CN112834903A - Detection method of high-speed optical communication chip applied to 5G network - Google Patents
Detection method of high-speed optical communication chip applied to 5G network Download PDFInfo
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- CN112834903A CN112834903A CN202011623628.9A CN202011623628A CN112834903A CN 112834903 A CN112834903 A CN 112834903A CN 202011623628 A CN202011623628 A CN 202011623628A CN 112834903 A CN112834903 A CN 112834903A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
- H04B10/075—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal
- H04B10/079—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal
- H04B10/0795—Performance monitoring; Measurement of transmission parameters
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Abstract
The invention discloses a detection method of a high-speed optical communication chip applied to a 5G network, which is characterized by comprising the following steps: the optical communication chip detects crystal lattices, and the crystal lattices detect internal cracks; chip detection, wherein the chip detection is chip crystal detection, and the crystal detection adopts a needle detection machine; the encapsulation detects, the encapsulation detects specifically for the equipment material detects, the equipment detects and detects the back to the size after accomplishing, the size detects the equipment structure after accomplishing, and this detecting system makes its this device can be fine detect the optical communication chip through the functional item of reinforcing detection range and detection, reduces the fault rate of optical communication chip, improves production technology through the trouble that detects out, increases production efficiency, and this detection mode can detect the signal strength scheduling problem of communication chip simultaneously.
Description
Technical Field
The invention relates to a detection method, in particular to a detection method of a high-speed optical communication chip applied to a 5G network, and belongs to the technical field of communication.
Background
5G is also called; the fifth generation mobile communication technology is the latest generation cellular mobile communication technology, and is also an extension following 4G (LTE-A, WiMax), 3G (UMTS, LTE) and 2G (gsm) systems. The performance goals of 5G are high data rate, reduced latency, energy savings, reduced cost, increased system capacity and large-scale device connectivity, the first phase of the 5G specification in Release-15 is to accommodate early commercial deployment, the second phase of Release-16 will be completed in 2020 and 4 months, and will be submitted to the International Telecommunication Union (ITU) as a candidate for IMT-2020 technology, ITU IMT-2020 specification requires speeds up to 20Gbit/s, and wide channel bandwidth and large capacity MIMO can be achieved.
However, when 5G is used, a matched optical communication chip is used to support operations such as signal transmission, decoding and encoding of 5G, but since a current 5G network is just developed, the number of matched optical communication chips is small, and the technology is not mature, so that the current 5G optical communication chip is prone to failure, and at present, the chip needs to be detected in all directions when the optical communication chip is manufactured, so that normal use of the chip function is ensured, and at present, no detection method specially for the 5G optical communication chip exists, so that a certain problem still exists when a part of the 5G optical communication chip is used.
Therefore, in view of the above problems, the present invention provides a method for detecting a high-speed optical communication chip applied to a 5G network.
Disclosure of Invention
The invention aims to provide a detection method of a high-speed optical communication chip applied to a 5G network, and solves the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a detection method of a high-speed optical communication chip applied to a 5G network is characterized by comprising the following steps:
structural detection, the optical communication chip detects crystal lattices, the crystal lattices detect internal cracks, connection and defect detection between layers are carried out after the crack detection is finished, and the chips are attached to each other to be detected after the layer detection is finished
Welding detection, wherein the optical communication chip base is subjected to welding detection, the welding detection is insufficient welding detection, and the welding detection is empty welding detection;
chip detection, wherein the chip detection is chip crystal detection, a needle detection machine is adopted for the crystal detection, a functional region in the chip is detected after the crystal detection is finished, and the connection stability is detected after the functional region is detected;
and (3) packaging detection, wherein the packaging detection is specifically equipment material detection, the size is detected after the equipment detection is finished, and the equipment structure is detected after the size detection is finished.
Preferably, the chip line is modified after the error is detected, the line modification requires using a tangent line, the line is reconnected after the tangent line is completed, and the design scheme is redesigned after the connection is completed.
Preferably, the chip is detected after the packaging is finished, and the detection information identifies the chip.
Preferably, the communication information is detected after the production is finished, and the qualified communication information is qualified in quality.
Preferably, the communication detection detects the signal strength first, the signal stability is detected after the signal strength detection is finished, and the signal stability detection is finished to detect the signal range.
Preferably, the penetration force is detected after the signal detection is finished, and the penetration force detection adopts a mode of wrapping a concrete wall with the thickness of ten centimeters;
acquiring information: the signal detection is performed by adopting a practical use mode, and is performed by installing a chip in the equipment.
Compared with the prior art, the invention has the beneficial effects that:
this detecting system is through reinforcing detection range and the functional item that detects, make its this device can be fine detect the optical communication chip, reduce the fault rate of optical communication chip, the trouble through detecting out improves production technology, increase production efficiency, this detection mode can detect the signal strength scheduling problem of communication chip simultaneously, avoid taking place not to have the production defect at the in-process of chip production, and lead to the signal unstability because design and technological defect, signal strength is low, the slow scheduling problem of transmission speed, this mode detection effect is better, it is more comprehensive to detect simultaneously, the more comprehensive different equipment of adaptation of its optical communication chip of ability.
