CN211730295U

CN211730295U - Hot melt bonding equipment suitable for PCB board and casing equipment

Info

Publication number: CN211730295U
Application number: CN202020167926.0U
Authority: CN
Inventors: 王衡
Original assignee: Suzhou Allbest Automation Technology Co ltd
Current assignee: Suzhou Allbest Automation Technology Co ltd
Priority date: 2020-02-13
Filing date: 2020-02-13
Publication date: 2020-10-23
Anticipated expiration: 2030-02-13

Abstract

The utility model relates to a hot melt combines equipment suitable for PCB board and casing equipment, including bearing the bottom plate, install the portal frame on bearing the bottom plate, the portal frame is provided with the roof including the support that the mirror image distributes on the roof, installs the push down device on the roof, and the bottom of push down device is connected with heating device, is provided with the locating support on bearing the bottom plate, and the work area who corresponds the push down device in the locating support is provided with plug connection device. From this, can let the air cylinder that pushes down drive heating device motion, both can realize the hot melt when pushing down and targetting in place, from pushing down to the hot melt link up in order fast, the centre need not shift, can accomplish at same station. The distribution of adopting a plurality of hot melt heads can be adjusted or zone heating as required according to the distribution of actual fixed column on the casing, can adapt to the shell connection needs of different models.

Description

Hot melt bonding equipment suitable for PCB board and casing equipment

Technical Field

The utility model relates to a PCB assembly combines equipment, especially relates to a hot melt combines equipment suitable for PCB board and casing equipment.

Background

The conventional fixing method of the PCB and the plastic case is to fix them by locking self-tapping screws, which brings high assembly cost and low assembly efficiency. Meanwhile, for the combination of some shells in other fields, a hot melting combination mode is adopted. However, if the adhesive is directly applied to PCB bonding, errors occur in heat transfer, resulting in insufficient local heating, and the effect of thermal fusion bonding is not good. Or, due to the adoption of the global hot melting mode, the PCB board may be locally heated too much, and damage may be caused. Moreover, corresponding hot-melting end heads are required to be selected for different shells or PCB boards, so that the cost is high during implementation, the implementation is difficult, and the popularization is not facilitated.

In view of the above-mentioned drawbacks, the present designer is actively making research and innovation to create a thermal fusion bonding apparatus suitable for assembling PCB board and housing, so that the thermal fusion bonding apparatus has more industrial application value.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model aims at providing a hot melt bonding equipment suitable for PCB board and casing equipment.

The utility model discloses a hot melt combines equipment suitable for PCB board and casing equipment, including bearing the bottom plate, install the portal frame on the bearing the bottom plate, the portal frame is including the support that the mirror image distributes, the support top is provided with the roof, wherein: the top plate is provided with a pressing device, the bottom of the pressing device is connected with a heating device, the bearing bottom plate is provided with a positioning support, and a plug connecting device is arranged in a working area corresponding to the pressing device in the positioning support.

Further, the hot melt bonding equipment suitable for the assembly of the PCB and the shell is characterized in that the pressing device comprises a pressing cylinder, the pressing cylinder is connected with a pressing block through a connecting rod, and the bottom of the pressing block is connected with a heating device.

Further, the above mentioned thermal fusion bonding device for assembling PCB board and housing is provided with a guide strip facing downwards.

Furthermore, the hot melt combination equipment suitable for assembling the PCB and the shell is characterized in that the heating device comprises a rectangular shell, a mounting cavity is arranged in the rectangular shell, a heating pipe is arranged in the mounting cavity, and a plurality of hot melt heads are distributed on the bottom of the rectangular shell.

Furthermore, foretell hot melt that is applicable to PCB board and casing equipment combines equipment, wherein, be connected with temperature sensor on the rectangle shell, temperature sensor is infrared temperature sensor, be provided with on the rectangle shell and link up the recess, infrared temperature sensor is the strip appearance, infrared temperature sensor imbeds in linking up the recess.

Further, the hot melting combination device suitable for the assembly of the PCB and the shell is characterized in that the top of the hot melting head is in a ball hole mushroom head structure.

Furthermore, the above hot-melt bonding device suitable for assembling the PCB and the housing, wherein the positioning bracket includes a positioning plate with mirror image distribution, the positioning plate is provided with a tray, an accommodating space is formed between the positioning plate and the tray, and the plug connecting device is located in the accommodating space.

Furthermore, the hot-melt bonding equipment suitable for assembling the PCB and the shell is characterized in that the plug connecting device comprises a plug connecting cylinder, a performance testing plug is arranged at the top of the plug connecting cylinder, and an independent communication module is arranged on the performance testing plug.

