CN112530652A - 一种小体积温度传感器制作方法 - Google Patents
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Abstract
本发明公开了一种小体积温度传感器制作方法,其特征在于,该方法包括以下步骤:步骤一、制备电阻银片:称取一定量Mn3O4、Fe2O3、Ni2O3、CuO、SiO原料混合,将混合后的原料通过去离子水、球磨、喷雾造粒、压片、高温烧结制成方锭,将方锭切成薄片,对切成的薄片进行丝网印刷,印刷完成后将薄片烧银制成电阻银片;步骤二、引线成型:选取一定规格的铜丝,裁成长度相等的直引线,将铜丝通过焊接从电阻银片中银层两边电极引出;步骤三、主体包装:将步骤二中的成型体在环氧树脂包封机中包封,放入烘箱中固化,取下电阻老化,测量后包装,解决热敏电阻使用过程因体积大影响反应速度问题,制作过程繁琐等问题。
Description
技术领域
本发明涉及电子元件制作工艺技术领域,具体为一种小体积温度传感器制作方法。
背景技术
温度传感器应用极为广泛,工业领域,家电领域,其它领域,气象,水产、养殖等等,温度传感器常见装配要求,要体积小,灵敏度高,仍需要性价比高,目前产品竞争激烈,制造端在满足要求下,如何提升产品性价比。
热敏电阻封装形式通常分为玻璃封装,环氧封装,成型珠状,玻璃封装可以耐高温,体积不易控制,直接成型珠状,烧结温度范围为1250-1300℃,烧结温度高需要采取铂丝。铂丝价格高,产品价值空间小,体积一致性差,其中不足:
1.玻璃封装阻体,体积一致好,耐高温,小尺寸不易控制,价格高;
2珠状成型,铂丝价格高,体积一致性控制差阻体椭圆,不圆润,生产周期长。
发明内容
本发明的目的提高生产率,降低成本,达成一种负温度系数传感器使用要求,在不改变温度传感器特性为实现上述目的,本发明的技术解决问题是:克服现有技术的不足,提供一种负温度系数珠状热敏电阻外形圆润,体积相等电阻的制备方法,解决热敏电阻使用过程因体积大影响反应速度问题,制作过程繁琐等问题。
为解决上述技术问题,本发明采用的技术方案是:一种小体积温度传感器制作方法,该方法包括以下步骤:
步骤一、制备电阻银片:
称取一定量Mn3O4、Fe2O3、Ni2O3、CuO、SiO原料混合,将混合后的原料通过去离子水、球磨、喷雾造粒、压片、高温烧结制成方锭,将方锭切成薄片,对切成的薄片进行丝网印刷,印刷完成后将薄片烧银制成电阻银片;
步骤二、引线成型:
选取一定规格的铜丝,裁成长度相等的直引线,将铜丝通过焊接从电阻银片中银层两边电极引出;
步骤三、主体包装:
将步骤二中的成型体在环氧树脂包封机中包封,放入烘箱中固化,取下电阻老化,测量后包装。
进一步地,所述步骤1高温烧结的温度在750~850℃之间。
进一步地,所述步骤1球磨时通过350-400转/分行星球磨机,球磨时间为10~14小时之间。
进一步地,所述喷雾造粒过程中通过粘和剂进行粘和,原料粉末与粘和剂的比例为100:15~20进行混合。
进一步地,所述方锭在切片时切成0.2~0.25mm厚度的薄片。
与现有技术相比,本发明的有益效果如下:
1、本发明采用高精密点焊机引出电极,操作便捷,不影响各项性能对比,铂丝点珠降低成本,缩短生产周期。
2、本发明采用树脂胶包封,使阻体圆润,体积相等,测试安装方便。
附图说明
图1为本发明一种小体积温度传感器制作方法中小体积温度传感器的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例,基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
根据本发明的一实施方式结合图1示出,一种小体积温度传感器制作方法,该方法包括以下步骤:
步骤一、制备电阻银片:
称取一定量Mn3O4、Fe2O3、Ni2O3、CuO、SiO原料混合,将混合后的原料通过去离子水、球磨、喷雾造粒、压片、高温烧结制成方锭,将方锭切成薄片,对切成的薄片进行丝网印刷,印刷完成后将薄片烧银制成电阻银片,分别选取Mn3O461.5克,Fe2O3100.02克,Ni2O3,139.5克,CuO149克,SiO4.5克原料;
步骤二、引线成型:
选取一定规格的铜丝,裁成长度相等的直引线,将铜丝通过焊接从电阻银片中银层两边电极引出,铜丝选用康铜丝;
步骤三、主体包装:
将步骤二中的成型体在环氧树脂包封机中包封,放入烘箱中固化,取下电阻老化,测量后包装。
步骤1高温烧结的温度在750~850℃之间,可将步骤一的金属原料融化进行浇筑成型,步骤1球磨时通过350~400转/分行星球磨机,球磨时间为10~14小时之间,以此将步骤一的金属原料进行研磨,使研磨更加精细,喷雾造粒过程中通过粘和剂进行粘和,原料粉末与粘和剂的比例为100:15~20进行混合,方锭在切片时切成0.2~0.25mm厚度的薄片,切成一定规格的薄片,在进行制造时易于进行印刷镀银。
具体实施例:在进行传感器制造时,首先称取Mn3O461.5克,Fe2O3100.02克,Ni2O3,139.5克,CuO149克,SiO4.5克原料,通过行星球磨机进行一次球磨,并对球磨后的粉料进行烘干;
预烧、过筛:把烘干的粉料装进匣钵,室温放置4h在750~850℃温度下预烧2h,随炉冷却,预烧后的粉体过30~40目筛,装入加盖容器或塑料袋内备用;
二次球磨、干燥:浆料配比按粉料:水:分散剂=1:1:0.1,在350~400转/分行星球磨机球磨10~14小时,过100~120目不锈钢筛网出料,把浆料倒入干净瓷盘,放进150±20℃烘箱烘干;
造粒:按粉料:粘合剂为100:15~20混合,搅拌均匀后过40~150目不锈钢筛网造粒;
