Disclosure of Invention
The invention mainly aims to provide an inertia measuring device to solve the problem that an inertia measuring unit in the prior art is poor in installation accuracy.
In order to achieve the above object, the present invention provides an inertial measurement unit comprising: an inertial measurement unit; the mounting seat comprises a body part, a plurality of first supporting parts and a plurality of second supporting parts, wherein the plurality of first supporting parts and the plurality of second supporting parts are connected with the body part; the plurality of first supporting parts protrude out of the body part, one ends of the plurality of first supporting parts, which are far away from the body part, are provided with first supporting surfaces, and the plurality of first supporting surfaces are in contact with the inertia measuring unit so as to support the inertia measuring unit; the second supporting parts are all protruded out of the body part, and one ends, far away from the body part, of the second supporting parts are provided with second supporting surfaces, so that the mounting seat is mounted on the mounting base body by enabling the second supporting surfaces to be in contact with the external mounting base body.
Furthermore, at least two first supporting parts are provided with first positioning structures, the positions of the inertia measurement unit corresponding to the first positioning structures are provided with second positioning structures, and the first positioning structures are matched with the second positioning structures in a one-to-one correspondence manner; one of the first positioning structure and the second positioning structure is a first positioning pin, and the other one of the first positioning structure and the second positioning structure is a first positioning hole; and/or the at least two second supporting parts are provided with third positioning structures, and when the mounting base is mounted on the mounting base body, each third positioning structure is correspondingly matched with each fourth positioning structure on the mounting base body one by one; one of the third positioning structure and the fourth positioning structure is a second positioning pin, and the other one is a second positioning hole.
Further, the inertial measurement unit includes: the protective cover is connected with the mounting seat, a mounting cavity is formed between the mounting seat and the protective cover, and the inertia measurement unit is arranged in the mounting cavity; the semiconductor refrigeration piece is in contact with the mounting seat and/or the protective cover.
Furthermore, the semiconductor refrigeration piece is arranged in the installation cavity, the installation seat is provided with a positioning groove, and the semiconductor refrigeration piece is embedded in the positioning groove.
Furthermore, the semiconductor refrigerating sheet is provided with a first heat exchange surface and a second heat exchange surface, the first heat exchange surface is in contact with the mounting seat, the inertia measuring device comprises an auxiliary heat exchange piece, and the auxiliary heat exchange piece is in contact with the second heat exchange surface; the auxiliary heat exchange piece is provided with a plurality of first heat exchange fins.
Further, the inertia measurement device comprises a fan, and the fan is arranged in the installation cavity.
Furthermore, the semiconductor refrigeration piece, the auxiliary heat exchange piece and the fan are arranged between the inertia measurement unit and the mounting seat.
Furthermore, the semiconductor refrigeration piece is arranged in the mounting cavity and is in contact with the mounting seat; one side of mount pad far away from the installation cavity is equipped with a plurality of second heat transfer fins.
Further, the thermal conductivity of the mounting seat is not less than 200W (/ m.K); the thermal conductivity of the protective cover is not higher than 0.5W (/ m.K).
Furthermore, the inertia measuring device comprises a heat insulation pad, and the heat insulation pad is arranged on one side surface of the mounting seat facing the mounting cavity; and avoidance holes are formed in the positions, corresponding to the semiconductor refrigeration sheets, of the heat insulation pads.
Further, the inertial measurement unit includes: the temperature detection element is arranged in the mounting cavity to detect the temperature in the mounting cavity; and the controller is electrically connected with the temperature detection element and the semiconductor refrigerating piece so as to control the work of the semiconductor refrigerating piece according to the temperature signal detected by the temperature detection element.
Furthermore, an annular sealing groove is arranged on the mounting seat, and an annular sealing surface is arranged on the protective cover; the inertia measuring device comprises a sealing ring, the sealing ring is arranged in the annular sealing groove, and the sealing ring is in compression contact with the annular sealing surface.
Furthermore, the protective cover is provided with a vent hole, and a vent valve is arranged at the vent hole.
Further, the inertial measurement unit includes: the protective cover is connected with the mounting seat, a mounting cavity is formed between the mounting seat and the protective cover, and the inertia measurement unit is arranged in the mounting cavity; the inertia measurement unit is electrically connected with the first circuit board; the signal processing unit is used for processing the data of the inertia measurement unit; the second circuit board is connected with the protective cover, and the signal processing unit is electrically connected with the second circuit board; and an auxiliary connection structure electrically connecting the first circuit board and the second circuit board.
