CN115494376A - Chip thermal testing device - Google Patents
Chip thermal testing device Download PDFInfo
- Publication number
- CN115494376A CN115494376A CN202211350448.7A CN202211350448A CN115494376A CN 115494376 A CN115494376 A CN 115494376A CN 202211350448 A CN202211350448 A CN 202211350448A CN 115494376 A CN115494376 A CN 115494376A
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- chip
- plate
- heat
- heat dissipation
- thermal
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
Abstract
The invention discloses a chip thermal test device which is used for detecting the performance of a chip in a high-temperature environment and comprises a bottom plate, a device shell, an electric heating plate and a test control assembly, wherein the bottom plate is used for installing the device shell, the electric heating plate is used for forming a high-temperature condition of a thermal test, the device shell is covered on the bottom plate to form an installation space, the device shell is movably connected with the bottom plate, the bottom plate is used for installing a chip to be tested, the electric heating plate is internally arranged in the installation space and conducts heat to the chip to be tested, the electric heating plate is electrically connected with the test control assembly, the test control assembly is used for controlling the electric heating plate and testing the chip to be tested, and the test control assembly dynamically controls the high-temperature condition established by the electric heating plate and collects relevant test data in the test process of the chip to be tested. The chip thermal testing device disclosed by the invention can independently form a thermal testing strip for the chip, does not need to heat the chip through a thermal testing aging cabinet, and improves the efficiency of the chip thermal testing process.
Description
Technical Field
The invention relates to the technical field of semiconductor application, in particular to a chip thermal testing device.
Background
The development of the technical field of modern communication equipment depends on the design and manufacture of semiconductor products, a chip has high precision as a core component for data processing in the communication equipment, the chip is easy to generate heat after long-time operation, the high-precision chip is easy to have the problems of operation blockage and the like under a high-temperature environment to influence the overall working efficiency of the equipment, and therefore, the performance test of the chip under the high-temperature environment is required to be carried out before the chip is put into application. The existing chip thermal test needs to use a chip thermal test aging cabinet, a test daughter board provided with a chip is placed on a placing frame in advance, the placing frame is placed into the aging cabinet, the test daughter board is connected through a test cable in the aging cabinet, and then the chip is subjected to power-on test, each parameter value tested by the chip at different high temperatures needs to be collected by relying on the aging cabinet, the size of the model of the aging cabinet restricts the capacity of the chip to be tested, the chip to be tested with a large number is difficult to be tested simultaneously, the manual test board is placed on the placing frame and then the cable is plugged to connect with a test mainboard for power-on test, and the manual operation steps are long in time consumption. Therefore, the conventional chip thermal testing technology has a problem of low efficiency.
Disclosure of Invention
The embodiment of the invention provides a chip thermal testing device, aiming at solving the problem of low chip high-temperature environment performance detection efficiency in the prior art.
The embodiment of the invention discloses a chip thermal testing device, which is used for detecting the performance of a chip in a high-temperature environment and is characterized by comprising the following components: the device comprises a bottom plate, a device shell, an electric hot plate and a test control assembly; the device shell is covered on the bottom plate to form an installation space, the device shell is movably connected with the bottom plate, the bottom plate is used for installing a chip to be tested, and the electric heating plate is internally arranged in the installation space and conducts heat to the chip to be tested; the electric heating plate is electrically connected with the test control assembly, and the test control assembly is used for controlling the electric heating plate and testing the chip to be tested.
Furthermore, the test control assembly comprises a control module, a thermal control circuit and a test circuit, wherein the control module controls the electric heating plate to generate heat through the thermal control circuit, and the control module is connected with the chip to be tested through the test circuit.
Further, the device shell includes first mounting panel, second mounting panel, third mounting panel and fourth mounting panel, first mounting panel the second mounting panel the third mounting panel and the fourth mounting panel connects gradually and encloses with the backup pad and close, the backup pad is located installation space's top, the backup pad is used for installing radiator unit.
Further, a chip fixing piece is arranged on the bottom plate and used for fixing the chip to be tested, and the test circuit is electrically connected with the chip to be tested through the chip fixing piece.
Furthermore, a plurality of power supply seats are arranged on the bottom plate and used for being connected into the thermal control circuit and the test circuit.
