CN116007686A - AI processing chip quality monitoring method, equipment and system - Google Patents
AI processing chip quality monitoring method, equipment and system Download PDFInfo
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- CN116007686A CN116007686A CN202310309659.4A CN202310309659A CN116007686A CN 116007686 A CN116007686 A CN 116007686A CN 202310309659 A CN202310309659 A CN 202310309659A CN 116007686 A CN116007686 A CN 116007686A
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- 238000012545 processing Methods 0.000 title claims abstract description 32
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- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 134
- 238000012360 testing method Methods 0.000 claims abstract description 105
- 238000010438 heat treatment Methods 0.000 claims abstract description 78
- 238000009434 installation Methods 0.000 claims abstract description 9
- 230000002159 abnormal effect Effects 0.000 claims description 31
- 238000004891 communication Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 7
- 238000003384 imaging method Methods 0.000 abstract description 3
- 238000012372 quality testing Methods 0.000 abstract 2
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- 238000010586 diagram Methods 0.000 description 4
- 238000012806 monitoring device Methods 0.000 description 4
- 238000013079 data visualisation Methods 0.000 description 3
- 230000001960 triggered effect Effects 0.000 description 3
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention relates to an AI processing chip quality monitoring method, equipment and a system, which belong to the technical field of chip detection and comprise a heating test device, a shape contour detection device, a relative distance detection device, a vibration test device, a relative position detection device, a looseness detection device and a main control device; the main control device is respectively connected with the heating test device, the shape contour detection device, the relative distance detection device, the vibration test device, the relative position detection device and the loosening detection device. Through the cooperation between heating testing arrangement, shape contour detection device, relative interval detection device, vibration testing arrangement, relative position detection device, the detection device that becomes flexible, can carry out the quality testing who has imaging to chip and installation mounting thereof, overcome the defect that the chip installation mounting quality testing was ignored to the great field of chip working strength at present, ensured the operational reliability of chip and installation mounting thereof in to heating and vibration unusual environment.
Description
Technical Field
The invention belongs to the technical field of chip detection, and particularly relates to an AI processing chip quality monitoring method, equipment and a system.
Background
Along with the enhancement of the application range and the functional characteristics of the chip, the chip is widely applied in more and more fields, such as the fields of industry, aerospace, military, automobile, ship and the like; in particular, with the increase of the yield of the AI processing chip, it is necessary to detect functional parameters of the AI processing chip, such as electrical operating parameters (high voltage current, contact resistance, insulation resistance, and electrical resistance).
In the current stage, the test of the quality of the chip is only carried out before the chip is put into use, and the related test after the chip is put into use has larger defects; especially in the AI processing field with larger working intensity of the chip, the whole electric control system is often failed due to the heating of the chip, but under the condition, the thermal property test of the chip is also passed; there is a high probability that the fixture adapted to the chip is damaged by the chip heating, and the detection of the chip-adapted component (chip and its adapted mounting fixture, etc.) is a frequently neglected link.
Therefore, at present, an AI processing chip quality monitoring device, an AI processing chip quality monitoring system and an AI processing chip quality monitoring method are needed to solve the above problems.
Disclosure of Invention
The invention aims to provide an AI processing chip quality monitoring device, an AI processing chip quality monitoring system and an AI processing chip quality monitoring method, which are used for solving the technical problems in the prior art, and the AI processing field with higher chip working strength often causes the fault of the whole electric control system due to the heating of the chip, but under the condition, the thermal property test of the chip is passed; there is a high probability that the fixture adapted to the chip is damaged by the chip heating, and the detection of the chip-adapted component (chip and its adapted mounting fixture, etc.) is a frequently neglected link.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
the AI processing chip quality monitoring equipment comprises a heating test device, a shape contour detection device, a relative distance detection device, a vibration test device, a relative position detection device, a looseness detection device and a main control device; the main control device is respectively connected with the heating test device, the shape contour detection device, the relative distance detection device, the vibration test device, the relative position detection device and the loosening detection device;
the heating test device is used for performing heating test on the chip and the mounting fixing piece of the chip;
the shape contour detection device is used for detecting the real-time shape contour of the mounting fixing piece and judging whether the real-time shape contour is abnormal or not;
the relative distance detection device is used for detecting the real-time relative distance between the chip and the mounting fixing piece and judging whether the real-time relative distance is abnormal or not;
the vibration testing device is used for carrying out vibration testing on the chip and the mounting fixing piece of the chip;
the relative position detection device is used for detecting the real-time relative position between the chip and the mounting fixing piece and judging whether the real-time relative position is abnormal or not;
the looseness detection device is used for detecting whether relative looseness occurs between the chip and the installation fixing piece.