Further, the auxiliary connection structure includes: the first plug-in matching part is arranged on the first circuit board; the second plug-in matching part is arranged on the second circuit board; when the protective cover is connected with the mounting seat, the first plug-in matching part is matched with the second plug-in matching part; when the protective cover is separated from the mounting seat, the first inserting and connecting part is separated from the second inserting and connecting part.
Furthermore, the auxiliary connecting structure is a board-to-board connector, one of the first plug-in matching part and the second plug-in matching part is a male end, and the other one is a female end; locate fifth location structure on the mount pad, be equipped with sixth location structure on the protective cover to when protective cover and mount pad were close to each other, carry out relative positioning to protective cover and mount pad through fifth location structure and sixth location structure.
The inertia measuring device applying the technical scheme of the invention comprises: an inertial measurement unit; the mounting seat comprises a body part, a plurality of first supporting parts and a plurality of second supporting parts, wherein the plurality of first supporting parts and the plurality of second supporting parts are connected with the body part; the plurality of first supporting parts protrude out of the body part, one ends of the plurality of first supporting parts, which are far away from the body part, are provided with first supporting surfaces, and the plurality of first supporting surfaces are in contact with the inertia measuring unit so as to support the inertia measuring unit; the second supporting parts are all protruded out of the body part, and one ends, far away from the body part, of the second supporting parts are provided with second supporting surfaces, so that the mounting seat is mounted on the mounting base body by enabling the second supporting surfaces to be in contact with the external mounting base body. The installation base is installed on the installation base body through the second supporting surfaces of the second supporting portions, and the inertia measuring unit is positioned on the installation base body through the first supporting surfaces of the first supporting portions, so that the inertia measuring unit can be accurately and stably fixed on the installation base body. Because adopt a plurality of first supporting parts to support inertial measurement unit, and adopt a plurality of second supporting parts to support the mount pad, this kind of mode that adopts a plurality of facet location compares with the current mode that adopts constant head tank or a whole locating surface to advance line location, can avoid the condition of over-locating effectively, guarantees inertial measurement unit's installation accuracy, has solved the poor problem of inertial measurement unit installation accuracy among the prior art.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1 to 5, the present invention provides an inertial measurement unit, including: an inertial measurement unit 1; a mount 2, the mount 2 including a body portion 21, a plurality of first support portions 22, and a plurality of second support portions 23, the plurality of first support portions 22 and the plurality of second support portions 23 each being connected to the body portion 21; the plurality of first supporting parts 22 are arranged to protrude from the main body part 21, one ends of the plurality of first supporting parts 22 far away from the main body part 21 are provided with first supporting surfaces 221, and the plurality of first supporting surfaces 221 are all in contact with the inertia measurement unit 1 to support the inertia measurement unit 1; the second supporting portions 23 are disposed to protrude from the main body 21, and one ends of the second supporting portions 23 far from the main body 21 are provided with second supporting surfaces 231, so that the mounting base 2 is mounted on an external mounting base by contacting the second supporting surfaces 231 with the external mounting base.
The inertial measurement unit of the present invention includes: an inertial measurement unit 1; a mount 2, the mount 2 including a body portion 21, a plurality of first support portions 22, and a plurality of second support portions 23, the plurality of first support portions 22 and the plurality of second support portions 23 each being connected to the body portion 21; the plurality of first supporting parts 22 are arranged to protrude from the main body part 21, one ends of the plurality of first supporting parts 22 far away from the main body part 21 are provided with first supporting surfaces 221, and the plurality of first supporting surfaces 221 are all in contact with the inertia measurement unit 1 to support the inertia measurement unit 1; the second supporting portions 23 are disposed to protrude from the main body 21, and one ends of the second supporting portions 23 far from the main body 21 are provided with second supporting surfaces 231, so that the mounting base 2 is mounted on an external mounting base by contacting the second supporting surfaces 231 with the external mounting base. By providing the plurality of first supporting portions 22 and the plurality of second supporting portions 23 on the body portion 21 of the mount 2, the mount 2 is mounted on the mount base by the second supporting surfaces 231 of the plurality of second supporting portions 23, and the inertial measurement unit 1 is positioned on the mount 2 by the first supporting surfaces 221 of the plurality of first supporting portions 22, so that the inertial measurement unit 1 can be accurately and stably fixed to the mount base. Because adopt a plurality of first supporting parts 22 to support inertial measurement unit 1, and adopt a plurality of second supporting parts 23 to support mount pad 2, this kind of mode that adopts a plurality of facet location compares with the current mode that adopts constant head tank or a whole locating surface to advance line location, can avoid the condition of crossing the location effectively, guarantees inertial measurement unit 1's installation accuracy, has solved the poor problem of inertial measurement unit installation accuracy among the prior art.