Further, the electric heating plate conducts heat to the chip to be tested through the heat conduction cover, the heat conduction cover is internally provided with the installation space and covers the chip fixing piece, and the electric heating plate is attached to the upper portion of the heat conduction cover.
Further, the heat dissipation assembly comprises a heat dissipation cover and a heat dissipation fan, the heat dissipation cover is internally provided with an installation space and is arranged above the heat conduction cover, the heat dissipation fan is arranged above the device shell, the heat dissipation cover and the top end face of the device shell are provided with ventilation openings, and the heat dissipation fan is used for guiding air in the device shell out of the testing device.
Further, radiator unit includes heat dissipation silicone grease layer and thermal-insulated cotton layer, heat dissipation silicone grease layer press from both sides and locate the electric hot plate with between the heat dissipation cover, thermal-insulated cotton layer central opening and four sides enclose and close, heat dissipation silicone grease layer set up in the central opening part on thermal-insulated cotton layer, thermal-insulated cotton layer respectively with first mounting panel the second mounting panel the third mounting panel and the inner wall laminating of fourth mounting panel.
Further, the outside surface of device shell is provided with the locating part, the upper surface of bottom plate sets up joint spare, the locating part with joint spare looks joint.
Furthermore, a plurality of chip fixing pieces are arranged on the bottom plate and a plurality of device shells are correspondingly arranged on the bottom plate.
The chip thermal testing device disclosed by the invention can independently form a thermal testing strip for the chip, does not need to heat the chip through a thermal testing aging cabinet, and improves the efficiency of the chip thermal testing process.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of a chip thermal testing apparatus according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a partial explosion structure of a chip thermal testing apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
As shown in fig. 1 to fig. 2, the chip thermal testing apparatus provided in this embodiment is used for detecting the performance of a chip in a high-temperature environment, and includes a bottom plate 1, an apparatus casing, an electric heating plate 2, and a test control assembly; the device shell is covered on the bottom plate 1 to form an installation space, the device shell is movably connected with the bottom plate 1, the bottom plate 1 is used for installing a chip to be tested, and the electric heating plate 2 is arranged in the installation space and conducts heat to the chip to be tested; the electric heating plate 2 is electrically connected with the test control assembly, and the test control assembly is used for controlling the electric heating plate 2 and testing the chip to be tested.
In an actual use scenario, the chip thermal testing apparatus disclosed in this embodiment is used for independently detecting performance of a chip in a high temperature environment, the thermal testing apparatus combines with an apparatus housing through a bottom plate 1 to construct an installation space, the installation space is used for setting an electric heating plate 2, the electric heating plate 2 generates heat in the installation space to construct the high temperature environment, specifically, the bottom plate 1 provides bearing and installation structure conditions for other functional components of the thermal testing apparatus, the apparatus housing is movably connected with the bottom plate 1 to enable the apparatus housing to be covered on the bottom plate 1, a hollow cavity is provided in the apparatus housing, the apparatus housing cover is arranged behind the bottom plate 1 to jointly form an installation space with the bottom plate 1, the installation space can provide a sufficient space environment for thermal testing of the chip, further, the thermal testing apparatus controls the electric heating plate 2 to generate heat by arranging the electric heating plate 2 in the installation space, so that a high temperature environment is formed in the installation space, the electric heating plate 2 is controlled by a test control component, the installation position of the thermal testing component can be flexibly arranged, a thermal testing technician controls the operation power of the electric heating plate 2 to control component to control the chip to generate heat in a stable temperature value, and a stable temperature change of each high temperature data, thereby enabling the chip to be more accurate and enabling the chip to be reflected in a stable temperature change of a stable operation data of a high temperature change in a temperature control performance of a temperature change stage, thereby enabling the chip to be generated by a stable temperature change of the chip to be generated by a chip to be generated in a chip to be generated by a high temperature change of the chip to be generated in a temperature change stage, and a chip to be more accurate temperature change of the chip to be generated by a chip to be detected temperature change of the chip to be detected by a chip to be detected temperature change, and a chip to be more accurate temperature change in a chip to be detected by a chip, and a chip to be detected by a chip to be detected temperature change stage.
