CN112519337B - 沿厚度方向具有超高导热系数的导热性片材 - Google Patents

沿厚度方向具有超高导热系数的导热性片材 Download PDF

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CN112519337B
CN112519337B CN202011220241.9A CN202011220241A CN112519337B CN 112519337 B CN112519337 B CN 112519337B CN 202011220241 A CN202011220241 A CN 202011220241A CN 112519337 B CN112519337 B CN 112519337B
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高文廷
范勇
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Shanghai Allied Industrial Co ltd
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Abstract

本发明涉及材料领域，沿厚度方向具有超高导热系数的导热性片材，包括呈片状的导热片，所述导热片包括位于竖直方向上的导热片层，各导热片层并排排布，相邻的两片导热片层之间是将导热片层粘合在一起的粘合树脂所形成的粘合树脂层。本发明通过对石墨片、石墨烯片等导热片层的有序化排列，使导热片沿厚度方向的导热系数可达50W/m·K以上，远远高于常规的导热界面材料；此外，通过导热片层和粘合树脂基体的复合，赋予导热片较低的界面热阻和沿厚度方向良好的回弹性，解决了石墨片、石墨烯片等导热片层无法应用到填充缝隙场合的难题。

Description

沿厚度方向具有超高导热系数的导热性片材
技术领域
本发明涉及材料领域，尤其涉及导热材料。
背景技术
随着科学技术的发展，各类电子产品向微型化、集成化、密集化的方向发展，与此同时，在高性能、高效率的驱动下，电子设备的工作频率急速增加，导致产生的热量迅速积累和增加，如果这些热量不能及时排出，长时间的高温导致电子设备的各种问题，影响电子设备的正常运行甚至使用寿命。根据行业经验，电子设备运行时，温度每升高10℃，则会使得其可靠性能降低50％，目前55％以上的电子设备失效是由热管理系统出现问题引起的。因此，改善电子设备的热管理系统越来越成为技术关键。传统的电子设备中，热量通过散热器导出，但热量聚集不仅与发热电子元件和散热器有关，还与发热电子元件和散热器的界面间的接触热阻有关，发热电子元件和散热器之间的微小间隙几乎被空气占据，严重影响热量传递。
发明内容
本发明的目的在于提供一种沿厚度方向具有超高导热系数的导热性片材，以解决上述问题。
本发明所解决的技术问题可以采用以下技术方案来实现：
沿厚度方向具有超高导热系数的导热性片材，包括呈片状的导热片，其特征在于，所述导热片包括位于竖直方向上的导热片层，各导热片层并排排布，相邻的两片导热片层之间是将导热片层粘合在一起的粘合树脂所形成的粘合树脂层。
优选，位于同一个导热片内的各所述导热片层的体积之和为所在的所述导热片的体积的30％-80％。
优选，所述导热片的厚度为0.3mm-2mm。
优选，所述导热片层为石墨片、石墨烯片、碳纤维布、铝箔、铜箔中的至少一种。
进一步优选，所述导热片层的厚度为10μm-150μm。
优选，所述粘合树脂层为聚有机硅氧烷、环氧树脂、聚氨酯、丙烯酸树脂中的任意一种。
优选，所述粘合树脂层中添加有导热粒子。
进一步优选，所述导热粒子为氮化铝、氮化硼、氮化硅、碳化硅、氧化铝、氧化锌、铝粉、银粉、石墨粉、石墨烯、碳纤维中的至少一种。
优选，所述导热片的外表面上复合有导热膜。
进一步优选，所述导热膜的厚度为100μm-300μm。
有益效果：本发明通过对石墨片、石墨烯片等导热片层的有序化排列，使导热片沿厚度方向的导热系数可达50W/m·K以上，远远高于常规的导热界面材料；此外，通过导热片层和粘合树脂基体的复合，赋予导热片较低的界面热阻和沿厚度方向良好的回弹性，解决了石墨片、石墨烯片等导热片层无法应用到填充缝隙场合的难题。
具体实施方式
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解，下面进一步阐述本发明。
具体实施例1
沿厚度方向具有超高导热系数的导热性片材，包括呈片状的导热片，所述导热片包括位于竖直方向上的导热片层，各导热片层并排排布，相邻的两片导热片层之间是将导热片层粘合在一起的粘合树脂所形成的粘合树脂层。
具体实施例2
沿厚度方向具有超高导热系数的导热性片材，包括呈片状的导热片，所述导热片的外表面上复合有导热膜。所述导热膜的厚度为100μm-300μm。所述导热片包括位于竖直方向上的导热片层，各导热片层并排排布，相邻的两片导热片层之间是将导热片层粘合在一起的粘合树脂所形成的粘合树脂层。
具体实施例3
沿厚度方向具有超高导热系数的导热性片材，包括呈片状的导热片，所述导热片的侧壁的外表面上、所述导热片的底上复合有导热膜。所述导热膜呈开口朝上的槽状。所述导热片包括位于竖直方向上的导热片层，各导热片层并排排布，相邻的两片导热片层之间是将导热片层粘合在一起的粘合树脂所形成的粘合树脂层。所述粘合树脂层中还可以添加有未固化的热固化材料颗粒。这样在安装的时候，利用未固化的热固化材料颗粒的流动性，允许导热片材的发生形变，在安装到位后，随着导热的进行，未固化的热固化材料再逐渐固化。该结构可以有效保证结合界面的密封性并可以适应不规则的结合界面。
具体实施例4
具体实施例4与上述各实施例的不同之处在于，所述导热片层的厚度自上而下逐渐增大，上述各实施例中导热片层的厚度是上下一致的。本实施例的导热片层的底部相互抵在一起。从而使底部更为紧密，导热性能更好。而且上小下大的结构使得导热片层的支撑力更强。可以在导热片层的侧壁上设有延伸方向为树脂方向的贯穿的通孔或开口朝外的凹槽，通孔和凹槽内填充有粘合树脂。从而提高导热片层和粘合树脂之间的粘合牢固性。
上述各实施例中，位于同一个导热片内的各所述导热片层的体积之和优选为所在的所述导热片的体积的30％-80％。所述导热片的厚度优选为0.3mm-2mm。所述导热片层优选为石墨片、石墨烯片、碳纤维布、铝箔、铜箔中的至少一种。所述导热片层的厚度优选为10μm-150μm。所述粘合树脂层优选为聚有机硅氧烷、环氧树脂、聚氨酯、丙烯酸树脂中的任意一种。
上述各实施例中，所述粘合树脂层中还可以添加有导热粒子。所述导热粒子优选为氮化铝、氮化硼、氮化硅、碳化硅、氧化铝、氧化锌、铝粉、银粉、石墨粉、石墨烯、碳纤维中的至少一种。从而改善导热效果。所述粘合树脂层中还可以添加有颜色随温度变化而变化的变色颗粒。从而通过观察变色颗粒的颜色粗略估计当前元器件的问题。而且，可以通过有计划的控制温度的变化，记录变色颗粒的变色程度、变色速度、所变颜色，并以该变化作为判断导热片性能好坏的评价标准之一，实现对导热片性能的检测评价。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (10)