Preferably, the first support surface 221 and the second support surface 231 are both manufactured by a finish machining method, so as to ensure the installation accuracy of the inertial measurement unit 1.
In the present embodiment, the first support portion 22 and the second support portion 23 are respectively disposed at two opposite sides of the body portion 21, that is, the protruding directions of the first support portion 22 and the second support portion 23 are opposite.
In order to connect the mounting base 2 with the mounting base body conveniently, each second supporting portion 23 is provided with a first connecting hole 233 thereon, so that the mounting base 2 is connected with the mounting base body by a first fastener penetrating through the first connecting hole 233.
Specifically, each first supporting portion 22 is provided with a second connecting hole 223, and the inertia measurement unit 1 is connected to each first supporting portion 22 through a second fastening member inserted into the second connecting hole 223.
The at least two first supporting parts 22 are provided with first positioning structures 222, the positions of the inertia measurement unit 1 corresponding to the first positioning structures 222 are provided with second positioning structures, and the first positioning structures 222 are matched with the second positioning structures in a one-to-one correspondence manner; wherein one of the first positioning structure 222 and the second positioning structure is a first positioning pin, and the other is a first positioning hole; and/or, the at least two second supporting portions 23 are provided with third positioning structures 232, when the mounting base 2 is mounted on the mounting base, each third positioning structure 232 is matched with each fourth positioning structure on the mounting base in a one-to-one correspondence manner; one of the third positioning structure 232 and the fourth positioning structure is a second positioning pin, and the other is a second positioning hole.
In this embodiment, there are four first supporting portions 22, two first positioning structures 222, and two first positioning structures 222 are correspondingly disposed on two first supporting portions 22 in a diagonal relationship, respectively; the number of the second supporting portions 23 is four, the number of the third positioning structures 232 is two, and the two third positioning structures 232 are correspondingly disposed on the two second supporting portions 23 in a diagonal relationship, respectively. Specifically, the first positioning structure 222 is a first positioning hole, the first positioning hole extends to the first supporting surface 221, and the second positioning structure is a first positioning pin; the third positioning structure 232 is a second positioning hole, the second positioning hole extends to the second supporting surface 231, and the fourth positioning structure is a second positioning pin.
Specifically, the inertial measurement unit includes: the protective cover 3 is connected with the mounting seat 2, a mounting cavity is formed between the mounting seat 2 and the protective cover 3, and the inertia measurement unit 1 is arranged in the mounting cavity; semiconductor refrigeration piece 4, semiconductor refrigeration piece 4 and mount pad 2 and/or protective cover 3 contact.
When the semiconductor refrigerating sheet 4 works, one surface of the semiconductor refrigerating sheet heats and the other surface of the semiconductor refrigerating sheet refrigerates, and the semiconductor refrigerating sheet is in contact with the installation base 2 and/or the protective cover 3, so that heat can be transferred between the semiconductor refrigerating sheet and the installation base, the installation cavity and the external space through the installation base 2 and/or the protective cover 3, and the purpose of controlling the temperature in the installation cavity is achieved.
The semiconductor refrigeration piece 4 can be arranged in the installation cavity and can also be arranged outside the installation cavity, and the temperature control effect when the semiconductor refrigeration piece is arranged outside is not the same as the effect when the semiconductor refrigeration piece is arranged inside the installation cavity.
The protective cover 3 is provided with a connecting lug 32, the connecting lug is provided with a third connecting hole 321, the mounting seat 2 is provided with a fourth connecting hole 28, and the protective cover 3 is connected with the mounting seat 2 through a third fastener penetrating through the third connecting hole 321 and the fourth connecting hole 28.
Specifically, semiconductor refrigeration piece 4 sets up in the installation cavity, is equipped with constant head tank 24 on the mount pad 2, and semiconductor refrigeration piece 4 inlays to be established in constant head tank 24.
Specifically, the depth of the positioning groove 24 may be greater than the thickness of the semiconductor refrigeration sheet 4, or may be less than or equal to the thickness of the semiconductor refrigeration sheet 4, that is, the semiconductor refrigeration sheet 4 may be completely embedded in the positioning groove 24, or may be partially embedded in the positioning groove 24.