In summary, the chip thermal testing apparatus disclosed in this embodiment can independently construct a high-temperature testing environment and simultaneously collect multiple performance parameters of the chip to be tested operating in the testing environment, the test control component dynamically controls the electric heating plate 2 to adjust the temperature change in the testing environment, the test control component collects the multiple performance parameters of the chip to be tested and performs performance evaluation while controlling the electric heating plate 2 to generate heat, and it is not necessary to repeatedly plug and unplug the testing circuit or repeatedly pick and place the chip to be tested, thereby simplifying the hardware using procedure in the chip thermal testing process and improving the efficiency of the chip thermal testing process.
Furthermore, the test control assembly comprises a control module, a thermal control circuit and a test circuit, wherein the control module controls the electric heating plate 2 to generate heat through the thermal control circuit, and the control module is connected with the chip to be tested through the test circuit.
Specifically, the test control assembly comprises a control module serving as a core component of the test control process, the control module can be used for generating and sending a control instruction, the control instruction is transmitted to the electric heating plate 2 in an electric signal form in an electric connection mode, the working power of the electric heating plate 2 is adjusted, the heat generation amount of the electric heating plate 2 meets the heat test requirement of technicians, the control module can also be used for receiving and storing data, the control module is connected with an electronic display device and quantitatively displays the received data reflecting the chip operation performance generated by the chip to be tested in the heat test process, the data reflecting the chip operation performance is more visual, the control module performs various types of test control through different circuit systems, specifically, the control module is respectively connected with a heat control circuit and a test circuit, the heat control circuit is used for controlling the heat generation of the electric heating plate 2, the heat generation precision of the electric heating plate 2 is reasonably adjusted, the test circuit is used for detecting the chip to be tested, namely, in the heat test process of the chip to be tested, the control module receives the operation related electric signals from the chip to be tested through the test circuit, the related electric signal parameters are compared, the control module can simultaneously and the heat control data and the test result can be more reasonably adjusted, and the problem that the heat control of the chip to be more reasonably caused by excessive heat control instruction can be avoided.
Further, the device shell comprises a first mounting plate 21, a second mounting plate 22, a third mounting plate 23 and a fourth mounting plate 24, wherein the first mounting plate 21, the second mounting plate 22, the third mounting plate 23 and the fourth mounting plate 24 are sequentially connected and enclosed with the support plate 20, the support plate 20 is located at the top of the mounting space, and the support plate 20 is used for mounting a heat dissipation assembly.
Specifically, the device shell is a spliced shell, and comprises four sequentially spliced mounting plates, namely a first mounting plate 21, a second mounting plate 22, edges of a third mounting plate 23 and a fourth mounting plate 24 are sequentially connected to form the peripheral side walls of the device shell, a support plate 20 is commonly connected to the upper edges of the four mounting plates, the support plate 20 is used as the top end surface of the device shell to enclose the four mounting plates, the device shell forms a hollow cover body with an opening at one end, the inner space of the cover body can be used as a field for chip thermal testing, the device shell cover is arranged on the bottom plate 1 to form a mounting space for mounting a chip to be tested, the field for chip thermal testing gathers a large amount of heat in the testing process, if the temperature in the field is higher than the normal bearing range of the chip to be tested, technicians need to dissipate heat to protect the field to protect the chip to be tested, the support plate 20 is used for mounting a heat dissipation assembly, the heat dissipation assembly can be used for guiding hot air flow of the mounting space in the device shell out of the detection device or conveying cooling air flow to the mounting space in the device shell, so that the cooling air flow is subjected to heat exchange in the mounting space, and the heat dissipation assembly obtains structural support through the support plate 20 and is arranged at the top end of the device shell, thereby establishing the top end of the device shell, and establishing the optimal heat dissipation structure.
Further, a chip fixing member 11 is arranged on the bottom plate 1, the chip fixing member 11 is used for fixing a chip to be tested, and the test circuit is electrically connected with the chip to be tested through the chip fixing member 11.
Specifically, the bottom plate 1 is used as an installation part of a chip to be tested, the chip fixing part 11 is arranged on the upper surface of the bottom plate 1, the chip fixing part 11 has functions of chip installation, electric connection, touch sensing and the like, a testing circuit in the test control assembly is connected into the chip fixing part 11 by a testing process technician, meanwhile, the chip to be tested is fixed on the chip fixing part 11, the testing circuit is connected with the chip to be tested and the control module, the chip fixing part 11 and the bottom plate 1 are integrally arranged, so that the chip to be tested can obtain a stable testing space, the testing space of the chip does not need to be replaced in the thermal testing process of the chip, the space restriction of a traditional chip thermal testing aging cabinet is eliminated, and the independence and the maneuverability of the thermal testing device for chip thermal testing are enhanced.