Drawings
FIG. 1 is a schematic view of the overall detection method of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a method for detecting a high-speed optical communication chip applied to a 5G network, which is characterized in that the method for detecting the optical communication chip includes the following steps:
structural detection, in which an optical communication chip detects lattices, detects each lattice of the optical communication chip to know whether the lattice structure is complete or not, then performs subsequent operations, and with the increase of design capacity and the shortening of the test time of each transistor, in order to find out the problem related to speed and verify the circuit timing sequence, a synchronous test method must be adopted, the synchronous test must be combined with a plurality of fault models including a transient model, path delay and IDDQ, the lattice detection finishes detecting internal cracks, the connection and defect detection between layers is performed after the crack detection finishes, the bonding between the chips is detected after the layer detection finishes, the detection can be primarily finished when the detection finishes, the detection process has a fault pair, and the chips need to be maintained;
welding detection, optical communication chip base welding detection, detection of chip welding conditions through instruments such as a microscope and the like, prevention of conditions such as cold joint and the like, guarantee of stability of equipment use, prevention of conditions such as instability and the like in the using process, welding detection is cold joint detection, welding detection is empty joint detection, and meanwhile, the number of pins needing to be scanned and the number of memories at each pin end can be embedded with boundary scanning on a SoC (system on chip), but not limited to interconnection test on a circuit board or a multi-chip module;
the chip detects, and the chip detects for chip crystal detects, and crystal detects and adopts the needle to examine the machine, and the crystal detects the functional region to chip inside after accomplishing and detects, and the functional region detects the stability of connecting after accomplishing, adopts SoC equipment to detect and must realize: properly configuring the ATPG tool for logic testing; the testing time is short; in the case of a novel high-speed fault model and various internal memory or small array tests, for a production line, a diagnosis method not only needs to find a fault, but also needs to separate a fault node from a node which normally works, and in addition, if possible, a test multiplexing technology is adopted to save test time. In the field of high-integration IC test, the testability design technology of ATPG and IDDQ has a strong fault separation mechanism;
encapsulation detects, and encapsulation detects specifically equipment material detects, detects the back to the size after the equipment detects, detects the back to the equipment structure after the size detects and accomplishes.
And modifying the chip circuit after detecting the error, wherein the circuit modification needs to use a tangent line, the circuit is reconnected after the tangent line is finished, and the design scheme is redesigned after the connection is finished.
And detecting the chip after the packaging is finished, identifying the chip according to the detection information, and inputting identification information into the chip.
The communication information is detected after production is completed, the communication detection is qualified, the communication detection quality is intersected in a traditional mode, the signal strength needs to be detected in the detection mode, and the problem that the actual use effect of a chip is not good can be avoided.
The communication detection detects the signal intensity firstly, detects the stability of the signal after the signal intensity detection is finished, and detects the signal range after the signal stability detection is finished.
The penetrating power is detected after signal detection is finished, the penetrating power is detected in a mode of wrapping by a concrete wall with the thickness of ten centimeters, the performance of the chip can be simulated by the concrete wall under the condition of daily use, the chip can be directly applied to life, and the capability of receiving signals of the chip is detected, so that the normal use of the chip is ensured, and the problem of design defects is avoided.
The signal detection is carried out by adopting an actual use mode, and the chip is installed in the equipment for detection, the chip is detected by the method to require practicability, and the chip is installed in the equipment firstly and then the whole signal receiving capability of the equipment is tested.
In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly attached, detachably attached, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A detection method of a high-speed optical communication chip applied to a 5G network is characterized by comprising the following steps:
the optical communication chip detects crystal lattices, internal cracks are detected after the crystal lattices are detected, connection and defect detection between layers are carried out after the crack detection is finished, and bonding between the chips is detected after the layer detection is finished;
welding detection, wherein the optical communication chip base is subjected to welding detection, the welding detection is insufficient welding detection, and the welding detection is empty welding detection;
chip detection, wherein the chip detection is chip crystal detection, a needle detection machine is adopted for the crystal detection, a functional region in the chip is detected after the crystal detection is finished, and the connection stability is detected after the functional region is detected;
and (3) packaging detection, wherein the packaging detection is specifically equipment material detection, the size is detected after the equipment detection is finished, and the equipment structure is detected after the size detection is finished.
2. The method for detecting the high-speed optical communication chip applied to the 5G network according to claim 1, wherein the method comprises the following steps: and modifying the chip circuit after the error is detected, wherein the circuit modification needs to use a tangent line, the circuit is reconnected after the tangent line is finished, and the design scheme is redesigned after the connection is finished.
3. The method for detecting the high-speed optical communication chip applied to the 5G network according to claim 1, wherein the method comprises the following steps: and detecting the chip after the packaging is finished, wherein the detection information identifies the chip.
4. The method for detecting the high-speed optical communication chip applied to the 5G network according to claim 1, wherein the method comprises the following steps: and detecting the communication information after the production is finished, wherein the qualified communication detection is qualified quality.
5. The method for detecting the high-speed optical communication chip applied to the 5G network according to claim 1, wherein the method comprises the following steps: the communication detection detects the signal intensity firstly, detects the stability of the signal after the signal intensity detection is finished, and detects the signal range after the signal stability detection is finished.
6. The method for detecting the high-speed optical communication chip applied to the 5G network according to claim 5, wherein the method comprises the following steps: and detecting the penetrating power after the signal detection is finished, wherein the penetrating power is detected in a mode of wrapping a concrete wall with the thickness of ten centimeters.
7. The method for detecting the high-speed optical communication chip applied to the 5G network according to claim 5, wherein the method comprises the following steps: the signal detection is performed by adopting a practical use mode, and is performed by installing a chip in the equipment.
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| CN202011623628.9A CN112834903A (en) | 2020-12-31 | 2020-12-31 | Detection method of high-speed optical communication chip applied to 5G network |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116007686A (en) * | 2023-03-28 | 2023-04-25 | 四川华鲲振宇智能科技有限责任公司 | AI processing chip quality monitoring method, equipment and system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116007686A (en) * | 2023-03-28 | 2023-04-25 | 四川华鲲振宇智能科技有限责任公司 | AI processing chip quality monitoring method, equipment and system |
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