Further, when the heating test is performed, the main control device controls the heating test device to be normally open, and controls the shape contour detection device and the relative interval detection device to be normally closed;
when the heating temperature of the heating test device for heating and testing the chip and the mounting and fixing piece thereof reaches the set temperature and the heating time length reaches the heating set time length; the main control device controls the shape contour detection device to be started;
when the shape contour detection device judges that the real-time shape contour is abnormal, the main control device controls the relative distance detection device to be started.
Further, the device also comprises a heating position detection device, wherein the heating position detection device is connected with the main control device;
the heating position detection device is used for detecting whether the positions of the chip and the mounting fixing piece thereof in the heating test device are abnormal or not when the chip and the mounting fixing piece thereof are subjected to heating test;
when the heating test device is started, the main control device simultaneously controls the heating position detection device to be started.
Further, when vibration test is performed, the main control device controls the vibration test device to be normally open, and controls the relative position detection device and the looseness detection device to be normally closed;
when the vibration intensity of the vibration testing device for carrying out vibration testing on the chip and the mounting and fixing piece thereof reaches the set vibration intensity and the vibration duration reaches the set vibration duration; the main control device controls the relative position detection device to be started;
when the relative position detection device judges that the real-time relative position is abnormal, the main control device controls the loosening detection device to be started.
Further, the vibration position detection device is connected with the main control device;
the vibration position detection device is used for detecting whether the positions of the chip and the mounting and fixing piece thereof in the vibration test device are abnormal or not when the chip and the mounting and fixing piece thereof perform vibration test;
when the vibration testing device is started, the main control device simultaneously controls the vibration position detection device to be started.
The AI processing chip quality monitoring system comprises the AI processing chip quality monitoring device and also comprises a monitoring terminal, wherein the monitoring terminal is in wireless communication with the main control device.
The AI processing chip quality monitoring method adopts the AI processing chip quality monitoring equipment to monitor the chip quality.
Compared with the prior art, the invention has the following beneficial effects:
one of the beneficial effects of this scheme lies in, through the cooperation between heating testing arrangement, shape contour detection device, relative interval detection device, vibration testing arrangement, relative position detection device, the not hard up detection device, can carry out the quality detection of imaging to chip and installation mounting thereof, overcome the defect that the chip installation mounting quality detected to the great field of chip working strength at present neglects, has ensured the operational reliability in chip and installation mounting thereof to heating and vibration unusual environment to a great extent. During heating test, the heating test device, the shape contour detection device and the relative interval detection device are sequentially matched and started, so that abnormal fine positioning from surface to point can be realized, and when the shape contour abnormality is detected, the relative interval detection device is started again; when the shape profile of the mounting fixing piece is abnormal due to the conclusion of multiple test data, the relative distance between the chip and the mounting fixing piece is also abnormal at a certain probability, so that the shape profile detection device is designed to be started firstly, and then the sequence of starting the relative distance detection device is triggered; the two are displayed by the subsequent data visualization links through feeding corresponding detection data back to the main control device. The same applies to vibration testing.
Drawings
Fig. 1 is a schematic diagram of a positional relationship between a chip and an adaptive mounting fixture according to the embodiment;
fig. 2 is a schematic diagram of the device structure according to the embodiment;
fig. 3 is a schematic diagram of the working principle of the heating test according to the embodiment;
fig. 4 is a schematic diagram of the working principle of the vibration test according to the embodiment.
Detailed Description
For the purpose of making the technical solution and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and examples. It should be understood that the particular embodiments described herein are illustrative only and are not intended to limit the invention, i.e., the embodiments described are merely some, but not all, of the embodiments of the invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present invention.
In the current stage, the test of the quality of the chip is only carried out before the chip is put into use, and the related test after the chip is put into use has larger defects; especially in the field of high working strength of chips, the whole electric control system is often failed due to the heating of the chips, but under the condition, the thermal property test of the chips is also passed; there is a high possibility that the chip-fitted fixture is damaged by the chip heating, and the detection of the chip-fitted fixture (chip and its fitted mounting fixture, etc., the structure of which is shown in fig. 1) is a link that is often ignored.