Further, a plurality of power supply seats 13 are arranged on the bottom plate 1, and the power supply seats 13 are used for being connected with a thermal control circuit and a test circuit.
Specifically, set up a plurality of power supply seats 13 that are used for inserting hot accuse circuit and test circuit on bottom plate 1, power supply seat 13 and bottom plate 1 integration setting, hot test technical personnel can connect hot accuse circuit and test circuit in advance before the hot test begins for test control subassembly and power supply seat 13 accomplish the electricity and be connected, need not repeatedly to carry out the electrical wiring after the hot testing arrangement accomplishes above-mentioned electricity and pull out and insert, have simplified hot testing arrangement's use process.
Further, the electric heating plate 2 conducts heat to the chip to be tested through the heat conduction cover 3, the heat conduction cover 3 is internally provided with an installation space and covers the chip fixing part 11, and the electric heating plate 2 is attached to and arranged above the heat conduction cover 3.
Specifically, enclose at device shell and bottom plate 1 and close the heat conduction cover 3 that is used for the heat conduction in the installation space who forms, heat conduction cover 3 adopts heat conduction metal material to make, thereby heat conduction cover 3 covers and locates on chip mounting 11 and make the chip that awaits measuring accept in heat conduction cover 3's cover internal, the laminating of electric plate 2 sets up in heat conduction cover 3's cover body top end face, electric plate 2 carries out solid heat-conduction with heat conduction cover 3, make the heat that electric plate 2 produced conduct to the chip that awaits measuring downwards through heat conduction cover 3, heat conduction cover 3 can improve electric plate 2 and carry out the efficiency of heat conduction to the chip that awaits measuring, promote the thermal utilization ratio of electric plate 2 formation.
Further, the heat dissipation assembly comprises a heat dissipation cover 6 and a heat dissipation fan 7, the heat dissipation cover 6 is internally provided with an installation space and is arranged above the heat conduction cover 3, the heat dissipation fan 7 is arranged above the device shell, the heat dissipation cover 6 and the top end face of the device shell are provided with ventilation openings, and the heat dissipation fan 7 is used for guiding air in the device shell out of the testing device.
Specifically, the heat dissipation assembly includes a heat dissipation cover 6, the heat dissipation cover 6 is disposed in an installation space formed by enclosing the device housing and the bottom plate 1 and is disposed above the heat conduction cover 3 and the electric hot plate 2, a cover body top end surface of the heat dissipation cover 6 is abutted to a top end surface of the device housing, the heat dissipation cover 6 and the top end surface of the device housing are provided with corresponding vents, the vents are communicated with the installation space of the device housing and an outer space of the housing, so that air in the installation space can be led out of the heat testing device through the vents, specifically, the top end surface vent of the device housing is provided with a heat dissipation fan 7, the heat dissipation fan 7 forms a wind direction structure facing the outer space of the housing from the installation space, after the heat dissipation fan 7 operates, air pressure in the installation space is greater than atmospheric pressure in the outer space of the housing, high-temperature air in the installation space flows out of the installation space through the vents due to air pressure difference, the heat dissipation is realized by the heat testing device, a technician can turn on the heat dissipation fan 7 according to actual test needs to adjust temperature in the installation space, and damage of a chip to be avoided.
Further, the heat dissipation assembly comprises a heat dissipation silicone grease layer 5 and a heat insulation cotton layer 4, the heat dissipation silicone grease layer 5 is clamped between the electric hot plate 2 and the heat dissipation cover 6, the heat insulation cotton layer 4 is open at the center and is enclosed on four sides, the heat dissipation silicone grease layer 5 is arranged at the opening at the center of the heat insulation cotton layer 4, and the heat insulation cotton layer 4 is attached to the inner walls of the first mounting plate 21, the second mounting plate 22, the third mounting plate 23 and the fourth mounting plate 24 respectively.