When the temperature in the installation cavity is too high, the semiconductor refrigerating sheet 4 can be controlled to refrigerate towards one side of the installation cavity and heat towards one side of the installation seat 2, so that heat can be transferred to the outer side of the installation cavity through the installation seat 2, and the temperature in the installation cavity is reduced. When the temperature in the installation cavity was crossed lowly, steerable semiconductor refrigeration piece 4 heats towards one side of installation cavity, and towards one side refrigeration of mount pad 2, like this, the heat transfer in the installation cavity outside is for mount pad 2 back, is giving semiconductor refrigeration piece 4 in the transmission, through the one side of semiconductor refrigeration piece 4 towards the installation cavity with heat release to the installation cavity in to improve the temperature in the installation cavity. Through adopting above-mentioned setting, can control the temperature in the installation cavity effectively, make inertia measurement unit 1 can work under stable temperature, avoid temperature variation great and the influence that causes inertia measurement unit's work, improve the reliability and the precision of inertia measurement unit work.
The semiconductor refrigerating plate 4 is provided with a first heat exchange surface and a second heat exchange surface, the first heat exchange surface is in contact with the mounting base 2, the inertia measuring device comprises an auxiliary heat exchange piece 5, and the auxiliary heat exchange piece 5 is in contact with the second heat exchange surface; the auxiliary heat exchange member 5 is provided with a plurality of first heat exchange fins.
Through setting up supplementary heat transfer spare 5, can make the second heat-transfer face of semiconductor refrigeration piece 4 carry out the heat exchange through supplementary heat transfer spare 5 more high-efficiently with the air in the installation cavity to improve the control effect to the temperature in the installation cavity.
Specifically, the inertial measurement unit includes a fan 6, and the fan 6 is disposed in the mounting cavity.
Through setting up fan 6 in the installation cavity, can drive the circulation of air in the installation cavity when fan 6 during operation to make the air in the installation cavity carry out the heat exchange with supplementary piece 5 of heating more high-efficiently, when the second heat transfer face of semiconductor refrigeration piece 4 does not set up supplementary piece 5 of heating, fan 6 drive circulation of air can improve the air in the heat transfer cavity and the heat exchange efficiency between semiconductor refrigeration piece 4, thereby improve the control effect to the temperature in the installation cavity.
Specifically, the semiconductor cooling plate 4, the auxiliary heat exchange member 5 and the fan 6 are disposed between the inertia measurement unit 1 and the mounting base 2.
Because inertia measuring unit 1 is supported by a plurality of first supporting part 22, forms a clearance between inertia measuring unit 1 and mount pad 2, through setting up semiconductor refrigeration piece 4, supplementary heat transfer piece 5 and fan 6 in this clearance, can make full use of the inner space of installation cavity, guarantee temperature control's high efficiency on the basis of the fixed effect of realization accuracy, reliability to inertia measuring unit 1.
Specifically, the semiconductor refrigeration sheet 4 is arranged in the mounting cavity and is in contact with the mounting seat 2; and one side of the mounting seat 2 far away from the mounting cavity is provided with a plurality of second heat exchange fins 25.
Specifically, the thermal conductivity of the mount 2 is not less than 200W/(m · K); the thermal conductivity of the protecting cover 3 is not higher than 0.5W/(m.K).
In specific implementation, the mounting seat 2 is preferably made of a metal material to ensure the heat transfer effect, and the protective cover 3 is preferably made of a high-temperature-resistant plastic material to ensure the heat insulation effect. In this embodiment, the mounting seat 2 is made of an aluminum alloy material, and the protective cover 3 is made of PC plastic.
Specifically, the inertia measurement device comprises a heat insulation pad 13, and the heat insulation pad 13 is arranged on one side surface of the mounting seat 2 facing the mounting cavity; and avoidance holes are formed in the positions, corresponding to the semiconductor refrigerating pieces 4, of the heat insulation pads 13. Thus, the heat inside and outside the installation cavity can be effectively reduced and transmitted through the installation seat 2, and the constancy of the temperature in the installation cavity is favorably controlled.
The inertial measurement unit includes: a temperature detection element 7 disposed in the mounting chamber to detect a temperature in the mounting chamber; and the controller is electrically connected with the temperature detection element 7 and the semiconductor chilling plate 4 so as to control the operation of the semiconductor chilling plate 4 according to the temperature signal detected by the temperature detection element 7.
Specifically, the controller may control the semiconductor chilling plates 4 to be turned on or off or control the operation power of the semiconductor chilling plates 4 according to the temperature signal detected by the temperature detection element 7.
Specifically, an annular sealing groove 29 is arranged on the mounting seat 2, and an annular sealing surface 33 is arranged on the protective cover 3; the inertia measuring device comprises a sealing ring which is arranged in the annular sealing groove 29 and is in pressing contact with the annular sealing surface 33.