Still further, the hot-melt bonding device suitable for assembling the PCB and the housing, wherein the communication module is an I/O communication interface; or a bluetooth communication interface.

Borrow by above-mentioned scheme, the utility model discloses at least, have following advantage:

1. can let the air cylinder that pushes down drive heating device motion, both can realize the hot melt when pushing down to target in place, from pushing down to the linking of hot melt in order fast, the centre need not shift, can accomplish at same station.

2. The distribution of adopting a plurality of hot melt heads can be adjusted or zone heating as required according to the distribution of actual fixed column on the casing, can adapt to the shell connection needs of different models.

3. Be equipped with independent locating support, can realize the stable of casing and place and pinpoint, ensure that the skew does not appear during the hot melt.

4. By adopting the plug connecting device, various conducting electrical properties of the current PCB can be detected in real time while certain step lifting support is provided, and synchronous operation between assembly and synchronization is achieved.

5. The whole structure is simple, the assembly and the maintenance are easy, and the PCB assembling device can be matched with various conventional PCB assembling devices for implementation.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.

Drawings

Fig. 1 is a schematic structural view of a thermal fusion bonding apparatus suitable for assembling a PCB board with a housing.

Fig. 2 is a schematic structural view (upright placement) of the thermal head.

The meanings of the reference symbols in the drawings are as follows.

1 load floor 2 roof

3 push down cylinder 4 connecting rod

5 lower press block 6 guide strip

7 rectangular shell 8 mounting cavity

9 heating pipe 10 hot melting head

12-ball-hole mushroom head of 11 infrared temperature sensor

13 tray 14 plug connection cylinder

15 performance test plug

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

As the hot melt combination equipment who is applicable to PCB board and casing equipment of fig. 1, fig. 2, including bearing plate 1, consider that follow-up can realize smooth downward pressfitting hot melt and connect, give suitable perpendicular guide, install the portal frame on bearing plate 1, the portal frame is provided with roof 2 including the support that the mirror image distributes, its distinctive and different part lies in: a hold-down device is mounted on the top plate 2. Meanwhile, the bottom of the pressing device is connected with a heating device. Therefore, heating can be realized while pressing down, and the final hot-melt bonding forming integrity is ensured. And, in view of the housing placement convenience, the load floor 1 is provided with a positioning bracket. In order to satisfy effectual upper and lower synchronous application of force pressfitting, be convenient for quick, stable hot melt combines, the utility model discloses the work area who corresponds the push-down device in the locating support is provided with plug connection device.

Combine the utility model discloses an embodiment of preferred sees, in order to realize comparatively smooth and easy the application of force that pushes down, and can adjust the dynamics of pushing down according to the product of difference, the device that pushes down of chooseing for use is including pushing down cylinder 3. Particularly, in order to ensure smooth transmission of the pressing force and realize synchronous hot melting when the pressing is in place (the PCB is completely combined with the shell), the adopted pressing cylinder 3 is connected with a pressing block 5 through a connecting rod 4, and the bottom of the pressing block 5 is connected with a heating device. In view of the fact that the depressing block 5 can have a better forward depressing guide during depressing, the depressing block 5 is provided with a guide strip 6 facing downward.

Further see, in order to realize thermal transmission, avoid appearing local heat gathering and influence the efficiency that the hot melt combines, the utility model discloses a heating device including rectangle shell 7, be provided with installation cavity 8 in the rectangle shell 7, be provided with heating pipe 9 in the installation cavity 8, the bottom distribution of rectangle shell 7 has a plurality of hot melt heads 10. Thus, in actual use, heat is transferred to the respective fuse heads 10 through the rectangular housing 7 by the operation of the heating pipe 9. At this moment, the positions of the hot melting heads 10 are just corresponding to the fixing columns of the shell, and the fixing columns are in a hot melting state after being heated, so that hot melting combination is realized.