Specifically, the heat dissipation assembly further comprises a heat dissipation silicone grease layer 5, the heat dissipation silicone grease layer 5 is arranged at a central opening of the heat insulation cotton layer 4, the heat dissipation silicone grease layer 5 and the heat insulation cotton layer 4 enclosed all around form a complete heat insulation layer, the heat insulation layer can be provided with four mounting plates of the shell which are sequentially connected, the mounting gaps among the mounting plates are attached and eliminated, the air tightness of the mounting space is enhanced, the situation that the air pressure in the mounting space is equal to the air pressure outside the device and cannot form pressure difference is avoided, in the heat dissipation process of the heat testing device, the heat generated by the electric heating plate 2 is absorbed by the heat dissipation silicone grease layer 5, high-temperature gas flows upwards through the heat dissipation silicone grease layer 5 and flows out of the heat testing device through a vent on the top end face of the heat dissipation cover 6 and a vent on the top end face of the device shell, and the air flow cooling and heat exchange process is smoothly completed.
Further, the outer side surface of the device shell is provided with a limiting part 30, the upper surface of the bottom plate 1 is provided with a clamping part 12, and the limiting part 30 is clamped with the clamping part 12.
Specifically, the complete cover body cover that device housing constitutes locates bottom plate 1's upper surface, device housing is provided with locating part 30 on the surface all around, locating part 30 has fixed joint function, bottom plate 1's upper surface sets up corresponding joint spare 12, joint spare 12 sets up around chip mounting 11, establish the scope to device housing's cover and prescribe a limit to, behind locating part 30 and the 12 joint of joint spare 12, device housing is fixed in bottom plate 1's upper surface, prevent that device housing and bottom plate 1 from taking place relative displacement, the installation or the dismantlement of device housing can be selected according to test condition to the technical staff.
Further, a plurality of chip fixing members 11 and a plurality of device housings are correspondingly disposed on the base plate 1.
Specifically, the bottom plate 1 can extend the chip installation capacity as the installation component of the chip to be tested according to the actual test requirement of the technical staff, the technical staff can set a plurality of chip fixing parts 11 on the bottom plate 1 and correspondingly set a plurality of device shells, so that the upper surface of one bottom plate 1 is covered with a plurality of device shells simultaneously, the chip to be tested can be subjected to thermal test simultaneously, and the limitation of the test space for the thermal test of the chip is overcome.
The invention discloses a chip thermal testing device, which comprises a bottom plate 1, a device shell, an electric heating plate 2 and a testing control assembly, wherein the bottom plate is provided with a plurality of through holes; the device shell is covered on the bottom plate 1 to form an installation space, the device shell is movably connected with the bottom plate 1, the bottom plate 1 is used for installing a chip to be tested, and the electric heating plate 2 is arranged in the installation space and conducts heat to the chip to be tested; the electric heating plate 2 is electrically connected with the test control assembly, and the test control assembly is used for controlling the electric heating plate 2 and testing the chip to be tested. The thermal testing technician controls the running power of the electric heating plate 2 by operating the testing control assembly, adjusts the heat generated by the electric heating plate 2 according to the detection state standard set by the technician, and the temperature change condition in the high-temperature environment is numerically accurately controlled, the temperature change in the installation space is in a step change, the temperature value in each gradient forms a stable temperature change stage, the chip to be tested runs in each temperature change stage to be beneficial to generating more stable relevant data reflecting the running performance of the chip, so that the running performance of the chip to be tested reflected by the relevant data is more authentic, the efficiency and accuracy of the technician for collecting the relevant data are improved, and the error rate and the error of the chip thermal testing process are reduced; the power supply base 13 and the bottom plate 1 are integrally arranged, a thermal testing technician can connect the thermal control circuit and the test circuit in advance before thermal testing starts, so that the test control assembly is electrically connected with the power supply base 13, and the thermal testing device does not need to repeatedly pull and plug a power-on circuit after the thermal testing device completes the electrical connection, thereby simplifying the use procedure of the thermal testing device; chip mounting 11 and bottom plate 1 integration set up and make the chip that awaits measuring obtain stable test space, need not to change the test space of chip at the hot test in-process of chip, have got rid of the space restriction of traditional chip thermal test ageing cabinet, and the independence and the mobility that thermal testing device carries out chip thermal test are reinforceed, have promoted the efficiency of chip thermal test technology on the whole.
While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A chip thermal test device is used for detecting the performance of a chip in a high-temperature environment, and is characterized by comprising: the device comprises a bottom plate, a device shell, an electric hot plate and a test control assembly;
the device shell is covered on the bottom plate to form an installation space, the device shell is movably connected with the bottom plate, the bottom plate is used for installing a chip to be tested, and the electric heating plate is arranged in the installation space and conducts heat to the chip to be tested;
the electric heating plate is electrically connected with the test control assembly, and the test control assembly is used for controlling the electric heating plate and testing the chip to be tested.