As shown in fig. 2, an AI processing chip quality monitoring device is provided, which comprises a heating test device, a shape contour detection device, a relative distance detection device, a vibration test device, a relative position detection device, a looseness detection device and a main control device; the main control device is respectively connected with the heating test device, the shape contour detection device, the relative distance detection device, the vibration test device, the relative position detection device and the loosening detection device;
the heating test device is used for performing heating test on the chip and the mounting fixing piece of the chip; the heating test device can be a heating test box which is mature at the present stage.
The shape contour detection device is used for detecting the real-time shape contour of the mounting fixing piece and judging whether the real-time shape contour is abnormal or not; the shape contour detection device can be a high-definition camera.
The relative distance detection device is used for detecting the real-time relative distance between the chip and the mounting fixing piece and judging whether the real-time relative distance is abnormal or not; the relative distance detection device can be an infrared range finder.
The vibration testing device is used for carrying out vibration testing on the chip and the mounting fixing piece of the chip; the vibration testing device can be a mature vibration testing box at the present stage.
The relative position detection device is used for detecting the real-time relative position between the chip and the mounting fixing piece and judging whether the real-time relative position is abnormal or not; the relative position detecting device can be a displacement sensor.
The looseness detection device is used for detecting whether relative looseness occurs between the chip and the installation fixing piece. The looseness detection device can also select a high-definition camera.
In the scheme, through the cooperation among the heating test device, the shape contour detection device, the relative distance detection device, the vibration test device, the relative position detection device and the loosening detection device, the chip and the mounting fixing piece thereof can be subjected to the imaging quality detection, the defect that the quality detection of the chip mounting fixing piece is ignored in the field with higher working strength of the chip at present is overcome, and the operation reliability of the chip and the mounting fixing piece thereof in heating and vibration abnormal environments is greatly ensured.
Further, as shown in fig. 3, when the heating test is performed, the main control device controls the heating test device to be normally opened, and controls the shape contour detection device and the relative interval detection device to be normally closed;
when the heating temperature of the heating test device for heating and testing the chip and the mounting and fixing piece thereof reaches the set temperature and the heating time length reaches the heating set time length; the main control device controls the shape contour detection device to be started;
when the shape contour detection device judges that the real-time shape contour is abnormal, the main control device controls the relative distance detection device to be started.
In the scheme, during heating test, the heating test device, the shape contour detection device and the relative interval detection device are sequentially matched and started, so that abnormal fine positioning from the surface to the point can be realized, and when the shape contour abnormality is detected, the relative interval detection device is started again; when the shape profile of the mounting fixing piece is abnormal due to the conclusion of multiple test data, the relative distance between the chip and the mounting fixing piece is also abnormal at a certain probability, so that the shape profile detection device is designed to be started firstly, and then the sequence of starting the relative distance detection device is triggered; the two are displayed by the subsequent data visualization links through feeding corresponding detection data back to the main control device.
Further, the device also comprises a heating position detection device, wherein the heating position detection device is connected with the main control device;
the heating position detection device is used for detecting whether the positions of the chip and the mounting fixing piece thereof in the heating test device are abnormal or not when the chip and the mounting fixing piece thereof are subjected to heating test;
when the heating test device is started, the main control device simultaneously controls the heating position detection device to be started.
In the above scheme, when the chip and the mounting fixture thereof are abnormal in the position of the heating test device, i.e. not in the set area, the heating test may not be performed normally; therefore, in order to ensure the smooth progress of the heating test, the defect is overcome by designing the heating position detecting device.
Further, as shown in fig. 4, when the vibration test is performed, the main control device controls the vibration test device to be normally opened, and controls the relative position detection device and the loosening detection device to be normally closed;
when the vibration intensity of the vibration testing device for carrying out vibration testing on the chip and the mounting and fixing piece thereof reaches the set vibration intensity and the vibration duration reaches the set vibration duration; the main control device controls the relative position detection device to be started;
when the relative position detection device judges that the real-time relative position is abnormal, the main control device controls the loosening detection device to be started.
In the scheme, during vibration test, the vibration test device, the relative position detection device and the loosening detection device are sequentially matched and started, so that abnormal fine positioning from the surface to the point can be realized, and when the relative position abnormality is detected, the loosening detection device is started again; the method comprises the steps that as the relative positions of a chip and a mounting fixing piece are summarized through multiple test data, loosening abnormality occurs at a certain probability, and therefore the relative position detection device is designed to be started first, and then the starting sequence of the loosening detection device is triggered; the two are displayed by the subsequent data visualization links through feeding corresponding detection data back to the main control device.