Thus, the inertia measurement unit 1 and the signal processing unit are respectively arranged on the two circuit boards, so that when equipment upgrading and damaged part replacement are involved, the circuit board where the inertia measurement unit 1 or the signal processing unit is located can be independently replaced, interchangeability is improved, and cost during replacement can be effectively saved.
Specifically, the protective cover 3 is provided with a vent hole, and a vent valve 11 is arranged at the vent hole. When the air pressure in the installation cavity changes, ventilation can be performed through the ventilation valve 11, the pressure fluctuation in the installation cavity is reduced, and the working stability of the inertia measurement unit 1 is maintained.
Specifically, the inertial measurement unit includes: the protective cover 3 is connected with the mounting seat 2, a mounting cavity is formed between the mounting seat 2 and the protective cover 3, and the inertia measurement unit 1 is arranged in the mounting cavity; the inertia measurement unit 1 is electrically connected to the first circuit board 8; the signal processing unit is used for processing the data of the inertia measuring unit 1; the second circuit board 9 is connected with the protective cover 3, and the signal processing unit is electrically connected with the second circuit board 9; and an auxiliary connection structure 10 electrically connecting the first circuit board 8 and the second circuit board 9.
Specifically, the auxiliary connection structure 10 includes: a first plug-in mating portion 101 disposed on the first circuit board 8; a second plug-in fitting part 102 disposed on the second circuit board 9; when the protective cover 3 is connected with the mounting seat 2, the first plug-in fitting part 101 is fitted with the second plug-in fitting part 102; when the protective cover 3 is separated from the mounting seat 2, the first plug-in fitting portion 101 is separated from the second plug-in fitting portion 102.
Specifically, the auxiliary connection structure 10 is a board-to-board connector, and one of the first insertion mating part 101 and the second insertion mating part 102 is a male end and the other is a female end; locate fifth location structure 27 on the mount pad 2, be equipped with sixth location structure 31 on the protective cover 3 to when protective cover 3 and mount pad 2 were close to each other, carry out relative positioning to protective cover 3 and mount pad 2 through fifth location structure 27 and sixth location structure 31. It is ensured that the first and second plug-in mating parts 101, 102 can be mated accurately.
Be equipped with fifth location structure 27 on mount pad 2, be equipped with sixth location structure 31 on the protective cover 3, when protective cover 3 is connected with mount pad 2, fifth location structure 27 and the cooperation of sixth location structure 31. Specifically, one of the fifth positioning structure 27 and the sixth positioning structure 31 is a third positioning pin, and the other is a third positioning hole. Of course, the third positioning pin may be directly disposed on the mounting seat 2 or the protecting cover 3, or may be detachably inserted into a mounting hole on the mounting seat 2 or the protecting cover 3.
The protective cover 3 is further provided with a wiring hole, the inertia measuring device comprises a connector 12, and at least part of the connector 12 extends out of the installation cavity through the connection hole so as to electrically connect the inertia measuring unit 1 with an external device through the connector 12.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects:
the inertial measurement unit of the present invention includes: an inertial measurement unit 1; a mount 2, the mount 2 including a body portion 21, a plurality of first support portions 22, and a plurality of second support portions 23, the plurality of first support portions 22 and the plurality of second support portions 23 each being connected to the body portion 21; the plurality of first supporting parts 22 are arranged to protrude from the main body part 21, one ends of the plurality of first supporting parts 22 far away from the main body part 21 are provided with first supporting surfaces 221, and the plurality of first supporting surfaces 221 are all in contact with the inertia measurement unit 1 to support the inertia measurement unit 1; the second supporting portions 23 are disposed to protrude from the main body 21, and one ends of the second supporting portions 23 far from the main body 21 are provided with second supporting surfaces 231, so that the mounting base 2 is mounted on an external mounting base by contacting the second supporting surfaces 231 with the external mounting base. By providing the plurality of first supporting portions 22 and the plurality of second supporting portions 23 on the body portion 21 of the mount 2, the mount 2 is mounted on the mount base by the second supporting surfaces 231 of the plurality of second supporting portions 23, and the inertial measurement unit 1 is positioned on the mount 2 by the first supporting surfaces 221 of the plurality of first supporting portions 22, so that the inertial measurement unit 1 can be accurately and stably fixed to the mount base. Because adopt a plurality of first supporting parts 22 to support inertial measurement unit 1, and adopt a plurality of second supporting parts 23 to support mount pad 2, this kind of mode that adopts a plurality of facet location compares with the current mode that adopts constant head tank or a whole locating surface to advance line location, can avoid the condition of crossing the location effectively, guarantees inertial measurement unit 1's installation accuracy, has solved the poor problem of inertial measurement unit installation accuracy among the prior art.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.