1.沿厚度方向具有超高导热系数的导热性片材，包括呈片状的导热片，其特征在于，所述导热片包括位于竖直方向上的导热片层，各导热片层并排排布，相邻的两片导热片层之间是将导热片层粘合在一起的粘合树脂所形成的粘合树脂层，所述粘合树脂层中添加有未固化的热固化材料颗粒，在安装的时候，利用未固化的热固化材料颗粒的流动性，允许导热片材发生形变，在安装到位后，随着导热的进行，未固化的热固化材料再逐渐固化；
所述粘合树脂层中还添加有颜色随温度变化而变化的变色颗粒；
所述导热片层的厚度自上而下逐渐增大，所述导热片层的底部相互抵在一起，在导热片层的侧壁上设有延伸方向为树脂方向的贯穿的通孔或开口朝外的凹槽，通孔和凹槽内填充有粘合树脂。
2.根据权利要求1所述的沿厚度方向具有超高导热系数的导热性片材，其特征在于，位于同一个导热片内的各所述导热片层的体积之和为所在的所述导热片的体积的30%-80%。
3.根据权利要求1所述的沿厚度方向具有超高导热系数的导热性片材，其特征在于，所述导热片的厚度为0.3mm-2mm。
4.根据权利要求1所述的沿厚度方向具有超高导热系数的导热性片材，其特征在于，所述导热片层为石墨片、石墨烯片、碳纤维布、铝箔、铜箔中的至少一种。
5.根据权利要求1所述的沿厚度方向具有超高导热系数的导热性片材，其特征在于，所述导热片层的厚度为10μm-150μm。
6.根据权利要求1所述的沿厚度方向具有超高导热系数的导热性片材，其特征在于，所述粘合树脂层为聚有机硅氧烷、环氧树脂、聚氨酯、丙烯酸树脂中的任意一种。
7.根据权利要求1所述的沿厚度方向具有超高导热系数的导热性片材，其特征在于，所述粘合树脂层中添加有导热粒子。
8.根据权利要求7所述的沿厚度方向具有超高导热系数的导热性片材，其特征在于，所述导热粒子为氮化铝、氮化硼、氮化硅、碳化硅、氧化铝、氧化锌、铝粉、银粉、石墨粉、石墨烯、碳纤维中的至少一种。
9.根据权利要求1所述的沿厚度方向具有超高导热系数的导热性片材，其特征在于，所述导热片的外表面上复合有导热膜。
10.根据权利要求9所述的沿厚度方向具有超高导热系数的导热性片材，其特征在于，所述导热膜的厚度为100μm-300μm。
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