2. The chip thermal testing device according to claim 1, wherein the test control assembly comprises a control module, a thermal control circuit and a test circuit, the control module controls the electric heating plate to generate heat through the thermal control circuit, and the control module is connected to the chip to be tested through the test circuit.
3. The chip thermal testing device according to claim 2, wherein the device housing includes a first mounting plate, a second mounting plate, a third mounting plate and a fourth mounting plate, the first mounting plate, the second mounting plate, the third mounting plate and the fourth mounting plate are sequentially connected and enclosed with a support plate, the support plate is located at the top of the mounting space, and the support plate is used for mounting a heat dissipation assembly.
4. The chip thermal testing device according to claim 3, wherein a chip fixing member is disposed on the bottom plate, the chip fixing member is used for fixing the chip to be tested, and the testing circuit is electrically connected to the chip to be tested through the chip fixing member.
5. The thermal chip testing apparatus of claim 4, wherein a plurality of power supply sockets are disposed on the bottom board, and the power supply sockets are used for connecting the thermal control circuit and the testing circuit.
6. The device for testing chip heat according to claim 4, wherein the electric heating plate conducts heat to the chip to be tested through a heat conducting cover, the heat conducting cover is disposed in the mounting space and covers the chip fixing member, and the electric heating plate is attached to and disposed above the heat conducting cover.
7. The chip thermal testing device according to claim 6, wherein the heat dissipation assembly includes a heat dissipation cover and a heat dissipation fan, the heat dissipation cover is disposed in the mounting space and above the heat conduction cover, the heat dissipation fan is disposed above the device housing, the heat dissipation cover and a top end surface of the device housing are provided with vents, and the heat dissipation fan is configured to guide air in the device housing out of the testing device.
8. The chip thermal testing device according to claim 7, wherein the heat dissipation assembly includes a heat dissipation silicone grease layer and a heat insulation cotton layer, the heat dissipation silicone grease layer is sandwiched between the electric hot plate and the heat dissipation cover, the heat insulation cotton layer has a central opening and is surrounded by four sides, the heat dissipation silicone grease layer is disposed at the central opening of the heat insulation cotton layer, and the heat insulation cotton layer is respectively attached to the inner walls of the first mounting plate, the second mounting plate, the third mounting plate and the fourth mounting plate.
9. The chip thermal testing device according to claim 1, wherein a limiting member is disposed on an outer side surface of the device housing, a clamping member is disposed on an upper surface of the bottom plate, and the limiting member is clamped with the clamping member.
10. The device for thermally testing chips as claimed in claim 4, wherein a plurality of said chip holders are disposed on said base plate and a plurality of said device housings are correspondingly disposed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211350448.7A CN115494376A (en) | 2022-10-31 | 2022-10-31 | Chip thermal testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211350448.7A CN115494376A (en) | 2022-10-31 | 2022-10-31 | Chip thermal testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115494376A true CN115494376A (en) | 2022-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211350448.7A Pending CN115494376A (en) | 2022-10-31 | 2022-10-31 | Chip thermal testing device |
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| CN (1) | CN115494376A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115800060A (en) * | 2023-02-10 | 2023-03-14 | 江苏万宝航天电气有限公司 | High-low voltage power distribution cabinet component load test safety protection device |
| CN116007686A (en) * | 2023-03-28 | 2023-04-25 | 四川华鲲振宇智能科技有限责任公司 | AI processing chip quality monitoring method, equipment and system |
-
2022
- 2022-10-31 CN CN202211350448.7A patent/CN115494376A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115800060A (en) * | 2023-02-10 | 2023-03-14 | 江苏万宝航天电气有限公司 | High-low voltage power distribution cabinet component load test safety protection device |
| CN115800060B (en) * | 2023-02-10 | 2023-04-11 | 江苏万宝航天电气有限公司 | High-low voltage power distribution cabinet component load test safety protection device |
| CN116007686A (en) * | 2023-03-28 | 2023-04-25 | 四川华鲲振宇智能科技有限责任公司 | AI processing chip quality monitoring method, equipment and system |
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