low-temperature environment is supplemented through heat conduction, the working performance in the laser low-temperature environment is guaranteed, and the low-temperature working window of the color light module is expanded.
Preferably, the integrated circuit chip is a GN1157 chip, the highest working speed of the channel can reach 11.3Gbps, the auxiliary heating circuit switch tube is a small-package voltage control type field effect transistor, the thermistor is a negative temperature coefficient thermistor NTC with the resistance value of 10K, and the heating resistor is a 0.3W small-package patch power resistor.
Preferably, the hard board design adds heating compensation temperature control thermistor, bias matching resistance and switch triode on original design basis, and the soft board design places heating power resistance on the coupling ground that is close to TOSA end, and the green oil windowing in resistance bottom position increases the contact compactness.
Preferably, the optical device adopts a conventional wavelength division laser component, and the shell structure is compatible with common products.
Compared with the prior art, the invention has the beneficial effects that:
the laser component has the advantages of simple packaging process, high production efficiency and yield, low material cost, high cost performance, good universality, simple temperature compensation circuit in the low-temperature environment of the laser, low material cost, pure hardware control and high reliability, the temperature compensation circuit works in a direct current mode, interference signals generated by high-frequency oscillation of a TEC controller are avoided, the power consumption is low, and the integral signal integrity and the power integrity of a product are not influenced.
The temperature compensation circuit is simple, few in used components, small in occupied PCB layout space and beneficial TO miniaturization design of an optical module, the heating power resistor of the temperature compensation circuit is welded on the soft board close TO the TO end, heating does not affect a PCB hard board, the problem that a TEC control chip needs TO consider heat dissipation is avoided, and the shell compatibility is good.
Drawings
FIG. 1 is a schematic diagram of a resistive heating compensation structure according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a resistive heating compensation circuit according to a first embodiment of the present invention;
fig. 3 is a schematic diagram of a TO control optical assembly with a TEC according TO a second embodiment of the present invention;
fig. 4 is a schematic view of a TEC constant temperature assembly structure according to a second embodiment of the present invention.
In the figure: 1. an optical component pin; 2. a TO base; 3. a TO pipe cap; 4. a TEC refrigerator; 5. a ball lens; 6. a laser chip; 7. a thermistor; 8. connecting the flexible board at a high speed; 9. a TEC control pin; 10. the control TOSA is provided with the TEC; 11. a heating resistor; 12. a common TOSA.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1-2, a design method of a low temperature expansion of a gigabit wavelength division module includes the following steps:
s1, firstly, a control circuit is designed on an optical module hard board and consists of a bias resistor, a thermistor and a switch triode, wherein the resistance value of the thermistor changes along with the working temperature of the optical module, the resistance value of the thermistor increases at low temperature, the control voltage of the switch triode rises along with the increase of the resistance value of the thermistor, the control voltage reaches a set threshold value TO control the conduction of the triode, a power heating resistor is electrified and heated, the heat generated by the power heating resistor is conducted TO a close-contact TO base through the soft board, the temperature of a laser working at low temperature is compensated through the TO base, the working temperature of the laser in a low-temperature environment is improved, the working photoelectric index of the optical module at low temperature is ensured, a temperature compensation circuit is simple, few used components are used, the space occupied by.
S2, welding and connecting the common laser component without TEC control by one end of a high-speed soft board with a heating compensation resistor, ensuring the shortest connection of the pins of TO, reducing the high-frequency inductance of the lead wire, ensuring the integrity of high-speed signals, meanwhile, the heating resistor is welded on the coupling ground plane of the microstrip circuit, the integrity of the high-speed signal is not influenced, the design of windowing in green oil at the corresponding position of the resistor, coating heat-conducting glue after welding and assembling to ensure reliable heat conduction, realizing the switch state control of the switch tube Q1 by dividing the voltage of the resistor R1 and the thermistor R2, wherein the resistor R2 is a negative temperature coefficient thermistor, the resistance value of the resistor is increased along with the reduction of the temperature, the control voltage corresponding TO the control pin Q1 is gradually increased along with the increase of the resistance value of the resistor, the heating power resistor of the temperature compensation circuit is welded at the end, close TO the TO end, of the flexible board, the heating power resistor does not influence the hard PCB, the problem that the heat dissipation of the TEC control chip needs TO be considered is avoided, and the shell compatibility is good.
And S3, finally, when the temperature is reduced to the set temperature point, the Q1 switching tube is conducted to supply power to the heating resistor. The heating resistor works to generate heat, the temperature of the laser working in the low-temperature environment is supplemented through heat conduction, the working performance in the laser low-temperature environment is guaranteed, and the low-temperature working window of the color light module is expanded.
In this embodiment: the integrated circuit chip adopts a GN1157 chip, the highest working speed of a channel can reach 11.3Gbps, the auxiliary heating circuit switch tube adopts a small-package voltage control type field effect transistor, the thermistor adopts a negative temperature coefficient thermistor NTC with the resistance value of 10K, the heating resistor adopts a 0.3W small-package patch power resistor, the transmitting end of the chip has a pre-emphasis function, the receiving end of the chip has a balancing function, the temperature compensation circuit works in a direct current mode, interference signals generated by high-frequency oscillation of a TEC controller are avoided, the power consumption is low, and the integral signal integrity and the power integrity of a product are not influenced.
In this embodiment: the hard board design adds heating compensation temperature control thermistor, biasing matching resistor and switch triode on original design basis, and the heating power resistance is placed on the coupling ground that is close to TOSA end to the soft board design, and the green oil windowing in resistance bottom position increases the contact compactness, can effectually reduce the thermal resistance, and the temperature compensation circuit under the laser low temperature environment is simple, and material cost is low, pure hardware control, and the reliability is high.