In view of practical use, in order to monitor the temperature of the thermal melting head 10 in real time, avoid heat loss caused by temperature transmission in the heating process and avoid difference between the working temperature and the monitored temperature, a temperature sensor is connected to the rectangular shell 7. Particularly, temperature sensor is infrared temperature sensor 11, is provided with on the rectangle shell 7 and links up the recess, and infrared temperature sensor 11 is the strip appearance, and infrared temperature sensor 11 imbeds in linking the recess. Thus, the temperature is controlled by the participation of the infrared temperature sensor 11 and the cooperation of the subsequent externally connected control device to control the actual heating efficiency of the heating pipe 9. In addition, in practical implementation, a plurality of or single heating pipes 9 can be adopted to cooperate with one or more of the plurality of hot melting heads 10 to realize temperature zone control, and the temperature error can be kept within +/-0.5 degrees, so that synchronous hot melting of a plurality of connection points is met. Meanwhile, in order to have a better hot-melting contact surface and ensure the sufficient hot-melting combination of the shell and the PCB, the top of the adopted hot-melting head 10 is in a structure of a ball hole mushroom head 12.

Further, in order to facilitate stable placement of the housing during machining and realize proper pre-positioning, the adopted positioning bracket comprises positioning plates distributed in a mirror image manner, the positioning plates are provided with trays 13, an accommodating space is formed between the positioning plates and the trays 13, and the plug connecting device is positioned in the accommodating space. In this way, appropriate placement indicia may be provided on the tray 13 during processing to facilitate placement of the housing in the correct position.

In order to realize a lifting force application to the bottom of the shell, the selected plug connecting device comprises a plug connecting cylinder 14, a performance testing plug 15 is arranged at the top of the plug connecting cylinder 14, and an independent communication module is configured on the performance testing plug 15. Therefore, various conducting electrical properties of the current PCB can be effectively tested in the hot melting process until the connection is finished. And, consider the facility with the communication of external data, the external testing arrangement of being convenient for acquires data smoothly, carries out the detection of each item function, the utility model discloses a communication module be IO communication interface. Of course, a bluetooth communication interface may be used in consideration of some special usage requirements.

Through foretell expression of characters and combination of the attached drawing can be seen, adopt the utility model discloses afterwards, possess following advantage:

Furthermore, the indication directions or positional relationships described in the present invention are directions or positional relationships based on the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the indicated device or structure must have a specific direction or operate in a specific directional configuration, and therefore, should not be construed as limiting the present invention.

The terms "primary" and "secondary" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "primary" or "secondary" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Also, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "connected" and "disposed" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other or mutually interacted. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art. And it may be directly on the other component or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or component so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the invention.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. Hot melt combines equipment suitable for PCB board and casing equipment, including bearing the bottom plate, install the portal frame on the bearing the bottom plate, the portal frame is including the support that the mirror image distributes, the support top is provided with roof, its characterized in that: the top plate is provided with a pressing device, the bottom of the pressing device is connected with a heating device, the bearing bottom plate is provided with a positioning support, and a plug connecting device is arranged in a working area corresponding to the pressing device in the positioning support.

2. A thermal fusion bonding apparatus suitable for PCB board and housing assembly according to claim 1, wherein: the pressing device comprises a pressing cylinder, the pressing cylinder is connected with a pressing block through a connecting rod, and the bottom of the pressing block is connected with a heating device.

3. A thermal fusion bonding apparatus suitable for PCB board and housing assembly according to claim 2, wherein: the lower pressing block is provided with a guide strip downwards.

4. A thermal fusion bonding apparatus suitable for PCB board and housing assembly according to claim 1, wherein: the heating device comprises a rectangular shell, an installation cavity is arranged in the rectangular shell, a heating pipe is arranged in the installation cavity, and a plurality of hot melting heads are distributed on the bottom of the rectangular shell.

5. A thermal fusion bonding apparatus suitable for PCB assembly with a housing according to claim 4, wherein: the temperature sensor is connected to the rectangular shell and is an infrared temperature sensor, a connecting groove is formed in the rectangular shell, the infrared temperature sensor is in a strip shape, and the infrared temperature sensor is embedded into the connecting groove.

6. A thermal fusion bonding apparatus suitable for PCB assembly with a housing according to claim 4, wherein: the top of the hot melting head is of a ball hole mushroom head structure.

7. A thermal fusion bonding apparatus suitable for PCB board and housing assembly according to claim 1, wherein: the positioning support comprises positioning plates distributed in a mirror image mode, trays are arranged on the positioning plates, an accommodating space is formed between the positioning plates and the trays, and the plug connecting device is located in the accommodating space.

8. A thermal fusion bonding apparatus suitable for PCB board and housing assembly according to claim 1, wherein: the plug connecting device comprises a plug connecting cylinder, a performance testing plug is arranged at the top of the plug connecting cylinder, and an independent communication module is configured on the performance testing plug.

9. A thermal fusion bonding apparatus suitable for PCB board and housing assembly according to claim 8, wherein: the communication module is an I/O communication interface; or a bluetooth communication interface.