成型:将造粒好的粉料倒入Ф44±1mm的模具中,在预压5~10Mpa停留数秒后,缓慢加压至255Mpa成型,加压至180Mpa进行等静压成型,厚度10±0.5mm;
烧结:排胶随炉冷却;
切片:将烧结好的方锭切成0.2~0.25mm厚度的薄片;
制电极:把烧结后瓷片放在40*40承载板上,用28*28或30.3*30.3丝网进行印刷;烘银窑温度控制在320~380℃之间,烘银窑调速电机电压指示为16±4V,制作后的电机银片要求银面光滑,无漏银、缺印、流边等缺陷,缺印最大直径不超过1mm,银层与瓷片边缘的距离应保留0.5mm以上的留边量,烧银,敏化;
划片:将符合要求的银片划片尺寸0.32mm*0.2mm;
将银片剥离出来,放入盛有无水乙醇玻璃小容器内,使用超声波设备清洗,将银片取出晾干,放入干燥的容器内。
选取0.07mm康铜丝,在精密裁线机上裁成长度相等的直引线,用弯脚镊子夹住银片,引线置于银片中间,通过显微镜放大投视到显示屏上,减少疲惫感,使用高精密焊接机焊接提高准确率,设定好焊接时间,焊接电压,将银层两边电极引出。
将焊接好的电阻体,按同一方向使用美纹胶带贴在治具上,严格控制对齐尺寸,使用高温树脂胶,在包封机中包封,放入烘箱中固化,固化完成后放入120-130℃烘箱中保温4-6天,待取出测量后包装。
其中包封胶需要严格控制配制比例,需要配比均匀倒入治具中,控制胶面高度小于1mm,使阻体缓慢进入树脂液体中,形成圆形后,提出电阻体,使包封圆润。
包装采取尺寸小封口袋,为提高产品耐用性,在测试时将两根引线分开后装入袋中
本发明优选了便捷工艺流程,满足使用条件,并提高产品产出率,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明采用精密点焊机引出电极,使用高温树脂胶包封,发挥了精密点焊机效率,保证了热敏电阻对珠状成型大小一致性的要求,与现有点珠工艺比,具有显著的进步。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点,对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明;因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内,不应将权利要求中的任何附图标记视为限制所涉及的权利要求。
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。
Claims (5)
1.一种小体积温度传感器制作方法,其特征在于,该方法包括以下步骤:
步骤一、制备电阻银片:
(1)称取一定量Mn3O4、Fe2O3、Ni2O3、CuO、SiO原料混合,
(2)将混合后的原料制成方锭,
(3)将方锭切成薄片,对切成的薄片进行印刷,印刷完成后将薄片烧银制成电阻银片;
步骤二、引线成型:
选取一定规格的铜丝,裁成直引线,将铜丝从电阻银片中银层两边电极引出;
步骤三、主体包装:
将步骤二中的成型体在环氧树脂包封机中包封,放入烘箱中固化,取下电阻老化,测量后包装。
2.根据权利要求1所述的一种小体积温度传感器制作方法,其特征在于:所述步骤1高温烧结的温度在750~850℃之间。
3.根据权利要求1所述的一种小体积温度传感器制作方法,其特征在于:所述步骤1球磨时通过350-400转/分行星球磨机,球磨时间为10~14小时之间。
4.根据权利要求1所述的一种小体积温度传感器制作方法,其特征在于:所述喷雾造粒过程中通过粘和剂进行粘和,原料粉末与粘和剂的比例为100:15~20进行混合。
5.根据权利要求1所述的一种小体积温度传感器制作方法,其特征在于:所述方锭在切片时切成0.2~0.25mm厚度的薄片。
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CN106448973A (zh) * | 2016-08-18 | 2017-02-22 | 陆川县华鑫电子厂 | 一种负温度系数ntc热敏电阻器及其制备方法 |
CN109133901A (zh) * | 2018-10-29 | 2019-01-04 | 惠州嘉科实业有限公司 | 含铁系热敏电阻及其制备方法 |
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2020
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Publication number | Priority date | Publication date | Assignee | Title |
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GB794058A (en) * | 1954-10-21 | 1958-04-30 | Cie Ind Des Ceramiques Electro | Improvements in thermistors and processes of manufacturing same |
CN106448973A (zh) * | 2016-08-18 | 2017-02-22 | 陆川县华鑫电子厂 | 一种负温度系数ntc热敏电阻器及其制备方法 |
CN109133901A (zh) * | 2018-10-29 | 2019-01-04 | 惠州嘉科实业有限公司 | 含铁系热敏电阻及其制备方法 |
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