In this embodiment: the optical device adopts a conventional wavelength division laser assembly, the shell structure is compatible with a common product, on the basis of an original color light module, on the premise of not changing the laser assembly, a power heating resistor is additionally arranged on a connecting soft board of the laser assembly and the optical module, the starting heating at low temperature is realized to supplement the working temperature of the laser through the threshold circuit control, the heating is automatically closed at high temperature, and the low-temperature working performance of the whole optical module is improved.
Example two:
referring to fig. 3-4, a difference from the first embodiment is that the design method of the low temperature expansion of a gigabit wavelength division module of the present embodiment includes the following steps:
s1, firstly, the laser is pasted on a TEC (semiconductor cooler), the TEC is pasted on a TO base, the thermistor is pasted near the TEC, the working temperature of the laser in the normal working process is collected through the thermistor in an induction mode, and collected temperature information is fed back TO a TEC controller circuit.
S2, controlling the working current of the TEC refrigerating sheet by the TEC controller through a PID software algorithm, and dynamically approaching the target temperature to achieve the aim that the laser works in a constant temperature state.
And S3, finally, welding and connecting the laser assembly with the TEC through one end of a high-speed soft board, ensuring the shortest connection of the pins of the TO, reducing the high-frequency inductance of the lead and ensuring the integrity of high-speed signals.
To sum up: compared with the second embodiment, the first embodiment has the advantages of simpler packaging process of the laser assembly, higher production efficiency and yield, lower material cost, higher cost performance, better universality of the laser assembly, simpler temperature compensation circuit of the laser in a low-temperature environment, lower material cost and pure hardware control, the reliability is higher, the temperature compensation circuit works in a direct current mode, interference signals generated by high-frequency oscillation of the TEC controller are avoided, the power consumption is low, the integral signal integrity and the power integrity of the product are not influenced, the temperature compensation circuit is simple, meanwhile, fewer components are used, the occupied space of the PCB is smaller, the miniaturization design of the optical module is facilitated, the heating power resistor of the temperature compensation circuit is welded at the end, close TO the TO, of the soft board, the heating power resistor does not influence the hard PCB, the problem that the heat dissipation of the TEC control chip needs TO be considered is avoided, and the shell compatibility is better.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A low-temperature expansion design method of a ten-gigabit wavelength division module is characterized by comprising the following steps: the design method comprises the following steps:
s1, firstly, a control circuit is designed on an optical module hard board and consists of a bias resistor, a thermistor and a switch triode, wherein the resistance value of the thermistor changes along with the working temperature of the optical module, the resistance value of the thermistor is increased at low temperature, the control voltage of the switch triode is increased along with the increase of the resistance value of the thermistor, the control voltage reaches a set threshold value TO control the conduction of the triode, a power heating resistor is electrified and heated, the heat generated by the power heating resistor is conducted TO a close-contact TO base through a soft board, the temperature of a laser working at low temperature is compensated through the TO base, the working temperature of the laser working at low temperature is improved, and the photoelectric index of the;
s2, welding and connecting the common laser component without TEC control through one end of a high-speed soft board with a heating compensation resistor, ensuring the shortest connection of the pins of TO, reducing the high-frequency inductance of a lead wire, ensuring the integrity of high-speed signals, meanwhile, welding a heating resistor on a coupling ground plane of a microstrip circuit, not influencing the integrity of the high-speed signals, designing a green oil window at the corresponding position of the resistor, coating heat-conducting glue after welding and assembling, ensuring the reliable heat conduction, realizing the switch state control of a switch tube Q1 by dividing the voltage of a resistor R1 and a thermistor R2, wherein R2 is a negative temperature coefficient thermistor, the resistance value of the resistor is increased along with the reduction of the temperature, and the control voltage corresponding TO a control pin Q1 is gradually increased along with the increase of the;
and S3, finally, when the temperature is reduced to the set temperature point, the Q1 switching tube is conducted to supply power to the heating resistor. The heating resistor works to generate heat, the temperature of the laser working in the low-temperature environment is supplemented through heat conduction, the working performance in the laser low-temperature environment is guaranteed, and the low-temperature working window of the color light module is expanded.
2. The design method of low temperature expansion of a gigabit wavelength division module according to claim 1, wherein: the integrated circuit chip adopts GN1157 chip, the highest working speed of the channel can reach 11.3Gbps, the auxiliary heating circuit switch tube adopts a small-package voltage control type field effect transistor, the thermistor adopts a negative temperature coefficient thermistor NTC with the resistance value of 10K, and the heating resistor adopts a 0.3W small-package patch power resistor.
3. The design method of low temperature expansion of a gigabit wavelength division module according to claim 1, wherein: the hard board design adds heating compensation temperature control thermistor, biasing matching resistor and switch triode on original design basis, and the soft board design places heating power resistance on the coupling ground that is close to TOSA end, and the green oil windowing in resistance bottom position increases the contact compactness.
4. The design method of low temperature expansion of a gigabit wavelength division module according to claim 1, wherein: the optical device adopts a conventional wavelength division laser component, and the shell structure is compatible with a common product.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113960727A (en) * | 2021-09-13 | 2022-01-21 | 江苏奥雷光电有限公司 | Optical device with temperature rising function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113960727A (en) * | 2021-09-13 | 2022-01-21 | 江苏奥雷光电有限公司 | Optical device with temperature rising function |
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