Further, the vibration position detection device is connected with the main control device;
the vibration position detection device is used for detecting whether the positions of the chip and the mounting and fixing piece thereof in the vibration test device are abnormal or not when the chip and the mounting and fixing piece thereof perform vibration test;
when the vibration testing device is started, the main control device simultaneously controls the vibration position detection device to be started.
In the above scheme, when the chip and the mounting and fixing member thereof are abnormal in the position of the vibration testing device, that is, not in the set area, the vibration test may not be performed normally; therefore, in order to ensure the smooth progress of the vibration test, the defect is overcome by designing the vibration position detecting device.
The AI processing chip quality monitoring system comprises the AI processing chip quality monitoring equipment, and further comprises a monitoring terminal, wherein the monitoring terminal is in wireless communication with the main control device, so that remote monitoring is realized.
The AI processing chip quality monitoring method adopts the AI processing chip quality monitoring equipment to monitor the chip quality.
The above is a preferred embodiment of the present invention, and all changes made according to the technical solution of the present invention belong to the protection scope of the present invention when the generated functional effects do not exceed the scope of the technical solution of the present invention.
Claims (7)
1. The AI processing chip quality monitoring equipment is characterized by comprising a heating test device, a shape contour detection device, a relative distance detection device, a vibration test device, a relative position detection device, a looseness detection device and a main control device; the main control device is respectively connected with the heating test device, the shape contour detection device, the relative distance detection device, the vibration test device, the relative position detection device and the loosening detection device;
the heating test device is used for performing heating test on the chip and the mounting fixing piece of the chip;
the shape contour detection device is used for detecting the real-time shape contour of the mounting fixing piece and judging whether the real-time shape contour is abnormal or not;
the relative distance detection device is used for detecting the real-time relative distance between the chip and the mounting fixing piece and judging whether the real-time relative distance is abnormal or not;
the vibration testing device is used for carrying out vibration testing on the chip and the mounting fixing piece of the chip;
the relative position detection device is used for detecting the real-time relative position between the chip and the mounting fixing piece and judging whether the real-time relative position is abnormal or not;
the looseness detection device is used for detecting whether relative looseness occurs between the chip and the installation fixing piece.
2. The AI processing chip quality monitoring apparatus according to claim 1, wherein the main control device controls the heating test device to be normally opened and controls the shape profile detection device and the relative pitch detection device to be normally closed when the heating test is performed;
when the heating temperature of the heating test device for heating and testing the chip and the mounting and fixing piece thereof reaches the set temperature and the heating time length reaches the heating set time length; the main control device controls the shape contour detection device to be started;
when the shape contour detection device judges that the real-time shape contour is abnormal, the main control device controls the relative distance detection device to be started.
3. The AI processing chip quality monitoring apparatus of claim 1, further comprising a heating position detection device connected to the main control device;
the heating position detection device is used for detecting whether the positions of the chip and the mounting fixing piece thereof in the heating test device are abnormal or not when the chip and the mounting fixing piece thereof are subjected to heating test;
when the heating test device is started, the main control device simultaneously controls the heating position detection device to be started.
4. The AI processing chip quality monitoring apparatus according to claim 1, wherein the main control device controls the vibration test device to be normally opened and controls the relative position detection device and the looseness detection device to be normally closed when vibration test is performed;
when the vibration intensity of the vibration testing device for carrying out vibration testing on the chip and the mounting and fixing piece thereof reaches the set vibration intensity and the vibration duration reaches the set vibration duration; the main control device controls the relative position detection device to be started;
when the relative position detection device judges that the real-time relative position is abnormal, the main control device controls the loosening detection device to be started.
5. The AI-processing-chip quality monitoring apparatus of claim 4, further comprising a vibration-position detecting device connected to the main control device;
the vibration position detection device is used for detecting whether the positions of the chip and the mounting and fixing piece thereof in the vibration test device are abnormal or not when the chip and the mounting and fixing piece thereof perform vibration test;
when the vibration testing device is started, the main control device simultaneously controls the vibration position detection device to be started.
6. An AI processing chip quality monitoring system, comprising an AI processing chip quality monitoring apparatus according to any one of claims 1-5, and further comprising a monitor terminal in wireless communication with the main control device.
7. An AI-processing chip quality monitoring method, characterized in that an AI-processing chip quality monitoring apparatus according to any one of claims 1 to 5 is employed for chip quality monitoring.
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